A sensor chip detection system

Abstract

The present disclosure provides a sensor chip detection system, comprising: a semiconductor refrigeration device configured to place and heat or cool the sensor chip, comprising an observation hole, which is a through hole provided in the semiconductor refrigeration device; a fiber fixing device and an amplification display device, which are respectively arranged on the upper and lower sides of the semiconductor refrigeration device, the fiber fixing device is used to support the optical fiber; the amplification display device is configured to amplify and display the sensor chip through the observation hole; and a temperature sensor is arranged on the semiconductor refrigeration device and electrically connected with the semiconductor refrigeration device, and the semiconductor refrigeration device is controlled to heat or cool according to the feedback temperature of the temperature sensor and the set temperature, so that the feedback temperature reaches the set temperature.

Description

Technical Field

[0001] This disclosure relates to a sensor chip detection system. Background Technology

[0002] Photoelectric sensors have been widely used in various industries, such as petroleum, aviation, aerospace, medical, and marine fields, and have demonstrated excellent performance. Before leaving the factory, sensors need to have parameters such as temperature sensitivity and pressure sensitivity tested; therefore, there is an urgent need for a device to measure the temperature sensitivity of sensors. Utility Model Content

[0003] Therefore, the purpose of this disclosure is to provide a sensor chip detection system. This sensor chip detection system solves the aforementioned problems.

[0004] This disclosure provides a sensor chip detection system, including: A semiconductor cooling device configured to place the sensor chip and heat or cool the sensor chip, comprising an observation hole, the observation hole being a through hole disposed in the semiconductor cooling device; An optical fiber fixing device and a magnifying display device are respectively disposed on the upper and lower sides of the semiconductor cooling device. The optical fiber fixing device is used to support the optical fiber. The magnifying display device is configured to magnify and display the sensor chip through the observation hole. The controller is configured to be electrically connected to the semiconductor refrigeration device and a temperature sensor disposed on the semiconductor refrigeration device, and to control the semiconductor refrigeration device to heat or cool according to the feedback temperature of the temperature sensor and a set temperature, so that the feedback temperature reaches the set temperature.

[0005] In one embodiment, the semiconductor cooling device includes: a semiconductor cooler and a heat-conducting sheet disposed on the semiconductor cooler, wherein the heat-conducting sheet has a groove and a temperature sensor for measuring temperature is disposed in the groove.

[0006] In one embodiment, the semiconductor cooling device further includes a thermally conductive film disposed on the thermally conductive sheet.

[0007] In one embodiment, a heat dissipation device is further included, which is disposed below the thermoelectric cooler and configured to dissipate heat from the thermoelectric cooler.

[0008] In one embodiment, it further includes: a sealing cover configured to seal the optical fiber fixing device and the semiconductor cooling device therein; and a cylinder configured to actuate the sealing cover to close or open the sealing cover.

[0009] In one embodiment, a pressure controller is also included, configured to control the pressure within the sealing cover to a set pressure.

[0010] In one embodiment, a demodulation device is further included, configured to be connected to the optical fiber, for determining the cavity length of the sensor chip.

[0011] In one embodiment, the device further includes a processor configured to obtain the temperature change rate of the sensor chip based on the determined cavity length of the sensor chip and the corresponding temperature.

[0012] In one embodiment, the demodulation device includes: A light source, configured to emit light, is transmitted to the sensor chip via the optical fiber; A birefringent optical component is configured to receive modulated light returned from the optical fiber and interfere with the modulated light to form interference light with improved contrast, wherein the modulated light is formed by the interference of light emitted from the light source on the sensor chip; A photodetector configured to receive the contrast-enhanced interference light and form an optical signal curve; The signal processing unit is configured to receive the optical signal curve and process it to obtain the cavity length of the sensor chip.

[0013] In one embodiment, an adjustment bracket is further included, configured to adjust the position of the optical fiber fixing device or the semiconductor cooling device to couple the optical fiber to the sensor chip.

[0014] The sensor chip detection system disclosed herein enables the measurement of the temperature sensitivity of the sensor chip. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments of this disclosure will be briefly described below. The drawings are merely illustrative of some embodiments of this disclosure and are not intended to limit the scope of all embodiments of this disclosure. In the drawings: Figure 1 A schematic diagram of the structure of a sensor chip detection system according to an embodiment of the present disclosure is shown; Figure 2 A front view of a sensor chip detection system according to an embodiment of the present disclosure is shown; Figure 3 A partial isometric view of a semiconductor cooling device in a sensor chip detection system according to an embodiment of the present disclosure is shown; Figure 4 A partial front view of a semiconductor cooling device for a sensor chip detection system according to an embodiment of the present disclosure is shown; Figure 5A partial cross-sectional view of a semiconductor cooling device of a sensor chip detection system according to an embodiment of the present disclosure is shown.

