Server compatible with air cooling and liquid cooling

Abstract

The utility model discloses a compatible server of air cooling heat dissipation and liquid cooling heat dissipation relates to server technical field, and the compatible server of air cooling heat dissipation and liquid cooling heat dissipation includes case, mainboard component and heat dissipation module, and the case has inner chamber, and the mainboard component includes substrate and a plurality of components, and a plurality of components include central processing unit, controller and hard disk, and central processing unit, hard disk and case inner wall define the installation area together, heat dissipation module includes detachable setting's air cooling heat dissipation structure and liquid cooling heat dissipation structure, and can select air cooling heat dissipation structure and liquid cooling heat dissipation structure one installation in installation area, and with controller electric connection. Air cooling heat dissipation structure and liquid cooling heat dissipation structure as replaceable component, in air cooling environment, will fan heat dissipation structure install in installation area, at this moment, the through -hole on the case as the air vent, in need change to liquid cooling environment, remove air cooling heat dissipation structure, and the compatibility is good when different environment reconstruction, can complete the reconstruction of air cooling and liquid cooling fast.

Description

Technical Field

[0001] This utility model relates to the field of server technology, and in particular to a server compatible with both air cooling and liquid cooling. Background Technology

[0002] With the development of technologies such as cloud computing and artificial intelligence, server power density has increased significantly, and traditional air cooling can no longer meet the needs of high-power scenarios. Immersion liquid cooling technology has gradually entered the public eye due to its advantages such as high heat dissipation efficiency and low energy consumption. However, the market is still dominated by air-cooled servers. Immersion liquid-cooled servers usually require a complete redesign of the system architecture or a modification of air-cooled servers, which is costly. Utility Model Content

[0003] The main purpose of this invention is to propose a server that is compatible with both air cooling and liquid cooling, which can simultaneously accommodate both air cooling and liquid cooling environments by replacing and installing parts of the structure.

[0004] To achieve the above objectives, this utility model proposes a server compatible with both air cooling and liquid cooling, comprising:

[0005] A chassis having an inner cavity, and the exterior of the chassis having multiple through holes communicating with the inner cavity;

[0006] A motherboard assembly is fixed inside the chassis. The motherboard assembly includes a base plate and multiple components disposed on the base plate. The multiple components include a central processing unit, a controller, and a hard disk. The central processing unit, the hard disk, and the inner wall of the chassis together define an installation area.

[0007] The heat dissipation module includes a detachable air-cooled heat dissipation structure and a liquid-cooled heat dissipation structure. One of the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure can be installed in the installation area and is electrically connected to the controller.

[0008] In one embodiment, a male terminal connector is provided on the substrate;

[0009] Both the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure are equipped with female terminal connectors that are compatible with the male terminal connector.

[0010] In one embodiment, the inner cavity of the chassis has protrusions on two opposite sidewalls.

[0011] In the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure, the part located in the installation area serves as the heat dissipation body. The outer shell of the heat dissipation body has flanges on both opposite sides. The two flanges abut against the two protrusions and are fixed by connectors.

[0012] In one embodiment, two opposing sidewalls of the chassis's inner cavity are each provided with slide rails, and the outer shell of the heat dissipation body is slidably mounted along the slide rails, such that during its sliding, the flanged portion abuts against the protrusion; and / or,

[0013] The outer shell of the heat dissipation body is provided with handles on both opposite sides, and the handles are suspended in the air when the flanged part contacts the protrusion.

[0014] In one embodiment, the air-cooled heat dissipation structure includes:

[0015] The first housing has two oppositely arranged first sides, one of which is provided with multiple air inlets and the other first side is provided with multiple air outlets, the multiple air outlets being arranged toward the central processing unit;

[0016] Multiple fan units are disposed within the first housing.

[0017] In one embodiment, the liquid cooling heat dissipation structure includes:

[0018] The second housing has two opposing second sides, each of which is provided with a liquid passage hole.

[0019] Multiple liquid pump units are spaced apart within the second housing;

[0020] Multiple liquid inlet pipes correspond one-to-one with multiple liquid pump units, and the liquid inlet pipes are connected to the inlet of the liquid pump units;

[0021] Multiple liquid outlet pipes correspond one-to-one with multiple liquid pump units. One end of each liquid outlet pipe is connected to the outlet of the liquid pump unit, and the other end extends toward the central processing unit.

