Structure modification device for automatic developing module unit of gumming and developing machine

Abstract

The application provides a structure modification device of an automatic developing module unit of a gluing and developing machine, which comprises a disc body and an air heat insulation layer arranged at the outer circle of the disc body, and the air heat insulation layer is used for blocking heat conduction between the disc body and an external functional module. The air heat insulation layer is additionally arranged at the outer circle of the disc body, heat conduction is effectively blocked, the working temperature of the external functional module (such as a photoelectric sensor, an air cylinder and the like) is reduced from 60-70 DEG C to 40-50 DEG C, the core requirement of the temperature control precision of a semiconductor device is met, the performance attenuation of a high-temperature sensitive element is obviously slowed down by the temperature reduction, the failure rate of the key functional module is reduced, and the overall service life of the device is prolonged, the abnormal alarm frequency of the functional module is greatly reduced after the modification, the wafer scrapping problem caused by temperature triggering interlock is avoided, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a structural modification device for an automatic developing module unit of a coating and developing machine. Background Technology

[0002] In the semiconductor manufacturing industry, the ADB (Automatic Developing Module) unit of a coating and developing machine often experiences a decrease in the reliability of its functional modules due to high temperatures. For existing technology, please refer to... Figure 1 The outer ring 102 of the ADB disk is in direct contact with the functional module, and heat is conducted to the external functional module through the disk body 101, causing its temperature to reach as high as 60-70℃. Excessive temperature not only accelerates component aging but also increases the frequency of machine alarms and the risk of downtime, seriously affecting production efficiency and product quality. For example, high temperatures may trigger interlock mechanisms, leading to unplanned downtime and wafer scrap. Although existing technologies attempt to mitigate the problem through heat dissipation materials or forced cooling systems, these methods are costly and have limited effectiveness.

[0003] To solve the above problems, it is necessary to propose a new structural modification device for the automatic developing module unit of the coating and developing machine. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a structural modification device for the automatic developing module unit of a coating and developing machine, which solves the problem that the reliability of the functional module of the ADB (automatic developing module) unit of the coating and developing machine often decreases due to high temperature in the prior art.

[0005] To achieve the above and other related objectives, the present invention provides a structural modification device for an automatic developing module unit of a coating and developing machine, comprising:

[0006] The disk body and the air insulation layer disposed on the outer ring of the disk body are used to block heat conduction between the disk body and the external functional modules.

[0007] Preferably, the external functional module includes at least one of a photoelectric sensor, a cylinder, a motor, and a solenoid valve.

[0008] Preferably, the air insulation layer is disposed between the outer ring of the disc and the contact surface of the external functional module.

[0009] Preferably, the air insulation layer is provided with a flow guiding structure to optimize the airflow path and enhance the insulation effect.

[0010] Preferably, the operating temperature of the external functional module is reduced to 40-50℃.

[0011] Preferably, auxiliary heat dissipation holes are provided on the outer ring of the disc.

[0012] As described above, the structural modification device for the automatic developing module unit of the coating and developing machine of the present invention has the following beneficial effects:

[0013] This invention effectively blocks heat conduction by adding an air insulation layer around the outer ring of the disk, reducing the operating temperature of external functional modules (such as photoelectric sensors and cylinders) from 60-70℃ to 40-50℃, meeting the core requirements of semiconductor equipment for temperature control accuracy. The temperature reduction significantly slows down the performance degradation of high-temperature sensitive components, reduces the failure rate of key functional modules, and extends the overall service life of the equipment. The frequency of abnormal alarms of functional modules after the modification is greatly reduced, avoiding wafer scrapping caused by temperature-triggered interlock shutdowns, thus improving production efficiency. The air insulation layer adopts a passive heat dissipation design, eliminating the need for additional forced cooling systems (such as air-cooled / liquid-cooled devices), reducing modification costs while avoiding the negative impact of complex structures on equipment maintainability. Attached Figure Description

[0014] Figure 1 This diagram shows the structure of an automatic developing module unit in a prior art coating and developing machine.

