A new high-thermal-conductivity optical module heat sink

Abstract

The utility model provides a novel high heat conduction optical module cooling fin, include: substrate, the substrate equidistance has 8 for the air duct of heat energy dissipation, the air duct adopts red copper extrusion forming again CNC processing completes product manufacturing, the substrate bottom side middle end integrated heat conduction boss, heat conduction boss is used for heat contact conduction to air duct carries out heat energy dissipation, heat conduction boss from left to right includes successively: first heat conduction boss, second heat conduction boss and third heat conduction boss, first heat conduction boss, second heat conduction boss and third heat conduction boss all are different shape step shape and three shape are different. This kind of novel high heat conduction optical module cooling fin, reasonable in structure, high heat conductivity, have the mass productivity and practicality of product processing.

Description

Technical Field

[0001] This utility model relates to the field of optical module heat dissipation technology, and more specifically, to a novel high thermal conductivity optical module heat sink. Background Technology

[0002] Optical modules are core components in optical communication systems, enabling the conversion between optical and electrical signals. Their main function is to convert electrical signals at the transmitting end into optical signals, transmit them through optical fibers, and then convert the optical signals back into electrical signals at the receiving end. They are a crucial component of information transmission infrastructure such as communication networks and 5G base stations. With the rapid development of the digital economy, data transmission volume is growing exponentially, placing higher demands on the transmission rate and capacity of optical modules. High-capacity, high-end optical modules (such as 1.6T and 3.2T optical modules) are gradually becoming mainstream application products due to their high bandwidth and low latency advantages.

[0003] However, while achieving high transmission performance, high-capacity high-end optical modules significantly increase the power density of their internal chips and electronic components, generating a large amount of heat during operation. If this heat cannot be dissipated efficiently and in a timely manner, it will cause the internal temperature of the optical module to rise, leading to a series of problems: on the one hand, excessively high temperatures will reduce the operational stability of the optical module, resulting in an increased signal transmission error rate and affecting the accuracy of data transmission; on the other hand, prolonged exposure to high temperatures will accelerate the aging of internal components, shorten their lifespan, increase equipment maintenance costs and replacement frequency, and pose a threat to the stable operation of the optical communication system. Therefore, for high-capacity high-end optical modules such as 1.6T and 3.2T, equipping them with heat sinks with high thermal conductivity and rapid heat dissipation capabilities has become a key requirement for solving their heat dissipation problems and ensuring their stable and reliable operation.

[0004] Currently, most heat sinks used in optical modules on the market are made of aluminum alloy. While aluminum alloy is relatively inexpensive and easier to process, its thermal conductivity is low, only about 155 W / (m·K), making its heat dissipation efficiency insufficient for the rapid cooling requirements of high-capacity, high-end optical modules such as 1.6T and 3.2T. In practical applications, high-capacity, high-end optical modules using aluminum alloy heat sinks often experience continuous temperature increases due to inadequate heat dissipation, failing to fully utilize their high transmission performance and even leading to malfunctions caused by overheating.

[0005] Furthermore, some existing heat sinks have structural design deficiencies. Some heat sinks use a separate design for their airflow channels and heat dissipation body, which can easily create contact gaps during assembly, increasing thermal resistance and affecting heat transfer efficiency. Other heat sinks have poorly designed airflow channels, failing to create efficient heat dissipation paths, leading to heat accumulation inside the heat sink and further reducing heat dissipation performance. Meanwhile, some heat sinks with high heat dissipation performance suffer from complex structures or special processing techniques, resulting in high manufacturing difficulty, low production efficiency, and difficulty in achieving large-scale mass production. This prevents them from meeting the market demand for mass-produced heat sinks for high-capacity, high-end optical modules, limiting their promotion in actual production and applications.

[0006] Therefore, there is an urgent need for a new type of heat sink with high thermal conductivity, efficient heat dissipation structure and stable mass production capability. Utility Model Content

[0007] The present invention aims to solve the technical problems mentioned in the background art and provide a novel heat sink for high thermal conductivity optical modules.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a novel high thermal conductivity optical module heat sink, comprising: a substrate, wherein the substrate is provided with 8 air ducts for heat dissipation at equal intervals, the air ducts are manufactured by extruding copper and then CNC machining, and a thermally conductive protrusion is integrally formed at the middle of the bottom side of the substrate, the thermally conductive protrusion being used for heat contact conduction to the air duct for heat dissipation.

