A device under test test fixture and test equipment for testing a device under test

Abstract

The embodiment of the present application relates to a kind of device under test test frame and the test equipment for testing device under test, device under test test frame includes first frame, second frame, first connection module, first test module, second test module;The first frame is stacked in the second frame;The first connection module and the first test module are all set in the first frame, the first connection module is electrically connected with the first test module, the first connection module is used to be electrically connected with device under test, the first test module is used to test the device under test;Second test module is set in the second frame, the second test module is electrically connected with the first test module, and the second test module is used to test the device under test.It can realize multilayer parallel test by the device under test test frame, improve test efficiency and test precision, meet the iteration requirement of device under test.

Description

Technical Field

[0001] This application relates to the field of device under test (DUT) testing technology, and more particularly to a DUT test fixture and a test device for testing DUTs. Background Technology

[0002] A device under test (DUT) test fixture is a device used for performance testing, functional verification, and reliability analysis of the device under test.

[0003] Current device-under-test (DUT) racks are single-layered. As DUTs are upgraded and iterated, the requirements for DUT testing equipment become increasingly stringent. Traditional single-layer DUT testing equipment can no longer meet the iterative requirements of current DUTs. Utility Model Content

[0004] In view of the above problems, embodiments of this application provide a test fixture for a device under test, which overcomes or at least partially solves the above problems.

[0005] According to one aspect of the embodiments of this application, a device under test (DUT) test fixture is provided, including a first frame, a second frame, a first connection module, a first test module, and a second test module; the first frame is stacked on the second frame; the first connection module and the first test module are both disposed on the first frame, the first connection module is electrically connected to the first test module, the first connection module is used to electrically connect to the DUT, and the first test module is used to test the DUT; the second test module is disposed on the second frame, the second test module is electrically connected to the first test module, and the second test module is used to test the DUT.

[0006] In one alternative embodiment, the first connection module includes a connector that electrically connects the adapter board and the first test module.

[0007] In one alternative approach, the number of the first test modules is multiple groups.

[0008] In one alternative embodiment, each group of first test modules includes two first PCBs, a first cooling device, and a first connection terminal and a second connection terminal disposed at both ends of the first PCBs. The first cooling device is sandwiched between the two first PCBs and is used to cool the first PCBs. The first connection terminal at one end of each of the two first PCBs is electrically connected to the first connection module, and the second connection terminal at the other end of each of the two first PCBs is electrically connected to the second test module.

[0009] In one alternative approach, the number of the second test modules is multiple.

[0010] In one alternative embodiment, each group of the second test modules includes a second PCB, two second cooling devices, and a third and a fourth connection terminal disposed at both ends of the second PCB. The second PCB is sandwiched between the two second cooling devices, which are used to cool the second PCB. The third connection terminal is electrically connected to the first test module, and the fourth connection terminal is electrically connected to an external device.

[0011] In an alternative embodiment, the second test module further includes a spare connection terminal disposed on the second PCB.

[0012] In one alternative embodiment, the device under test (DUT) test fixture further includes a second connection module, which is electrically connected to the first test module and the second test module.

[0013] In one alternative embodiment, the second connection module includes a first connector, a connecting cable, and a second connector that are electrically connected in sequence. The first connector is disposed on the first frame and is floatingly connected to the first test module. The second connector is disposed on the first frame and is floatingly connected to the second test module.

[0014] According to one aspect of the embodiments of this application, a test device for testing a device under test is provided, including a device under test test fixture and a test host.

[0015] The beneficial effects of this application's embodiments are as follows: A device under test (DUT) test fixture is provided, including a first frame, a second frame, a first connection module, a first test module, and a second test module. The first frame is stacked on the second frame. Both the first connection module and the first test module are disposed on the first frame. The first connection module is electrically connected to the first test module and is used to electrically connect to the DUT. The first test module is used to test the DUT. The second test module is disposed on the second frame and is electrically connected to the first test module. The second test module is used to test the DUT. Through the first and second test modules of this DUT test fixture, multi-layer parallel testing can be achieved, improving test density, test efficiency, and test accuracy, and meeting the iterative requirements of the DUT. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0017] Figure 1 This is a schematic diagram of the test fixture for the device under test provided in an embodiment of this application.