[0015] Figure 2 The diagram shown is a structural modification device for the automatic developing module unit of the coating and developing machine according to the present invention. Detailed Implementation

[0016] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0017] Please see Figure 2 This invention provides a structural modification device for an automatic developing module unit of a coating and developing machine, comprising:

[0018] The disk body 101 and the air insulation layer located on the outer ring 102 of the disk body serve to prevent heat conduction between the disk body 101 and external functional modules. The air insulation layer employs a passive heat dissipation design, eliminating the need for an additional forced cooling system (such as air cooling / liquid cooling), thus reducing modification costs and avoiding the negative impact of complex structures on equipment maintainability. In practical applications, the air insulation layer can significantly reduce the operating temperature of external functional modules, thereby reducing the risk of component aging and unplanned machine downtime caused by high temperatures. This structure improves machine stability and is particularly suitable for the environmental temperature control requirements of high-precision semiconductor manufacturing processes.

[0019] In some embodiments, the external functional modules include at least one of a photoelectric sensor, a cylinder, a motor, and a solenoid valve. For example, the photoelectric sensor monitors the thickness of the developer coating, the cylinder controls the movement of the robotic arm, the motor drives the developing disc to rotate, and the solenoid valve regulates the liquid flow rate. Isolating and protecting these critical modules with an air insulation layer simultaneously improves the operational reliability of multiple subsystems.

[0020] In some embodiments, an air insulation layer is disposed between the outer ring 102 of the disk and the contact surface of the external functional module. Specifically, a heat insulation bracket can be welded or assembled onto the outer ring 102 of the disk to form a continuous hollow area surrounding the disk. Experimental data shows that this structure can reduce the operating temperature of the relevant functional modules from 60-70℃ before the modification to 40-50℃, meeting the temperature control accuracy requirements of semiconductor equipment. The temperature reduction significantly slows down the performance degradation of high-temperature sensitive components, reduces the failure rate of key functional modules, and extends the overall service life of the equipment; the frequency of abnormal alarms of the functional modules after the modification is greatly reduced, avoiding wafer scrapping caused by temperature-triggered interlock shutdowns, and improving production efficiency.

[0021] In some embodiments, the air insulation layer includes a flow-guiding structure to optimize airflow paths and enhance insulation performance. The flow-guiding structure is distributed axially along the insulation cavity, forming multiple layers of meandering airflow channels. Furthermore, auxiliary heat dissipation holes can be added to the outer ring 102 of the disc to facilitate natural convection of ambient air, enabling phased heat dissipation.

[0022] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0023] In summary, this invention, by adding an air insulation layer to the outer ring of the disk, effectively blocks heat conduction, reducing the operating temperature of external functional modules (such as photoelectric sensors and cylinders) from 60-70℃ to 40-50℃, meeting the core requirements of semiconductor equipment for temperature control accuracy. The temperature reduction significantly slows down the performance degradation of high-temperature sensitive components, lowering the failure rate of critical functional modules and extending the overall lifespan of the equipment. The frequency of abnormal alarms from the modified functional modules is greatly reduced, avoiding wafer scrapping caused by temperature-triggered interlock shutdowns, thus improving production efficiency. The air insulation layer uses a passive heat dissipation design, eliminating the need for an additional forced cooling system (such as air / liquid cooling devices), reducing modification costs while avoiding the negative impact of complex structures on equipment maintainability. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0024] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A structural modification device for an automatic developing module unit of a coating and developing machine, characterized in that, include: The disk body and the air insulation layer disposed on the outer ring of the disk body are used to block heat conduction between the disk body and the external functional modules.

2. The structural modification device for the automatic developing module unit of the coating and developing machine according to claim 1, characterized in that: The external functional module includes at least one of a photoelectric sensor, a cylinder, a motor, and a solenoid valve.

3. The structural modification device for the automatic developing module unit of the coating and developing machine according to claim 1, characterized in that: The air insulation layer is located between the outer ring of the disc and the contact surface of the external functional module.

4. The structural modification device for the automatic developing module unit of the coating and developing machine according to claim 1, characterized in that: The air insulation layer is equipped with a flow guiding structure to optimize the airflow path and enhance the insulation effect.

5. The structural modification device for the automatic developing module unit of the coating and developing machine according to claim 1, characterized in that: The operating temperature of the external functional module is reduced to 40-50℃.

6. The structural modification device for the automatic developing module unit of the coating and developing machine according to claim 1, characterized in that: The outer ring of the disk is provided with auxiliary heat dissipation holes.

Images