Folding electronic device

Abstract

Embodiments of the present application provide a foldable electronic device, aiming to solve the technical problem that the resonant frequency of a resonant cavity is likely to fall into the communication frequency band of an antenna structure on the foldable electronic device, thereby affecting the communication performance of the antenna structure. The foldable electronic device has a dielectric material arranged in the resonant cavity, thereby reducing the resonant frequency of the resonant cavity, moving the resonant frequency of the resonant cavity out of the communication frequency band of the antenna structure, and thereby reducing the antenna efficiency pit of the antenna structure and improving the communication performance of the antenna structure.

Description

Technical Field

[0001] This application relates to the field of terminal device technology, specifically to a foldable electronic device. Background Technology

[0002] Foldable electronic devices (such as foldable phones and foldable tablets) generally have a first frame and a second frame. The first frame can be folded or unfolded relative to the second frame. When the first frame is folded together relative to the second frame, the first and second frames form a resonant cavity. The resonant frequency of the resonant cavity can easily fall within the communication frequency band of the antenna structure on the foldable electronic device, thus affecting the communication performance of the antenna structure. Utility Model Content

[0003] This application provides a foldable electronic device that can improve the communication performance of the antenna structure.

[0004] In a first aspect, embodiments of this application provide a foldable electronic device, comprising: a first middle frame, a second middle frame, a flexible display panel, a first back cover, and a dielectric material; the first middle frame and the second middle frame are foldably connected; the flexible display panel is disposed on the first middle frame and the second middle frame; the first back cover is disposed on the first middle frame, and the first back cover is disposed opposite to the flexible display panel on the first middle frame; an antenna structure is disposed on the first middle frame and / or the second middle frame; in the closed state of the foldable electronic device, conductors on the first middle frame and conductors on the second middle frame are spaced apart along a direction perpendicular to the flexible display panel, and the first back cover is disposed between the first middle frame and the second middle frame; the dielectric material is disposed in a first partial area of ​​the first back cover, the first partial area being a portion of the first back cover.

[0005] In the foldable electronic device of this application embodiment, the conductors on the first middle frame and the conductors on the second middle frame are spaced apart along a direction perpendicular to the flexible display panel, that is, the conductors on the first middle frame and the conductors on the second middle frame form a resonant cavity; the dielectric material is disposed in a first local area of ​​the first back cover, that is, the dielectric material is disposed in the resonant cavity, which can reduce the resonant frequency of the resonant cavity and move the resonant frequency of the resonant cavity to outside the communication frequency band of the antenna structure, thereby reducing the dip in the antenna efficiency curve of the antenna structure caused by the resonant cavity, avoiding or weakening the influence of the resonant cavity on the antenna structure in the communication frequency band, and improving the communication performance of the antenna structure.

[0006] In some embodiments that may include the above-described embodiments, the first back cover includes an insulating region where the dielectric material is located. This arrangement prevents the first back cover from affecting the dielectric material, allowing the dielectric material to reduce the resonant frequency of the resonant cavity. For example, the insulating region may include a window or hole on the first back cover, which may be used for light transmission or decoration, and may be filled with insulating material.

[0007] In some embodiments that may include the above-described embodiments, the first back cover is an insulating back cover, which can prevent the first back cover from affecting the frequency shift effect of the dielectric material on the resonant frequency of the resonant cavity. For example, the material of the insulating back cover may include resin, rubber, ceramics, etc.

[0008] In some embodiments that may include the above-described embodiments, the dielectric material may be located on the outer surface of the first back cover facing the second middle frame. This can increase the distance between the dielectric layer material and the conductors on the first and second middle frames, thereby ensuring the frequency shift effect of the dielectric material. And / or, the dielectric material is located on the inner surface of the first back cover away from the second middle frame. With this configuration, the dielectric material is not visible from the outside of the foldable electronic device, thus improving the decorative effect of the foldable electronic device. And / or, the dielectric material is embedded within the first back cover. This configuration avoids the dielectric material occupying space in the foldable electronic device, facilitating miniaturization of the foldable electronic device. And / or, the material of the first back cover includes the dielectric material. With this configuration, using the dielectric material to make the first back cover reduces the volume of the foldable electronic device compared to using additional dielectric material, while also avoiding the dielectric material occupying space.

[0009] In some embodiments that may include the above-described embodiments, the first back cover is a conductive back cover, and the dielectric material is located on the outer surface of the first back cover facing the second middle frame. For example, the material of the first back cover may include steel, copper, aluminum, etc. In this case, the dielectric material is disposed on the outer surface of the first back cover facing the second middle frame. This arrangement can avoid the first back cover from affecting the dielectric material, allowing the dielectric material to reduce the resonant frequency of the resonant cavity.

[0010] In some embodiments that may include the above embodiments, the foldable electronic device further includes a third middle frame, which is foldably connected to both the first and second middle frames, and a flexible display panel is also disposed on the third middle frame; in the closed state, the first middle frame is located between the second and third middle frames. The conductor on the first middle frame may be at least one of the first battery, the circuit on the first circuit board, and the first middle plate, and the conductor on the second middle frame may be the display layer in the flexible display panel on the second middle frame. The resonant cavity includes a first part and a second part. At least one of the first battery, the circuit on the first circuit board, and the first middle plate forms the first part with the display layer on the second middle frame, and the second part forms the second part with the display layer on the first middle frame and the display layer on the third middle frame. In this embodiment, the antenna structure is disposed on the first frame and / or the second frame. The electromagnetic field formed after the first part is excited is strong and has a significant impact on the antenna structure. The dielectric material is disposed on the first back cover, i.e., the dielectric material is disposed within the first part, which can significantly reduce the resonant frequency of the resonant cavity, thereby reducing the impact of the resonant cavity on the antenna structure.

