drive mechanism

Abstract

A driving mechanism for moving an optical element includes a fixed portion, a movable portion, and a driving assembly. The movable portion is movably connected to the fixed portion and is used to support the optical element. The driving assembly drives the movable portion to move relative to the fixed portion.

Description

Technical Field

[0001] This utility model relates to a driving mechanism. More specifically, this utility model relates to a driving mechanism for moving optical elements. Background Technology

[0002] With the development of technology, many electronic devices today (such as smartphones or digital cameras) have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with photographic or video recording functions include a lens drive module to drive an optical element to move, thereby achieving autofocus and optical image stabilization (OIS). Light can pass through the aforementioned optical element to form an image on a photosensitive element.

[0004] However, further miniaturization of the lens drive module and ensuring its sufficient structural strength have become significant challenges for researchers in this field. Utility Model Content

[0005] The purpose of this invention is to provide a driving mechanism to solve at least one of the above-mentioned problems.

[0006] In view of the aforementioned known problems, one embodiment of the present invention provides a driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, and the driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part, wherein the optical element is disposed on the movable part. The driving assembly is used to drive the movable part to move relative to the fixed part.

[0007] In one embodiment, the aforementioned driving mechanism further includes a plurality of conductive elements and a grounding element, and the aforementioned fixing part includes a housing and a base connected to each other, wherein the aforementioned conductive elements and the aforementioned grounding element are fixed in the aforementioned base, and the aforementioned grounding element is electrically connected to the aforementioned housing.

[0008] In one embodiment, the aforementioned conductive element and the aforementioned grounding element are embedded in the aforementioned base in a molded manner.

[0009] In one embodiment, the aforementioned driving mechanism further includes a lower spring, which is movably connected to the aforementioned base and the aforementioned movable member, and at least one of the aforementioned conductive members is formed with a platform portion, which is exposed on the top side of the aforementioned base and electrically connected to the aforementioned lower spring.

[0010] In one embodiment, the aforementioned movable member has a winding post, and the aforementioned base has two extensions extending toward the aforementioned optical axis, wherein the aforementioned winding post is located between the aforementioned extensions.

[0011] In one embodiment, the aforementioned driving mechanism further includes a circuit assembly disposed on the aforementioned base, the aforementioned conductive element being electrically connected to the aforementioned circuit assembly, and the aforementioned grounding element being located between the aforementioned conductive elements and connected to the aforementioned housing.

[0012] In one embodiment, the aforementioned grounding member forms a protruding structure, a grounding portion, and a trench, wherein the aforementioned protruding structure and the aforementioned grounding portion extend toward a first direction and are exposed on the same side of the aforementioned base, and the aforementioned trench is formed between the aforementioned protruding structure and the aforementioned grounding portion, wherein the aforementioned first direction is perpendicular to the aforementioned optical axis.

[0013] In one embodiment, the width of the aforementioned protruding structure is smaller than the width of the aforementioned grounding portion.

[0014] In one embodiment, the aforementioned grounding member further forms two protruding structures and two grooves, the aforementioned grounding portion is located between the aforementioned protruding structures, and the aforementioned grooves are located between the aforementioned protruding structures and the aforementioned grounding portion.

[0015] In one embodiment, the aforementioned housing is made of metal, and the aforementioned grounding portion is electrically connected to the aforementioned housing by welding or soldering.

[0016] In one embodiment, the aforementioned driving mechanism further includes a circuit assembly disposed on the aforementioned base, and the aforementioned movable member has a first protrusion and a second protrusion, wherein the aforementioned first and second protrusions are located on opposite sides of the aforementioned movable member, and the aforementioned second protrusion faces the aforementioned circuit assembly.

[0017] In one embodiment, the aforementioned movable member is formed with a first protrusion and a second protrusion extending in the direction of the aforementioned optical axis. The first protrusion is located below the aforementioned first protrusion and faces the aforementioned base, and the second protrusion is located below the aforementioned second protrusion and faces the aforementioned base.

[0018] In one embodiment, the aforementioned movable member is formed with a third protrusion and a fourth protrusion extending toward the aforementioned optical axis, wherein the aforementioned first, second, third and fourth protrusions are respectively located on four different sides of the aforementioned movable member.

[0019] In one embodiment, the area of ​​the first protrusion is larger than the area of ​​the second protrusion.

[0020] In one embodiment, the area of ​​the second protrusion is larger than the area of ​​the third protrusion.

