A heat dissipation module

Abstract

The utility model relates to optical module heat dissipation technical field discloses a heat dissipation module, including connecting piece, the one end surface of connecting piece forms the installation position of being suitable for fixed optical module, and the other end surface forms the fixed position, the heat dissipation piece includes the main body heat dissipation part of integrative mould and sets up a plurality of heat dissipation tines on main body heat dissipation part, and the main body heat dissipation part is fitted and is installed on the fixed position, and a plurality of heat dissipation tines are mutually parallel and are arranged at intervals along the same direction, and form the heat dissipation air duct between adjacent heat dissipation tines, a plurality of heat dissipation tines are integrative mould with main body heat dissipation part through the process of spade tooth, and the heat dissipation piece of the utility model adopts the process of spade tooth integrative mould main body heat dissipation part and a plurality of parallel interval heat dissipation tines, has broken through the bottleneck of traditional machining process on the manufacture of ultrathin, high density fin, has guaranteed structure strength, and the special heat dissipation air duct formed by adjacent heat dissipation tines can improve heat dissipation efficiency more, reduces the thermal resistance.

Description

Technical Field

[0001] This utility model relates to the field of optical module heat dissipation technology, specifically to a heat dissipation module. Background Technology

[0002] As data centers and communication networks evolve towards higher speeds and computing power, the transmission rate of optical modules is continuously increasing, and their power density and heat generation are also increasing dramatically. At the same time, the trend of miniaturization and high-density integration of equipment requires the size of optical modules to continue to shrink. Taking the mainstream QSFP-DD packaged optical module as an example, its size is only 76.2×18.3×13.4mm. This leads to a more compact layout of its internal components and an increase in volumetric heat density, creating a contradiction of "increased power consumption and reduced size." The heat dissipation structure needs to be adapted to the tiny size of the module and even achieve efficient heat dissipation in narrower installation spaces.

[0003] However, common integrated or external heat dissipation structures often struggle to achieve effective heat dissipation area within a confined space for optical modules that are only a few centimeters in size, and they also suffer from drawbacks such as high thermal resistance and complex manufacturing processes. Traditional machining processes also face bottlenecks in manufacturing ultra-thin, high-density fins suitable for micro-modules, making it difficult to achieve synergistic optimization of heat dissipation performance and module miniaturization while ensuring structural strength. Utility Model Content

[0004] In view of this, the present invention provides a heat dissipation module to solve the problems in the prior art, such as excessively high heat density caused by the reduction in size and increase in power consumption of optical modules, and the difficulty of achieving efficient heat dissipation in a small space, complex process, and high thermal resistance of traditional heat dissipation structures.

[0005] This utility model provides a heat dissipation module, including: A connector, wherein one end face of the connector forms a mounting position suitable for fixing the optical module, and the other end face forms a fixing position; The heat sink includes an integrally formed main heat sink and a plurality of heat sink teeth disposed on the main heat sink. The main heat sink is fitted and mounted on the fixed position. The plurality of heat sink teeth are arranged parallel to each other and spaced apart in the same direction, and heat dissipation channels are formed between adjacent heat sink teeth. The plurality of heat sink teeth are integrally formed with the main heat sink by a tooth-shaving process.

[0006] Optionally, the connection between the heat dissipation teeth and the main heat dissipation part is formed into an arc-shaped connection.

[0007] Optionally, the heat sink is a copper heat sink.

[0008] Optionally, the thickness of the heat dissipation teeth is 0.05mm-0.5mm.

[0009] Optionally, the connector is a U-shaped connector, and the opening side of the U-shaped connector forms the fixing position.

[0010] Optionally, the U-shaped connector includes a main board portion and fixing portions disposed on both sides of the main board portion. The plane of the main heat dissipation portion is parallel to the plane of the main board portion. The heat dissipation teeth are parallel to the fixing portions, and the two heat dissipation teeth near the fixing portions are spaced apart from the fixing portions to form a heat dissipation channel.

[0011] Optionally, the fixing part abuts against the main heat dissipation part, and the heat dissipation teeth abut against the main board part.

[0012] Optionally, the contact area between the fixing part and the heat dissipation part of the main body is filled with heat dissipation material; And / or, the heat dissipation teeth and the motherboard portion are filled with heat dissipation material.

[0013] Optionally, the U-shaped connector is formed using CNC, MIM, or powder metallurgy processes.

[0014] Optionally, the connector is a copper connector.

