Heat dissipation device for notebook computer

Abstract

This utility model discloses a heat dissipation device for laptop-type electronic devices, comprising: a first substrate, a second substrate, a first heat dissipation fin group, a second heat dissipation fin group, a first heat pipe, and a second heat pipe. The first substrate carries a first heat source, and the second substrate carries a second heat source. The first substrate and the second substrate are coplanar and spaced apart. The first heat dissipation fin group is disposed on the side of the first substrate away from the second substrate. The second heat dissipation fin group is disposed on the side of the second substrate away from the first substrate. A portion of the first heat pipe is installed in a first slot of the first substrate, and its two ends are respectively connected to the first heat dissipation fin group and the first substrate, so as to guide the heat generated by the first heat source absorbed by the first substrate to the first heat dissipation fin group. A portion of the second heat pipe is installed in a second slot of the second substrate, and its two ends are respectively connected to the second heat dissipation fin group and the second substrate, so as to guide the heat generated by the second heat source absorbed by the second substrate to the second heat dissipation fin group.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation device for laptop-type electronic devices. Background Technology

[0002] The current trend in laptop electronic devices is towards higher performance, thinner design, and reduced shock absorption. As the demand for high performance and lightweight laptops continues to rise, customers are placing increasingly higher demands on the heat dissipation performance of cooling devices, while simultaneously requiring laptops to become lighter. To address this contradiction, traditional cooling devices often resort to adding heat sink fins to meet high cooling requirements. However, this approach not only increases the overall weight of the cooling device but also raises manufacturing costs. Furthermore, since traditional cooling devices mostly use vapor chambers, the overall structural strength of the cooling device is reduced.

[0003] Therefore, with traditional heat dissipation devices unable to meet customers' high power demands, there is an urgent need for a heat dissipation device with better thermal conductivity, relatively lighter weight, and relatively high structural strength to meet market demands. Utility Model Content

[0004] This utility model aims to solve the above-mentioned technical problems by providing a heat dissipation device for laptop-type electronic devices, comprising: A first substrate and a second substrate, wherein the top surface of the first substrate is used to support a first heat source and the top surface of the second substrate is used to support a second heat source, and the first substrate and the second substrate are coplanar and spaced apart. The first heat dissipation fin group is disposed on the side of the first substrate away from the second substrate; The second heat dissipation fin group is disposed on the side of the second substrate away from the first substrate; At least one first heat pipe, the bottom surface of the first substrate has a first slot, a portion of the first heat pipe is installed in the first slot and the two ends of the first heat pipe are respectively connected to the first heat dissipation fin assembly and the first substrate. At least one second heat pipe, the bottom surface of the second substrate has a second slot, a portion of the second heat pipe is installed in the second slot and the two ends of the second heat pipe are respectively connected to the second heat dissipation fin assembly and the second substrate. Specifically, the heat generated by the first heat source absorbed by the first substrate is guided to the first heat dissipation fin group through the first heat pipe, and the heat generated by the second heat source absorbed by the second substrate is guided to the second heat dissipation fin group through the second heat pipe.

[0005] The aforementioned heat dissipation device further includes: The third heat dissipation fin group is disposed on the side of the first substrate away from the second substrate and located between the first substrate and the first heat dissipation fin group; The fourth heat dissipation fin group is disposed on the side of the second substrate away from the first substrate and located between the second substrate and the second heat dissipation fin group; At least one third heat pipe, a portion of which is installed in the first slot and the second slot, and both ends of which are respectively connected to the third heat dissipation fin group and the fourth heat dissipation fin group. The heat absorbed by the first substrate and the second substrate is conducted to the third heat dissipation fin group and the fourth heat dissipation fin group respectively through the third heat pipe.

[0006] The aforementioned heat dissipation device further includes at least one fourth heat pipe, and the bottom surface of the second substrate also has a third slot, the third slot being connected to and penetrating the second slot, and the fourth heat pipe being installed in the third slot and located above the third heat pipe.

[0007] The aforementioned heat dissipation device further includes at least one fifth heat pipe, which is mounted on the bottom surface of the second substrate and connected to the second heat dissipation fin assembly.

[0008] In the aforementioned heat dissipation device, the first substrate and / or the second substrate are die-cast parts.

[0009] In the aforementioned heat dissipation device, the first heat dissipation fin group, the second heat dissipation fin group, the third heat dissipation fin group, and the fourth heat dissipation fin group each include at least one heat dissipation fin, and each heat dissipation fin includes an aluminum core layer and a copper outer layer.