[0021] In one embodiment, the shape of the first protrusion is different from the shape of the second protrusion.

[0022] In one embodiment, the aforementioned driving mechanism further includes a magnetic field sensing element and a magnet, the magnet being disposed on the aforementioned movable member, and the aforementioned magnetic field sensing element being disposed on the aforementioned circuit assembly, for sensing the positional change of the aforementioned magnet.

[0023] In one embodiment, the aforementioned driving mechanism further includes a thermosetting adhesive, and the aforementioned second protrusion forms a groove, wherein the aforementioned magnet is disposed in the aforementioned groove, and the aforementioned thermosetting adhesive is disposed on the bottom surface of the aforementioned groove for bonding the aforementioned magnet and the aforementioned movable member.

[0024] In one embodiment, the aforementioned driving mechanism further includes a photocurable adhesive covering the aforementioned magnet and the aforementioned groove, with the aforementioned magnet located between the aforementioned thermocurable adhesive and the aforementioned photocurable adhesive.

[0025] In one embodiment, the aforementioned photocurable adhesive protrudes from the surface of the aforementioned second protrusion. Attached Figure Description

[0026] Figure 1 This is an exploded view of a drive mechanism according to an embodiment of the present invention.

[0027] Figure 2 express Figure 1 Another exploded view of the drive mechanism in the diagram.

[0028] Figure 3 express Figure 1 and Figure 2 The drive mechanism is shown in the 3D diagram after assembly.

[0029] Figure 4 A perspective view showing the housing and base of the drive mechanism before assembly.

[0030] Figure 5 This is an exploded view showing the base, circuit components, and conductive components before they are assembled.

[0031] Figure 6 A schematic diagram showing the electrical connection between conductive components and circuit components.

[0032] Figure 7 This is a side view of a conductive component.

[0033] Figure 8 A three-dimensional view showing the combination of the base, circuit components, and conductive components.

[0034] Figure 9 This is a perspective view of the drive mechanism, showing adhesive on the bottom side of the base.

[0035] Figure 10 This is a perspective view of the aforementioned drive mechanism after the housing and upper spring have been removed.

[0036] Figure 11 This is a top view of the aforementioned drive mechanism after the housing and upper spring have been removed.

[0037] Figure 12 A three-dimensional view showing the carrier and magnet after assembly.

[0038] Figure 13 This is a perspective view showing the carrier and magnet after assembly.

[0039] Figure 14 This is a bottom view of the aforementioned support component.

[0040] Figure 15 A cross-sectional view showing that the magnet is disposed in the groove of the second protrusion of the carrier.

[0041] Figure 16 This diagram illustrates the application of light-curing adhesive to the outer side of the second protrusion of the carrier.

[0042] The attached figures are labeled as follows:

[0043] 100: Drive mechanism

[0044] B: Plastic base

[0045] B1: Extension Section

[0046] B11: Depression

[0047] B2: Extension Section

[0048] BS: Lower spring

[0049] C: Coil

[0050] F: Circuit components

[0051] FS: Upper Spring

[0052] G: Glue

[0053] G1: Thermosetting adhesive

[0054] G2: Light-curing adhesive

[0055] H: Shell

[0056] HM: Magnet

[0057] HS: Magnetic field sensing element

[0058] LH: Load-bearing component

[0059] LH1: First protrusion

[0060] LH2: Second protrusion

[0061] LH3: Winding Post

[0062] LH4: Winding Post

[0063] M: Magnetic element

[0064] O: Optical axis

[0065] P: Conductive component

[0066] P1: Conductive component

[0067] P2: Conductive component

[0068] P3: Conductive component

[0069] P4: Conductive component

[0070] P5: Conductive component

[0071] P6: Conductive component

[0072] P7: Support component

[0073] P8: Support component

[0074] P11: Platform Department

[0075] P61: Platform Department

[0076] P21: End

[0077] P31: End

[0078] P41: End

[0079] P51: End

[0080] PG: Grounding component

[0081] PG1: End

[0082] PG2: Protruding structure

[0083] PG3: Grounding section

[0084] PG4: Groove

[0085] R: Groove

[0086] ST1: First bump

[0087] ST2: Second bump

[0088] ST3: Third bump

[0089] ST4: Fourth Bump

[0090] W: Conductor Detailed Implementation

[0091] The following describes the drive mechanism of an embodiment of the present invention. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts that can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the present invention in a particular manner and are not intended to limit the scope of the present invention.