[0018] Figure 2 This is a schematic diagram of the first connection module provided in the embodiment of this application connected to the device under test.

[0019] Figure 3 This is a schematic diagram showing the connection between the first test module and the first connection module and the device under test provided in the embodiments of this application.

[0020] Figure 4 This is a schematic diagram of the second test module provided in the embodiments of this application being set in the second frame.

[0021] Figure 5 This is a schematic diagram of the second connection module provided in the embodiments of this application being disposed in the first frame.

[0022] The labels in the attached diagram are as follows: 100. Test fixture for device under test; 200. Device under test; 201. Chip; 202. Electronic connector; 203. Adapter board; 10. First frame; 20. Second frame; 30. First connection module; 40. First test module; 50. Second test module; 60. Second connection module; 31. Connecting parts; 32. Support plate; 41. First PCB; 42. First cooling device; 43. First connecting terminal; 44. Second connecting terminal; 51. Second PCB; 52. Second cooling device; 53. Third connecting terminal; 54. Fourth connecting terminal; 61. First connector; 62. Connecting cable; 63. Second connector. Detailed Implementation

[0023] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly attached to the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0025] Please see Figure 1 and Figure 2 This application provides a device under test (DUT) test fixture 100, comprising a first frame 10, a second frame 20, a first connection module 30, a first test module 40, and a second test module 50. The first frame 10 is stacked on the second frame 20. The first connection module 30 and the first test module 40 are both disposed on the first frame 10, and the first connection module 30 is electrically connected to the first test module 40. The first connection module 30 is used to electrically connect to the DUT 200, and the first test module 40 is used to test the DUT 200. The second test module 50 is disposed on the second frame 20, and the second test module 50 is electrically connected to the first test module 40. The second test module 50 is used to test the DUT 200. This DUT test fixture 100 enables multi-layer parallel testing, improving testing efficiency and accuracy, and meeting the iterative requirements of the DUT 200.

[0026] Specifically, the first test module 40 disposed in the first frame 10 and the second test module 50 disposed in the second frame 20 can be independent test layers. When the device under test 200 is electrically connected to the first connection module 30, the first test module 40 and the second test module 50 cooperate. For example, the first test module 40 can perform specific performance tests on the device under test 200, and the second test module 50 can distribute test programs to the first test module 40 to perform performance tests on different devices under test 200.

[0027] Furthermore, the first test module 40 is electrically connected to the device under test (DUT) 200 via the first connection module 30. Because of its proximity to the DUT 200, high-speed testing resources can be allocated to this module, shortening the link distance to the DUT 200 and thus meeting higher-speed testing requirements. Meanwhile, the second test module 50 is responsible for allocating other resources, thereby ensuring that the entire DUT test rack 100 has richer testing resources within a limited space and can accommodate higher-speed testing scenarios.

[0028] In addition, the first test module 40 and the second test module 50 can also perform different performance tests. For example, the first test module 40 can be a module for high-speed signal testing, while the second test module 50 can be a module for low-speed signal testing or a module for specific function testing.

[0029] In this embodiment, the first test module 40 and the second test module 50 cooperate to simultaneously test different devices under test 200 or different performance characteristics of devices under test 200. This parallel testing technology not only shortens the testing cycle, but also, due to the division of labor among the test modules, allows for more precise identification of performance bottlenecks and potential problems of the device under test 200.

[0030] Furthermore, the device under test (DUT) test fixture 100 can be flexibly expanded by adding more test frames and test modules to form a multi-layer test architecture, adapting to the further growth of future DUT 200 testing needs. For example, a third frame (not shown) and a third test module (not shown) set on the third frame can be added, wherein the second frame 20 is stacked on the third frame, and the third test module is used to perform specific environmental tests or other tests. When the third test module is used for environmental testing, it can be for DUT 200 performance testing under environments such as high temperature, low temperature, and high humidity.

