Single-chip microcomputer development board stacking short-circuit prevention insulation spacer group

Abstract

This utility model relates to the field of electronics, and in particular to a stacked short-circuit insulating and isolating pad assembly for microcontroller development boards. The insulating and isolating pad assembly includes an insulating and isolating support assembly and fasteners. The insulating and isolating support assembly is disposed between a first development board and a second development board. The insulating and isolating support assembly includes a first insulating layer, a second insulating layer, a conductive shielding layer, and multiple supporting and positioning parts. The conductive shielding layer is sandwiched between the first and second insulating layers. At least one supporting and positioning part is a conductive supporting and positioning part, which contains a conductive sleeve and has a central connecting cavity. The outer wall of the conductive sleeve has a beveled pushing part, and an open conductive ring is provided within the connecting cavity. The conductive shielding layer's edge conductive part extends into the connecting cavity. After the fasteners are tightened, the beveled pushing part pushes the open conductive ring to abut against the edge conductive part, causing the conductive shielding layer to form a conductive connection structure.

Description

Technical Field

[0001] This utility model relates to the field of electronics, and in particular to a stacked short-circuit insulation and isolation pad assembly for microcontroller development boards. Background Technology

[0002] Microcontroller development boards, expansion boards, and functional module boards are commonly used in teaching experiments, prototype verification, and embedded system development. To save installation space and facilitate signal expansion, multiple development boards are usually stacked on top of each other and supported and fixed by bolts, spacers, or gaskets. However, the top and bottom surfaces of development boards typically have solder joints, pin headers, pads, vias, and protruding electronic components. When the spacing between adjacent development boards is insufficient or assembly deviations occur, there is a risk of local contact, pressure, or short circuits.

[0003] Existing development board stacking structures mostly use ordinary insulating posts or individual insulating pads for isolation. While these structures can provide support at the mounting hole locations, their main function is concentrated at point support points, making it difficult to form a continuous isolation layer between two development boards. Some solutions add insulating sheets or shielding sheets between the two development boards, but these sheets and positioning posts are usually separate structures, requiring alignment with the mounting holes during assembly, which is cumbersome. Furthermore, if a conductive shielding layer is sandwiched within the insulating sheet, the conductive shielding layer needs to avoid the positioning posts or fasteners, easily creating shielding interruption areas around the holes.

[0004] Furthermore, if the conductive shielding layer is directly grounded via ordinary bolts or metal washers, it can easily lead to exposed conductive components or unintended contact with non-grounded areas on the development board. If only a separate grounding lead is provided, it increases assembly steps, and the stability of the grounding connection is significantly affected by manual assembly. Especially under conditions of long-term insertion / removal, vibration, or repeated disassembly / reassembly of the development board, the contact reliability between the conductive shielding layer and the grounding component can easily decrease. Therefore, it is necessary to provide a stacked insulating gasket assembly for development boards that can simultaneously provide inter-board insulation support, interlayer shielding, and peri-hole conductive connections. Utility Model Content

[0005] This application provides a stackable short-circuit protection insulating pad assembly for microcontroller development boards, which is used to be placed between a first development board and a second development board. This helps to form an insulating support when the two development boards are stacked and installed, and allows the conductive shielding layer inside the insulating support assembly to form an outgoing connection structure at the support positioning position.

[0006] According to one aspect of this application, a stacked short-circuit protection insulating pad assembly for microcontroller development boards is provided, including an insulating support assembly and fasteners.

[0007] The insulating support assembly includes a first insulating layer, a second insulating layer, a conductive shielding layer, and multiple support positioning parts; the first insulating layer and the second insulating layer are disposed opposite to each other, and the conductive shielding layer is sandwiched between the first insulating layer and the second insulating layer; the multiple support positioning parts are respectively disposed at the corners of the insulating support assembly and are integrally formed with the first insulating layer and the second insulating layer.

[0008] The support positioning part has an axial through hole, and the fastener passes through the axial through hole and is used to pass through the first development board and the second development board, so that the insulation isolation support assembly is assembled between the first development board and the second development board.

