Mini LED device and sighter

Abstract

The application relates to the technical field of visual auxiliary positioning, and discloses a micro LED device and a gunsight. The micro LED device comprises a circuit board, a micro light emitting element, a color conversion layer and a light shielding layer. The micro light emitting element is arranged on the circuit board and is electrically connected with the circuit board. The color conversion layer is arranged on the micro light emitting element. The color conversion layer is used for converting the color of light from the micro light emitting element into a preset color. The light shielding layer is arranged on the side of the color conversion layer away from the micro light emitting element. The micro LED device adopts the micro light emitting element as a light source. Compared with the OLED light source in the prior art, the micro LED device has higher brightness, solves the problem of poor visibility in a strong light environment, has higher reliability and a longer service life, compared with a laser light source, the micro light emitting element has no diffraction phenomenon, display content is not uneven, aiming accuracy is improved, power consumption is lower, and the requirement for battery endurance is reduced. The entire device can realize uniform display without introducing an additional optical fiber structure, and the structure is simple and compact.

Description

Technical Field

[0001] This application relates to the field of visual-assisted positioning technology, and in particular to a miniature LED device and a sight. Background Technology

[0002] Commonly used light source technologies in sights include OLED and laser light sources. While OLED light sources have a relatively simple structure, their brightness is low, resulting in poor visibility in strong light conditions, insufficient reliability, and a short lifespan. Laser light sources, although brighter, exhibit significant diffraction, causing uneven brightness in the displayed content and affecting aiming accuracy. Furthermore, laser light sources consume a lot of power, requiring long battery life, which is detrimental to the extended use of portable aiming devices. Although diffraction problems can be mitigated by introducing fiber optic structures, this increases the module size and structural complexity, hindering the lightweight design of the sight. Utility Model Content

[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a miniature LED device and a sight.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: This application provides: A miniature LED device, comprising: Circuit board; A micro-light-emitting element, wherein the micro-light-emitting element is disposed on the circuit board and electrically connected to the circuit board; A color conversion layer is disposed on the micro-light-emitting element, and the color conversion layer is used to convert the color of light from the micro-light-emitting element into a preset color; A light-shielding layer is disposed on the side of the color conversion layer opposite to the micro-light-emitting element.

[0005] Furthermore, the circuit board includes a carrier portion and a connecting portion, the micro-light-emitting element is disposed on the carrier portion, and the connecting portion is used for connection with a power source.

[0006] Furthermore, a conductive layer is provided between the micro-light-emitting element and the circuit board, and the micro-light-emitting element is electrically connected to the circuit board through the conductive layer.

[0007] Furthermore, a transparent cover is provided on the side of the light-shielding layer opposite to the color conversion layer, and the light-shielding layer and the color conversion layer are sequentially disposed on the transparent cover.

[0008] Furthermore, a first adhesive layer is provided on the side of the micro-luminescent element facing the transparent cover, and the first adhesive layer is located between the color conversion layer and the micro-luminescent element.

[0009] Furthermore, a light-shielding adhesive is provided on the circuit board, which surrounds and covers the micro-light-emitting element, the color conversion layer, the light-shielding layer, and the peripheral surface of the transparent cover.

[0010] Furthermore, a heat sink is provided on the side of the circuit board away from the micro-light-emitting element, and at least one side of the heat sink is provided with adhesive for connecting to the circuit board.

[0011] Furthermore, a second adhesive layer is provided between the heat sink and the circuit board for connecting the two.

[0012] Furthermore, the micro LED device is defined with a first direction, the projected area of ​​the micro light-emitting element along the first direction is S1, and the projected area of ​​the transparent cover along the first direction is S2, satisfying: S1 > S2.

[0013] This application also provides a sight, comprising the micro LED device described in any one of the above descriptions.