[0031] It is worth noting that the first framework 10 provides support for the first test module 40, and the specific structure of the first framework 10 is not limited in this embodiment. Similarly, the second framework 20 provides support for the second test module 50, and the specific structure of the second framework 20 is not limited in this embodiment.

[0032] It is worth noting that in practical applications, there are multiple sets of first connection modules 30, which are used to electrically connect the devices under test 200 respectively. At the same time, there are multiple first test modules 40 and multiple sets of second test modules 50, so that the different performance of multiple devices under test 200 can be tested separately at the same time.

[0033] It is understandable that the number of first connection modules 30 is the same as the number of first test modules 40, but the number of second test modules 50 and first test modules 40 can be the same or different. Specifically, it can be reasonably set according to actual needs.

[0034] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 2 and combined Figure 1The device under test (DUT) 200 includes a chip 201, an electronic connector 202, and an adapter board 203. The electronic connector 202 is electrically connected to the adapter board 203, and the contacts of the electronic connector 202 match the pins of the chip 201. The adapter board 203 is electrically connected to the first test module 40. The electronic connector 202 enables signal transmission and power supply. The adapter board 203 ensures the reliability of electrical signal interaction and communication between the DUT 200 and the first test module 40 via the electronic connector 202.

[0035] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 2 and combined Figure 1 The first connection module 30 includes a connector 31, which electrically connects the device under test 200 (specifically, the adapter board 203) and the first test module 40; alternatively, the adapter board 203 has a connection area (not shown), and the first test module 40 is electrically connected to the connection area. Through the connector 31 or the connection area, a stable connection between the device under test 200 and the first test module 40 is achieved via the first connection module 30.

[0036] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 2 and combined Figure 1 The first connection module 30 further includes a support plate 32, which is supported on the first frame 10. The adapter plate 203 is stacked on the support plate 32. When the first connection module 30 includes the connector 31, the connector 31 is disposed on the support plate 32 and exposed for electrical connection with the first test module 40. When the adapter plate 203 has the connection area, the connection area is exposed on the support plate 32 so that the first test module 40 can be electrically connected to the connection area. The support plate 32 provides support for the adapter plate 203, improving the overall stability and reliability of the first connection module 30.

[0037] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 3 and combined Figure 1Each group of first test modules 40 includes two first PCBs 41 (Printed Circuit Boards), a first cooling device 42, and first connection terminals 43 and second connection terminals 44 disposed at both ends of the first PCBs 41. The first cooling device 42 is sandwiched between the two first PCBs 41 and is used to cool the first PCBs 41. The first connection terminals 43 at one end of the two first PCBs 41 are electrically connected to the first connection module 30, and the second connection terminals 44 at the other end of the two first PCBs 41 are electrically connected to the second test module 50. The first PCBs 41 are used to test the specific performance of the device under test 200. The first connection terminals 43 ensure reliable electrical conduction and signal transmission between the device under test 200 and the first PCBs 41 through the first connection module 30. The second connection terminals 44 ensure reliable electrical conduction and signal transmission between the first PCBs 41 and the second test module 50. The first cooling device 42 is used to dissipate heat from the first PCBs 41, reducing the risk of temperature rise due to prolonged operation and ensuring test accuracy and stability.

[0038] It is understandable that there are multiple sets of the first test modules 40, and each set of the first test modules 40 includes two first PCBs 41. Therefore, the number of first PCBs 41 in the multiple sets of the first test modules 40 is at least two, for example, two, four, six, etc. The first cooling device 42 can be configured as a fan, heat sink, liquid cooling device, etc., and can be reasonably selected according to the actual application scenario and testing requirements.

[0039] It is worth noting that when the first connection module 30 includes the connector 31, the first connection terminal 43 in the first test module 40 is electrically connected to the connector 31. When the adapter plate 203 of the first connection module 30 is provided with a connection area, the first connection terminal 43 in the first test module 40 is electrically connected to the connection area.

[0040] It is understandable that when the test devices on the first PCB41 are set on both sides, the first PCB41 can also be cooled by at least two first cooling devices 42. Specifically, a reasonable selection can be made according to actual needs and space constraints.