[0092] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0093] The foregoing and other technical contents, features, and effects of this utility model will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present utility model.

[0094] Please refer to the following: Figures 1 to 4 ,in Figure 1 This is an exploded view of a drive mechanism 100 according to an embodiment of the present invention. Figure 2 express Figure 1 Another exploded view of the drive mechanism 100 in the middle, Figure 3 express Figure 1 and Figure 2 The drive mechanism 100 is shown in the three-dimensional view after assembly. Figure 4 This is a perspective view of the housing H and base B of the drive mechanism 100 before assembly.

[0095] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the drive mechanism 100 in this embodiment is, for example, a voice coil motor (VCM), which can be installed inside a mobile phone or other portable electronic device to drive an optical element (e.g., an optical lens) to move, thereby achieving functions such as autofocus (AF) or optical image stabilization (OIS).

[0096] The aforementioned driving mechanism 100 mainly includes a hollow housing H, a plastic base B, a circuit assembly F, a carrier LH, an upper spring FS, at least one lower spring BS, at least one magnetic element M, and at least one coil C. In this embodiment, the aforementioned housing H has a hollow structure and is connected to the base B, while the circuit assembly F is fixed to one side of the base B. The housing H and the base B together form a fixed part of the driving mechanism 100.

[0097] Furthermore, the aforementioned carrier LH is movably housed within the housing H, and an optical element (not shown) can be fixed within the carrier LH, wherein the aforementioned carrier LH constitutes a movable part that can move relative to the aforementioned fixed part (housing H and base B).

[0098] Specifically, the aforementioned carrier LH is connected to the housing H and the base B via upper and lower springs FS and BS, respectively, allowing the carrier LH to be movably suspended within the drive mechanism 100. Through this configuration, external light can enter the drive mechanism 100 along the optical axis O (Z-axis direction) of the optical element, passing through the optical lens and reaching an image sensing element (not shown) located below the base B, thereby generating a digital image.

[0099] It should be noted that a coil C is provided on each side of the aforementioned carrier LH, and a magnetic element M (e.g., a magnet) corresponding to the aforementioned coil C is provided on the inner side of the housing H. The aforementioned coil C and magnetic element M can constitute a driving assembly.

[0100] When a current signal is applied to the aforementioned coil C, the magnetic force generated between the coil C and the magnetic element M drives the carrier LH and the optical element disposed therein to move together relative to the base B and the housing H along the optical axis O (Z axis direction), thereby achieving the function of autofocus (AF) or optical image stabilization (OIS).

[0101] Depend on Figure 1 As can be seen, a magnetic field sensing element HS is provided on the circuit assembly F, and a magnet HM is provided on one side of the carrier LH. Figure 12 The aforementioned magnetic field sensing element HS can be used to sense the positional change of the aforementioned magnet HM. For example, the aforementioned magnetic field sensing element HS can be a Hall effect sensor, a magnetoresistive sensor, or a fluxgate, etc., which can be used to sense the position of the magnet HM, thereby enabling the determination of the relative positional change information between the carrier LH and the fixing part (the housing H and the base B).

[0102] Please refer to the following as well. Figure 5 , Figure 6 , Figure 7, Figure 8 and Figure 9 ,in Figure 5 This is an exploded view of the base B, circuit component F, and conductive component P before they are assembled. Figure 6 A schematic diagram showing the electrical connection between conductive component P and circuit component F. Figure 7 This is a side view of conductive component P. Figure 8 This is a three-dimensional view showing the assembly of base B, circuit component F, and conductive component P. Figure 9 Another perspective view of the drive mechanism 100, in which adhesive G is provided on the bottom side of the base B.

[0103] like Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the base B in this embodiment has a quadrilateral structure, and a conductive component P is embedded inside the base B. Specifically, the aforementioned conductive component P includes multiple conductive elements P1, P2, P3, P4, P5, and P6 made of metal, two support elements P7 and P8, and a grounding element PG. The aforementioned conductive elements P1 to P6, support elements P7 and P8, and grounding element PG can be integrated into the plastic base B by insert molding, and the ends of the aforementioned conductive elements P1 to P6, support elements P7 and P8, and grounding element PG are exposed on different sides of the base B.

[0104] In this embodiment, the aforementioned conductive elements P1 to P6 are electrically connected and directly connected to the aforementioned circuit assembly F. The ends of conductive elements P1 and P6 are respectively formed with flat platform portions P11 and P61. The aforementioned platform portions P11 and P61 are perpendicular to the optical axis O and exposed on the top side of the base B, and are used to electrically connect to two lower springs BS located above the base B. The aforementioned platform portions P11 and P61 are positioned higher than the aforementioned grounding element PG.