[0011] In some embodiments that may include the above-described embodiments, the foldable electronic device further includes a third middle frame and a second rear cover. The second rear cover is disposed on the second middle frame and is disposed opposite to a flexible display panel on the second middle frame. The flexible display panel is also disposed on the third middle frame. The third middle frame is foldably connected to the first middle frame. In the closed state, the first middle frame is located between the second and third middle frames, or the third middle frame is foldably connected to the second middle frame. In the closed state, the second middle frame is located between the first and third middle frames. The second rear cover is located between the first and second middle frames, i.e., the first rear cover faces the second rear cover. In the closed state, the first rear cover faces the second rear cover. Correspondingly, the conductor on the first middle frame can be at least one of a first battery, a circuit on a first circuit board, and a first middle plate. The conductor on the second middle frame can be at least one of a second battery, a circuit on a second circuit board, and a second middle plate. At least one of the first battery, the circuit on the first circuit board, and the first middle plate, together with the second battery, the circuit on the second circuit board, and the second middle plate, forms a resonant cavity. A dielectric material is disposed on the first rear cover, i.e., the dielectric material is disposed in the resonant cavity to reduce the resonant frequency of the resonant cavity.

[0012] In some embodiments that may include the above-described embodiments, the dielectric material is further disposed in a second partial region of the second rear cover, the second partial region being a portion of the second rear cover. That is, the dielectric material can be disposed on both the first and second rear covers. This configuration allows the dielectric material disposed on the second rear cover to further reduce the resonant frequency of the resonant cavity, thereby further reducing the dip in the antenna efficiency curve of the antenna structure and improving the communication performance of the antenna structure.

[0013] In some embodiments that may include the above-described embodiments, the foldable electronic device further includes a first battery and a first circuit board. A first mid-frame forms a first accommodating cavity. The first battery and the first circuit board are disposed at intervals within the first accommodating cavity along a direction parallel to the first rear cover. The projection of the dielectric material on the first rear cover can at least partially cover the projection of the first battery and / or the first circuit board on the first rear cover. That is, the dielectric material is disposed directly opposite the first battery and / or the first circuit board. Since the area of ​​the first battery and the first circuit board is large, the dielectric material is not affected by other structures, thereby allowing the area of ​​the dielectric material to be set larger, ensuring the frequency shift effect of the dielectric material.

[0014] In some embodiments that may include the above-described embodiments, the area of ​​the dielectric material disposed in the first back cover is 5%-80% of the area of ​​the first back cover. This configuration allows for a wide range of dielectric material areas, making it suitable for various foldable electronic devices.

[0015] In some examples, the area of ​​the dielectric material in the first back cover is 20%-80% (20%, 30%, 40%, 80%, etc.) of the area of ​​the first back cover. This setting ensures that the area of ​​the dielectric material is large enough, thereby ensuring the frequency shift effect of the dielectric material, so as to shift the resonant frequency of the resonant cavity to outside the communication frequency band of the antenna structure.

[0016] In some embodiments that may include the above embodiments, the thickness of the dielectric material is 0.05mm-0.3mm (e.g., 0.05mm, 0.1mm, 0.2mm, 0.3mm, etc.). This setting ensures the frequency shifting effect of the dielectric material while avoiding excessive thickness of the dielectric material from taking up too much space in the foldable electronic device.

[0017] In some embodiments that may include the above embodiments, the dielectric material includes a first dielectric material with a permeability greater than 1. The first local region includes a magnetic field strength point between the conductors on the first middle frame and the conductors on the second middle frame, i.e., the first dielectric material is positioned near the magnetic field strength point of the resonant cavity. This configuration, by placing a magnetic material with a permeability greater than 1 at the magnetic field strength point, can reduce the resonant frequency of the resonant cavity.

[0018] In some embodiments that may include the above embodiments, the dielectric material includes a first dielectric material with a permeability greater than 1, and the first local region includes the central region of the first back cover. The central region of the first back cover may be the middle position of the first back cover along its length, so that the first dielectric material is located near the strong magnetic field point of the resonant cavity.

[0019] In some embodiments that may include the above-described embodiments, the permeability of the first dielectric material is greater than or equal to 10. This setting ensures that the first dielectric material has sufficient permeability to guarantee the frequency shift effect of the first dielectric material on the resonant frequency of the resonant cavity.

[0020] In some embodiments that may include the above embodiments, the dielectric material includes a second dielectric material with a dielectric constant greater than or equal to 2. The first local region includes the electric field strength point between the conductors on the first middle frame and the conductors on the second middle frame, that is, the electric field strength point of the second dielectric material is located near the resonant cavity. By placing a dielectric material with a dielectric constant greater than or equal to 2 at the electric field strength point, the resonant frequency of the resonant cavity can be reduced.

[0021] In some embodiments that may include the above embodiments, the dielectric material includes a second dielectric material, the dielectric constant of the second dielectric material is greater than or equal to 2, and the first local region includes one end of the first back cover along the length direction, such that the second dielectric material is located near the point of electric field strength.

[0022] In some embodiments that may include the above examples, the dielectric constant of the second dielectric material is greater than or equal to 6. This setting ensures that the dielectric constant of the second dielectric material is sufficiently large to guarantee the frequency shift effect of the second dielectric material on the resonant frequency of the resonant cavity.

[0023] Secondly, embodiments of this application also provide a foldable electronic device, including: a first middle frame, a second middle frame, a flexible display panel, and a dielectric material; the first middle frame and the second middle frame are foldably connected; the flexible display panel is disposed on the first middle frame and the second middle frame, and the flexible display panel includes a display layer and a protective layer stacked on the light-emitting side of the display layer; an antenna structure is disposed on the first middle frame and / or the second middle frame; in the closed state, conductors on the first middle frame and conductors on the second middle frame are spaced apart along a direction perpendicular to the flexible display panel, that is, the conductors on the first middle frame and the conductors on the second middle frame form a resonant cavity, and the flexible display panel on the second middle frame is located between the first middle frame and the second middle frame; the dielectric material is disposed on the protective layer of the second middle frame.