[0015] Beneficial effects This utility model provides a heat dissipation module, including a connector, one end face of which forms an installation position suitable for fixing an optical module, and the other end face forms a fixing position; a heat dissipation component, including an integrally formed main heat dissipation part and a plurality of heat dissipation teeth disposed on the main heat dissipation part, the main heat dissipation part being fitted and mounted on the fixing position, the plurality of heat dissipation teeth being arranged parallel to each other and spaced apart in the same direction, and heat dissipation air channels being formed between adjacent heat dissipation teeth; the plurality of heat dissipation teeth being integrally formed with the main heat dissipation part by a tooth-shaving process.

[0016] The heat dissipation module provided by this utility model adopts a shovel-tooth process to integrally form the main heat dissipation part and multiple parallel and spaced heat dissipation teeth. This not only breaks through the bottleneck of traditional machining process in the manufacturing of ultra-thin, high-density fins, ensuring structural strength, but also increases the heat dissipation area. The dedicated heat dissipation air duct formed by adjacent heat dissipation teeth can further improve heat dissipation efficiency and reduce thermal resistance. The overall structure does not require external attachment or complex assembly. The process is simple and adaptable to the high-density integration requirements of optical modules. It achieves synergistic optimization of heat dissipation performance, structural miniaturization and process feasibility, effectively alleviating the heat dissipation pressure of micro optical modules. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a heat dissipation module according to an embodiment of the present utility model; Figure 2 This is a schematic diagram of the connector structure according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the heat sink component according to an embodiment of the present invention; Explanation of reference numerals in the attached figures: 1. Connector; 11. Mounting position; 12. Fixing position; 13. Main board; 14. Fixing part; 2. Heat sink; 21. Main heat sink; 22. Heat sink fins. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] The following is combined Figures 1 to 3 The following describes embodiments of the present invention.

[0021] According to an embodiment of the present invention, a heat dissipation module is provided, comprising: Connector 1, one end face of connector 1 forms a mounting position 11 suitable for fixing the optical module, and the other end face forms a fixing position 12; The heat sink 2 includes an integrally formed main heat sink 21 and a plurality of heat sink teeth 22 disposed on the main heat sink 21. The main heat sink 21 is fitted and mounted on the fixed position 12. The plurality of heat sink teeth 22 are arranged parallel to each other and spaced apart in the same direction, and heat dissipation air channels are formed between adjacent heat sink teeth 22. The plurality of heat sink teeth 22 are integrally formed with the main heat sink 21 by a tooth-shaving process.

[0022] It should be noted that the maximum size of this heat dissipation module is 75x25x10mm. Within this size, the ultra-thin heat dissipation teeth 22 processed by the tooth-shaving process can still achieve a high-density arrangement, maintaining sufficient heat dissipation area and smooth heat dissipation airflow within a limited volume, ensuring that the heat dissipation performance does not decrease due to size compression, and achieving a synergy between miniaturization and efficient heat dissipation.

[0023] It should be noted that the tooth-shaving process is an integrated forming and processing technology for metal heat dissipation structures. Using a combination of cutting and extrusion processing on specialized CNC equipment, continuously arranged heat dissipation teeth 22 are directly processed on high thermal conductivity metal substrates such as aluminum and copper without splicing or secondary assembly. This not only achieves seamless connection between the heat dissipation teeth 22 and the main heat dissipation part 21, completely eliminating contact thermal resistance and improving structural strength, but also breaks through the bottleneck of traditional machining to produce ultra-thin, high-density heat dissipation tooth 22 structures. This maximizes the heat dissipation area within the limited space of the optical module. At the same time, the height, thickness, and spacing of the heat dissipation teeth 22 can be flexibly adjusted by controlling the processing parameters to ensure smooth heat dissipation airflow. Moreover, the process is simple, has high mass production efficiency, and is compatible with a variety of high thermal conductivity materials. It takes into account both heat dissipation performance and application economy, effectively solving the heat dissipation problems caused by the increase in power consumption and reduction in size of micro optical modules. It provides key process support for the synergistic optimization of miniaturization, high density, and low thermal resistance of heat dissipation modules.

[0024] The heat dissipation module provided in this embodiment uses a shovel-tooth process to integrally form the main heat dissipation part 21 and multiple parallel and spaced heat dissipation teeth 22. This not only breaks through the bottleneck of traditional machining processes in the manufacturing of ultra-thin, high-density fins, ensuring structural strength, but also increases the heat dissipation area. The dedicated heat dissipation air duct formed by adjacent heat dissipation teeth 22 can further improve heat dissipation efficiency and reduce thermal resistance. The overall structure does not require external attachment or complex assembly. The process is simple and adaptable to the high-density integration requirements of optical modules. It achieves synergistic optimization of heat dissipation performance, structural miniaturization and process feasibility, effectively alleviating the heat dissipation pressure of micro optical modules.