[0014] This application's micro-LED device uses micro-light-emitting elements as the light source, which has higher brightness than OLED light sources in the background technology, solving the problem of poor visibility in strong light environments. At the same time, it has higher reliability and longer service life. Compared with laser light sources, micro-light-emitting elements have no diffraction phenomenon, avoiding uneven brightness of the displayed content, improving aiming accuracy, and lower power consumption, reducing the requirements for battery life. The entire device can achieve uniform display without introducing additional fiber optic structures. The structure is simple and compact, which is conducive to the lightweight design of the scope. Furthermore, the circuit board provides support and electrical connection for the micro-light-emitting elements, the color conversion layer converts the light into a preset color, and the light-shielding layer effectively blocks non-display areas, improving display contrast and pattern clarity.

[0015] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A side view of the micro LED device of this application is shown; Figure 2 A top view of the micro LED device of this application is shown; Figure 3 This application shows Figure 1 Enlarged diagram of point A in the middle.

[0018] Explanation of key component symbols: 100 - Circuit board; 110 - Supporting part; 120 - Connecting part; 200 - Micro-light-emitting element; 300 - Color conversion layer; 301 - First adhesive layer; 400 - Light-shielding layer; 500 - Conductive layer; 600 - Transparent cover; 700 - Light-shielding adhesive; 800 - Heat sink; 801 - Second adhesive layer; 900 - Connecting adhesive; X - First direction. Detailed Implementation

[0019] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] This application provides a micro LED device, which includes a circuit board 100, a micro-light-emitting element 200, a color conversion layer 300, and a light-shielding layer 400. The micro-light-emitting element 200 is disposed on the circuit board 100 and electrically connected to the circuit board 100. The color conversion layer 300 is disposed on the micro-light-emitting element 200 and is used to convert the color of light from the micro-light-emitting element 200 into a preset color. The light-shielding layer 400 is disposed on the side of the color conversion layer 300 away from the micro-light-emitting element 200.

[0025] Currently, the light sources used in scopes are OLED or laser. OLED light sources have low brightness and poor reliability, while laser light sources have high power consumption and laser diffraction problems, which prevents the scope from having a lightweight and simple structure, requires high battery life, and cannot be effectively aimed in sunlight. The high power consumption and laser diffraction problems of laser light sources cause the display content to be dark and bright, affecting aiming. Although the diffraction problem can be solved by adding fiber optic structure technology, it will increase the size and complexity of the structure, which is not conducive to the structural design of the scope.

[0026] In this embodiment, the micro-light-emitting element 200 mentioned above is an array of micro-light-emitting diodes (MicroLEDs). Compared with organic light-emitting diodes (OLEDs) and laser light sources, micro-light-emitting diodes have higher brightness and lower power consumption, which greatly helps and improves the all-weather use and battery life of the scope.

[0027] Please see Figures 1 to 3 As shown, the circuit board 100 is connected to the power supply, and the micro-light-emitting element 200 is electrically connected to the circuit board 100. After the micro-light-emitting element 200 is powered, it will emit light to the outside. The light is converted into a preset color through the color conversion layer 300, and finally the non-display pattern area is blocked by the light-shielding layer 400, so that the light emitted to the outside is a preset pattern shape.

[0028] like Figure 2As illustrated, exemplarily, since the micro-LED in this embodiment is mainly used in a sight, the shape of the light-shielding layer 400 relative to the non-display area resembles a crosshair. In practice, different light-shielding layers 400 can be used depending on the different crosshair shapes. Furthermore, the area of ​​the micro-light-emitting elements 200 can be reduced by arranging the array of micro-light-emitting elements 200 into a crosshair shape while still satisfying the crosshair shape requirements, thereby reducing power consumption and extending usage time. Moreover, if the micro-LED is used in sights in other fields, the shape formed by the light-shielding layer 400 after blocking the non-display area can be designed according to actual needs, and is not limited here.