[0022] The liquid passage is located between two adjacent liquid pump units.

[0023] In one embodiment, the inlet pipe and / or the outlet pipe are arranged to gradually widen in the direction away from the liquid pump unit.

[0024] In one embodiment, the liquid outlet pipe includes a first pipe section and a second pipe section connected in sequence. The first pipe section is connected to the liquid pump unit, and the second pipe section is inclined toward the central processing unit.

[0025] In one embodiment, the end of the second pipe segment is gradually widened in a direction away from the first pipe segment, and the projection of the end of the second pipe segment on the substrate covers the central processing unit.

[0026] In one embodiment, the motherboard assembly further includes a DIP switch disposed on the substrate. The DIP switch is used to generate a first DIP signal and a second DIP signal. The first DIP signal corresponds to an air-cooling mode, and the second DIP signal corresponds to a liquid-cooling mode. The DIP switch is electrically connected to the controller so that the controller can control the server to enter the air-cooling mode or the liquid-cooling mode according to the first DIP signal or the second DIP signal.

[0027] In the technical solution of this utility model, the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure are replaceable components. In an air-cooled environment, the fan heat dissipation structure is installed in the installation area, and the through holes on the chassis serve as ventilation openings. When it is necessary to switch to a liquid-cooled environment, the air-cooled heat dissipation structure is removed, and the liquid-cooled heat dissipation structure is installed in the installation area. At this time, the through holes on the chassis serve as coolant flow holes. The space of the installation area can meet the installation needs of both the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure. It has good compatibility when modifying different environments and can quickly complete the modification from air-cooled to liquid-cooled. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 A schematic diagram of a server embodiment compatible with both air cooling and liquid cooling provided by this utility model;

[0030] Figure 2 for Figure 1 A schematic diagram of the structure of the mid-chassis and the heat dissipation unit;

[0031] Figure 3 for Figure 1 A schematic diagram of the air-cooled heat dissipation structure;

[0032] Figure 4 for Figure 1 Schematic diagram of the heat dissipation structure for medium-temperature and cold-temperature cooling;

[0033] Figure 5 for Figure 4 Schematic diagram of the intermediate liquid pump unit;

[0034] Figure 6 for Figure 1 A schematic diagram of the heat dissipation structure and its interaction with the central processing unit;

[0035] Figure 7for Figure 1 A schematic diagram of signal transmission in the connector.

[0036] Explanation of icon numbers:

[0037] 100. Server compatible with both air cooling and liquid cooling; 1. Chassis; 11. Protrusion; 12. Slide rail; 2. Motherboard assembly; 21. Base plate; 22. Central processing unit; 23. Controller; 24. Hard disk; 25. Male terminal connector; 26. CRPS power supply; 27. OCP; 28. Server port; 20. Installation area; 31. Air cooling structure; 311. First housing; 312. Fan unit; 313. Filter; 32. Liquid cooling structure; 321. Second housing; 322. Liquid passage hole; 323. Liquid pump unit; 324. Liquid inlet pipe; 325. Liquid outlet pipe; 33. Flanged edge; 34. Handle; 35. Female terminal connector.

[0038] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] It should be noted that if the embodiments of this utility model involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0041] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0042] Existing air-cooled servers cannot quickly adapt to immersion liquid cooling environments, mainly because:

[0043] Air-cooled servers primarily use fan units to dissipate heat from heat-generating components. However, the fan units cannot rotate in the immersion coolant or the high resistance to rotation in the immersion coolant can cause the fan motor to burn out.

[0044] If the fan module is removed directly, the coolant flow path will require additional compensation design when the server is immersed in a liquid cooling environment, making it impossible to quickly transform and deploy an air-cooled server into a liquid-cooled server.

[0045] Therefore, this application mainly designs a server compatible with both air cooling and immersion liquid cooling, achieving mutual compatibility and substitution in terms of power supply and signal control. It primarily addresses the following issues:

[0046] Poor compatibility: Enables plug-and-play modification of liquid cooling systems and air-cooled servers.

[0047] High cost: Avoid overall structural modifications and reuse existing power sources.

[0048] Uneven heat dissipation: Increase the directional liquid flow rate in the CPU area.