[0025] Furthermore, an arc-shaped connection is formed at the junction of the heat dissipation fins 22 and the main heat dissipation part 21.

[0026] In a straightforward manner, the arc-shaped connection between the heat dissipation tooth 22 and the main heat dissipation part 21 forms a rounded corner. This rounded corner not only disperses the stress concentration at the tooth root after the tooth is formed, avoiding tooth breakage or fracture during high-frequency vibration or installation stress, but also improves the structural stability and service life of the heat dissipation component 2. Furthermore, it optimizes the heat conduction path. The arc-shaped surface increases the contact conduction area between the tooth root and the main heat dissipation part 21, reducing local thermal resistance and allowing the heat generated by the optical module to be more smoothly conducted to the entire area of ​​the heat dissipation tooth 22.

[0027] Furthermore, heat sink 2 is a copper heat sink.

[0028] It should be noted that heat sink 2 is made of pure copper. Since pure copper has a high thermal conductivity (typically above 380 W / m·K), far exceeding that of aluminum alloy (approximately 96 W / m·K), using pure copper improves the overall thermal conductivity of heat sink 2 from the heat source to the fin array, resulting in lower overall thermal resistance. It should be understood that the choice between pure copper and aluminum alloy is a decision made after comprehensively weighing factors such as heat dissipation performance, manufacturing cost, and overall weight. For 1.6T or even 3.2T optical modules with extremely demanding heat dissipation requirements, pure copper is the preferred option; while for cost-sensitive or weight-constrained conventional applications, copper alloys offer a more economical solution.

[0029] Furthermore, the thickness of the heat dissipation teeth 22 is 0.05mm-0.5mm.

[0030] Intuitively, the heat dissipation fins 22 employ a fin thickness range of 0.05mm-0.5mm, balancing the heat dissipation requirements of the miniature optical module with structural reliability. Each fin range is suitable for different application scenarios: 0.05mm, as the minimum fin thickness, maximizes the number of fins within the limited space of the optical module, increasing the heat dissipation area. This is particularly suitable for the confined installation space of ultra-miniaturized packages such as OSFP-XD. Combined with copper alloy material and fin-cutting technology, it overcomes space limitations while ensuring the strength of the basic structure. Intermediate values ​​(such as 0.2-0.3mm) represent the optimal balance between heat dissipation performance and structural stability. The design retains sufficient tooth density to ensure unobstructed heat dissipation airflow while also possessing excellent resistance to deformation and vibration, making it suitable for the general heat dissipation needs of most QSFP-DD and medium-to-high power optical modules. With a maximum tooth thickness of 0.5mm, the structure offers superior strength, capable of withstanding thermal stress under long-term high-temperature conditions of high-power optical modules and mechanical impacts during installation. This makes it suitable for demanding scenarios where the durability of the heat dissipation teeth is critical. This thickness range allows for flexible adaptation to the size, power consumption, and operating conditions of different optical modules, achieving a match between heat dissipation area, structural strength, and application adaptability without taking up additional space.

[0031] Furthermore, connector 1 is a U-shaped connector, and the opening side of the U-shaped connector forms a fixing position 12.

[0032] In essence, the U-shaped structure can conform to the outline of the optical module to achieve a compact layout. The design of the open side allows the main heat dissipation part 21 of the heat sink 2 to be quickly inserted and aligned from the opening. The fixing position 12 is specifically formed by the inner wall of the opening side of the U-shaped connector 1 to form a flat fitting surface. This fitting surface matches the outer dimensions of the main heat dissipation part 21 (such as the fitting surface dimensions of the corresponding main heat dissipation part 21). The two are tightly fixed by screw fastening, snap-fit ​​engagement or thermal adhesive bonding. At the same time, the two side walls of the U-shaped structure can provide lateral restraint for the heat sink 2 to prevent displacement or loosening during installation or use. This ensures the tight fit between the main heat dissipation part 21 and the connector 1 to reduce contact thermal resistance, simplifies the assembly process, and the overall structure does not occupy too much extra space. It is perfectly adapted to the narrow installation scenario of high-density integration of optical modules, further improving the installation reliability and usage stability of the heat dissipation module.

[0033] Furthermore, the U-shaped connector includes a main board portion 13 and fixing portions 14 disposed on both sides of the main board portion 13. The plane on which the main heat dissipation portion 21 is located is parallel to the plane on the main board portion 13. The heat dissipation teeth 22 are disposed parallel to the fixing portions 14, and the two heat dissipation teeth 22 near the fixing portions 14 are spaced apart from the fixing portions 14 to form a heat dissipation channel.