[0024] With the above configuration, the conductors on the first and second middle frames are spaced apart along a direction perpendicular to the flexible display panel, that is, the conductors on the first and second middle frames form a resonant cavity. The dielectric material is disposed on the protective layer of the second middle frame so that the dielectric material is located inside the resonant cavity, thereby reducing the resonant frequency of the resonant cavity. This allows the resonant frequency of the resonant cavity to be moved outside the communication frequency band of the antenna structure, thereby reducing the pit in the antenna efficiency curve of the antenna structure caused by the resonant cavity, avoiding or weakening the influence of the resonant cavity on the antenna structure within the communication frequency band, and improving the communication performance of the antenna structure.

[0025] In some embodiments that may include the above embodiments, the dielectric material is disposed on the light-emitting side and / or light-receiving side of the protective layer; and / or, the material of the protective layer includes the dielectric material, that is, by using the dielectric material to make the protective layer, there is no need to set an additional protective layer, which can reduce the size and weight of the foldable electronic device.

[0026] In some embodiments that may include the above-described embodiments, the foldable electronic device further includes a third middle frame, which is foldably connected to both the first and second middle frames, and a flexible display panel is also disposed on the third middle frame. In the closed state, the first middle frame is located between the second and third middle frames, and the flexible display panel on the first middle frame is located between the first and third middle frames. Correspondingly, the conductor on the first middle frame may be at least one of a first battery, a circuit on the first circuit board, or a first middle plate, and the conductor on the second middle frame may be the display layer on the second middle frame. At least one of the first battery, the circuit on the first circuit board, and the first middle plate, together with the display layer on the second middle frame, forms a resonant cavity. A dielectric material is disposed on a protective layer on the second middle frame so that the dielectric material is located within the resonant cavity to reduce the resonant frequency of the resonant cavity.

[0027] In some embodiments that may include the above-described embodiments, a protective layer of dielectric material is disposed on the first middle frame and a protective layer on the second middle frame. In the closed state, the flexible display panel on the first middle frame is located between the first and second middle frames. This arrangement can increase the area of ​​the dielectric material, thereby further reducing the resonant frequency of the resonant cavity.

[0028] In some embodiments that may include the above embodiments, the dielectric material includes a first dielectric material with a permeability greater than 1. The first dielectric material is disposed at least at a magnetic field strength point between the conductors on the first middle frame and the conductors on the second middle frame, that is, the first dielectric material is disposed near the magnetic field strength point of the resonant cavity. This arrangement, by disposing of a magnetic material with a permeability greater than 1 at the magnetic field strength point, can reduce the resonant frequency of the resonant cavity.

[0029] In some embodiments that may include the above embodiments, the dielectric material includes a first dielectric material with a permeability greater than 1. The first dielectric material is disposed at least in the central region of the protective layer on the second middle frame. The magnetic field strength point is located in the central region of the resonant cavity, which can be the middle position along the length direction of the resonant cavity. Correspondingly, the first dielectric material is disposed at least in the central region of the protective layer on the second middle frame, which can be the middle position along the length direction of the protective layer, so that the first dielectric material is located near the magnetic field strength point of the resonant cavity.

[0030] In some embodiments that may include the above-described embodiments, the permeability of the first dielectric material is greater than or equal to 10. This setting ensures that the first dielectric material has sufficient permeability to guarantee the frequency shift effect of the first dielectric material on the resonant frequency of the resonant cavity.

[0031] In some embodiments that may include the above embodiments, the dielectric material includes a second dielectric material with a dielectric constant greater than or equal to 2. The second dielectric material is disposed at least at the electric field strength point between the conductors on the first middle frame and the conductors on the second middle frame, that is, the second dielectric material is located near the electric field strength point of the resonant cavity. By disposing of a dielectric material with a dielectric constant greater than or equal to 2 at the electric field strength point, the resonant frequency of the resonant cavity can be reduced.

[0032] In some embodiments that may include the above embodiments, the dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the second dielectric material is disposed at least at one end of the protective layer on the second middle frame along the length direction. The electric field strength point is located at one end of the resonant cavity along the length direction, and the second dielectric material is disposed at least at one end of the protective layer on the second middle frame along the length direction, such that the second dielectric material is located near the electric field strength point of the resonant cavity.

[0033] In some embodiments that may include the above examples, the dielectric constant of the second dielectric material is greater than or equal to 6. This setting ensures that the dielectric constant of the second dielectric material is sufficiently large to guarantee the frequency shift effect of the second dielectric material on the resonant frequency of the resonant cavity.

[0034] Thirdly, embodiments of this application also provide a foldable electronic device, including: a first middle frame, a second middle frame, a flexible display panel, a first frame member, a second frame member, and a dielectric material; the first middle frame and the second middle frame are foldably connected; the flexible display panel is disposed on the first middle frame and the second middle frame; an antenna structure is disposed on the first middle frame and / or the second middle frame; in the closed state, conductors on the first middle frame and conductors on the second middle frame are spaced apart along a direction perpendicular to the flexible display panel, that is, the conductors on the first middle frame and the conductors on the second middle frame form a resonant cavity, and the flexible display panel on the second middle frame is located between the first middle frame and the second middle frame; the first frame member is disposed on the first middle frame and surrounds the outer periphery of the flexible display panel on the first middle frame, the second frame member is disposed on the second middle frame and surrounds the outer periphery of the flexible display panel on the second middle frame; the dielectric material is disposed on the second frame member.