[0049] Please refer to Figures 1 to 2 The server 100, which is compatible with both air cooling and liquid cooling, includes a chassis 1, a motherboard assembly 2, and a heat dissipation module. The chassis 1 has an inner cavity, and the exterior of the chassis 1 has multiple through holes communicating with the inner cavity. The motherboard assembly 2 is fixed in the inner cavity of the chassis 1. The motherboard assembly 2 includes a baseboard 21 and multiple components disposed on the baseboard 21. The multiple components include a central processing unit 22 (CPU), a controller 23 (BMC), and a hard disk 24. The central processing unit 22, the hard disk 24, and the inner wall of the chassis 1 together define an installation area 20. The heat dissipation module includes a detachable air cooling structure 31 and a liquid cooling structure 32. One of the air cooling structure 31 and the liquid cooling structure 32 can be installed in the installation area 20 and is electrically connected to the controller 23.

[0050] In the technical solution of this utility model, the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32 are replaceable components. In an air-cooled environment, the fan heat dissipation structure is installed in the installation area 20, and the through hole on the chassis 1 serves as a ventilation port. When it is necessary to switch to a liquid-cooled environment, the air-cooled heat dissipation structure 31 is removed, and the liquid-cooled heat dissipation structure 32 is installed in the installation area 20. At this time, the through hole on the chassis 1 serves as a coolant flow hole. The space of the installation area 20 can meet the installation needs of the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32. It has good compatibility when modifying different environments and can quickly complete the modification from air-cooled to liquid-cooled.

[0051] Specifically, the installation area 20 can accommodate the installation of both the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32, thus ensuring spatial compatibility. Apart from the heat dissipation module, other modules do not require separate modifications, reducing costs. The liquid-cooled heat dissipation structure 32 is a superimposed liquid cooling structure after the server is immersed in the coolant, enabling the server to simultaneously receive heat exchange heat dissipation from the immersion liquid cooling box and heat dissipation from the liquid-cooled heat dissipation structure 32, thereby improving the uniformity of heat dissipation.

[0052] It should be understood that when the air-cooled heat dissipation structure 31 is installed, a certain distance should be left between it and the hard drive 24 to ensure the air intake effect. Therefore, the space occupied by the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32 when actually installed in the installation area 20 is different.

[0053] Furthermore, a male terminal connector 25 is provided on the substrate 21, and both the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32 are provided with female terminal connectors 35 that are compatible with the male terminal connector 25. By using the same female terminal connector 35 for the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32, the shape and number of interfaces of the connectors are the same, thereby achieving compatibility of the male terminal connector 25 on the substrate 21. In some embodiments, a 5-pin male terminal connector 25 is reserved on the substrate 21, where Pin1 is the 12V power supply positive terminal, Pin2 is GND ground, and Pin3, Pin4, and Pin5 are signal connection pins. Correspondingly, the female terminal connectors 35 of the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32 can achieve compatibility by making corresponding signal settings.

[0054] When considering the installation compatibility of the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32, please refer to the following, in addition to the installation space and electrical signal connection method: Figure 2 The inner cavity of the chassis 1 has two opposing side walls with protrusions 11. In the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32, the heat dissipation body located in the installation area 20 has flanges 33 on opposite sides of its outer shell. These flanges 33 abut against the two protrusions 11 and are fixed by connectors. The outer shells of the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32 have identical structures, both featuring flanges 33 that are fixed to the same protrusions 11 on the chassis 1, thus achieving installation compatibility. The connectors can be screws, pins, etc., and this invention does not limit their use.

[0055] It should be noted that the outer shell dimensions of the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32 can be made exactly the same, so that their installation and positioning are completely consistent. Alternatively, multiple holes can be provided on the protrusion 11. The outer shell dimensions of the air-cooled heat dissipation structure 31 and the liquid-cooled heat dissipation structure 32 can be the same length to fit the distance between the two protrusions 11, but the widths can be different. In this case, the flange 33 can be matched with different holes to achieve the purpose of installation and adaptation.

[0056] To facilitate installation and positioning, two opposite side walls of the inner cavity of the chassis 1 are equipped with slide rails 12. The outer shell of the heat sink is slidably installed along the slide rails 12, and during its sliding, the flange 33 abuts against the protrusion 11. The slide rails 12 serve as installation guides for the heat sink. The outer shell of the heat sink first contacts the slide rails 12, and when it slides until the flange 33 abuts against the protrusion 11, the heat sink is installed in place. The slide rails 12 can be two rails located on both sides of the protrusion 11, or the slide rails 12 can be a U-shaped structure encircling the outside of the protrusion 11, in which case they also provide support.