[0009] At least one of the multiple support positioning parts is a conductive support positioning part. A conductive sleeve is provided within the conductive support positioning part, and the conductive sleeve is arranged along the axial direction of the conductive support positioning part, with fasteners passing through the conductive sleeve. A sandwich connecting cavity is provided in the middle of the conductive support positioning part, and the sandwich connecting cavity corresponds to the location of the conductive shielding layer.

[0010] The outer wall of the conductive sleeve is provided with a sloping pushing part, which is located in the interlayer connecting cavity; an open conductive ring is provided in the interlayer connecting cavity, which is sleeved on the outside of the conductive sleeve, and the inner edge of the open conductive ring is opposite to the sloping pushing part.

[0011] The conductive shielding layer has a column hole at the position corresponding to the conductive support positioning part, and a hole edge guide part is provided at the edge of the column hole. The hole edge guide part extends into the interlayer connecting cavity and is positioned opposite to the outer edge of the open guide ring.

[0012] In some embodiments, when the fastener is locked, the beveled pushing portion abuts against the inner edge of the open guide ring, and the outer edge of the open guide ring abuts against the hole edge guide portion, thereby forming a conductive connection between the conductive shielding layer, the hole edge guide portion, the open guide ring, the conductive sleeve, and the fastener.

[0013] In some embodiments, the outer peripheral edge of the conductive shielding layer is located inside the outer peripheral edges of the first insulating isolation layer and the second insulating isolation layer, and the first insulating isolation layer and the second insulating isolation layer are connected to each other at the outer peripheral position of the conductive shielding layer.

[0014] In some embodiments, the interlayer communication cavity is an annular communication groove, a semi-annular communication groove, a lateral communication hole, or a communication notch.

[0015] In some embodiments, the conductive sleeve is a metal sleeve, a conductive bushing, a conductive insert, or a conductive inner cylinder.

[0016] In some embodiments, the inclined pressing portion is a conical shoulder, a wedge surface, a frustum outer wall, or an inclined step.

[0017] In some embodiments, the open conductive ring is an open metal ring, an open elastic ring, an expansion ring, or a conductive retaining ring.

[0018] In some embodiments, the hole edge conductive portion is a hole perimeter overlapping piece, hole edge flange, hole edge protrusion, or hole edge conductive tongue piece.

[0019] In some embodiments, the stacked short-circuit protection insulating pad assembly of the microcontroller development board further includes a lead-out connecting piece, which contacts at least one of a fastener, a crimping pad, a nut, or a conductive sleeve.

[0020] The beneficial effects of the technical solution provided in this application are as follows: By sandwiching the conductive shielding layer between the first insulating layer and the second insulating layer, the insulating isolation support assembly forms a conductive shielding interlayer inside while forming inter-plate isolation; by setting the support positioning part and the first insulating layer and the second insulating layer as an integral structure, multiple support positioning parts can be assembled as a whole with the insulating isolation support assembly, reducing the positional deviation caused by the assembly of individual support parts; by setting a conductive sleeve in the conductive support positioning part and setting an interlayer connecting cavity in the middle of the conductive support positioning part, the conductive shielding layer can enter the conductive support positioning part at the support positioning position to form a conductive relationship; by setting a beveled pushing part on the outer wall of the conductive sleeve and setting an open guide ring in the interlayer connecting cavity, the axial locking fit generated when the fastener is locked can be transformed into a radial abutment fit between the open guide ring and the hole edge guide part; through the sequential connection of the hole edge guide part, the open guide ring, the conductive sleeve and the fastener, the conductive shielding layer forms a lead-out connection structure at the conductive support positioning part. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure and installation of this utility model.

[0023] Figure 2 This is a schematic diagram of the structure of this utility model.

[0024] Figure 3 yes Figure 2 Enlarged view of point A in the image.

[0025] Figure 4 This is a schematic diagram showing the contact between the inclined pressing part and the open guide ring.