[0009] A further preferred embodiment: the heat-conducting protrusions, from left to right, include: a first heat-conducting protrusion, a second heat-conducting protrusion, and a third heat-conducting protrusion, wherein the first heat-conducting protrusion, the second heat-conducting protrusion, and the third heat-conducting protrusion are all irregularly stepped and have different shapes.

[0010] A further preferred embodiment: The first heat-conducting protrusion includes two oppositely arranged first heat-conducting platforms 1, each of which has a first heat-conducting platform 2 arranged on its left side. The area of ​​the first heat-conducting platform 2 is larger than that of the first heat-conducting platform 1, and the height of the first heat-conducting platform 1 is greater than that of the first heat-conducting platform 2. A first heat-conducting groove 1 is formed between the pair of first heat-conducting platforms 1 and first heat-conducting platforms 2. The first heat-conducting groove 1 is T-shaped, and a first heat-conducting groove 2 is formed on the right side of the first heat-conducting platform 1.

[0011] A further preferred embodiment: The second heat-conducting boss includes a second heat-conducting platform one, which is a wide flat plate. A second heat-conducting platform two is arranged at the middle left side of the second heat-conducting platform one. A second heat-conducting platform three is arranged on both the front and rear sides of the second heat-conducting platform two. A second heat-conducting platform four is arranged on both the front and rear sides of the second heat-conducting platform three. The thickness of the second heat-conducting platform one, the second heat-conducting platform two, the second heat-conducting platform three, and the second heat-conducting platform four decreases sequentially. The second heat-conducting platform two, the second heat-conducting platform three, and the second heat-conducting platform four are stepped in shape symmetrical about the second heat-conducting platform two as the axis.

[0012] A further preferred embodiment: The third heat-conducting protrusion includes two oppositely arranged third heat-conducting platforms 1, and a third heat-conducting platform 2 is arranged on the right side between the two front and rear third heat-conducting platforms 1. The area of ​​the third heat-conducting platform 2 is larger than the area of ​​the third heat-conducting platform 1, and a third heat-conducting groove 1 is formed between the two front and rear third heat-conducting platforms 1 and the third heat-conducting platform 2.

[0013] A further preferred embodiment: the substrate has grooves at both the left and right ends, and the top end of the groove is wider than the bottom end.

[0014] A further preferred embodiment: Two fixing studs are respectively arranged at the right end of the bottom side of the substrate and at the left and right ends of the third heat-conducting boss. The fixing studs are used to fix the heat sink to prevent it from falling or falling off.

[0015] Beneficial effects:

[0016] This new type of high thermal conductivity optical module heat sink features stepped thermally conductive protrusions that contact the chip and other heat-dissipating components, conducting heat through eight air ducts for dissipation. Made of copper, the heat sink and air ducts are integrated into a single unit, achieving a thermal conductivity of 350-380 W / (m·K). This represents a significant advantage over aluminum alloy heat sinks, which have a thermal conductivity of 155 W / (m·K). The innovative air duct structure ensures efficient heat dissipation. Furthermore, the air ducts are manufactured using pure copper extrusion molding followed by CNC machining, ensuring mass production feasibility and practicality. Attached Figure Description

[0017] Figure 1 This is a top view of the overall structure of this utility model.

[0018] Figure 2 This is a top view of the overall structure of this utility model from another perspective.

[0019] Figure 3 This is a schematic diagram of the overall structure of this utility model from a bottom view.

[0020] Figure 4 This is a schematic diagram of the overall structure of this utility model from a downward angle.

[0021] Figure 5 This is a schematic diagram of the upward-viewing planar structure of this utility model.

[0022] Figure 6 This is a schematic diagram of the left-side planar structure of this utility model.

[0023] Figure 7 This is a schematic diagram of the right-side planar structure of this utility model.

