A chip burn-in test apparatus

CN224732096UActive Publication Date: 2026-09-08HEFEI HISEMI SEMICON CO LTD
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Patent Information

Application Number
CN202521331216.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-27
Publication Date
2026-09-08
Estimated Expiration
2035-06-27

AI Technical Summary

Technical Problem

[0003]为了弥补现有技术问题的不足,本实用新型的目的是提供一种芯片老化测试装置,解决了现有的芯片老化测试板的金手指长期暴露,容易受到物理刮伤和污染的问题

Benefits of technology

1、本实用新型通过设置能够同时移动的上盖板和下盖板,配合U型把的设置,在需要插入金手指时,操作U型把拉动上盖板和下盖板露出金手指,在不需要插入时,松开U型把,则能够通过上盖板和下盖板将金手指包裹,对金手指进行有效的防护,减少金手指受到物理损伤以及污染的概率;

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Abstract

The utility model discloses a kind of chip aging test device, it is related to chip aging test field, and this kind of chip aging test device includes bottom frame, the top surface of bottom frame is fixed with test board, the top surface of test board is arranged with multiple groups of test socket, the side of test board close to bottom frame front beam is formed with the extension of protruding bottom frame, the middle part of extension is formed with sink groove;This kind of chip aging test device is moved by setting simultaneously upper cover plate and lower cover plate, cooperate the setting of U type handle, when needing to insert gold finger, operate U type handle to pull upper cover plate and lower cover plate to expose gold finger, when not needing to insert, loosen U type handle, then gold finger can be wrapped by upper cover plate and lower cover plate, effectively protect gold finger, reduce the probability that gold finger is physically damaged and contaminated.
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Description

Technical Field

[0001] This utility model relates to the field of chip aging testing, and in particular to a chip aging testing device. Background Technology

[0002] In semiconductor chip aging tests, the gold fingers on the edge of the test board are key components for achieving electrical connection with the test system. In traditional equipment, the gold fingers are exposed for extended periods, making them susceptible to physical scratches or contamination, leading to malfunctions such as poor contact and signal distortion. Therefore, there is an urgent need for a structure that can dynamically switch protection states: one that can completely cover the gold fingers during non-testing phases and quickly expose the interface during testing. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, the purpose of this invention is to provide a chip aging test device that solves the problem that the gold fingers of existing chip aging test boards are exposed for a long time and are easily subject to physical scratches and contamination.

[0004] To address the problems in the existing technology, the technical solution of this utility model is as follows: A chip aging test device includes a base frame, a test board fixed on the top surface of the base frame, multiple test sockets arranged on the top surface of the test board, two gold fingers on one side of the test board, a lower cover plate slidably connected to the front beam of the base frame via a slide groove, the lower cover plate being below the gold fingers, an upper cover plate fixed on the lower cover plate, the upper cover plate being above the gold fingers, the connection between the lower cover plate and the upper cover plate passing through the two gold fingers, the upper cover plate being placed on top of the test board, and the upper cover plate and the lower cover plate having a protective posture that covers the gold fingers and an open posture that exposes the gold fingers.

[0005] Optionally, the test plate has an extension protruding from the bottom frame on the side near the gold fingers. A groove is formed in the middle of the extension, which communicates with the gap between the two gold fingers. The two gold fingers are respectively installed at both ends of the extension. A connecting block is fixed in the middle of the top surface of the lower cover plate away from the test plate. The top surface of the connecting block is fixed to the upper cover plate. The connecting block connects the upper cover plate and the lower cover plate. The connecting block is located in the gap between the two gold fingers. When the upper cover plate and the lower cover plate are in an open position, the connecting block is embedded in the groove.

[0006] Optionally, multiple through slots are provided at equal intervals on both the upper and lower cover plates, and the upper and lower cover plates switch between protective and open postures via a moving component.

[0007] Optionally, the movable component includes a U-shaped handle slidably connected to the rear beam of the bottom frame via a sliding hole. The opening of the U-shaped handle faces the lower cover plate, and the open end of the U-shaped handle is fixed to the bottom surface of the lower cover plate. Two tension springs are symmetrically fixed inside the open end of the U-shaped handle. The end of the tension spring facing away from the U-shaped handle is fixed to the outer wall of the front beam. Under the action of the tension spring, the open end of the U-shaped handle is kept in contact with the outer wall of the front beam.

[0008] Optionally, a handle is fixed to the middle of the side of the rear beam away from the front beam, and the middle of the U-shaped handle extends through the rear beam to the inside of the handle. When the upper and lower cover plates are in an open position, the outer wall of the middle of the U-shaped handle abuts against the inner wall of the handle.