[0035] With the above configuration, the conductors on the first frame and the second frame are spaced apart along a direction perpendicular to the flexible display panel, that is, the conductors on the first frame and the second frame form a resonant cavity. The dielectric material is disposed on the second frame member so that the dielectric material is located inside the resonant cavity, thereby reducing the resonant frequency of the resonant cavity. This allows the resonant frequency of the resonant cavity to be moved outside the communication frequency band of the antenna structure, thereby reducing the dip in the antenna efficiency curve of the antenna structure caused by the resonant cavity, avoiding or weakening the influence of the resonant cavity on the antenna structure within the communication frequency band, and improving the communication performance of the antenna structure.

[0036] In some embodiments that may include the above-described embodiments, the dielectric material is disposed on the outer surface of the second frame member facing the first middle frame, for example, the dielectric material is disposed on the outer surface of the cover plate of the second frame member. This arrangement increases the distance between the dielectric material and the display layer on the second middle frame, thereby improving the frequency shifting effect of the dielectric material. And / or, the dielectric material is disposed on the inner surface of the second frame member away from the first middle frame, for example, the dielectric material is disposed on the inner surface of the cover plate of the second frame member; this arrangement prevents the dielectric material from being observed from the outside, improving the decorative effect of the foldable electronic device. And / or, the dielectric material is embedded within the second frame member, for example, the dielectric material is embedded within the cover plate of the second frame member; this arrangement avoids the dielectric material occupying space. And / or, the material of the second frame member includes the dielectric material; this arrangement eliminates the need for additional dielectric material, facilitating a reduction in the size and weight of the foldable electronic device.

[0037] In some embodiments that may include the above embodiments, the foldable electronic device further includes a third middle frame, which is foldably connected to both the first and second middle frames, and a flexible display panel is disposed on the third middle frame. In the closed state, the first middle frame is located between the second and third middle frames, and the flexible display panel on the first middle frame is located between the first and third middle frames. Correspondingly, the conductor on the first middle frame can be at least one of a first battery, a first circuit board, and a first middle plate, and the conductor on the second middle frame is the display layer of the flexible display panel on the second middle frame. At least one of the first battery, the first circuit board, and the first middle plate, together with the display layer on the second middle frame, forms a resonant cavity. A dielectric material is disposed on the second frame member, such that the dielectric material is located within the resonant cavity to reduce the resonant frequency of the resonant cavity.

[0038] In some embodiments that may include the above-described embodiments, a dielectric material is further disposed on the first frame member; in the closed state, the flexible display panel on the first middle frame is located between the first middle frame and the second middle frame. The conductor on the first middle frame includes the display layer on the first middle frame, and the conductor on the second middle frame includes the display layer on the second middle frame, with the display layers on the first and second middle frames forming a resonant cavity. The dielectric material may be disposed on the first and second frame members. With this configuration, the dielectric material on the first and second frame members can simultaneously reduce the resonant frequency of the resonant cavity, thereby further reducing the resonant frequency of the resonant cavity.

[0039] In some embodiments that may include the above embodiments, the dielectric material includes a first dielectric material with a permeability greater than 1. The first dielectric material is disposed at least at a magnetic field strength point between the conductors on the first middle frame and the conductors on the second middle frame, i.e., the first dielectric material is disposed near the magnetic field strength point of the resonant cavity. This arrangement, by disposing of a magnetic material with a permeability greater than 1 at the magnetic field strength point, can reduce the resonant frequency of the resonant cavity. It is understood that the magnetic field strength point of the resonant cavity is the point where the magnetic field is relatively strong when the resonant cavity is excited to resonate; this magnetic field strength point can be a region where the magnetic field is stronger than that of other regions. The first dielectric material being disposed near the magnetic field strength point can be understood as the projection of the first dielectric material covering at least a portion of the projection of the magnetic field strength point in a plane parallel to the first back cover.

[0040] In some examples, the permeability of the first dielectric material is greater than or equal to 10 (e.g., 10, 20, 30, etc.). This setting ensures that the first dielectric material has sufficient permeability to guarantee the frequency shift effect of the first dielectric material on the resonant frequency of the resonant cavity.

[0041] It is understood that the embodiments of this application do not limit the first medium material. For example, the first medium material may include resin and magnetic powder, with the magnetic powder doped in the resin; of course, the first medium material may also include ferrite, etc.

[0042] In some embodiments that may include the above embodiments, the dielectric material includes a first dielectric material with a permeability greater than 1. The first dielectric material is disposed at least on a portion of the second frame member at the middle position along the length direction. The magnetic field strength point is located near the middle position along the length direction of the resonant cavity, and the central region of the second frame is the middle position along the length direction of the second frame. The first dielectric material is disposed on a portion of the second frame member at the middle position along the length direction, such that the first dielectric material is located at the magnetic field strength point of the resonant cavity.

[0043] In some embodiments that may include the above embodiments, the dielectric material includes a second dielectric material with a dielectric constant greater than or equal to 2. The second dielectric material is disposed at least at the electric field strength point between the conductors on the first middle frame and the conductors on the second middle frame, that is, the second dielectric material is disposed near the electric field strength point of the resonant cavity. This arrangement, by disposing of the dielectric material with a dielectric constant greater than or equal to 2 at the electric field strength point, can reduce the resonant frequency of the resonant cavity. It is understood that the electric field strength point of the resonant cavity is the point where the electric field is stronger when the resonant cavity is excited to resonate; this electric field strength point can be a region where the electric field is stronger than in other regions. The second dielectric material being disposed near the electric field strength point can be understood as the projection of the second dielectric material covering at least a portion of the projection of the electric field strength point in a plane parallel to the first back cover.

[0044] In some embodiments that may include the above embodiments, the dielectric constant of the second dielectric material is greater than or equal to 6 (e.g., 6, 7, 8, etc.). This setting ensures that the dielectric constant of the second dielectric material is large enough to guarantee the frequency shift effect of the second dielectric material on the resonant frequency of the resonant cavity.