[0026] In the figure: 1-First development board, 2-Second development board, 3-Insulation and isolation support assembly, 31-First insulation and isolation layer, 32-Conductive shielding layer, 33-Second insulation and isolation layer, 34-Interlayer connecting cavity, 35-Hole edge guide part, 4-Support positioning part, 41-Conductive support positioning part, 42-Conductive sleeve, 43-Fastener, 44-Crimping pad, 45-Fastening head, 46-Beveled pushing part, 47-Open guide ring, 48-Nut, 5-Outlet connecting piece. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other. The application will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. The terms "upper," "lower," "inner," "outer," "axial," "radial," "circumferential," etc., are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application.

[0029] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," "abutment," "sleeving," and "clamping" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] like Figures 1 to 4 As shown, this embodiment provides a stacked short-circuit protection insulating pad assembly for microcontroller development boards, which is disposed between a first development board 1 and a second development board 2. The first development board 1 and the second development board 2 can be microcontroller development boards, expansion boards, functional module boards, sensor boards, communication module boards, or other circuit board structures. For ease of explanation, in the embodiment shown in the accompanying drawings, the first development board 1 is located above the second development board 2, but this orientation does not constitute a limitation on the scope of protection of this application.

[0031] The insulating isolation pad assembly includes an insulating isolation support component 3 and a fastener 43. The insulating isolation support component 3 is located between the first development board 1 and the second development board 2, and the fastener 43 is inserted through the first development board 1, the insulating isolation support component 3, and the second development board 2. With this arrangement, the insulating isolation support component 3 is located at the stacking interval of the two development boards, and the fastener 43 serves as a through connector to form an assembly relationship with the two development boards.

[0032] The insulating support assembly 3 includes a first insulating layer 31, a conductive shielding layer 32, a second insulating layer 33, and multiple support positioning parts 4. The first insulating layer 31 and the second insulating layer 33 are arranged vertically opposite each other. The conductive shielding layer 32 is sandwiched between the first insulating layer 31 and the second insulating layer 33. The first insulating layer 31 is located on one side of the conductive shielding layer 32, and the second insulating layer 33 is located on the other side of the conductive shielding layer 32. In this way, the conductive shielding layer 32 is arranged in the internal interlayer of the insulating support assembly 3, rather than being directly exposed on the upper and lower outer surfaces of the insulating support assembly 3.

[0033] In some embodiments, the outer peripheral edge of the conductive shielding layer 32 is located inside the outer peripheral edges of the first insulating isolation layer 31 and the second insulating isolation layer 33. The first insulating isolation layer 31 and the second insulating isolation layer 33 are connected to each other at the outer periphery of the conductive shielding layer 32. This structure allows the outer peripheral edge of the conductive shielding layer 32 to be surrounded internally by the first insulating isolation layer 31 and the second insulating isolation layer 33. Exemplarily, the first insulating isolation layer 31 and the second insulating isolation layer 33 can be made of insulating plastic, insulating composite, glass fiber, polyimide, or other insulating materials. The conductive shielding layer 32 can be made of copper foil, copper sheet, stainless steel sheet, tin-plated conductive layer, conductive composite layer, or other conductive shielding materials.

[0034] Multiple support positioning parts 4 are located at the corners of the insulating isolation support assembly 3. The support positioning parts 4 are integrally formed with the first insulating isolation layer 31 and the second insulating isolation layer 33. For example, the support positioning parts 4 can be integrally formed with the first insulating isolation layer 31 and the second insulating isolation layer 33 by injection molding, hot pressing, bonding, insert molding or lamination molding. Since the support positioning parts 4 are integrally formed with the first insulating isolation layer 31 and the second insulating isolation layer 33, during the assembly process, the multiple support positioning parts 4 are positioned together with the insulating isolation support assembly 3, and it is not necessary to separately install multiple column-shaped support members on the insulating isolation support assembly 3.

[0035] The support and positioning part 4 is arranged in the vertical direction. One end of the support and positioning part 4 is arranged opposite to the first development plate 1, and the other end of the support and positioning part 4 is arranged opposite to the second development plate 2. An axial through hole is provided in the support and positioning part 4, which is arranged through the support and positioning part 4 in the vertical direction. The first development plate 1 and the second development plate 2 are respectively provided with mounting holes corresponding to the support and positioning part 4. The fastener 43 is arranged to pass through the mounting hole of the first development plate 1, the axial through hole of the support and positioning part 4, and the mounting hole of the second development plate 2 in sequence.