[0010] In the aforementioned heat dissipation device, each of the heat dissipation fins is formed by an aluminum-copper plating process.

[0011] The aforementioned heat dissipation device further includes a first heat-conducting component. The top surface of the first substrate has a first opening, which exposes portions of the first heat pipe and the third heat pipe. The first heat-conducting component is disposed at the first opening and is attached to portions of the first heat pipe and the third heat pipe.

[0012] The aforementioned heat dissipation device further includes a second heat-conducting component, the top surface of the second substrate has a recess, the second slot extends to the recess, and the second heat-conducting component is disposed in the recess and attached to the portion of the second heat pipe and the third heat pipe.

[0013] The aforementioned heat dissipation device further includes a third heat-conducting component disposed on the fifth heat pipe.

[0014] The aforementioned heat dissipation device further includes multiple layers of thermal paste, which are respectively disposed on the top surface of the first substrate, the top surface of the second substrate, and the third thermal conductive component.

[0015] The aforementioned heat dissipation device, wherein the first heat-conducting component includes: A first heat-conducting block is disposed at the first opening; A polyester film layer is disposed on the first heat-conducting block, the polyester film layer having a second opening to expose a portion of the first heat-conducting block; A foam layer is disposed on the polyester film layer and surrounds the second opening; A blue adhesive layer is disposed on the polyester film layer and surrounds the foam layer.

[0016] Compared with related technologies, the heat dissipation device of this utility model has heat pipes inserted into the grooves on the bottom surface of the substrate and connected to the heat dissipation fin assembly, which makes this utility model better meet the requirements of thinness; at the same time, the substrate formed by die casting in this utility model not only improves the overall structural strength of the heat dissipation device compared with the heat spreader plate, but also reduces the manufacturing cost; this utility model uses aluminum-copper plating process to form heat dissipation fins, which not only reduces the overall weight of the heat dissipation device, but also meets the high power heat dissipation requirements. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from one perspective.

[0018] Figure 2 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from another perspective.

[0019] Figure 3 This is a three-dimensional schematic diagram of the first substrate from one perspective.

[0020] Figure 4 This is a three-dimensional schematic diagram of the first substrate from another perspective.

[0021] Figure 5 This is a three-dimensional schematic diagram of the second substrate from one perspective.

[0022] Figure 6 This is a three-dimensional schematic diagram of the second substrate from another perspective.

[0023] Figure 7 This is an exploded view of the first heat-conducting component.

[0024] Figure 8 This is a schematic diagram of the heat dissipation fins.

[0025] The attached figures are labeled as follows: Heat dissipation device: 1; First substrate: 11; Top surface: S11; First opening: K1; Bottom surface: S12; First slot: C1; Second substrate: 12; Top surface: S21; Depression: C4; Bottom surface: S22; Second slot: C2; Third slot: C3; First heat dissipation fin group: F1; Second heat dissipation fin group: F2; Third heat dissipation fin group: F3; Fourth heatsink fin group: F4; Heat dissipation fins: f; Aluminum core layer: f1; Copper outer layer: f2; First heat pipe: G1; Second heat pipe: G2; Third heat pipe: G3; Fourth heat pipe: G4; Fifth heat pipe: G5; First thermal conductive component: 13; First heat-conducting block: 131; Polyester film layer: 132; Second opening: K2; Foam layer: 133; Blue adhesive layer: 134; Second thermal conductive component: 14; Third thermal conductive component: 15; Thermal paste layer: 16. Detailed Implementation

[0026] Please refer to Figures 1-2 , Figure 1 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from one perspective; Figure 2 This is a three-dimensional schematic diagram of the heat dissipation device of this utility model from another perspective. For example... Figures 1-2As shown, a heat dissipation device 1 for laptop-type electronic devices according to this utility model includes: a first substrate 11, a second substrate 12, a first heat dissipation fin group F1, a second heat dissipation fin group F2, at least one first heat pipe G1, and at least one second heat pipe G2. The top surface S11 of the first substrate 11 is used to support a first heat source, and the top surface S21 of the second substrate 12 is used to support a second heat source. The first substrate 11 and the second substrate 12 are coplanar and spaced apart. The first heat dissipation fin group F1 is disposed on the side of the first substrate 11 away from the second substrate 12. The second heat dissipation fin group F2 is disposed on the side of the second substrate 12 away from the first substrate 11. The bottom surface S12 of the first substrate 11 has a first slot C1. A portion of the first heat pipe G1 is installed in the first slot C1, and both ends of the first heat pipe G1 are respectively connected to the first heat dissipation fin group F1 and the first substrate 11; the bottom surface S22 of the second substrate 12 has a second slot C2, a portion of the second heat pipe G2 is installed in the second slot C2, and both ends of the first heat pipe G1 are respectively connected to the second heat dissipation fin group F2 and the second substrate 12; wherein, the heat generated by the first heat source absorbed by the first substrate 11 is guided to the first heat dissipation fin group F1 through the first heat pipe G1, and the heat generated by the second heat source absorbed by the second substrate 12 is guided to the second heat dissipation fin group F2 through the second heat pipe G2. The heat pipe passing through the slot on the back of the substrate allows for a thinner design of the heat dissipation device.