[0045] For example, the second medium material may include at least one of ceramics, resin, and rubber.

[0046] In some embodiments that may include the above embodiments, the dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the second dielectric material is disposed at least on a portion of the second frame member along one end of the length direction. The electric field strength points are located near both ends of the resonant cavity along the length direction, and the second dielectric material is disposed at least on a portion of the second frame member along one end of the length direction, such that the second dielectric material is located near the electric field strength points of the resonant cavity.

[0047] In some embodiments that may include the above embodiments, the dielectric material includes a first dielectric material and a second dielectric material. The permeability of the first dielectric material is greater than 1, and the dielectric constant of the second dielectric material is greater than or equal to 2. The first dielectric material is positioned near the magnetic field strength point of the resonant cavity, and the second dielectric material is positioned near the electric field strength point of the resonant cavity. With this arrangement, the first and second dielectric materials can simultaneously reduce the resonant frequency of the resonant cavity.

[0048] In some embodiments that may include the above-described embodiments, the first dielectric material and the second dielectric material are stacked, or the first dielectric material and the second dielectric material are doped together. With this arrangement, the resonant frequency of the resonant cavity can be reduced simply by placing the dielectric material in the first back cover near the points of high electric field strength and / or high magnetic field strength in the resonant cavity, without needing to distinguish between the first and second dielectric materials, making installation more convenient.

[0049] In some embodiments that may include the above embodiments, the first medium and the second medium material are spaced apart along the width direction of the foldable electronic device, and the first medium and the second medium material extend along the length direction of the foldable electronic device. The first medium and the second medium material can be located at both the electric field strength point and the magnetic field strength point to reduce the resonant frequency of the resonant cavity. It is not necessary to precisely set the position of the first medium and the second medium material, which reduces the installation and design difficulty.

[0050] In some embodiments that may include the above examples, the loss tangent of the dielectric material is greater than or equal to 0.5. With this configuration, the electromagnetic wave gradually bypasses the dielectric material, effectively changing the shape of the resonant cavity, thereby causing the resonant frequency to shift further to lower frequencies.

[0051] In some embodiments that may include the above-described embodiments, the foldable electronic device further includes an antenna structure disposed in the first middle frame and / or the second middle frame, wherein the minimum distance between the dielectric material and the antenna structure is greater than or equal to 5 mm. It is understood that the dielectric material needs to maintain a certain distance from the antenna structure to keep it away from the radiation field of the antenna structure, thereby avoiding any impact on the antenna structure; for example, the minimum distance between the dielectric material and the antenna structure can be greater than or equal to 5 mm (e.g., 5 mm, 10 mm, 20 mm, 30 mm, etc.) to ensure sufficient distance between the dielectric material and the antenna structure so as not to affect the radiated signal of the antenna structure. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the unfolded state of the foldable electronic device provided in the embodiments of this application, which is a bi-fold device;

[0053] Figure 2 The foldable electronic device provided in this application embodiment is a schematic diagram of the closed state of a bi-fold device. Figure 1 ;

[0054] Figure 3 The foldable electronic device provided in this application embodiment is a schematic diagram of the closed state of a bi-fold device. Figure 2 ;

[0055] Figure 4 A cross-sectional view of the first middle frame in the foldable electronic device provided in the embodiments of this application;

[0056] Figure 5 This is a cross-sectional view of the second middle frame in the foldable electronic device provided in the embodiments of this application;

[0057] Figure 6 A schematic diagram of the unfolded state of the foldable electronic device provided in the embodiment of this application, which is a tri-fold device;

[0058] Figure 7 This application provides a schematic diagram of the closed state of a three-fold folding electronic device. Figure 1 ;

[0059] Figure 8a This application provides a schematic diagram of the closed state of a three-fold folding electronic device. Figure 2 ;

[0060] Figure 8b This application provides a schematic diagram of the closed state of a three-fold folding electronic device. Figure 3 ;

[0061] Figure 9 This is an S-curve diagram of antenna structures in related technologies;

[0062] Figure 10 A schematic diagram of the structure in which the dielectric material is disposed on the outer surface of the first rear cover in a foldable electronic device provided in an embodiment of this application;

[0063] Figure 11 A schematic diagram of a structure in which an insulating region is provided on the first rear cover of a foldable electronic device provided in an embodiment of this application;

[0064] Figure 12 A schematic diagram of the structure in which the dielectric material is disposed on the inner surface of the first rear cover in a foldable electronic device provided in an embodiment of this application;

[0065] Figure 13 for Figure 7 The electric field distribution of the first and second parts of the foldable electronic device in the closed state is shown. Figure 1 ;

[0066] Figure 14 for Figure 7 The magnetic field distribution of the first and second parts of the foldable electronic device in the closed state is shown. Figure 1 ;

[0067] Figure 15 A schematic diagram of a first dielectric material disposed on the first rear cover of a foldable electronic device provided in an embodiment of this application;

[0068] Figure 16 To set the S-curve diagram before and after using the first medium material;

[0069] Figure 17 The S-curves of the resonant cavity under different permeabilities are shown.

[0070] Figure 18 The S-curves of the resonant cavity under different magnetic losses are shown.