[0036] In some embodiments, the fastener 43 can be a bolt, screw, threaded rod, or other through-type fastening structure; in the embodiment shown in the figures, the fastener 43 is a bolt structure; one end of the fastener 43 is provided with a fastening head 45, and the other end of the fastener 43 can be connected to a nut; the fastening head 45 is located on the outside of the first development plate 1, and the nut 48 is located on the outside of the second development plate 2; the crimping pad 44 can be disposed between the fastening head 45 and the first development plate 1, or between the nut 48 and the second development plate 2; the crimping pad 44 can be an insulating pad, a conductive pad, an elastic pad, or a composite pad. In the assembled state, the fastening head 45, the fastener 43, the nut 48, and the crimping pad 44 together form a through-assembly structure for the first development plate 1, the insulating isolation support assembly 3, and the second development plate 2.

[0037] At least one of the multiple support and positioning parts 4 is a conductive support and positioning part 41; a conductive sleeve 42 is provided inside the conductive support and positioning part 41, the conductive sleeve 42 is arranged along the axial direction of the conductive support and positioning part 41, and a fastener 43 is provided through the conductive sleeve 42. The conductive sleeve 42 can be embedded in the conductive support and positioning part 41, or it can be press-fitted into the axial through hole of the conductive support and positioning part 41. The conductive sleeve 42 can be a metal sleeve, a conductive bushing, a conductive insert, a conductive inner cylinder, or other conductive parts arranged along the axial direction.

[0038] In some embodiments, the upper end of the conductive sleeve 42 may be lower than the upper end face of the conductive support positioning part 41, and the lower end of the conductive sleeve 42 may be higher than the lower end face of the conductive support positioning part 41; both the upper and lower end faces of the conductive support positioning part 41 may be insulated end faces; thus, the conductive sleeve 42 is mainly located inside the conductive support positioning part 41, and the upper and lower ends of the conductive support positioning part 41 are still formed by insulating material to form end face structures. When the fastener 43 passes through the conductive sleeve 42, the conductive sleeve 42 may directly contact the fastener 43, or it may be connected to the fastener 43 through the crimping pad 44, the nut 48, or the guide connecting piece 5.

[0039] A sandwiched connecting cavity 34 is formed in the middle of the conductive support positioning part 41. The sandwiched connecting cavity 34 is located between the first insulating isolation layer 31 and the second insulating isolation layer 33, and corresponds to the location of the conductive shielding layer 32. The sandwiched connecting cavity 34 can be an annular connecting groove, a semi-annular connecting groove, a lateral connecting hole, a connecting notch, or other connecting space. In the embodiment shown in the figure, the sandwiched connecting cavity 34 is an annular connecting groove arranged circumferentially along the conductive support positioning part 41. Since the conductive shielding layer 32 is sandwiched between the first insulating isolation layer 31 and the second insulating isolation layer 33, after the sandwiched connecting cavity 34 is set in the middle of the conductive support positioning part 41, a sandwich space corresponding to the conductive shielding layer 32 can be formed inside the conductive support positioning part 41.

[0040] The outer wall of the conductive sleeve 42 is provided with a sloping pressing portion 46, which is located within the interlayer connecting cavity 34. The sloping pressing portion 46 can be a conical shoulder, a wedge surface, a frustum outer wall, a sloping step, or other pressing structure with an inclined surface; in the embodiment shown in the figure, the sloping pressing portion 46 is a conical shoulder formed on the outer wall of the conductive sleeve 42. The sloping pressing portion 46 can be arranged circumferentially along the conductive sleeve 42 and has an inclined outer surface facing the inside of the interlayer connecting cavity 34. The sloping pressing portion 46 is integrally provided with or fixedly provided on the outer wall of the conductive sleeve 42, so when the conductive sleeve 42 undergoes a slight positional change along the axial direction of the conductive support positioning portion 41, the sloping pressing portion 46 moves synchronously with the conductive sleeve 42.