[0009] Compared with the prior art, the advantages of this utility model are as follows: 1. This utility model features a movable upper and lower cover plate, along with a U-shaped handle. When gold fingers need to be inserted, the upper and lower cover plates are pulled by operating the U-shaped handle to expose the gold fingers. When insertion is not needed, the U-shaped handle is released, and the gold fingers are covered by the upper and lower cover plates, effectively protecting them and reducing the probability of physical damage and contamination. 2. This utility model achieves the switching between the upper and lower cover plates in a protective posture and an open posture by setting a moving component composed of a U-shaped handle and a tension spring. Its core convenience lies in the fact that when the worker holds the handle fixed to the rear beam to pick up the entire test plate and put it into the aging test chamber, this gripping and force-moving action will naturally drive the U-shaped handle linked to it to move in sync, thereby automatically completing the sliding switching of the upper and lower cover plates, combining the two actions of "picking up the test plate" and "opening the protective cover" into one, which significantly simplifies the operation process. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0011] Figure 2 This is a schematic diagram showing the position of the tension spring in this utility model.

[0012] Figure 3 This is a schematic diagram of the through-groove structure of this utility model.

[0013] Figure 4 This is a schematic diagram of the settling tank structure of this utility model.

[0014] Reference numerals: 1. Base frame; 101. Front beam; 102. Rear beam; 2. Test plate; 201. Extension; 2011. Slot; 2012. Gold finger; 3. Test socket; 4. Grip; 5. Lower cover plate; 6. Connecting block; 7. Upper cover plate; 8. U-shaped handle; 9. Tension spring; 10. Through slot. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] Please see Figures 1 to 4 This embodiment provides a chip aging test device, including a base frame 1, a test board 2 fixed on the top surface of the base frame 1, and multiple test sockets 3 arranged on the top surface of the test board 2. An extension 201 protruding from the base frame 1 is formed on the side of the test board 2 near the front beam 101 of the base frame 1. A groove 2011 is formed in the middle of the extension 201. Two gold fingers 2012 are symmetrically arranged on the extension 201. The groove 2011 communicates with the gap between the two gold fingers 2012. A handle 4 is fixed in the middle of the side of the rear beam 102 of the base frame 1 away from the front beam 101. The test sockets 3 are used to insert chips so that the chips are electrically connected to the entire test board 2. The test sockets 3 are prior art and have been fully disclosed in many patents, so they will not be described again.

[0017] In the actual testing process, after all the test sockets 3 are loaded with chips, the test board 2 is pushed into the aging chamber by holding the handle 4, ensuring that the gold fingers 2012 are inserted into the test sockets in the aging test chamber to complete the installation. Then, the door of the aging test chamber is closed, the test interface is powered on, so that the chip is powered on and running. The aging test chamber is heated and cooled to achieve the aging test of the chip.

[0018] A lower cover plate 5 is slidably connected to the front beam 101 via a groove. The lower cover plate 5 is located below the gold finger 2012. A connecting block 6 is fixed to the middle of the top surface of the lower cover plate 5 on the side away from the test plate 2. An upper cover plate 7 is fixed to the top surface of the connecting block 6. Multiple through slots 10 are evenly spaced on the upper cover plate 7 and the lower cover plate 5. The through slots 10 reduce the weight of the upper cover plate 7 and the lower cover plate 5. The upper cover plate 7 faces the lower cover plate 5 and is located above the gold finger 2012. The connecting block 6 passes through the gap between the two gold fingers 2012. The upper cover plate 7 is placed on top of the test plate 2. The upper cover plate 7 and the lower cover plate 5 have a protective posture that wraps around the gold finger 2012 and an open posture that exposes the gold finger 2012. When the upper cover plate 7 and the lower cover plate 5 are in the open posture, the connecting block 6 is embedded in the sink 2011.

[0019] The upper cover plate 7 and the lower cover plate 5 can cover the gold finger 2012, thereby effectively protecting the gold finger 2012 when not being tested, physically isolating the gold finger 2012, preventing it from being physically damaged, and preventing it from being contaminated by direct contact with external objects.

[0020] A U-shaped handle 8 is slidably connected to the rear beam 102 through a sliding hole. The opening of the U-shaped handle 8 faces the lower cover plate 5. The open end of the U-shaped handle 8 is fixed to the bottom surface of the lower cover plate 5. Two tension springs 9 are symmetrically fixed inside the open end of the U-shaped handle 8. One end of the tension spring 9 away from the U-shaped handle 8 is fixed to the outer wall of the front beam 101. Under the action of the tension spring 9, the open end of the U-shaped handle 8 is kept in contact with the outer wall of the front beam 101. The middle part of the U-shaped handle 8 extends through the rear beam 102 to the inside of the grip 4. The upper cover plate 7 and the lower cover plate 5 are in an open position, and the outer wall of the middle part of the U-shaped handle 8 is in contact with the inner wall of the grip 4.