[0071] Figure 19 S-curves corresponding to different loss tangent values;

[0072] Figure 20 A schematic diagram of a first rear cover of a foldable electronic device provided in an embodiment of this application, wherein a second dielectric material is disposed on the first dielectric material;

[0073] Figure 21 To set the S-curve before and after using the second medium material;

[0074] Figure 22 S-curves of the resonant cavity under different dielectric constants;

[0075] Figure 23 S-curves of the resonant cavity under different dielectric losses;

[0076] Figure 24 for Figure 7 The electric field distribution of the first and second parts of the foldable electronic device in the closed state is shown. Figure 2 ;

[0077] Figure 25 for Figure 7 The magnetic field distribution of the first and second parts of the foldable electronic device in the closed state is shown. Figure 2 ;

[0078] Figure 26 A schematic diagram of the structure of a foldable electronic device provided in this application, wherein a first dielectric material and a second dielectric material are disposed on the first rear cover. Figure 1 ;

[0079] Figure 27 A schematic diagram of the structure of a foldable electronic device provided in this application, wherein a first dielectric material and a second dielectric material are disposed on the first rear cover. Figure 2 ;

[0080] Figure 28 S-curve diagram showing the magnetic field strength points of the first dielectric material near the resonant cavity and the electric field strength points of the second dielectric material near the resonant cavity;

[0081] Figure 29 A schematic diagram of a structure in which the first and second medium materials are spaced apart along the x-direction;

[0082] Figure 30 for Figure 1 Sectional view along the AA direction;

[0083] Figure 31 This is a schematic diagram showing the position of the second dielectric material in TM0.5,1 mode;

[0084] Figure 32 This is a schematic diagram showing the position of the second dielectric material in TM1.5,0 mode.

[0085] Explanation of reference numerals in the attached drawings: 10: First middle frame; 20: Second middle frame; 30: Third middle frame; 40: Flexible display panel; 50: First frame component; 60: Second frame component; 70: Antenna structure; 101: First accommodating cavity; 102: First back cover; 103: First battery; 104: First circuit board; 105: First middle plate; 106: First frame; 107: Insulating area; 201: Second accommodating cavity; 202: Second back cover; 203: Second battery; 204: Second circuit board; 205: Second middle plate; 206: Second frame; 301: Hinge structure; 302: First hinge structure; 303: Second hinge structure; 501: Cover plate; 502: Fixing part. Detailed Implementation

[0086] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0087] Connection / Link: should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0088] This application provides a foldable electronic device, which may include foldable mobile phones, foldable tablets, etc. This application does not limit the foldable electronic device.

[0089] Please refer to Figure 1 In some embodiments, the foldable electronic device can be a double-folding device. For example, the foldable electronic device includes a first middle frame 10 and a second middle frame 20, which are foldably connected by a hinge structure 301, allowing the first middle frame 10 to be folded and unfolded relative to the second middle frame 20. The foldable electronic device also includes a flexible display panel 40 disposed on the first middle frame 10 and the second middle frame 20. During the folding or unfolding of the first middle frame 10 relative to the second middle frame 20, the flexible display panel 40 can deform accordingly.

[0090] Please refer to Figure 1 and Figure 2In some examples, the foldable electronic device can be an inward-folding device, that is, when the first middle frame 10 and the second middle frame 20 are folded together (the closed state of the foldable electronic device), the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the second middle frame 20 are both located between the first middle frame 10 and the second middle frame 20, that is, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the second middle frame 20, and the flexible display panel 40 is located on the inside; in the unfolded state of the foldable electronic device, the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the second middle frame 20 are approximately located in the same plane.

[0091] Please refer to Figure 3 In some examples, the foldable electronic device can also be an outward folding device. That is, when the first middle frame 10 and the second middle frame 20 are folded together (closed state), the first middle frame 10 and the second middle frame 20 are both located between the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the second middle frame 20. That is, the flexible display panel 40 on the first middle frame 10 is positioned away from the flexible display panel 40 on the second middle frame 20, and the flexible display panel 40 is located on the outside. In the unfolded state, the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the second middle frame 20 are approximately located in the same plane.

[0092] like Figure 4 As shown, in the above embodiment, the foldable electronic device further includes a first back cover 102, which covers the first middle frame 10 and is disposed opposite to the flexible display panel 40 on the first middle frame 10. It is understood that the first middle frame 10 can form a first accommodating cavity 101, and the first back cover 102 can close the first accommodating cavity 101. The foldable electronic device also includes a first battery 103 and a first circuit board 104. The first battery 103 and the first circuit board 104 can be disposed in the first accommodating cavity 101. The first battery 103 is electrically connected to the first circuit board 104 to supply power to the first circuit board 104. The first circuit board 104 and the first battery 103 can be spaced apart along a direction parallel to the first back cover 102 (as shown by the y-direction in the figure) to reduce the thickness occupied by the first battery 103 and the first circuit board 104, thereby reducing the thickness of the foldable electronic device.

[0093] It is understood that the first middle frame 10 may include a first middle plate 105 and a first side frame 106. The first side frame 106 is arranged around the first middle plate 105 and forms a first accommodating cavity 101. The first rear cover 102 may cover the first side frame 106 to close the first accommodating cavity 101.

[0094] like Figure 5As shown, in some embodiments, the foldable electronic device further includes a second back cover 202, which covers the second middle frame 20 and is disposed opposite to the flexible display panel 40 on the second middle frame 20. It is understood that the second middle frame 20 can form a second accommodating cavity 201, and the second back cover 202 can close the second accommodating cavity 201. The foldable electronic device also includes a second battery 203 and a second circuit board 204. The second battery 203 and the second circuit board 204 can be disposed in the second accommodating cavity 201. The second battery 203 is electrically connected to the second circuit board 204 to supply power to the second circuit board 204. The second circuit board 204 and the second battery 203 can be spaced apart along a direction parallel to the second back cover 202 (as shown by the y-direction in the figure) to reduce the thickness occupied by the second battery 203 and the second circuit board 204, thereby reducing the thickness of the foldable electronic device.

[0095] It is understood that the second middle frame 20 may include a second middle plate 205 and a second side frame 206. The second side frame 206 is arranged around the second middle plate 205 and forms a second accommodating cavity 201. The second rear cover 202 may cover the second side frame 206 to close the second accommodating cavity 201.