[0029] In this embodiment, the main function of the color conversion layer 300 is to convert the color of the light from the micro-light-emitting element 200 into the desired color, thereby achieving color conversion. For example, the micro-light-emitting element 200 emits blue light. Generally speaking, the crosshair color of a scope is red, which means that the blue light from the micro-light-emitting element 200 can be converted into red by the color conversion layer 300. Of course, the color conversion layer 300 can be replaced with a color conversion layer that can convert to other colors according to the pattern or working environment. This is not limited here.

[0030] In this embodiment, in order to accommodate the mounting space of the sight, the circuit board 100 is a flexible circuit board (FPC), or a suitable printed circuit board (PCB) can be selected as needed.

[0031] In some embodiments, the circuit board 100 includes a support portion 110 and a connecting portion 120, with the micro-light-emitting element 200 disposed on the support portion 110 and the connecting portion 120 used for connection to a power source.

[0032] like Figure 1 and Figure 2 As shown, the circuit board 100 is divided into a carrier part 110 and a connecting part 120. It should be noted that the carrier part 110 is mainly used for mounting and fixing components such as the micro-light-emitting element 200, the color conversion layer 300, and the light-shielding layer 400. The connecting part 120 is mainly used for connecting to an external power supply. Electrical energy is transmitted to the carrier part 110 through the connecting part 120 to power the micro-light-emitting element 200. It can be understood that in order to connect to the power supply, the connecting part 120 should have corresponding contacts to achieve connection with the power supply.

[0033] In some embodiments, a conductive layer 500 is provided between the micro-light-emitting element 200 and the circuit board 100, and the micro-light-emitting element 200 is electrically connected to the circuit board 100 through the conductive layer 500.

[0034] Please see Figure 1 and Figure 3As shown, in order to enable the electrical transmission from the circuit board 100 to the micro-light-emitting element 200 and to bond and fix the micro-light-emitting element 200 to the circuit board 100, a conductive layer 500 is provided on the support of the circuit board 100. The conductive layer 500 can be anisotropic conductive adhesive film. The micro-light-emitting element 200 is bonded to the circuit board 100 by a pressing process. During the pressing process, the conductive particles in the anisotropic conductive adhesive film burst under the action of pressure and temperature and form a conductive path, realizing the electrical connection between the micro-light-emitting element 200 and the circuit board 100, and realizing circuit conduction.

[0035] In another embodiment, the conductive layer 500 can also be a conductive metal. For example, the conductive layer 500 can be a conductive metal such as gold or tin. The specific conductive metal material is not limited here.

[0036] In some embodiments, a transparent cover 600 is provided on the side of the light-shielding layer 400 away from the color conversion layer 300, the light-shielding layer 400 and the color conversion layer 300 are sequentially disposed on the transparent cover 600, and a first adhesive layer 301 is provided on the side of the micro-light-emitting element 200 facing the transparent cover 600, the first adhesive layer 301 being located between the color conversion layer 300 and the micro-light-emitting element 200.

[0037] Please continue reading. Figure 1 and Figure 3 As shown, the light-shielding layer 400 is an adhesive used for light shielding, mainly used to block non-display areas. The color conversion layer 300 is a quantum dot color filter, or it can be a fluorescent film, mainly used to convert light into the desired color.

[0038] In this embodiment, in order to transmit the light after color conversion from the color conversion layer 300 to the outside, the transparent cover 600 should be transparent as a whole to facilitate light transmission. In addition, it also plays a role in protecting the micro-light-emitting element 200 to a certain extent, preventing dust from entering and damaging the micro-light-emitting element 200 after it comes into contact with the external environment.

[0039] Furthermore, in order to place the color conversion layer 300 and the light-shielding layer 400 on the light transmission side of the micro-light-emitting element 200, photolithography can be used to imprint the color conversion layer 300 and the light-shielding layer 400 onto the transparent cover 600. At this time, the light-shielding layer 400 is located between the color conversion layer 300 and the transparent cover 600. Next, the transparent cover 600 is fixed to the side of the micro-light-emitting element 200 by the first adhesive layer 301, thus completing the fixation of the transparent cover 600, the light-shielding layer 400, the color conversion layer 300, and the micro-light-emitting element 200. From the perspective of the layered structure, the first adhesive layer 301 is located between the color conversion layer 300 and the micro-light-emitting element 200.