[0057] It should be noted that the setting direction of the slide rail 12 needs to be set according to the matching direction of the heat dissipation body and the chassis 1. When the flange 33 is set upward after installation, the slide rail 12 extends in the vertical direction. When the flange 33 is set to the side after installation, the slide rail 12 extends in the horizontal direction.

[0058] To facilitate handling of the outer casing during installation and disassembly, in some embodiments, handles 34 are provided on opposite sides of the outer casing of the heat dissipation body. When the flanged portion 33 contacts the protrusion 11, the handles 34 are suspended in the air. The handles 34 are L-shaped for easy lifting and positioning by the operator. In this embodiment, the handles 34 are located on the side of the flanged portion 33. When two flanged portions 33 are provided on one side, the handles 34 are located between the two flanged portions 33.

[0059] This utility model does not limit the form of the air-cooled heat dissipation structure; it can be a fan, blower, etc. Please refer to [reference needed]. Figure 3 In this embodiment, the air-cooled heat dissipation structure 31 includes a first housing 311 and a plurality of fan units 312. The first housing 311 has two oppositely arranged first sides, one of which has a plurality of air inlets and the other of which has a plurality of air outlets, with the air outlets facing the central processing unit 22. The plurality of fan units 312 are disposed inside the first housing 311. Specifically, the axis of the fan unit 312 should extend in the direction from the air inlet to the air outlet, and each fan unit 312 corresponds to one air inlet and one air outlet, thereby forming an airflow path. A reasonable number of fan units 312 are set based on the fan power and the server's heat dissipation requirements.

[0060] Furthermore, a filter 313 is installed at the air outlet to achieve air filtration. Additionally, an air guide plate (not shown in the diagram) can be installed on the outside of the air-cooled heat dissipation structure 31 to enhance airflow guidance.

[0061] This utility model does not limit the specific form of the liquid cooling heat dissipation structure 32; it can be a spray system, a water pump, etc. Please refer to [reference needed]. Figures 4 to 5 The liquid cooling structure 32 includes a second housing 321, multiple liquid pump units 323, multiple liquid inlet pipes 324, and multiple liquid outlet pipes 325. The second housing 321 has two oppositely arranged second sides, each of which is provided with a liquid passage hole 322. The multiple liquid pump units 323 are spaced apart within the second housing 321. The multiple liquid inlet pipes 324 correspond one-to-one with the multiple liquid pump units 323, and the liquid inlet pipes 324 are connected to the inlet of the liquid pump unit 323. The multiple liquid outlet pipes 325 correspond one-to-one with the multiple liquid pump units 323, one end of the liquid outlet pipe 325 is connected to the outlet of the liquid pump unit 323, and the other end extends toward the central processing unit 22. The liquid passage hole 322 is located between two adjacent liquid pump units 323. After replacing the air-cooled cooling structure 31 with a liquid-cooled heat dissipation structure 32, the entire server is immersed in coolant. The liquid flow inside the server chassis 1 is mainly divided into two parts. The first part enters the server motherboard assembly 2 for cooling through the liquid passage hole 322 between adjacent liquid pump units 323. The power for this part of the liquid mainly comes from the external liquid cooling system (which has a pump providing power). The second part of the liquid is drawn in from the inlet pipe 324 and flows out from the outlet pipe 325 at a certain speed under the action of the liquid pump unit 323 inside the server, thereby accelerating the flow rate and speed of the coolant flowing to the central processing unit 22 and improving the heat dissipation effect. The liquid passage hole 322 also helps to reduce the resistance of the liquid inside the server.

[0062] Since liquid cooling and air cooling have different efficiencies, the number of fan units 312 and liquid pump units 323 can be set differently depending on the environment and heat dissipation requirements.

[0063] It should be understood that the first housing 311 and the second housing 321 are the same in at least the length direction. Specifically, the second housing 321 is a cuboid with the same external dimensions as the first housing 311. Both the first housing 311 and the second housing 321 are provided with flanges 33 and handles 34 on opposite sides along their lengths. The flanges 33 are fixed to the server using the same positioning and screw holes, and are fixed to the server chassis 1 by screws on the side.