[0024] Figure 8 This is a bottom-view three-dimensional structural diagram of the first heat-conducting boss of this utility model.

[0025] Figure 9 This is a three-dimensional structural diagram of the first heat-conducting protrusion of this utility model from another perspective, viewed from below.

[0026] Figure 10 This is a bottom-view three-dimensional structural diagram of the second heat-conducting boss of this utility model.

[0027] Figure 11 This is a three-dimensional structural diagram of the second heat-conducting protrusion of this utility model from another perspective, viewed from below.

[0028] Figure 12 This is a bottom-view three-dimensional structural diagram of the third heat-conducting boss of this utility model.

[0029] Figure 13 This is a three-dimensional structural diagram of the third heat-conducting protrusion of this utility model from another perspective, viewed from below.

[0030] Figure 1-13 In the middle: 1. Substrate; 2. Air duct; 3. Groove; 4. Heat-conducting boss;

[0031] 41. First thermally conductive boss; 42. Second thermally conductive boss; 43. Third thermally conductive boss;

[0032] 5. Fix the studs;

[0033] 411-First heat conduction stage one; 412-First heat conduction stage two; 413-First heat conduction groove one; 414-First heat conduction groove two;

[0034] 421 - Second heat conduction stage one; 422 - Second heat conduction stage two; 423 - Second heat conduction stage three; 424 - Second heat conduction stage four;

[0035] 431 - Third heat conduction stage one; 432 - Third heat conduction stage two; 433 - Third heat conduction tank one. Detailed Implementation

[0036] The following will refer to the appendix in the embodiments of this utility model. Figures 1-13 The technical solutions in the embodiments of this utility model will be clearly and completely described.

[0037] Please see Figure 1-2 and Figure 6-7 In this embodiment of the present invention, a novel high thermal conductivity optical module heat sink includes: a substrate 1, which serves as the main supporting structure of the heat sink. On one hand, it provides a mounting and support foundation for components such as air ducts 2, heat-conducting protrusions 4, and fixing studs 5, ensuring the overall structural stability. On the other hand, it assists in heat conduction. When the heat-conducting protrusions 4 transfer the heat from the optical module chip to the substrate 1, the substrate 1 can evenly distribute the heat to eight air ducts 2 through its own metallic thermal conductivity, avoiding localized heat accumulation. The substrate 1 is made of extruded copper. The substrate 1 has eight equally spaced air ducts 2 for heat dissipation. The air ducts 2 are manufactured by extruding copper and then CNC machining. The air ducts 2 are the core heat dissipation channels of the heat sink, improving heat dissipation efficiency by increasing the heat dissipation area and enhancing air convection. The eight equally spaced air ducts maximize the heat dissipation area within the limited space of the substrate 1. Simultaneously, the equally spaced layout avoids airflow interference between air ducts, ensuring the airflow efficiency of each air duct. The substrate 1 is made of copper. With a thermal conductivity of approximately 350-380 W / (m·K), compared to 155 W / (m·K) for aluminum alloy, copper has a thermal conductivity 2.3-2.5 times that of traditional aluminum alloy. The extrusion process ensures the continuity of the air duct, followed by CNC precision machining to ensure a smooth inner wall and accurate dimensions. This reduces airflow resistance, allowing air to flow more smoothly through the duct and carry away more heat, while also improving thermal conductivity. The copper material quickly transfers heat from the substrate 1 to the duct wall, where it is then dissipated through air convection. A thermally conductive protrusion 4 is integrally formed on the bottom center of the substrate 1. This protrusion is used for heat transfer to the air duct 2 for heat dissipation. The integral molding process, where copper extrusion profiles directly form the substrate 1, air duct 2, and thermally conductive protrusion 4, completely eliminates the contact gaps in traditional split structures. Gaps create thermal resistance, making it difficult for heat to transfer across them. The integral molding allows the heat generated by the chip to be directly and quickly transferred to the substrate 1 and air duct 2, preventing heat buildup on the chip surface.