[0040] For example, the transparent cover 600 can be made of glass.

[0041] In some embodiments, a light-shielding adhesive 700 is disposed on the circuit board 100, and the light-shielding adhesive 700 surrounds and covers the micro-light-emitting element 200, the color conversion layer 300, the light-shielding layer 400 and the periphery of the transparent cover 600.

[0042] Please continue reading. Figure 1 and Figure 3 As shown, the light from the micro-light-emitting element 200 may propagate in the circumferential direction, resulting in light leakage. To address this, a light-shielding adhesive 700 is provided on the circuit board 100. It can be understood that the light-shielding adhesive 700 is provided around the micro-light-emitting element 200, and the light-shielding adhesive 700 surrounds and covers the transparent cover 600, the light-shielding layer 400, the color conversion layer 300, and the micro-light-emitting element 200, thereby preventing light leakage and preventing external moisture from entering the micro-light-emitting element 200, the color conversion layer 300, and the light-shielding layer 400 from the circumferential side, thus affecting the light propagation.

[0043] In some embodiments, a heat sink 800 is provided on the side of the circuit board 100 opposite to the micro-light-emitting element 200, and at least one side of the heat sink 800 is provided with a connecting adhesive 900 that is connected to the circuit board 100.

[0044] Specifically, the adhesive 900 is provided on the side of the heat sink 800 facing the connection part 120, thereby improving the connection strength with the circuit board 100. In particular, the adhesive 900 can also be provided on the periphery of the heat sink 800 to further improve the connection strength with the circuit board 100.

[0045] Please see Figure 1 As shown, since the micro-light-emitting element 200 generates heat after prolonged use, in order to prevent the micro-light-emitting element 200 from being damaged due to high temperature because the generated heat cannot be dissipated, a heat sink 800 is provided on the side of the support portion 110 of the circuit board 100 away from the micro-light-emitting element 200, and the heat sink 800 absorbs and dissipates the heat generated from the micro-light-emitting element 200.

[0046] Please see Figure 1 As shown, in order to prevent the connection between the circuit board 100 and the heat sink 800 from tearing when bent, a bonding adhesive 900 is provided on the side of the heat sink 800 facing the connection portion 120 of the circuit board 100, and the bonding adhesive 900 is also connected to the circuit board 100. With the reinforcement of the bonding adhesive 900, the connection between the circuit board 100 and the heat sink 800 is not easy to tear, thus increasing the structural strength of the connection between the two.

[0047] For example, the heat sink 800 can be made of aluminum, copper or other metals used for heat dissipation. Furthermore, a black film can be applied to the surface of the heat sink 800, which not only achieves an all-black effect and enhances the appearance, but also prevents reflections in the scope.

[0048] In some embodiments, in order to enable a fixed connection between the heat sink 800 and the circuit board 100, a second adhesive layer 801 for connecting the two is provided between the heat sink 800 and the circuit board 100.

[0049] In this embodiment, the first adhesive layer 301 and the second adhesive layer 801 mentioned above can be encapsulating adhesive, which is made of epoxy resin adhesive. Its high airtightness can meet the reliable use of the scope in all weather conditions.

[0050] In some embodiments, the micro LED device is defined with a first direction X, the projected area of ​​the micro light-emitting element 200 along the first direction X is S1, and the projected area of ​​the transparent cover 600 along the first direction X is S2, satisfying: S1 > S2.