[0016] 1-Semiconductor cooling device; 11-Semiconductor cooler; 12-Heat-conducting plate; 121-Groove; 13-Heat-conducting film; 14-Observation hole; 2-Fiber optic fixing device; 3-Sealing cover; 31-Rail; 5-Magnifying display device; 6-Temperature sensor; 7-Heat dissipation device; 8-Cylinder; 9-Controller; 10-Adjusting frame Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0018] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not necessarily indicate a quantity limitation. The terms “comprising,” “including,” or “having,” and similar terms mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. The terms “connected” or “connected,” and similar terms are not limited to the physical or mechanical connection or connection shown in the drawings, but may include equivalent connections or connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, which may change accordingly when the absolute position of the described object changes.

[0019] like Figure 1-5The diagram shows a schematic of the sensor chip detection system disclosed herein. A sensor chip detection system includes: a semiconductor cooling device 1, configured to place the sensor chip and heat or cool it; the semiconductor cooling device 1 includes an observation hole 14, which is a through-hole disposed in the semiconductor cooling device 1 and configured to magnify and display the sensor chip through the observation hole 14; an optical fiber fixing device 2 and a magnifying display device 5, respectively disposed on the upper and lower sides of the semiconductor cooling device 1; the optical fiber fixing device 2 is used to fix the optical fiber, and the magnifying display device 5 is configured to magnify and display the sensor chip through the observation hole 14; an adjustment frame, configured to adjust the position of the optical fiber fixing device 2 or the semiconductor cooling device 1 to couple the optical fiber to the sensor chip; and a controller, configured to be electrically connected to the semiconductor cooling device 1 and a temperature sensor 6 disposed in the semiconductor cooling device, and to control the heating or cooling of the semiconductor cooling device 1 based on the feedback temperature of the temperature sensor and a set temperature.

[0020] The magnifying display device and observation aperture allow for precise coupling between the optical fiber and the sensor chip, enabling cavity length demodulation of the sensor chip. Because the controller controls the heating or cooling of the semiconductor cooling device 1 based on the feedback temperature from the temperature sensor and the set temperature, temperature control is more accurate, thereby improving the accuracy of temperature sensitivity detection. The type of sensor chip described in this disclosure is not limited; for example, it can be a Fabry-Perot sensor.

[0021] The thermoelectric cooling device 1 includes a thermoelectric cooler 11, a heat-conducting plate 12, and a heat-conducting film 13, sequentially disposed on a heat dissipation device 7. The thermoelectric cooler 11 is fixed to the heat dissipation device 7, and the heat-conducting plate 12 and the heat-conducting film 13 are disposed on the thermoelectric cooler 11. The heat-conducting plate 12 has a groove 121 in which a temperature sensor 6 for measuring temperature is placed. The heat-conducting film 13 has a lower hardness than the heat-conducting plate 12. The heat-conducting film can be made of thermally conductive silicone, while the heat-conducting plate can be made of thermally conductive grease, metal, or other materials with good thermal conductivity. The combination of the heat-conducting plate 12 and the heat-conducting film 13 ensures a smooth surface and prevents scratches and damage to the sensor chip.

[0022] The thermoelectric cooler 11 and temperature sensor 6 are connected to the controller 9 via wires. Temperature sensor 6 changes with ambient temperature. The controller 9 obtains the current ambient temperature through temperature sensor 6 and compares it with a set temperature. If the ambient temperature is higher or lower than the set temperature, the controller 9 controls the thermoelectric cooler 11 to start cooling or heating. When the ambient temperature reaches the set temperature, the controller 9 controls the thermoelectric cooler 11 to stop cooling or heating, thus enabling more precise control of the ambient temperature of the sensor chip and significantly reducing test result errors. The controller 9 drives the thermoelectric cooler 11 to raise or lower its temperature based on the feedback from temperature sensor 6, and the temperature is transferred to the sensor chip through the heat-conducting sheet 12 and heat-conducting film 13, thereby controlling the ambient temperature.

[0023] The sensor chip testing system also includes a sealing cover 3 and a cylinder 8. The sealing cover 3 is configured to seal the optical fiber fixing device 2 and the semiconductor cooling device 1 within it, and the sealing cover 3 can move up and down along a track 31. The cylinder 8 is configured to push the sealing cover 3 along the track 31, with the sealing cover 3 closing downwards or opening upwards. The pressure inside the sealing cover, i.e., the ambient pressure of the sensor chip, can be controlled by a vacuum device. Therefore, the temperature sensitivity of the sensor chip under a certain ambient pressure can be tested, or the pressure sensitivity of the sensor chip as the cavity length changes with changes in ambient pressure can be tested.