[0038] Please see Figure 3-5In this embodiment of the utility model, the heat-conducting protrusion 4 includes, from left to right, a first heat-conducting protrusion 41, a second heat-conducting protrusion 42, and a third heat-conducting protrusion 43. The first heat-conducting protrusion 41, the second heat-conducting protrusion 42, and the third heat-conducting protrusion 43 are all irregularly stepped and have different shapes. The heat-conducting protrusion 4 is designed as a three-segment irregular structure to adapt to the heat dissipation needs of chips with different positions and power inside the optical module. Because the chip layout inside the optical module is not uniform, the power of different chips is different, the heat generated is also different, the installation position is also different, and the contact space with the heat sink is also different. If a heat-conducting protrusion of uniform shape is used, there will be problems such as poor contact of some chips, heat not being able to be transferred, and excessive contact of some chips wasting space. The second heat-conducting protrusion 42 is thickened by the wide flat plate design, and the contact area is increased to improve the heat conduction efficiency. The three-segment structure covers the main heat-generating areas inside the optical module, ensuring that each chip can make close contact with the heat-conducting protrusion 4, achieving precise heat conduction and heat dissipation without dead corners.

[0039] Please see Figure 8-9 In this embodiment of the present invention, the first heat-conducting protrusion 41 includes two opposing first heat-conducting platforms 411. A second first heat-conducting platform 412 is arranged on the left side of each first heat-conducting platform 411. The area of ​​the second first heat-conducting platform 412 is larger than that of the first heat-conducting platform 411, and the height of the first heat-conducting platform 411 is greater than that of the second first heat-conducting platform 412. A first heat-conducting groove 413 is formed between the pair of first heat-conducting platforms 411 and the second first heat-conducting platform 412. The first heat-conducting groove 413 is T-shaped. A second first heat-conducting groove 414 is formed on the right side of the first heat-conducting platform 411. The first heat-conducting platform 411 is higher and is used to contact chips installed at higher positions in the optical module. The second first heat-conducting platform 412 is lower and is used to contact peripheral auxiliary chips installed at lower positions. This height adaptation ensures that both types of chips can make close contact with the protrusion, avoiding situations where taller chips cannot be contacted and shorter chips are damaged. The second first heat-conducting platform 412 has a larger area. The first heat-conducting platform 411 is smaller in area and is suitable for chips with higher power but limited installation space. The small area saves space, and the high power heat can be quickly transferred through the high thermal conductivity of copper. The first heat-conducting groove 413 is used to avoid protruding pins or small components inside the optical module. If the protrusion is a complete plane, it will interfere with these components, causing the heat sink to be unable to be installed or to damage the components. The first heat-conducting groove 413 can reserve installation space for components, while the groove wall can still conduct heat without affecting the overall heat conduction efficiency. The second heat-conducting groove 414 further avoids surrounding components and serves as an auxiliary heat dissipation channel. Air can flow in the groove, carrying away some of the heat from the surface of the protrusion, forming a dual effect of conduction and convection heat dissipation.

[0040] Please see Figure 10-11 In this embodiment of the present invention, the second heat-conducting protrusion 42 includes a second heat-conducting platform 421, which is a wide flat plate. A second heat-conducting platform 422 is arranged at the middle left side of the second heat-conducting platform 421. Second heat-conducting platforms 423 are arranged on both the front and rear sides of the second heat-conducting platform 422. Second heat-conducting platforms 424 are arranged on both the front and rear sides of the second heat-conducting platform 423. The thickness of the second heat-conducting platforms 421, 422, 423, and 424 decreases sequentially. The second heat-conducting platforms 422, 423, and 424 are stepped in a symmetrical manner about the second heat-conducting platform 422. The wide flat plate-shaped second heat-conducting platform 421 serves as the main heat dissipation area. The wide plane can fully contact the main chip with the highest power and the largest heat generation in the optical module. The larger the contact area, the less heat is generated. Higher heat transfer efficiency allows for rapid conduction of the large amount of heat generated by the main chip to substrate 1 and air duct 2, preventing the main chip from being dated or damaged due to high temperature. The stepped design with decreasing thickness of the second heat conduction platform 1 421, the second heat conduction platform 2 422, the third heat conduction platform 3 423, and the fourth heat conduction platform 424 is adapted to the layout of auxiliary chips with progressively decreasing power around the main chip. Their power and heat generation decrease with distance from the main chip. The progressively thinner protrusions can make precise contact with these auxiliary chips. High-power auxiliary chips correspond to thick protrusions, and low-power chips correspond to thin protrusions, ensuring heat dissipation while avoiding material waste and space occupation. The symmetrical design with the second heat conduction platform 2 422 as the axis is adapted to the symmetrical layout of auxiliary components inside the optical module. The symmetrical steps ensure that the contact area and heat conduction efficiency of the components on both sides are consistent, avoiding excessive local temperature caused by uneven heat dissipation on one side.