[0096] Please refer to Figure 6 and Figure 7 In some embodiments, the foldable electronic device can also be a tri-fold device. Accordingly, the foldable electronic device also includes a third middle frame 30. In some examples, in the unfolded state, the third middle frame 30 can be located between the first middle frame 10 and the second middle frame 20. In the closed state, the first middle frame 10 is located between the second middle frame 20 and the third middle frame 30. The third middle frame 30 is connected to the first middle frame 10 through a first hinge structure 302, and the second middle frame 20 is connected to the third middle frame 30 through a second hinge structure 303, so that the first middle frame 10, the second middle frame 20 and the third middle frame 30 can be folded and unfolded. Correspondingly, the flexible display panel 40 is also disposed on the third middle frame 30, and in the closed state, the flexible display panel 40 on the first middle frame 10 is located between the first middle frame 10 and the third middle frame 30, that is, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the third middle frame 30, and the flexible display panel 40 on the second middle frame 20 is located between the first middle frame 10 and the second middle frame, that is, the flexible display panel 40 on the second middle frame 20 faces the first middle frame 10.

[0097] It is understandable that, when the aforementioned foldable electronic device is closed, in a cross section perpendicular to the rotation axis of the first middle frame 10, the second middle frame 20, and the third middle frame 30, the first middle frame 10, the second middle frame 20, and the third middle frame 30 are arranged in a roughly "G" shape.

[0098] In the above example, the foldable electronic device may also include a first rear cover 102 (e.g., Figure 4 (as shown) and the second rear cover 202 (as shown) Figure 5 As shown, a first back cover 102 is fitted over the first middle frame 10, and the first back cover 102 is positioned opposite to the flexible display panel 40 on the first middle frame 10. In the closed state, the first back cover 102 is located between the first middle frame 10 and the second middle frame 20, that is, the first back cover 102 faces the flexible display panel 40 on the second middle frame 20. The first middle frame 10 can form a first accommodating cavity 101. The foldable electronic device also includes a first battery 103 and a first circuit board 104, which can be disposed within the first accommodating cavity 101. Similarly, a second back cover 202 is fitted over the second middle frame 20, and the second back cover 202 is positioned opposite to the flexible display panel 40 on the second middle frame 20. In the closed state, the second back cover 202 is positioned away from the first middle frame 10. The second middle frame 20 can form a second accommodating cavity 201. The foldable electronic device also includes a second battery 203 and a second circuit board 204. The second battery 203 and the second circuit board 204 can be disposed in the second accommodating cavity 201.

[0099] It is understood that the first middle frame 10 may include a first middle plate 105 and a first side frame 106. The first side frame 106 is disposed around the first middle plate 105 and forms a first receiving cavity 101. The first rear cover 102 may cover the first side frame 106 to close the first receiving cavity 101. Similarly, the second middle frame 20 may include a second middle plate 205 and a second side frame 206. The second side frame 206 is disposed around the second middle plate 205 and forms a second receiving cavity 201. The second rear cover 202 may cover the second side frame 206 to close the second receiving cavity 201.

[0100] Please refer to Figure 8a In other examples, in both the unfolded and closed states, the first middle frame 10 is located between the third middle frame 30 and the second middle frame 20. The first middle frame 10 and the second middle frame 20 are connected by a first hinge structure 302, and the second middle frame 20 and the third middle frame 30 are connected by a second hinge structure 303, so that the first middle frame 10, the second middle frame 20, and the third middle frame 30 can be folded and unfolded. Correspondingly, a flexible display panel 40 is also disposed on the third middle frame 30, and in the closed state, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the third middle frame 30, while the flexible display panel 40 on the second middle frame 20 is disposed away from the first middle frame 10.

[0101] It is understandable that, after being folded, the aforementioned foldable electronic device is arranged in an "S" shape in a cross section perpendicular to the rotation axis of the first middle frame 10, the second middle frame 20, and the third middle frame 30.

[0102] In the above example, the foldable electronic device may also include a first back cover 102 and a second back cover 202. The first back cover 102 is disposed over the first middle frame 10 and is positioned opposite to the flexible display panel 40 on the first middle frame 10. In the closed state, the first back cover 102 faces the second middle frame 20. The first middle frame 10 may form a first accommodating cavity 101. The foldable electronic device also includes a first battery 103 and a first circuit board 104, which may be disposed within the first accommodating cavity 101. Similarly, the second back cover 202 is disposed over the second middle frame 20 and is positioned opposite to the flexible display panel 40 on the second middle frame 20. In the closed state, the second back cover 202 faces the first middle frame 10, i.e., the first back cover 102 faces the second back cover 202. The second middle frame 20 can form a second accommodating cavity 201. The foldable electronic device also includes a second battery 203 and a second circuit board 204. The second battery 203 and the second circuit board 204 can be disposed in the second accommodating cavity 201.

[0103] In the above embodiments, the foldable electronic device further includes an antenna structure 70, which can be disposed on the first middle frame 10 and / or the second middle frame 20. For example, the antenna structure 70 can be disposed on the first side frame 106 and / or the second side frame 206, with a portion of the first side frame 106 and / or the second side frame 206 serving as a radiating branch of the antenna structure 70. Of course, the antenna structure 70 can also be mounted on the first side frame 106 and / or the second side frame 206; wherein, the antenna structure 70 can be located along the length direction of the first side frame 106 and / or the second side frame 206. Figure 1 At one end (in the y-direction), the antenna structure 70 can also be located at the first frame 106 and / or the second frame 206 along the width direction (in the y-direction). Figure 1 The antenna structure 70 can be distributed across the entire first frame 106 and / or the second frame 206, at one end in the x-direction. This embodiment of the application does not impose any limitations on this. Wireless signals can be transmitted and / or received through the antenna structure 70. For example, the communication frequency band of the antenna structure 70 may include at least one of a cellular frequency band, a Bluetooth frequency band, and a WiFi frequency band.