[0024] The sensor chip detection system further includes a demodulation device configured to connect to the optical fiber for determining the cavity length of the sensor chip. It may also include a processor configured to obtain the temperature change rate of the sensor chip based on the determined cavity length and corresponding temperature, and / or to calculate the pressure change rate of the sensor chip based on the determined cavity length and corresponding pressure.

[0025] The demodulation device includes: a light source configured to emit light and transmit it to the sensor chip via the optical fiber; a birefringent optical component configured to receive the modulated light returned by the optical fiber and interfere with the modulated light to form contrast-enhanced interference light, wherein the modulated light is formed by the interference of light emitted by the light source on the sensor chip; a photodetector configured to receive the contrast-enhanced interference light and form an optical signal curve; and a signal processing unit configured to receive the optical signal curve and process it to obtain the cavity length of the sensor chip.

[0026] The birefringent optical component includes: a first polarizer configured to split the modulated light into different polarization components; a second polarizer having a polarization direction that is the same as or perpendicular to the polarization direction of the first polarizer, disposed downstream of the first polarizer and configured to combine the different polarization components; a birefringent element located between the first polarizer and the second polarizer; and a condenser disposed upstream of the first polarizer and configured to receive the modulated light and forward the modulated light to the output position via the first polarizer, the birefringent element, and the second polarizer to provide an optical signal as a function of path length difference.

[0027] The left half of the table below compares the pressure sensitivity measured by the sensor chip detection system of this disclosure with the pressure sensitivity measured by the pressure calibration device. It can be seen that the measurement error of the pressure sensitivity of the sensor chip is less than 5%. The right half compares the temperature sensitivity measured by the sensor chip detection system of this disclosure with the temperature sensitivity measured by the temperature calibration device. It can be seen that the measurement error of the temperature sensitivity of the sensor chip is less than 5%.

[0028]

[0029] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A sensor chip detection system, characterized in that, include: A semiconductor cooling device configured to place the sensor chip and heat or cool the sensor chip, comprising an observation hole, the observation hole being a through hole disposed in the semiconductor cooling device; An optical fiber fixing device and a magnifying display device are respectively disposed on the upper and lower sides of the semiconductor cooling device. The optical fiber fixing device is used to support the optical fiber. The magnifying display device is configured to magnify and display the sensor chip through the observation hole. The controller is configured to be electrically connected to the semiconductor refrigeration device and a temperature sensor disposed on the semiconductor refrigeration device, and to control the semiconductor refrigeration device to heat or cool according to the feedback temperature of the temperature sensor and a set temperature, so that the feedback temperature reaches the set temperature.

2. The sensor chip detection system according to claim 1, characterized in that, The semiconductor cooling device includes: a semiconductor cooler and a heat-conducting sheet disposed on the semiconductor cooler, wherein the heat-conducting sheet has a groove and a temperature sensor for measuring temperature is disposed in the groove.

3. The sensor chip detection system according to claim 2, characterized in that, The semiconductor cooling device further includes a thermally conductive film disposed on the thermally conductive sheet.

4. The sensor chip detection system according to claim 2, characterized in that, It also includes a heat dissipation device disposed below the semiconductor cooler and configured to dissipate heat from the semiconductor cooler.

5. The sensor chip detection system according to claim 1, characterized in that, Also includes: A sealing cover is configured to seal the optical fiber fixing device and the semiconductor cooling device therein; A cylinder configured to move the sealing cover to close or open the sealing cover.

6. The sensor chip detection system according to claim 5, characterized in that, It also includes a pressure controller configured to control the pressure inside the sealing cover to a set pressure.

7. The sensor chip detection system according to any one of claims 1-6, characterized in that, It also includes a demodulation device configured to be connected to the optical fiber for determining the cavity length of the sensor chip.

8. The sensor chip detection system according to claim 7, characterized in that, It also includes a processor configured to obtain the temperature change rate of the sensor chip based on the determined cavity length of the sensor chip and the corresponding temperature.

9. The sensor chip detection system according to claim 7, characterized in that, The demodulation device includes: A light source, configured to emit light, is transmitted to the sensor chip via the optical fiber; A birefringent optical component is configured to receive modulated light returned from the optical fiber and interfere with the modulated light to form interference light with improved contrast, wherein the modulated light is formed by the interference of light emitted from the light source on the sensor chip; A photodetector configured to receive the contrast-enhanced interference light and form an optical signal curve; The signal processing unit is configured to receive the optical signal curve and process it to obtain the cavity length of the sensor chip.

10. The sensor chip detection system according to claim 1, characterized in that, It also includes an adjustment bracket configured to adjust the position of the optical fiber fixing device or the semiconductor cooling device to couple the optical fiber to the sensor chip.

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