[0105] It should be noted that the aforementioned conductive components P2, P3, P4, and P5 are respectively formed with end portions P21, P31, P41, and P51 extending in the -Z axis direction, wherein the aforementioned end portions P21, P31, P41, and P51 protrude from the bottom side of the base B. Figure 9 ), used to connect an external circuit.

[0106] Please continue reading. Figures 5-9The aforementioned grounding element PG is located between the ends P31 and P41 of the conductive elements P3 and P4. The grounding element PG has an end PG1, at least one protruding structure PG2, a grounding portion PG3, and at least one trench PG4. The protruding structure PG2 and the grounding portion PG3 extend in the -Y axis direction (first direction), while the aforementioned grounding end PG1 extends in the -Z axis direction and protrudes from the bottom side of the base B. Figure 9 ).

[0107] It should be understood that the aforementioned groove PG4 is formed between the protruding structure PG2 and the grounding part PG3. The aforementioned protruding structure PG2 is used to connect the metal strip fixed in the mold. After the plastic base B is formed, the protruding structure PG2 can be cut off from the metal strip.

[0108] Specifically, the aforementioned grounding part PG3 can be electrically connected to the metal housing H by welding or soldering, thereby shielding the electronic components inside the drive mechanism 100. The protruding structure PG2 and the grounding part PG3 are separated by a distance (groove PG4), and the width of the protruding structure PG2 in the X-axis direction (second direction) is smaller than the width of the grounding part PG3 in the X-axis direction (second direction).

[0109] In this embodiment, two protruding structures PG2 are formed on the grounding member PG, and the aforementioned grounding portion PG3 is located between the two protruding structures PG2, wherein the protruding structures PG2 and the grounding portion PG3 are exposed on the same side of the base B. Figure 8 ).

[0110] from Figure 9 As can be seen, during the assembly of the drive mechanism 100, glue G can be applied to the bottom side of the base B to protect the conductive parts P1 to P6, the support parts P7 and P8, and the grounding parts PG that protrude from the surface of the base B. At the same time, glue G can also be used to bond the base B and the housing H, thereby improving the structural strength and reliability of the drive mechanism 100.

[0111] Please refer to the following as well. Figure 10 and Figure 11 ,in Figure 10 This is a perspective view of the aforementioned drive mechanism 100 after removing the housing H and the upper spring FS. Figure 11 This is a top view of the aforementioned drive mechanism 100 after the housing H and upper spring FS have been removed.

[0112] like Figure 10 and Figure 11As shown, in this embodiment, a first protrusion LH1 protruding in the -Y axis direction, a second protrusion LH2 protruding in the Y axis direction, and two winding posts LH3 and LH4 are formed on the carrier LH. The first and second protrusions LH1 and LH2 are located on opposite sides of the carrier LH, and the second protrusion LH2 faces the circuit assembly F. The winding posts LH3 and LH4 are respectively adjacent to the first and second protrusions LH1 and LH2.

[0113] Specifically, the two wires W can be connected to the coil C respectively, and the ends of the two wires W can be wound around the winding posts LH3 and LH4 respectively during assembly. The wires W located on the winding posts LH3 and LH4 can be fixed to the lower spring BS by welding or soldering, so as to be electrically connected to the external circuit through the conductive parts P1 and P6 and the aforementioned circuit assembly F.

[0114] It should be noted that the aforementioned winding post LH3 protrudes from the carrier member LH in the -Y axis direction (first direction), and the position of the aforementioned winding post LH3 is between the two extensions B1 and B2 on the base B, which helps to achieve miniaturization of the drive mechanism 100. The aforementioned extensions B1 and B2 extend from the bottom of the base B in the optical axis O direction (Z axis direction). When viewed along the X axis direction (second direction), the aforementioned winding post LH3 will at least partially overlap with the two extensions B1 and B2 on the base B, and the aforementioned second direction (X axis direction) is perpendicular to the first direction (-Y axis direction) and the aforementioned optical axis O direction.

[0115] In addition, from Figure 10 and Figure 11 As can be seen, a recess B11 is formed inside the extension B1 of the base B. The first protrusion LH1 on the movable member LH will extend into the aforementioned recess B11 after assembly. This can prevent the movable member LH from excessively displacing or rotating in the horizontal direction when it is subjected to an external force impact, thereby avoiding contact with other components in the drive mechanism 100.