[0027] In this embodiment, the first substrate 11 and / or the second substrate 12 are die-cast parts, that is, the first substrate 11 and the second substrate 12 are integrally formed by die casting process, which can not only reduce the manufacturing cost of heat dissipation device, but also improve the structural strength of heat dissipation device.

[0028] In one embodiment of the present invention, the first substrate 11 and / or the second substrate 12 are made of ADC12.

[0029] It should be noted that, although this embodiment discloses that there is one first heat pipe G1 and one second heat pipe G2, the present invention does not limit the number of first heat pipe G1 and second heat pipe G2.

[0030] Furthermore, the heat dissipation device 1 further includes: a third heat dissipation fin group F3, a fourth heat dissipation fin group F4, and at least one third heat pipe G3. The third heat dissipation fin group F3 is disposed on the side of the first substrate 11 away from the second substrate 12 and is located between the first substrate 11 and the first heat dissipation fin group F1. The fourth heat dissipation fin group F4 is disposed on the side of the second substrate 12 away from the first substrate 11 and is located between the second substrate 12 and the second heat dissipation fin group F2. A portion of the third heat pipe G3 is installed in the first slot C1 and the second slot C2, and both ends of the third heat pipe G3 are respectively connected to the third heat dissipation fin group F3 and the fourth heat dissipation fin group F4. The heat absorbed by the first substrate 11 and the second substrate 12 is conducted to the third heat dissipation fin group F3 and the fourth heat dissipation fin group F4 through the third heat pipe G3.

[0031] It should be noted that although two third heat pipes G3 are disclosed in this embodiment, the present invention does not limit the number of third heat pipes G3.

[0032] Furthermore, the heat dissipation device 1 further includes at least one fourth heat pipe G4 and at least one fifth heat pipe G5. The bottom surface S22 of the second substrate 12 also has a third slot C3, which communicates with and penetrates the second slot C2. The fourth heat pipe G4 is installed in the third slot C3 and is located above the third heat pipe G3. The fifth heat pipe G5 is installed on the bottom surface S22 of the second substrate 12 and connected to the second heat dissipation fin group 14.

[0033] In this embodiment, the fourth heat pipe G4 is U-shaped, which is a preferred implementation. The fourth heat pipe G4 not only evenly distributes the heat absorbed by the second substrate 12 across the entire second substrate 12, but also improves the thermal conductivity.

[0034] It should be noted that, although this embodiment discloses that there is one fourth heat pipe G4 and one fifth heat pipe G5, the present invention does not limit the number of fourth heat pipe G4 and fifth heat pipe G5.

[0035] Please refer to Figures 3-7 , Figure 3 This is a three-dimensional schematic diagram of the first substrate from one perspective; Figure 4 A three-dimensional schematic diagram of the first substrate from another perspective; Figure 5 This is a three-dimensional schematic diagram of the second substrate from one perspective; Figure 6 This is a three-dimensional schematic diagram of the second substrate from another perspective; Figure 7 This is an exploded view of the first heat-conducting component. (See diagram below.) Figures 3-7 As shown, and please refer to Figures 1-2The heat dissipation device 1 further includes a first heat-conducting component 13, a second heat-conducting component 14, a third heat-conducting component 15, and a plurality of thermal paste layers 16; the top surface S11 of the first substrate 11 has a first opening K1, the first opening K1 exposes portions of the first heat pipe G1 and the third heat pipe G3, the first heat-conducting component 13 is disposed in the first opening K1 and is attached to portions of the first heat pipe G1 and the third heat pipe G3; the top surface S21 of the second substrate 12 has a recess C4, the second slot C2 extends to the recess C4, the second heat-conducting component 14 is disposed in the recess C4 and is attached to portions of the second heat pipe G2 and the third heat pipe G3; the third heat-conducting component 15 is disposed on the fifth heat pipe G5; the plurality of thermal paste layers 16 are respectively disposed on the top surface S11 of the first substrate 11, the top surface S21 of the second substrate 12, and the third heat-conducting component 15.