[0064] Furthermore, the inlet pipe 324 and / or outlet pipe 325 are gradually widened in the direction away from the liquid pump unit 323. The inlet pipe 324 can be configured in a funnel shape to increase the inlet flow rate. The outlet pipe 325 can be configured in a funnel shape to increase the outlet coverage area, so that the coolant discharged through the liquid pump unit 323 can cover the central processing unit 22.

[0065] Please refer to Figure 6 The liquid outlet pipe 325 includes a first pipe section and a second pipe section connected in sequence. The first pipe section is connected to the liquid pump unit 323, and the second pipe section is inclined towards the central processing unit 22. That is, when the liquid outlet pipe 325 is set, the first pipe section and the second pipe section are set at an angle, and the liquid outlet direction of the liquid outlet pipe 325 corresponds to the central processing unit 22. Specifically, the outlet of the liquid outlet pipe 325 can be set above the central processing unit 22 and inclined, so that the liquid outlet of the second pipe section can accurately cool the central processing unit 22 and increase the liquid flow rate and velocity near the central processing unit 22.

[0066] It should be understood that the inclined setting of the second pipe section makes the flow direction of the coolant when it is discharged also inclined. The overall movement trend is the same as the movement trend of the coolant in the immersion liquid cooling system. If the second pipe section is perpendicular to the central processing unit 22, the vertically sprayed coolant is likely to cut off the coolant that has not passed through the liquid pump unit 323, which will affect the heat dissipation.

[0067] Furthermore, the end of the second pipe segment gradually widens in the direction away from the first pipe segment, and the projection of the end of the second pipe segment on the substrate 21 covers the central processing unit 22. This arrangement ensures the liquid output and the effective contact area between the coolant sprayed by the liquid pump unit 323 and the central processing unit 22.

[0068] Specifically, in this embodiment, the liquid cooling structure 32 includes a liquid pump, a liquid pump housing, and a control module. Liquid enters from the inlet of the liquid pump, passes through the inside of the liquid pump housing, and is discharged from the outlet. The flow rate and velocity of the liquid after passing through the liquid pump are significantly higher than those of the coolant surrounding the liquid pump unit 323. The specific flow rate can be achieved by controlling the speed of the pump motor using a PWM (Pulse Width Modulation) signal. The liquid pump control module mainly includes an electrical control section and a motor. This section is sealed to the liquid pump housing to ensure that coolant does not enter the control module of the liquid pump. In an immersion liquid cooling environment, no special modifications are required due to the original packaging and connection of the server's electrical components. A DC pump is used, and it can operate normally with a 12V DC power supply. The liquid pump is connected to the original male fan connector on the motherboard via a female connector 35, obtains power from the motherboard, and is connected to the BMC on the motherboard. The motherboard BMC controls the speed of the liquid pump.

[0069] In addition, the motherboard component 2 is equipped with an OCP (Overcurrent Protection) 27, a server port 28, a CRPS power supply 26, and a server power button. This embodiment includes two central processing units 22, corresponding to the following: Figure 1 The CPU1 and CPU2 are equipped with two liquid cooling units and five fan units 312.

[0070] The connectors for fan unit 312 and liquid pump unit 323 are compatible; they are the same type of connector, meaning the connector shape and number of interfaces are identical. Please refer to [reference needed]. Figure 7 The substrate 21 has a reserved 5-pin male connector 25, where Pin 1 is the 12V power supply positive terminal, Pin 2 is GND ground (ground wire or neutral wire), and Pins 3, 4, and 5 are signal connection pins. Both the fan unit 312 and the liquid pump unit 323 have corresponding female connectors 35 with the same definitions: Pin 1 is the 12V power supply, Pin 2 is GND ground, Pin 3 is the speed feedback signal, Pin 4 is the speed control signal, and Pin 5 is the presence detection signal. When the male and female connectors are connected, the 12V and GND of the fan unit 312 or the liquid pump unit 323 are connected to the motherboard. The 12V is output through the power protection chip and then connected to the connector, ultimately powering the fan unit 312 or the liquid pump unit 323. The power protection chip prevents overshoot during hot-plugging of the fan unit 312, which could affect the stability of the input 12V power supply. The speed feedback signal is connected to the BMC contacts via a connector and then level-shifted. The BMC obtains the fan speed or liquid pump motor speed through two contacts. The BMC PWM signal is connected to the connector after level-shifting. The BMC controls the speed of the heatsink via PWM to control the airflow (air volume) or coolant flow (flow rate). The presence detection signal is connected to the BMC's GPIO interface (General-Purpose Input / Output Ports) via a connector. When the connector is not connected to the heatsink or is connected but not properly installed, this pin signal remains high. When the heatsink is connected, it goes low. The BMC uses the high and low levels to determine the heatsink's presence.