[0051] like Figure 1 As shown, in this embodiment, the first direction X is the thickness direction of the micro-light-emitting element 200 and the transparent cover 600. Since the color conversion layer 300 and the light-shielding layer 400 are disposed on the side of the transparent cover 600 using photolithography, the projected area of ​​the color conversion layer 300 and the light-shielding layer 400 in the first direction X is the same as the projected area of ​​the transparent cover 600 in the first direction X. It can be understood that since the micro-light-emitting element 200 is connected to the circuit board 100 through the conductive layer 500, the area of ​​the micro-light-emitting element 200 and the conductive layer 500 is the same.

[0052] Please continue reading. Figure 1 As shown, in order to more easily ensure that the light-shielding adhesive 700 fully covers the periphery of the transparent cover 600, the light-shielding layer 400, the color conversion layer 300, the micro-light-emitting element 200, and the conductive layer 500, the area of ​​the transparent cover 600 needs to be less than or equal to the area of ​​the micro-light-emitting element 200. Therefore, in this embodiment, in order to facilitate the application of adhesive around the transparent cover 600 and the micro-light-emitting element 200, and to ensure that the adhesive fully contacts the periphery of the transparent cover 600 and the micro-light-emitting element 200, the area of ​​the transparent cover 600 projected in the first direction X is made smaller than the area of ​​the micro-light-emitting element 200 projected in the first direction X, so that a transition step is formed at the connection between the transparent cover 600 and the micro-light-emitting element 200.

[0053] This embodiment also provides a sight, which includes any of the miniature LED devices described above. The sight also includes a mounting base and a scope lamp disposed on the mounting base. The mounting base has a housing space, and the miniature LED device is installed in the housing space. For example, in this embodiment, the sight can be a holographic sight or a red dot sight, etc.

[0054] It should be noted that, since the aiming device includes the aforementioned micro LED device, the aiming device possesses all the technical effects of the micro LED device.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0056] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A miniature LED device, characterized in that, include: Circuit board; A micro-light-emitting element, wherein the micro-light-emitting element is disposed on the circuit board and electrically connected to the circuit board; A color conversion layer is disposed on the micro-light-emitting element, and the color conversion layer is used to convert the color of light from the micro-light-emitting element into a preset color; A light-shielding layer is disposed on the side of the color conversion layer opposite to the micro-light-emitting element.

2. The micro LED device according to claim 1, characterized in that, The circuit board includes a carrier portion and a connecting portion. The micro-light-emitting element is disposed on the carrier portion, and the connecting portion is used to connect to a power source.

3. The micro LED device according to claim 1, characterized in that, A conductive layer is disposed between the micro-light-emitting element and the circuit board, and the micro-light-emitting element is electrically connected to the circuit board through the conductive layer.

4. The micro LED device according to claim 1, characterized in that, A transparent cover is provided on the side of the light-shielding layer away from the color conversion layer, and the light-shielding layer and the color conversion layer are sequentially disposed on the transparent cover.

5. The micro LED device according to claim 4, characterized in that, A first adhesive layer is provided on the side of the micro-luminescent element facing the transparent cover, and the first adhesive layer is located between the color conversion layer and the micro-luminescent element.

6. The micro LED device according to claim 5, characterized in that, The circuit board is provided with a light-shielding adhesive, which surrounds and covers the micro-light-emitting element, the color conversion layer, the light-shielding layer, and the peripheral surface of the transparent cover.

7. The micro LED device according to claim 1, characterized in that, A heat sink is provided on the side of the circuit board away from the micro-light-emitting element, and at least one side of the heat sink is provided with adhesive for connecting to the circuit board.

8. The micro LED device according to claim 7, characterized in that, A second adhesive layer is provided between the heat sink and the circuit board for connecting the two.

9. The micro LED device according to claim 5, characterized in that, The micro LED device is defined with a first direction, the projected area of ​​the micro light-emitting element along the first direction is S1, and the projected area of ​​the transparent cover along the first direction is S2, satisfying: S1 > S2.

10. A sight, characterized in that, The micro LED device included in any one of claims 1 to 9.

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