[0041] An open conductive ring 47 is provided within the interlayer connecting cavity 34. The open conductive ring 47 is a conductive ring with an open slit, and it is sleeved on the outside of the conductive sleeve 42. The open conductive ring 47 is located within the interlayer connecting cavity 34, with its inner edge facing the inclined pressing portion 46, and its outer edge facing the conductive shielding layer 32. The open conductive ring 47 can be an open metal ring, an open elastic ring, an expansion ring, a conductive retaining ring, or other conductive rings with an open structure. Because the open conductive ring 47 has an open slit, its ring body can undergo radial position changes under the action of the inclined outer surface of the inclined pressing portion 46.

[0042] The conductive shielding layer 32 has a post hole at the position corresponding to the conductive support positioning part 41. The conductive support positioning part 41 passes through the post hole, and a post hole edge guide part 35 is provided at the edge of the post hole. The post hole edge guide part 35 is provided along the edge of the post hole and extends into the interlayer connecting cavity 34. The post hole edge guide part 35 is disposed opposite to the outer edge of the open conductive ring 47. The post hole edge guide part 35 can be a periphery overlap piece, a periphery flange, a periphery protrusion, a periphery conductive tongue piece, or other conductive structures provided at the edge of the post hole. In the embodiment shown in the figure, the post hole edge guide part 35 is a periphery overlap piece extending from the edge of the post hole of the conductive shielding layer 32 into the interlayer connecting cavity 34. The post hole edge guide part 35 can be an integral structure with the conductive shielding layer 32, or it can be a conductive sheet structure fixedly connected to the edge of the post hole of the conductive shielding layer 32.

[0043] With fastener 43 not tightened, it passes through the conductive sleeve 42. The open guide ring 47 is located in the interlayer connecting cavity 34. The inner edge of the open guide ring 47 is opposite to the inclined pushing part 46, and the outer edge of the open guide ring 47 is opposite to the hole edge guide part 35. At this time, the conductive sleeve 42, the inclined pushing part 46, the open guide ring 47, and the hole edge guide part 35 are in a pre-assembled relative position.

[0044] With the fastener 43 locked, at least one of the fastening head 45, nut 48, or pressing pad 44 forms a relative pressing contact with the conductive sleeve 42, causing the conductive sleeve 42 to change position axially relative to the conductive support positioning part 41. As the conductive sleeve 42 moves, the inclined pressing part 46 abuts against the inner edge of the open guide ring 47. Because the inclined pressing part 46 has an inclined outer surface, the inner edge of the open guide ring 47 moves outward under the abutting action of the inclined pressing part 46, causing the outer edge of the open guide ring 47 to abut against the hole edge guide part 35. Thus, the axial locking action of the fastener 43 is transmitted to the open guide ring 47 via the conductive sleeve 42 and the inclined pressing part 46, causing the open guide ring 47 to form a contact fit with the hole edge guide part 35.

[0045] After the open conductive ring 47 abuts against the hole edge conductive portion 35, a conductive connection is formed between the conductive shielding layer 32, the hole edge conductive portion 35, the open conductive ring 47, the conductive sleeve 42, and the fastener 43. Specifically, the conductive shielding layer 32 is connected to the hole edge conductive portion 35, the hole edge conductive portion 35 abuts against the open conductive ring 47, the open conductive ring 47 abuts against the inclined pushing portion 46, the inclined pushing portion 46 is disposed on the outer wall of the conductive sleeve 42, and the conductive sleeve 42 contacts the fastener 43 or a conductive component connected to the fastener 43, thereby forming a conductive path extending from the conductive shielding layer 32 to the outside of the conductive support positioning portion 41.