[0071] Furthermore, the motherboard assembly 2 also includes a DIP switch (not shown) mounted on the substrate 21. This switch generates a first DIP signal and a second DIP signal. The first DIP signal corresponds to the air-cooling mode, and the second DIP signal corresponds to the liquid-cooling mode. The DIP switch is electrically connected to the controller 23, allowing the controller 23 to control the server to enter either air-cooling or liquid-cooling mode based on the first or second DIP signal. When replacing the air-cooling structure 31 or the liquid-cooling structure 32, the server chassis 1 cover needs to be opened, exposing the entire motherboard assembly 2. The DIP switch can then be toggled during the heat dissipation process to complete the signal conversion. In circuit configuration, the DIP switch only needs to be connected to the BMC, providing a judgment signal for the BMC's logic control.

[0072] The specific implementation logic is as follows:

[0073] The BMC determines whether the system is used in an air-cooled or liquid-cooled environment by using a DIP switch. Two sets of codes are pre-programmed into the BMC, corresponding to the fan control in an air-cooled environment (i.e., air-cooled mode) and the liquid pump control in a liquid-cooled environment (i.e., liquid-cooled mode). By changing the DIP switch signal, the BMC determines which set of codes to use for execution.

[0074] When used in an air-cooled environment, the server is equipped with fan units 312, and the DIP switch is used to select air-cooling mode. At this time, all five female terminal connectors 35 of the five fan units 312 are connected. The BMC senses the presence of the fan units 312 via an in-situ signal and performs stepped control of the fan speed based on the CPU temperature read by the BMC. For example, when the CPU temperature is higher than temperature T1, the BMC controls the PWM to make the fan run at full speed and obtains the fan speed through contacts to determine if the fan speed is within a preset range; when the CPU temperature is higher than T2 (T2 < T1), the BMC controls the PWM to make the fan run at full speed and obtains the fan speed through contacts to determine if the fan speed is within a preset range. Stepped control of the fan speed is achieved based on the CPU temperature.

[0075] When used in an immersion liquid cooling environment, the server is equipped with liquid pump unit 323, and the DIP switch is selected to select liquid cooling mode. At this time, only two of the five male connectors 25 are connected to the female connectors 35 of the liquid pump unit 323. The BMC senses the presence of the liquid pump via an on-line signal and performs stepped control of the liquid pump motor speed based on the CPU temperature read by the BMC, thereby controlling the corresponding pump output flow. (Different CPU temperature ranges are pre-set to correspond to different pump motor speeds (and corresponding flow rates). For example, when the CPU temperature is 0-10℃, the pump operates at the lowest speed, providing the minimum flow rate. When the CPU temperature is >80℃, the pump speed is increased to the maximum, providing the maximum flow rate.) This method achieves precise CPU cooling in liquid cooling systems by controlling the pump output flow based on the CPU temperature.

[0076] Since the speed of a liquid pump is much lower than that of a fan, one possible method for detecting whether a connector is connected to a liquid pump or a fan is as follows: Set a midpoint speed threshold. When the BMC detects a connector with a heatsink connected, it receives the heatsink speed corresponding to the connector's TACH signal. If the speed is below the threshold, it's a liquid pump connection; if it's above the threshold, it's a fan connection. This method also compares the DIP switch modes to prevent mixing air-cooled and liquid-cooled environments.

[0077] In the technical solution of this utility model, the liquid pump can be replaced in situ by reusing the installation position, power supply interface and control interface of the air-cooled server fan. The corresponding structure can be plugged and used when the environment changes, and the air-cooled to liquid-cooled transformation can be completed in a short time, saving transformation costs. The liquid pump's liquid outlet direction is limited to achieve directional heat dissipation, which can increase the liquid flow speed in the CPU area by many times, and precisely cool the CPU. The installation has strong compatibility, and the server does not need to be modified much, sharing power supply, control, etc.