[0041] Please see Figure 12-13In this embodiment of the present invention, the third heat-conducting protrusion 43 includes two opposing third heat-conducting platforms 431. A second third heat-conducting platform 432 is arranged to the right between the two third heat-conducting platforms 431. The area of ​​the second third heat-conducting platform 432 is larger than that of the first third heat-conducting platform 431. A third heat-conducting groove 433 is formed between the two third heat-conducting platforms 431 and the second third heat-conducting platform 432. The two opposing third heat-conducting platforms 431 are used to contact small chips symmetrically distributed at the front and back edges of the optical module. These chips are usually of medium power and have dispersed installation positions. A single small protrusion can accurately cover a single chip. The chip design avoids wasting space due to excessively large boss areas. The large-area third heat conduction platform 432 is used for centralized chips with slightly higher power and requiring a large contact area in the contact edge area. The large-area design can improve heat conduction efficiency and quickly dissipate the heat generated by the chip. The third heat conduction groove 433 is mainly used to avoid connectors, ribbon cables or fixing posts at the edge of the optical module. Since there are usually many external interface-related components in the edge area, the groove can reserve installation space for these components to ensure that the heat sink can be installed smoothly. At the same time, the groove can enhance air circulation, help remove heat from the surface of the boss, and improve the local heat dissipation effect.

[0042] Please see Figure 1-2 and Figure 6-7 In this embodiment of the present invention, grooves 3 are provided at both ends of the substrate 1. The top end of the groove 3 is wider than the bottom end. The optical module housing usually has raised positioning ribs. The groove 3 can precisely match the positioning ribs. The shape design of being wider at the top and narrower at the bottom not only facilitates quick alignment during assembly, but also allows the wide opening at the top to guide the insertion of the positioning ribs. After assembly, the narrow opening can tightly fit with the positioning ribs, restricting the back-and-forth movement of the heat sink inside the optical module, ensuring the stability of the heat sink position, and avoiding the heat sink displacement and poor contact with the chip due to vibration. Moreover, the internal space of the optical module is compact, and the groove 3 can reduce the amount of material used at both ends of the substrate 1, achieving weight reduction, which is in line with the development trend of miniaturization and weight reduction of optical modules. At the same time, it avoids other structures inside the housing, such as buckles and wiring terminals, to avoid assembly interference. In addition, the inner wall of the groove 3 can increase the surface area of ​​the substrate 1, further increasing the air contact area, helping to dissipate the heat conducted by the substrate 1 itself, and indirectly improving the overall heat dissipation efficiency.

[0043] Please see Figure 2-5 and Figure 7In this embodiment of the present invention, two fixing studs 5 are respectively arranged at the right end of the bottom side of the substrate 1 at the left and right ends of the third heat-conducting protrusion 43. The fixing studs 5 are used to fix the heat sink to prevent it from falling or falling off. During transportation, installation or use, the optical module may be subjected to vibration and impact. The positioning of the groove 3 alone cannot completely prevent the heat sink from shifting. The fixing studs 5 can be rigidly connected to the optical module shell or internal bracket by screws. The four symmetrically distributed fixing studs 5 can form a stable fixing plane, which can completely prevent the heat sink from falling, falling off or shifting, and ensure that the heat-conducting protrusion 4 is always in close contact with the chip, avoiding the increase in thermal resistance due to the increase in contact gap. Furthermore, by placing the fixing studs 5 at both ends of the third heat-conducting protrusion 43, rather than directly below the heat-conducting protrusion 4, interference between the fixing studs 5 and the chip or heat conduction path can be avoided. If the fixing studs 5 were located directly below the heat-conducting protrusion 4, they would occupy the chip contact space or block heat conduction. The arrangement at both ends can ensure the fixing strength and allow the heat-conducting protrusion 4 to fully contact the chip without affecting the heat dissipation efficiency. In addition, the fixing studs 5 adopt an integrated molding process and are processed synchronously with the substrate 1. The dimensions are precise and can be adapted to automated screw fastening equipment, meeting the high-efficiency assembly requirements of optical module mass production and avoiding the problem of traditional split fasteners requiring separate installation and low efficiency.