[0046] The lead-out connecting piece 5 can be positioned at at least one of the fastener 43, nut 48, crimping pad 44, or conductive sleeve 42. The lead-out connecting piece 5 can be a sheet-like conductive element, with one end in contact with the fastener 43, nut 48, crimping pad 44, or conductive sleeve 42, and the other end extending outwards from the insulating support assembly 3. The lead-out connecting piece 5 may have a connection hole for connection to an external connector. Thus, the conductive shielding layer 32, after passing through the bore edge guide portion 35, the open guide ring 47, the conductive sleeve 42, and the fastener 43, can be connected to the lead-out connecting piece 5.

[0047] In some embodiments, the guide connecting piece 5 can be sandwiched between the nut 48 and the crimping washer 44, or between the fastening head 45 and the crimping washer 44. When the guide connecting piece 5 contacts the nut 48 or the fastening head 45, the guide connecting piece 5 is connected to the conductive sleeve 42 via the fastener 43. When the guide connecting piece 5 is in direct contact with the conductive sleeve 42, the guide connecting piece 5 is directly connected to the conductive sleeve 42.

[0048] In some embodiments, only one of the plurality of support positioning parts 4 is configured as a conductive support positioning part 41, while the remaining support positioning parts 4 are ordinary insulating support positioning parts. The ordinary insulating support positioning parts do not have conductive sleeves 42, and the axial perforations within them have insulating hole wall structures. The ordinary insulating support positioning parts are also integrally integrated with the first insulating isolation layer 31 and the second insulating isolation layer 33. Thus, multiple corners of the insulating isolation support assembly 3 have support positioning parts 4, and the conductive support positioning part 41 forms the lead-out connection position of the conductive shielding layer 32.

[0049] The assembly process of this embodiment can be as follows: First, place the insulating support assembly 3 on the second development board 2, so that the multiple support positioning parts 4 correspond to the mounting holes on the second development board 2; then place the first development board 1 above the insulating support assembly 3, so that the mounting holes on the first development board 1 correspond to the axial through holes of the support positioning parts 4; then pass the fastener 43 through the first development board 1, the support positioning parts 4 and the second development board 2, and connect the nut 48 to the other end of the fastener 43.

[0050] For the conductive support positioning part 41, the fastener 43 passes through the conductive sleeve 42. The inclined pushing part 46 on the outer wall of the conductive sleeve 42 is located in the interlayer connecting cavity 34. The open guide ring 47 in the interlayer connecting cavity 34 is sleeved on the outside of the conductive sleeve 42. The hole edge guide part 35 on the conductive shielding layer 32 extends into the interlayer connecting cavity 34 and is opposite to the open guide ring 47. When the fastener 43 is gradually tightened, the conductive sleeve 42 and the inclined pushing part 46 form an axial fit with the fastener 43 in the tightened state. The open guide ring 47 forms an abutment relationship between the inclined pushing part 46 and the hole edge guide part 35, so that the conductive shielding layer 32 forms a continuous connection structure with the conductive sleeve 42, the fastener 43 and the lead-out connecting piece 5 at the position of the conductive support positioning part 41.

[0051] The working principle of this embodiment is as follows: After the first development board 1 and the second development board 2 are stacked and installed, the insulating support assembly 3 is located between the first development board 1 and the second development board 2. The upper and lower ends of the support positioning part 4 correspond to the first development board 1 and the second development board 2, respectively. Fasteners 43 connect the first development board 1, the insulating support assembly 3, and the second development board 2 into a stacked structure. The conductive shielding layer 32 is sandwiched between the first insulating layer 31 and the second insulating layer 33.

[0052] At the conductive support positioning part 41, the conductive sleeve 42 is arranged along the axial direction of the conductive support positioning part 41. The inclined pushing part 46 is disposed on the outer wall of the conductive sleeve 42 and located in the interlayer connecting cavity 34. The open guide ring 47 is disposed in the interlayer connecting cavity 34. The hole edge guide part 35 extends into the interlayer connecting cavity 34 from the edge of the post hole of the conductive shielding layer 32. After the fastener 43 is locked, the conductive sleeve 42 drives the inclined pushing part 46 to abut against the inner edge of the open guide ring 47, and the outer edge of the open guide ring 47 abuts against the hole edge guide part 35, so that a conductive connection is formed between the conductive shielding layer 32, the hole edge guide part 35, the open guide ring 47, the conductive sleeve 42, and the fastener 43. When the lead-out connecting piece 5 is connected to at least one of the fastener 43, nut 48, crimping pad 44, or conductive sleeve 42, the conductive shielding layer 32 is connected outward through the lead-out connecting piece 5.