[0116] Please refer to the following as well. Figure 12 , Figure 13 and Figure 14 ,in Figure 12 This is a 3D view showing the carrier LH and the magnet HM after assembly. Figure 13 This is a perspective view of the carrier LH and magnet HM after assembly. Figure 14 This is a bottom view of the aforementioned support component LH.

[0117] like Figure 12As shown, the carrier LH in this embodiment has a quadrilateral structure, wherein a magnet HM is fixed in the groove R on the second protrusion LH2 of the carrier LH, and the magnetic field sensing element HS on the circuit assembly F can sense the position of the magnet HM on the carrier LH, thereby being able to know the relative position change between the carrier LH and the fixing part (the housing H and the base B).

[0118] On the other hand, from Figure 12 and Figure 13 As can be seen, a first protrusion ST1, a second protrusion ST2, a third protrusion ST3, and a fourth protrusion ST4 protruding in the -Z axis direction (optical axis O direction) are formed on the bottom side of the support member LH. The first protrusion ST1 is located below the first protrusion LH1, the second protrusion ST2 is located below the second protrusion LH2, and the third and fourth protrusions ST3 and ST4 are located on the opposite side of the support member LH. Specifically, the first, second, third, and fourth protrusions ST1 to ST4 are located on four different sides of the support member LH and face the base B.

[0119] from Figure 14 As can be seen, the shape of the first protrusion ST1 is different from the shape of the second protrusion ST2, and the shapes of the first and second protrusions ST2 are also different from the shapes of the third and fourth protrusions ST3 and ST4. In particular, the area of ​​the first protrusion ST1 is larger than the area of ​​the second protrusion ST2, the area of ​​the second protrusion ST2 is larger than the area of ​​the third protrusion ST3, and the area of ​​the second protrusion ST2 is also larger than the area of ​​the fourth protrusion ST4.

[0120] As mentioned above, this embodiment mainly forms a first protrusion ST1 and a second protrusion ST2 extending in the -Z axis direction below the first protrusion LH1 and the second protrusion LH2, respectively, and positions the first, second, third, and fourth protrusions ST1 to ST4 on four different sides of the carrier LH. In this way, when the drive mechanism 100 is impacted by an external force, the carrier LH (movable member) can contact the base B through the first, second, third, and fourth protrusions ST1 to ST4, thus preventing the optical elements inside the carrier LH from directly colliding with the base B and causing damage to the mechanism. Since the first and second protrusions ST1 and ST2 are located directly below the first and second protrusions LH1 and LH2, they can form a large contact surface, effectively preventing structural damage caused when the carrier LH collides with the base B.

[0121] Please refer to the following as well. Figure 15 and Figure 16 ,in Figure 15 This is a cross-sectional view showing that the magnet HM is disposed within the groove R of the second protrusion LH2 of the support member LH. Figure 16This diagram illustrates the application of light-curable adhesive G2 to the outer side of the second protrusion LH2 of the carrier LH.

[0122] like Figure 15 and Figure 16 As shown, before installing the aforementioned magnet HM into the groove R of the second protrusion LH2 of the carrier LH, thermosetting glue G1 can be applied to the bottom surface of the groove R, and then the magnet HM can be placed in the groove R; next, a light-curing glue G2 (e.g., UV glue) can be applied to cover the opening of the groove R. At this time, the light-curing glue G2 will cover the magnet HM and slightly protrude from the surface of the second protrusion LH2, and the position of the magnet HM is between the thermosetting glue G1 and the light-curing glue G2.

[0123] In this embodiment, thermosetting adhesive G1 is first applied inside the groove R, and then photocurable adhesive G2 is applied to the outside of the second protrusion LH2 after the magnet HM is placed in the groove R. This allows the photocurable adhesive G2 to be cured by irradiating the outside of the support member LH, preventing it from falling out of the groove R. Then, after the other components of the drive mechanism 100 are installed, they can be baked at high temperature to cure the thermosetting adhesive G1. In other words, this embodiment uses a stepwise curing method to ensure that the components inside the drive mechanism 100 are securely bonded to each other.

[0124] While the embodiments and advantages of this utility model have been disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of this utility model. Furthermore, the scope of protection of this utility model is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps currently in development or to be developed in the future can be understood from the disclosure of this utility model, and can be used according to this utility model as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of this utility model includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of this utility model also includes combinations of the various claims and embodiments.