Claims

1. A novel high thermal conductive optical module heat sink characterized by: include: The substrate (1) has 8 air ducts (2) for heat dissipation at equal intervals. The air ducts (2) are made by extruding copper and then CNC machining. The substrate (1) has a heat-conducting boss (4) integrally formed on the bottom side of the middle. The heat-conducting boss (4) is used to conduct heat to the air ducts (2) for heat dissipation.

2. A novel high thermal conductivity optical module heat sink according to claim 1, characterized in that: The heat-conducting protrusion (4) includes, from left to right, a first heat-conducting protrusion (41), a second heat-conducting protrusion (42) and a third heat-conducting protrusion (43). The first heat-conducting protrusion (41), the second heat-conducting protrusion (42) and the third heat-conducting protrusion (43) are all irregularly shaped steps and have different shapes.

3. A novel high thermal conductive optical module heat sink according to claim 2, characterized in that: The first heat-conducting protrusion (41) includes two oppositely arranged first heat-conducting platforms (411). A first heat-conducting platform (412) is arranged on the left side of each of the first heat-conducting platforms (411). The area of ​​the first heat-conducting platform (412) is larger than that of the first heat-conducting platform (411). The height of the first heat-conducting platform (411) is greater than that of the first heat-conducting platform (412). A first heat-conducting groove (413) is opened between the pair of first heat-conducting platforms (411) and first heat-conducting platforms (412). The first heat-conducting groove (413) is in the shape of a "T". A first heat-conducting groove (414) is opened on the right side of the first heat-conducting platform (411).

4. The novel high thermal conductive light module heat sink according to claim 2, characterized in that: The second heat-conducting protrusion (42) includes a second heat-conducting platform one (421), which is a wide flat plate. A second heat-conducting platform two (422) is arranged at the middle left side of the second heat-conducting platform one (421). A second heat-conducting platform three (423) is arranged on both the front and rear sides of the second heat-conducting platform two (422). A second heat-conducting platform four (424) is arranged on both the front and rear sides of the second heat-conducting platform three (423). The thickness of the second heat-conducting platform one (421), the second heat-conducting platform two (422), the second heat-conducting platform three (423) and the second heat-conducting platform four (424) decreases sequentially. The second heat-conducting platform two (422), the second heat-conducting platform three (423) and the second heat-conducting platform four (424) are in a stepped shape symmetrical about the second heat-conducting platform two (422).

5. The novel high thermal conductive light module heat sink according to claim 2, characterized in that: The third heat-conducting protrusion (43) includes two oppositely arranged third heat-conducting platforms (431), and a third heat-conducting platform (432) is arranged on the right between the two third heat-conducting platforms (431). The area of ​​the third heat-conducting platform (432) is larger than the area of ​​the third heat-conducting platform (431). A third heat-conducting groove (433) is opened between the two third heat-conducting platforms (431) and the third heat-conducting platform (432).

6. A novel high thermal conductivity optical module heat sink according to claim 1, characterized in that: The substrate (1) has grooves (3) at both ends, with the top of the groove (3) being wider than the bottom.

7. A novel high thermal conductive light module heat sink according to claim 2, characterized in that: Two fixing studs (5) are arranged at the right end of the bottom side of the substrate (1) at the left and right ends of the third heat-conducting boss (43). The fixing studs (5) are used to fix the heat sink to prevent it from falling or falling off.

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