[0041] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 4 and combined Figure 1 and Figure 3The second test module 50 includes a second PCB 51, two second cooling devices 52, and a third connection terminal 53 and a fourth connection terminal 54 disposed at both ends of the second PCB 51. The second PCB 51 is sandwiched between the two second cooling devices 52, which are used to cool the second PCB 51. The third connection terminal 53 is electrically connected to the first test module 40, and the fourth connection terminal 54 is electrically connected to external devices (e.g., a backplane, a test host, or a host computer). The second PCB 51 can be used to distribute test programs to the first test module 40 (specifically, the first PCB 41), and can also be used to test the specific performance of the device under test 200. The third connection terminal 53 ensures reliable electrical conduction and signal transmission between the first test module 40 (specifically, the second connection terminal 44 in the first test module 40) and the second PCB 51. The fourth connection terminal 54 ensures reliable electrical conduction and signal transmission between the second PCB 51 and external devices. The second cooling devices 52 are used to dissipate heat from the second PCB 51, reducing the risk of temperature rise due to prolonged operation and ensuring test accuracy and stability.

[0042] It is understood that there are multiple sets of the second test modules 50, and each set of the second test modules 50 includes two second cooling devices 52. Therefore, the number of second cooling devices 52 in the multiple sets of second test modules 50 is at least two, for example, two, four, six, etc. The second cooling device 52 can be configured as a fan, heat sink, liquid cooling device, etc., and can be reasonably selected according to the actual application scenario and testing requirements.

[0043] It is worth noting that in some embodiments, the number of the second cooling devices 52 is at least two, and the second PCB 51 is sandwiched between at least two of the second cooling devices 52. The test devices on the second PCB 51 can be arranged on both sides, so that heat can be dissipated on both sides of a second PCB 51 through at least two second cooling devices 52.

[0044] It is understandable that when the test device on the second PCB51 is set on one side, at least two second PCBs51 can also be cooled by a second cooling device 52. Specifically, a reasonable choice can be made according to actual needs and space constraints.

[0045] It is worth noting that in some embodiments, the second test module 50 further includes a spare connection terminal (not shown) disposed on the second PCB 51. This spare connection terminal increases testing flexibility without adding additional test modules. The spare connection terminal can be used to connect other test equipment or test modules to adapt to different testing needs or perform extended testing. For example, the spare connection terminal can be connected to other test systems to achieve multi-system joint testing, or connected to specific test probes to test specific areas or functions of the device under test 200. This design gives the device under test test fixture 100 good scalability and adaptability, enabling it to meet the continuous development of future device under test 200 testing technologies.

[0046] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 1 The device under test (DUT) test fixture 100 further includes a second connection module 60, which electrically connects the first test module 40 and the second test module 50. The second connection module 60 ensures stable electrical conduction and communication between the first test module 40 and the second test module 50.

[0047] The second connection module 60 can be disposed on either the first frame 10 or the second frame 20, depending on actual needs. For some embodiments, please refer to... Figure 5 and combined Figure 1 , Figure 3 and Figure 4The second connection module 60 includes a first connector 61, a connecting cable 62, and a second connector 63, which are electrically connected in sequence. The first connector 61 is disposed on the first frame 10 and is floatingly connected to the first test module 40 (specifically, it may be the second connecting terminal 44 in the first test module 40). The second connector 63 is disposed on the first frame 10 and is floatingly connected to the second test module 50 (specifically, it may be the third connecting terminal 53 in the second test module 50). The floating connection between the first connector 61 and the first test module 40 means that the connection between them is not rigidly fixed, but allows for a certain degree of relative displacement. Similarly, the floating connection between the second connector 63 and the second test module 50 means that the connection between them is not rigidly fixed, but allows for a certain degree of relative displacement. This design allows for a certain degree of relative displacement between the first test module 40 and the second test module 50 while maintaining good electrical connection and communication. This floating connection design helps to accommodate minor displacements or deformations that may occur during testing, improving the reliability and stability of the test. In addition, the selection of the connecting cable 62 should also take into account its flexibility and durability to ensure that it can maintain good performance in various testing environments.