[0036] In this embodiment, it is preferred that both the second heat-conducting component 14 and the third heat-conducting component 15 are heat-conducting blocks.

[0037] Furthermore, the first heat-conducting component 13 includes: a first heat-conducting block 131, a polyester film layer 132, a foam layer 133, and a blue adhesive layer 134. The first heat-conducting block 131 is disposed at the first opening K1; the polyester film layer 132 is disposed on the first heat-conducting block 131, and the polyester film layer 132 has a second opening K2 to expose a portion of the first heat-conducting block 131; the foam layer 133 is disposed on the polyester film layer 132 and surrounds the second opening K2; and the blue adhesive layer 134 is disposed on the polyester film layer 132 and surrounds the foam layer 133.

[0038] Please refer to Figure 8 , Figure 8 This is a schematic diagram of the heat dissipation fins. Figure 8 As shown, the first heat dissipation fin group F1, the second heat dissipation fin group F2, the third heat dissipation fin group F3 and the fourth heat dissipation fin group F4 each include at least one heat dissipation fin f, and each heat dissipation fin f includes an aluminum core layer f1 and a copper outer layer f2.

[0039] Specifically, each heat dissipation fin f of this utility model has an aluminum core inside, and the aluminum core is wrapped with a layer of copper by metallurgical bonding or electroplating. The thermal conductivity of the heat dissipation fin f is about 250W / (m·K), which has good thermal conductivity. Compared with aluminum heat dissipation fins, the weight of each heat dissipation fin f of this utility model is only 1.14 times that of aluminum heat dissipation fins.

[0040] In one embodiment of this invention, each heat sink fin f is formed by aluminum-copper plating. Through material optimization, using aluminum-copper plating instead of traditional aluminum improves the cooling efficiency by approximately 2.3 degrees Celsius for a single-CPU system, approximately 1.3 degrees Celsius for a dual-CPU system, and approximately 1.75 degrees Celsius for a dual-GPU system. Furthermore, aluminum-copper plating has a density only 34.8% that of copper heat sinks, resulting in a significant weight advantage.

[0041] Based on this, compared with the heat dissipation fins in the prior art, the present invention has the following advantages: 1. Lightweight advantages Aluminum has only 30% the density of copper (approximately 2.7 g / cm³ vs. 8.96 g / cm³). For the same volume, aluminum-plated copper parts are about 70% lighter than pure copper parts, significantly reducing the overall weight of the equipment. This is of great significance for fields such as aerospace, new energy vehicles, and portable electronic products. 2. Excellent heat dissipation performance (thermal management advantages) Optimized heat conduction pathways: The internal aluminum core acts as a "heat dissipation fin," possessing a large volume and heat capacity, enabling rapid absorption and storage of heat; the surface copper layer serves as a "high-speed heat conduction channel," utilizing its extremely high thermal conductivity to rapidly diffuse heat laterally and transfer it to the external heat sink. This structure effectively solves the "hot spot" problem in high-power devices (such as IGBTs and CPUs), avoiding localized overheating and significantly improving heat dissipation efficiency and equipment reliability.

[0042] 3. Strong mechanical properties Strength to weight ratio: The aluminum alloy matrix provides good mechanical strength and rigidity, ensuring the stability of the structural components while maintaining lightweight characteristics.

[0043] In summary, the heat dissipation device of this invention, by having heat pipes inserted into the grooves on the bottom surface of the substrate and connected to the heat dissipation fin assembly, better meets the requirements for thinness. Furthermore, the die-cast substrate used in this invention, compared to a vapor chamber, not only improves the overall structural strength of the heat dissipation device but also reduces manufacturing costs. The aluminum-copper plating process used in this invention to form the heat dissipation fins not only reduces the overall weight of the heat dissipation device but also meets the requirements for high-power heat dissipation.

[0044] Therefore, the embodiments of this utility model are sufficient to achieve the above-mentioned objectives and advantages, and can also achieve the essential effects that should be possessed. The specific embodiments described above are merely illustrative examples, and those skilled in the art can make various modifications and equivalent implementations after understanding the content of this utility model. Except for the contents described in the following claims, the disclosed structural and design details are not limited. Therefore, it is understood that the specific embodiments described above can be changed, combined, or modified, and all such changes should be considered to be covered within the scope and spirit of this utility model. Furthermore, it should be understood that the constituent elements of this embodiment are not mutually exclusive, and those skilled in the art can arbitrarily combine the constituent elements according to design requirements.