[0021] In the protective posture, the tension spring 9 contracts, causing the U-shaped handle 8 to press tightly against the front beam 101. The upper cover plate 7 and the lower cover plate 5 close and seal the gold fingers 2012. When the worker grasps the handle 4 to lift the test plate 2, they simultaneously grasp and pull the U-shaped handle 8 backward. The tension spring 9 stretches synchronously, dragging the lower cover plate 5 backward along the slide groove. The connecting block 6 enters the recess 2011 from the gap between the two gold fingers 2012, allowing the lower cover plate 5 to enter the inner side of the bottom frame 1. Meanwhile, the upper cover plate 7 covers the test plate 2, completely exposing the gold fingers 2012. At this point, the U-shaped handle 8 automatically engages with the inner wall of the grip 4. Then, the entire test board 2 is inserted into the test chamber, with the gold fingers 2012 inserted into the test socket. The aging chamber is then closed. Due to the weight of the test board 2, it is stacked on the placement layer inside the test chamber for stability. The rebound force of the tension spring 9 is insufficient to push the inner wall of the test chamber with the upper and lower cover plates 5 to pull out the gold fingers 2012. Furthermore, existing aging test chambers typically have a structure to position the test board 2, maintaining its connection stability. After the test, the test board 2 is pulled out, and the U-shaped handle 8 is released. Under the rebound force of the tension spring 9, the upper and lower cover plates 5 enclose the gold fingers 2012.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip aging test apparatus, comprising a base frame (1), a test board (2) fixed on the top surface of the base frame (1), and a plurality of test sockets (3) arranged on the top surface of the test board (2), characterized in that, Two gold fingers (2012) are provided on one side of the test plate (2). A lower cover plate (5) is slidably connected to the front beam (101) of the bottom frame (1) through a slide groove. The lower cover plate (5) is located below the gold fingers (2012). An upper cover plate (7) is fixed on the lower cover plate (5). The upper cover plate (7) is located above the gold fingers (2012). The connection between the lower cover plate (5) and the upper cover plate (7) passes through the two gold fingers (2012). The upper cover plate (7) is placed on the top of the test plate (2). The upper cover plate (7) and the lower cover plate (5) have a protective posture that covers the gold fingers (2012) and an open posture that exposes the gold fingers (2012).

2. The chip aging test apparatus according to claim 1, characterized in that, The test board (2) has an extension (201) protruding from the bottom frame (1) on the side near the gold fingers (2012). A groove (2011) is formed in the middle of the extension (201). The groove (2011) is connected to the gap between the two gold fingers (2012). The two gold fingers (2012) are respectively installed at both ends of the extension (201).

3. The chip aging test apparatus according to claim 2, characterized in that, A connecting block (6) is fixed in the middle of the top surface of the lower cover plate (5) away from the test plate (2). The top surface of the connecting block (6) is fixed to the upper cover plate (7). The connecting block (6) connects the upper cover plate (7) and the lower cover plate (5). The connecting block (6) is located in the gap between the two gold fingers (2012). When the upper cover plate (7) and the lower cover plate (5) are in an open position, the connecting block (6) is embedded in the sink (2011).

4. The chip aging test apparatus according to claim 1, characterized in that, Multiple through slots (10) are equally spaced on the upper cover plate (7) and the lower cover plate (5).

5. The chip aging test apparatus according to claim 3, characterized in that, The upper cover plate (7) and the lower cover plate (5) switch between protective and open postures via a moving component.

6. The chip aging test apparatus according to claim 5, characterized in that, The movable component includes a U-shaped handle (8) that is slidably connected to the rear beam (102) of the bottom frame (1) through a sliding hole. The opening of the U-shaped handle (8) faces the lower cover plate (5). The open end of the U-shaped handle (8) is fixed to the bottom surface of the lower cover plate (5). Two tension springs (9) are symmetrically fixed inside the open end of the U-shaped handle (8). One end of the tension spring (9) away from the U-shaped handle (8) is fixed to the outer wall of the front beam (101). Under the action of the tension spring (9), the open end of the U-shaped handle (8) is kept in contact with the outer wall of the front beam (101).

7. The chip aging test apparatus according to claim 6, characterized in that, A handle (4) is fixed to the middle of the side of the rear beam (102) away from the front beam (101). The middle part of the U-shaped handle (8) extends through the rear beam (102) to the inside of the handle (4). The upper cover plate (7) and the lower cover plate (5) are in an open position, and the outer wall of the middle part of the U-shaped handle (8) abuts against the inner wall of the handle (4).