[0078] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A server compatible with air cooling and liquid cooling, characterized in that, The application relates to a computer case. The computer case comprises: a case body having an inner cavity, and a plurality of through holes are formed in the outer wall of the case body and communicate with the inner cavity; a mainboard assembly fixed in the inner cavity of the case body, the mainboard assembly comprising a substrate and a plurality of components arranged on the substrate, wherein the plurality of components comprise a central processing unit, a controller and a hard disk, and the central processing unit, the hard disk and the inner wall of the case body jointly define a mounting area; 2. The server compatible with air cooling and liquid cooling according to claim 1, wherein, a heat dissipation module comprising a detachable air-cooled heat dissipation structure and a liquid-cooled heat dissipation structure, and one of the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure can be selectively mounted in the mounting area and electrically connected with the controller. The substrate is provided with a male terminal connector; 3. The server compatible with air cooling and liquid cooling according to claim 1, wherein, The air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure are both provided with a female terminal connector matched with the male terminal connector. Two opposite side walls of the inner cavity of the case body are both provided with protrusions; 4. The server compatible with air cooling and liquid cooling according to claim 3, wherein, In the air-cooled heat dissipation structure and the liquid-cooled heat dissipation structure, a heat dissipation main body is arranged in the mounting area, the outer shell of the heat dissipation main body is provided with two flange portions on opposite sides, the two flange portions are in abutment with the two protrusions and are fixed by a connecting piece. Two opposite side walls of the inner cavity of the case body are both provided with sliding rails, the outer shell of the heat dissipation main body is slidably mounted along the sliding rails and can abut the flange portion with the protrusion during the sliding process; and / or 5. The server compatible with air cooling and liquid cooling according to claim 1, wherein, The outer shell of the heat dissipation main body is provided with a handle on opposite sides, and the handle is in a suspended state when the flange portion is in contact with the protrusion. The air-cooled heat dissipation structure comprises: a first shell body having two opposite first side surfaces, one of the first side surfaces is provided with a plurality of air inlets, and the other first side surface is provided with a plurality of air outlets, and the air outlets are arranged towards the central processing unit; 6. The server compatible with air cooling and liquid cooling according to claim 1, wherein, a plurality of fan units arranged in the first shell body. The liquid-cooled heat dissipation structure comprises: a second shell body having two opposite second side surfaces, and the two second side surfaces are both provided with liquid passing holes; a plurality of liquid pump units arranged in the second shell body at intervals; a plurality of liquid inlet pipelines corresponding to the liquid pump units, and the liquid inlet pipelines are connected with the inlets of the liquid pump units; a plurality of liquid outlet pipelines corresponding to the liquid pump units, one end of the liquid outlet pipelines is connected with the outlets of the liquid pump units, and the other end of the liquid outlet pipelines extends towards the central processing unit; 7. The server compatible with air cooling and liquid cooling according to claim 6, wherein, The liquid passing holes are arranged between two adjacent liquid pump units.

8. The server compatible with air cooling and liquid cooling according to claim 6 or 7, wherein The liquid inlet pipelines and / or the liquid outlet pipelines are gradually expanded in a direction away from the liquid pump units.

9. The server compatible with air cooling and liquid cooling according to claim 8, wherein, The liquid outlet pipeline comprises a first pipeline segment and a second pipeline segment connected in sequence, the first pipeline segment communicates with the liquid pump unit, and the second pipeline segment is arranged in an inclined manner towards the central processing unit. The end of the second pipeline segment is gradually expanded in a direction away from the first pipeline segment, and the projection of the end of the second pipeline segment on the substrate covers the central processing unit.

10. The server compatible with air cooling and liquid cooling according to claim 1, wherein, The mainboard assembly further comprises a DIP switch arranged on the substrate, the DIP switch is used to generate a first DIP signal and a second DIP signal, the first DIP signal is used to correspond to the air cooling mode, the second DIP signal is used to correspond to the liquid cooling mode, and the DIP switch is electrically connected with the controller, so that the controller can control the server to enter the air cooling mode or the liquid cooling mode according to the first DIP signal or the second DIP signal.

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