Claims

1. A heat dissipation device for laptop-type electronic devices, characterized in that, include: A first substrate and a second substrate, wherein the top surface of the first substrate is used to support a first heat source and the top surface of the second substrate is used to support a second heat source, and the first substrate and the second substrate are coplanar and spaced apart. The first heat dissipation fin group is disposed on the side of the first substrate away from the second substrate; The second heat dissipation fin group is disposed on the side of the second substrate away from the first substrate; At least one first heat pipe, the bottom surface of the first substrate has a first slot, a portion of the first heat pipe is installed in the first slot and the two ends of the first heat pipe are respectively connected to the first heat dissipation fin assembly and the first substrate. At least one second heat pipe, the bottom surface of the second substrate has a second slot, a portion of the second heat pipe is installed in the second slot and the two ends of the second heat pipe are respectively connected to the second heat dissipation fin assembly and the second substrate. Specifically, the heat generated by the first heat source absorbed by the first substrate is guided to the first heat dissipation fin group through the first heat pipe, and the heat generated by the second heat source absorbed by the second substrate is guided to the second heat dissipation fin group through the second heat pipe.

2. The heat dissipation device as described in claim 1, characterized in that, Also includes: The third heat dissipation fin group is disposed on the side of the first substrate away from the second substrate and located between the first substrate and the first heat dissipation fin group; The fourth heat dissipation fin group is disposed on the side of the second substrate away from the first substrate and located between the second substrate and the second heat dissipation fin group; At least one third heat pipe, a portion of which is installed in the first slot and the second slot, and both ends of which are respectively connected to the third heat dissipation fin group and the fourth heat dissipation fin group. The heat absorbed by the first substrate and the second substrate is conducted to the third heat dissipation fin group and the fourth heat dissipation fin group respectively through the third heat pipe.

3. The heat dissipation device as described in claim 2, characterized in that, It also includes at least one fourth heat pipe, and the bottom surface of the second substrate also has a third slot, the third slot being connected to and penetrating the second slot, the fourth heat pipe being installed in the third slot and located above the third heat pipe.

4. The heat dissipation device as described in claim 1, characterized in that, It also includes at least one fifth heat pipe, which is mounted on the bottom surface of the second substrate and connected to the second heat dissipation fin assembly.

5. The heat dissipation device as described in claim 1, characterized in that, The first substrate and / or the second substrate are die-cast parts.

6. The heat dissipation device as described in claim 2, characterized in that, The first heat dissipation fin group, the second heat dissipation fin group, the third heat dissipation fin group and the fourth heat dissipation fin group each include at least one heat dissipation fin, and each heat dissipation fin includes an aluminum core layer and a copper outer layer.

7. The heat dissipation device as described in claim 6, characterized in that, Each of the aforementioned heat dissipation fins is formed by an aluminum-copper plating process.

8. The heat dissipation device as described in claim 2, characterized in that, It also includes a first heat-conducting component, the top surface of the first substrate having a first opening, the first opening exposing portions of the first heat pipe and the third heat pipe, the first heat-conducting component being disposed in the first opening and attached to portions of the first heat pipe and the third heat pipe.

9. The heat dissipation device as described in claim 2, characterized in that, It also includes a second heat-conducting component, the top surface of the second substrate has a recess, the second slot extends to the recess, and the second heat-conducting component is disposed in the recess and attached to the portion of the second heat pipe and the third heat pipe.

10. The heat dissipation device as described in claim 4, characterized in that, It also includes a third heat-conducting component, which is disposed on the fifth heat pipe.

11. The heat dissipation device as described in claim 10, characterized in that, It also includes multiple thermal paste layers, which are respectively disposed on the top surface of the first substrate, the top surface of the second substrate, and the third thermal conductive component.

12. The heat dissipation device as described in claim 8, characterized in that, The first thermally conductive component includes: A first heat-conducting block is disposed at the first opening; A polyester film layer is disposed on the first heat-conducting block, the polyester film layer having a second opening to expose a portion of the first heat-conducting block; A foam layer is disposed on the polyester film layer and surrounds the second opening; A blue adhesive layer is disposed on the polyester film layer and surrounds the foam layer.

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