[0034] In a straightforward manner, the U-shaped connector, through the structural design of the main board portion 13 and the two side fixing portions 14, combined with the layout where the surface of the main heat dissipation portion 21 is parallel to the surface of the main board portion 13, the heat dissipation fins 22 are parallel to the fixing portions 14, and the heat dissipation fins 22 on both sides are spaced apart from the fixing portions 14, not only allows the heat dissipation component 2 and the connector 1 to form a neat and fitting assembly structure, maximizing the use of the internal space of the U-shaped connector without occupying additional installation space around the optical module, perfectly adapting to the compact layout requirements of the micro optical module; it also forms a dedicated heat dissipation channel through the spacing between the heat dissipation fins 22 on both sides and the fixing portions 14. The air ducts between the heat sink 21 and the adjacent heat sink 22 are interconnected, forming a comprehensive heat dissipation airflow path without dead angles, effectively reducing airflow resistance, improving heat exchange efficiency, and avoiding local heat accumulation; at the same time, the parallel layout allows the main heat sink 21 to fit more tightly and evenly with the motherboard 13, reducing contact thermal resistance. The lateral limiting effect of the fixing parts 14 on the heat sink 2 is also further enhanced, and the fixing parts 14 can provide effective protection for the heat sink 22, preventing displacement or loosening during assembly or use, thereby damaging the heat sink 22, and further improving the overall structural reliability of the heat dissipation module.

[0035] Furthermore, the fixing part 14 is abutted against the main heat dissipation part 21, and the heat dissipation teeth 22 are abutted against the main board part 13.

[0036] In an easy-to-understand manner, the contact arrangement between the fixing part 14 and the main heat dissipation part 21, and between the heat dissipation teeth 22 and the motherboard part 13, not only improves the tightness of the fit between the components and reduces the contact thermal resistance to accelerate heat conduction, but also strengthens the overall structural stability through multi-point contact, preventing displacement and loosening during use, while not taking up extra space, perfectly adapting to the compact installation and efficient heat dissipation requirements of micro optical modules.

[0037] Furthermore, the contact area between the fixing part 14 and the main heat dissipation part 21 is filled with heat dissipation material; And / or, the heat dissipation fins 22 and the motherboard portion 13 are filled with heat dissipation material.

[0038] In an easy-to-understand way, the contact points between the fixing part 14 and the main heat dissipation part 21, and between the heat dissipation teeth 22 and the motherboard part 13 are filled with heat dissipation material (such as thermally conductive grease, thermally conductive gel or thermally conductive pads with high thermal conductivity. These materials have both good filling properties and thermal conductivity, and can fit tightly into the tiny gaps of the contact surface). This can completely eliminate the high contact thermal resistance caused by the air gaps on the contact surface, allowing the heat of the optical module to be quickly conducted to the entire area of ​​the heat dissipation component 2 through the heat dissipation material, thereby improving the heat dissipation efficiency. It can also use the adhesive or bonding properties of the heat dissipation material to help fix each component, enhance the reliability of the structural connection, and avoid loosening or displacement caused by vibration or temperature changes. Moreover, the material filling does not occupy additional space.

[0039] In some alternative embodiments, to ensure a durable, stable, and low-thermal-resistance connection between the fixing part 14 and the main heat dissipation part 21, the two can be directly fixed by welding. The metallurgical bonding layer formed by welding can effectively eliminate air gaps between contact interfaces, reduce interface contact thermal resistance, and thus achieve an efficient heat conduction path from the optical module housing to the heat dissipation module. Specific welding methods include, but are not limited to, tin soldering, copper soldering, or silver soldering. Using alloy solders such as tin-silver or tin-bismuth has a low melting point and simple process, making it suitable for heat-sensitive scenarios requiring good thermal conductivity; using silver-based solder has excellent wettability, filling properties, and thermal conductivity, and can form a high-quality metallurgical bond on a pure copper substrate, making it one of the preferred solutions for achieving a low-thermal-resistance, high-strength connection; while using copper solder, which is made of the same material as the main body, can achieve the same thermal conductivity. In addition, this integrated welding structure also improves the overall mechanical integrity of the heat dissipation module, enabling it to maintain stable heat dissipation performance under harsh conditions such as vibration and insertion / removal, avoiding the attenuation of heat dissipation efficiency due to loose connections.

[0040] Furthermore, the U-shaped connector is formed using CNC, MIM, or powder metallurgy processes.