[0053] In summary, in this embodiment, the locking path of the fastener 43 and the exit path of the conductive shielding layer 32 form a mating relationship at the conductive support positioning part 41. The fastener 43 passes through the conductive sleeve 42, the inclined pushing part 46 of the conductive sleeve 42 mates with the open guide ring 47, the open guide ring 47 mates with the hole edge guide part 35 of the conductive shielding layer 32, and the exit connecting piece 5 connects to the fastener 43, the nut 48, the pressing pad 44, or the conductive sleeve 42. Thus, the conductive shielding layer 32 forms a sandwich structure inside the insulating isolation support assembly 3 and forms an exit connecting structure at the conductive support positioning part 41.

Claims

1. A stacked short-circuit insulating pad assembly for microcontroller development boards, disposed between a first development board and a second development board, characterized in that, Including insulating support components and fasteners; The insulating support assembly includes a first insulating layer, a second insulating layer, a conductive shielding layer sandwiched between the two, and a plurality of support and positioning parts. The support and positioning parts are integral with the first insulating layer and the second insulating layer and are provided with axial through holes. At least one support positioning part is a conductive support positioning part, and the conductive support positioning part is provided with a conductive sleeve for fasteners to pass through, and a sandwich communication cavity corresponding to the location of the conductive shielding layer is provided in the middle. The outer wall of the conductive sleeve is provided with a sloping pushing part located in the interlayer connecting cavity, and an open conductive ring is provided in the interlayer connecting cavity and sleeved on the outside of the conductive sleeve; the conductive shielding layer is provided with a column hole corresponding to the conductive support positioning part, and the edge of the column hole is provided with a hole edge conductive part extending into the interlayer connecting cavity; in the locked state, the sloping pushing part abuts against the inner edge of the open conductive ring, and the outer edge of the open conductive ring abuts against the hole edge conductive part, so that a conductive connection is formed between the conductive shielding layer, the hole edge conductive part, the open conductive ring, the conductive sleeve and the fastener.

2. The stacked short-circuit insulating and isolating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The outer peripheral edge of the conductive shielding layer is located inside the outer peripheral edges of the first insulating isolation layer and the second insulating isolation layer, and the first insulating isolation layer and the second insulating isolation layer are connected to each other at the outer peripheral position of the conductive shielding layer.

3. The stacked short-circuit insulating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The multiple support positioning parts are located at the corner positions of the insulating isolation support assembly. One end of the support positioning part is disposed opposite to the first development board, and the other end of the support positioning part is disposed opposite to the second development board.

4. The stacked short-circuit insulating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The conductive sleeve is arranged along the axial direction of the conductive support positioning part.

5. The stacked short-circuit insulating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The interlayer connecting cavity is located between the first insulating layer and the second insulating layer, and the interlayer connecting cavity is an annular connecting groove, a semi-annular connecting groove, a lateral connecting hole, or a connecting notch.

6. The stacked short-circuit insulating and isolating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The conductive sleeve is a metal sleeve, a conductive bushing, a conductive insert, or a conductive inner cylinder.

7. The stacked short-circuit insulating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The inclined pressing part is a conical shoulder, a wedge surface, the outer wall of a truncated cone, or an inclined step.

8. The stacked short-circuit insulating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The open conductive ring is a conductive ring with an open slot.

9. The stacked short-circuit insulating and isolating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, The hole edge conductive part is a hole perimeter overlapping piece, hole edge flange, hole edge protrusion, or hole edge conductive tongue piece.

10. The stacked short-circuit insulating and isolating pad assembly for single-chip microcomputer development boards according to claim 1, characterized in that, It also includes a lead-out connector, and the fastener is provided with a crimping pad and a nut, wherein the lead-out connector contacts at least one of the fastener, the crimping pad, the nut or the conductive sleeve.

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