[0048] It is worth noting that the specific implementation of the floating connection between the first connector 61 and the first test module 40 can be that the first connector 61 is locked to the first frame 10 by the threaded part of the shoulder screw (not shown in the figure), and the floating connection with the first test module 40 (specifically, the second connection terminal 44 in the first test module 40) is achieved by the shoulder part of the shoulder screw.

[0049] Similarly, the second connector 63 and the second test module 50 can be floatingly connected by locking the second connector 63 to the first frame 10 through the threaded part of the shoulder screw (not shown in the figure), and floatingly connecting it to the second test module 50 (specifically, the third connection terminal 53 in the second test module 50) through the shoulder part of the shoulder screw.

[0050] To facilitate understanding, one implementation method for testing the device under test (DUT) 200 using the test fixture 100 is briefly described below: The chip 201 in the DUT 200 contacts the electronic connector 202, establishing electrical connection between the chip 201 and the adapter board 203. The other end of the adapter board 203 is electrically connected to the first test module 40 via a connector 31 or a connection area. The second test module 50 distributes a test program to the first test module 40. The first test module 40 performs performance testing on the chip 201 in the DUT 200. The first test module 40 transmits the test results to the second test module 50, which then transmits the test results to an external device, such as a backplane, and finally to a test host or upper computer for processing. The program steps involved in the first test module 40 and the second test module 50 are existing program steps.

[0051] This application also provides an embodiment of a test apparatus for testing a device under test (DUT). The test apparatus includes the DUT test fixture and a test host. The specific structure and function of the DUT test fixture can be found in the above embodiments and will not be repeated here. The test host can be connected to the second test module 50 and is used to receive the test results of the first test module 40 transmitted by the second test module 50.

[0052] It should be noted that while preferred embodiments of this application are provided in the specification and accompanying drawings, this application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this application; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this application. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this application's specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A test fixture for a device under test, characterized in that, include: First frame, second frame, first connection module, first test module, second test module; The first frame is stacked on top of the second frame; Both the first connection module and the first test module are disposed on the first frame. The first connection module is electrically connected to the first test module. The first connection module is used to electrically connect to the device under test. The first test module is used to test the device under test. The second test module is disposed on the second frame and is electrically connected to the first test module. The second test module is used to test the device under test.

2. The test fixture for the device under test according to claim 1, characterized in that, The first connection module includes a connector that electrically connects the device under test (DUT) and the first test module.

3. The test fixture for the device under test according to claim 1, characterized in that, The number of the first test modules is multiple.

4. The test fixture for the device under test according to claim 3, characterized in that, The first test module of each group includes two first PCBs, a first cooling device, and a first connection terminal and a second connection terminal disposed at both ends of the first PCBs. The first cooling device is sandwiched between the two first PCBs and is used to cool the first PCBs. The first connection terminal at one end of each of the two first PCBs is electrically connected to the first connection module, and the second connection terminal at the other end of each of the two first PCBs is electrically connected to the second test module.

5. The test fixture for the device under test according to claim 1, characterized in that, The second test module consists of multiple sets.

6. The test fixture for the device under test according to claim 5, characterized in that, The second test module in each group includes a second PCB, two second cooling devices, and a third and a fourth connection terminal disposed at both ends of the second PCB. The second PCB is sandwiched between the two second cooling devices, which are used to cool the second PCB. The third connection terminal is electrically connected to the first test module, and the fourth connection terminal is electrically connected to an external device.

7. The test fixture for the device under test according to claim 6, characterized in that, The second test module also includes a spare connection terminal disposed on the second PCB.

8. The test fixture for the device under test according to any one of claims 1-7, characterized in that, The device under test (DUT) test fixture also includes a second connection module, which is electrically connected to the first test module and the second test module.

9. The test fixture for the device under test according to claim 8, characterized in that, The second connection module includes a first connector, a connecting cable, and a second connector that are electrically connected in sequence. The first connector is disposed on the first frame and is floatingly connected to the first test module. The second connector is disposed on the first frame and is floatingly connected to the second test module.

10. A test apparatus for testing a device under test, characterized in that, It has the device under test test fixture and test host as described in any one of claims 1-9.

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