[0041] It is easy to understand that the U-shaped connector adopts CNC or powder metallurgy forming process, which can match the compact installation requirements of micro optical modules. It ensures the dimensional accuracy, flatness of the mating surface and structural strength of the motherboard part 13 and the two side fixing parts 14, ensuring a tight fit with the optical module and heat sink 2, while also taking into account mass production efficiency and cost controllability, perfectly meeting the core requirements of high-precision assembly and high-reliability use of heat sink modules.

[0042] It should be noted that CNC forming process refers to the high-precision machining of complex contours and tiny dimensions of U-shaped connectors by controlling the machining path through a numerical control system. It controls key parameters such as wall thickness and spacing of fixing parts, ensures the smoothness of the mating surface to reduce contact thermal resistance, and adapts to personalized structural adjustment needs.

[0043] MIM (Metal Injection Molding) technology involves mixing metal powder with a binder to create a flowable feedstock, which is then injected into a mold cavity using an injection molding machine to form a preform. After debinding to remove the binder, the preform is sintered at high temperature to achieve densification. This process can achieve near-net-shape molding with dimensional accuracy within ±0.1mm. It can precisely control key parameters such as the wall thickness of U-shaped connectors and the spacing of fixing parts, ensuring a tight fit with optical modules and heat sinks. The sintered material has a uniform microstructure and high density (up to 95% or more), with stable structural strength and thermal conductivity, making it suitable for high-frequency vibration applications of micro optical modules.

[0044] Powder metallurgy forming is a technology that involves mixing metal powders in a specific ratio, pressing them into U-shaped connecting blanks in a mold using a press, and then sintering them at high temperature to densify the powder particles. This process offers advantages such as high material utilization, the ability to directly press a U-shaped integral structure consisting of the main body and the two side fixing parts, reducing material waste; the dense and uniform strength of the sintered blanks, meeting the requirements of the connecting parts for support strength and thermal conductivity; and a simple process flow, high mass production efficiency, and controllable costs.

[0045] Powder metallurgy forming process can achieve near-net-shape forming, with high material utilization and dense and uniform structure after forming. It does not require complex subsequent processing, has higher mass production efficiency and more cost advantages. Both processes can meet the assembly accuracy and structural stability requirements of U-shaped connectors in the narrow installation space of micro optical modules.

[0046] Furthermore, connector 1 is a copper connector.

[0047] It is easy to understand that connector 1 is made of pure copper, and its technical effect is the same as that of pure copper heat sink. Its technical effect will not be elaborated here.

[0048] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A heat dissipation module, characterized by, include: Connector (1), one end face of which forms a mounting position (11) suitable for fixing the optical module, and the other end face forms a fixing position (12). The heat sink (2) includes an integrally formed main heat sink (21) and a plurality of heat sink teeth (22) disposed on the main heat sink (21). The main heat sink (21) is fitted and mounted on the fixed position (12). The plurality of heat sink teeth (22) are arranged parallel to each other and spaced apart in the same direction. A heat dissipation channel is formed between adjacent heat sink teeth (22). The plurality of heat sink teeth (22) are integrally formed with the main heat sink (21) by a tooth-shaving process.

2. The heat dissipation module of claim 1, wherein, The connection between the heat dissipation teeth (22) and the main heat dissipation part (21) forms an arc-shaped connection.

3. The heat dissipation module of claim 2, wherein, The heat sink (2) is a copper heat sink.

4. The heat dissipation module of claim 3, wherein, The thickness of the heat dissipation teeth (22) is 0.05mm-0.5mm.

5. The heat dissipation module according to any one of claims 1-4, characterized in that, The connector (1) is a U-shaped connector, and the opening side of the U-shaped connector forms the fixing position (12).

6. The heat dissipation module of claim 5, wherein, The U-shaped connector includes a main board (13) and a fixing part (14) disposed on both sides of the main board (13). The plane of the main heat dissipation part (21) is parallel to the plane of the main board (13). The heat dissipation teeth (22) are disposed parallel to the fixing part (14), and the two heat dissipation teeth (22) close to the fixing part (14) are spaced apart from the fixing part (14) to form a heat dissipation channel.

7. The heat dissipation module of claim 6, wherein, The fixing part (14) is abutted against the main heat dissipation part (21), and the heat dissipation teeth (22) are abutted against the main board part (13).

8. The heat dissipation module of claim 7, wherein, The fixing part (14) and the main heat dissipation part (21) are filled with heat dissipation material at the contact position; And / or, the heat dissipation teeth (22) and the main board portion (13) are filled with heat dissipation material.

9. The heat dissipation module of claim 5, wherein, The U-shaped connector is formed using CNC, MIM, or powder metallurgy processes.

10. The heat dissipation module according to any one of claims 1-4, wherein, The connector (1) is a copper connector.

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