[0125] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A driving mechanism for driving the movement of an optical element, characterized in that, The optical element has an optical axis, and the driving mechanism includes: A fixing part includes a housing and a base that are interconnected; A movable member is movably connected to the fixed part, wherein the optical element is disposed on the movable member; A drive assembly for driving the movable part to move relative to the fixed part; Multiple conductive components are fixed within the base; and A grounding element is fixed inside the base and is electrically connected to the housing.

2. The driving mechanism as described in claim 1, characterized in that, The plurality of conductive elements and the grounding element are embedded in the base in an embedded manner.

3. The driving mechanism as described in claim 1, characterized in that, The drive mechanism also includes a lower spring that is movably connected to the base and the movable member, and at least one of the plurality of conductive members forms a platform portion that is exposed on the top side of the base and electrically connected to the lower spring portion, and the platform portion is higher than the grounding member.

4. The driving mechanism as described in claim 1, characterized in that, The movable member has a winding post, and the base has a plurality of extensions extending toward the optical axis, wherein the winding post extends in a direction perpendicular to the optical axis and is located between the plurality of extensions.

5. The driving mechanism as described in claim 1, characterized in that, The drive mechanism also includes a circuit assembly disposed on the base, the plurality of conductive elements being electrically connected and directly connected to the circuit assembly, and the grounding element being located between the plurality of conductive elements and connected to the housing.

6. The driving mechanism as described in claim 5, characterized in that, The grounding element has a protruding structure, a grounding portion, and a groove, wherein the protruding structure and the grounding portion extend toward a first direction and are exposed on the same side of the base, and the groove is formed between the protruding structure and the grounding portion, wherein the first direction is perpendicular to the optical axis.

7. The driving mechanism as described in claim 6, characterized in that, The width of the protruding structure is smaller than the width of the grounding part.

8. The driving mechanism as described in claim 6, characterized in that, The grounding element further comprises two protruding structures and two grooves, the grounding portion being located between the protruding structures and the grooves being located between the protruding structures and the grounding portion.

9. The driving mechanism as described in claim 6, characterized in that, The housing is made of metal, and the grounding part is electrically connected to the housing by welding or soldering.

10. The driving mechanism as described in claim 1, characterized in that, The drive mechanism also includes a circuit assembly disposed on the base, and the movable member has a first protrusion and a second protrusion protruding in a direction perpendicular to the optical axis, wherein the first protrusion and the second protrusion are located on opposite sides of the movable member and protrude in opposite directions, and the second protrusion faces the circuit assembly.

11. The driving mechanism as described in claim 10, characterized in that, The movable member has a first protrusion and a second protrusion extending in the direction of the optical axis. The first protrusion is located below the first protrusion and faces the base, and the second protrusion is located below the second protrusion and faces the base.

12. The driving mechanism as described in claim 11, characterized in that, The movable member has a third protrusion and a fourth protrusion extending toward the optical axis, wherein the first, second, third and fourth protrusions are located on four different sides of the movable member.

13. The driving mechanism as described in claim 12, characterized in that, The area of ​​the first bump is larger than the area of ​​the second bump.

14. The driving mechanism as described in claim 13, characterized in that, The area of ​​the second bump is larger than the area of ​​the third bump.

15. The driving mechanism as described in claim 12, characterized in that, The shape of the first bump is different from the shape of the second bump.

16. The driving mechanism as described in claim 10, characterized in that, The drive mechanism also includes a magnetic field sensing element and a magnet, which is disposed on the movable part and the magnetic field sensing element is disposed on the circuit assembly to sense the position change of the magnet.

17. The driving mechanism as described in claim 16, characterized in that, The drive mechanism also includes a thermosetting adhesive, and the second protrusion forms a groove, wherein the magnet is disposed in the groove, and the thermosetting adhesive is disposed on the bottom surface of the groove for bonding the magnet and the movable part.

18. The drive mechanism as described in claim 17, characterized in that, The drive mechanism also includes a photocurable adhesive covering the magnet and the groove, with the magnet located between the thermocurable adhesive and the photocurable adhesive.

19. The driving mechanism as described in claim 18, characterized in that, The light-curing adhesive protrudes from the surface of the second protrusion.

20. The driving mechanism as described in claim 1, characterized in that, The base has an extension extending toward the optical axis and a recess formed on the extension, and the movable member has a first protrusion protruding in a direction perpendicular to the optical axis, wherein the first protrusion extends into the recess.

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