[0104] In the above embodiments, in the closed state, the conductors on the first middle frame 10 and the conductors on the second middle frame 20 are spaced apart along a direction perpendicular to the flexible display panel 40, that is, the conductors on the first middle frame 10 and the conductors on the second middle frame 20 form a resonant cavity 80 (e.g., Figure 2 , Figure 3 , Figure 7 , Figure 8a As shown, the resonant cavity 80 has a resonant frequency that easily falls within the communication frequency band of the antenna structure 70, thus causing a dip in the antenna efficiency curve of the antenna structure 70 and affecting its communication performance. For example, Figure 9 The figure shows the S-curve of antenna structure 70 in the related technology. L1 is the return loss curve (S11) of antenna structure 70, L2 is the antenna efficiency curve of antenna structure 70 in the deployed state, L3 is the antenna efficiency curve of antenna structure 70 in the closed state, and L4 is the system efficiency curve of antenna structure 70. Comparing curves L2 and L3, it can be seen that in the closed state, the resonant frequency of the resonant cavity 80 falls within the communication frequency band of antenna structure 70, resulting in a dip in the antenna efficiency curve of antenna structure 70.

[0105] In this embodiment, the foldable electronic device further includes a dielectric material disposed in the resonant cavity, which can reduce the resonant frequency of the resonant cavity and move the resonant frequency of the resonant cavity outside the communication frequency band of the antenna structure 70. This can reduce the dip in the antenna efficiency curve of the antenna structure 70 caused by the resonant cavity, avoid or weaken the influence of the resonant cavity 80 on the antenna structure 70 in the communication frequency band, and improve the communication performance of the antenna structure 70.

[0106] Please refer to Figure 3 and Figure 10 In this embodiment, the dielectric material 110 can be disposed in a first partial area of ​​the first back cover 102, wherein the first partial area is a portion of the first back cover 102; that is, the dielectric material 110 is not disposed throughout the entire first back cover 102. In some examples, the foldable electronic device is a double-folding device and an outward-folding device, that is, in the closed state, the first middle frame 10 and the second middle frame 20 are both located between the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the second middle frame 20, that is, the flexible display panel 40 on the first middle frame 10 is disposed away from the flexible display panel 40 on the second middle frame 20. Correspondingly, the conductor on the first middle frame 10 can be at least one of the first battery 103, the line on the first circuit board 104, and the first middle plate 105. The conductor on the second middle frame 20 can be at least one of the second battery 203, the line on the second circuit board 204, and the second middle plate 205. The dielectric material 110 is disposed in the first partial area of ​​the first back cover 102, that is, the dielectric material 110 is disposed within the resonant cavity.

[0107] In the above example, the dielectric material 110 can be disposed in the first local area of ​​the first rear cover 102 and the second local area of ​​the second rear cover 202, wherein the second local area is a part of the second rear cover 202; with such a configuration, the dielectric material 110 disposed in the second rear cover 202 can further reduce the resonant frequency of the resonant cavity, thereby further reducing the dip in the antenna efficiency curve of the antenna structure 70 and improving the communication performance of the antenna structure 70.

[0108] Please refer to Figure 7 and Figure 10 In other examples, the foldable electronic device is a tri-fold device, and in the closed state, the first back cover 102 is located between the first middle frame 10 and the second middle frame 20, that is, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the third middle frame 30, and the flexible display panel 40 on the second middle frame 20 faces the first middle frame 10. Accordingly, the conductor on the first middle frame 10 can be at least one of the first battery 103, the lines on the first circuit board 104, and the first middle plate 105. Of course, the conductor can also be other conductive structures on the first middle frame 10, and the conductor on the second middle frame 20 can be the display layer in the flexible display panel 40 on the second middle frame 20. The resonant cavity 80 includes a first part 801 and a second part 802. At least one of the first battery 103, the lines on the first circuit board 104, and the first middle plate 105 forms the first part 801 with the display layer on the second middle frame 20. The second part 802 forms the display layer on the first middle frame 10 and the display layer on the third middle frame 30. In this embodiment, the antenna structure 70 is disposed on the first frame 106 and / or the second frame 206. The electromagnetic field formed after the first part 801 is excited is strong and has a significant impact on the antenna structure 70. The dielectric material 110 is disposed in the first back cover 102, that is, the dielectric material 110 is disposed in the first part 801, which can significantly reduce the resonant frequency of the resonant cavity, thereby reducing the impact of the resonant cavity on the antenna structure 70.

[0109] Understandably, the flexible display panel 40 includes a display layer and a protective layer stacked together. The display layer emits light to display images; the protective layer is located on the light-emitting side of the display layer and protects the display layer from scratches. Since conductive lines are provided within the display layer, it can act as a conductor on the corresponding middle frame to form a resonant cavity 80.

[0110] Please refer to Figure 8a and Figure 10In other examples, the foldable electronic device is a tri-fold device. In the closed state, the flexible display panel 40 on the first middle frame 10 is located between the first middle frame 10 and the third middle frame 30, that is, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the third middle frame 30. The flexible display panel 40 on the second middle frame 20 is positioned away from the first middle frame 10. In other words, in the closed state, the first back cover 102 faces the second back cover 202. Correspondingly, the conductors on the first middle frame 10 can be the first battery 103 or the wires on the first circuit board 104. The conductor on the second middle frame 20 can be at least one of the following: the first battery 203, the circuit on the second circuit board 204, and the second middle plate 205. The first battery 103, the circuit on the first circuit board 104, and the first middle plate 105 together form a resonant cavity 80. The dielectric material 110 is disposed in a first local area of ​​the first rear cover 102, that is, the dielectric material 110 is disposed in the resonant cavity 80 to reduce the resonant frequency of the resonant cavity.

[0111] In the above example, the dielectric material 110 can be disposed in the first local area of ​​the first rear cover 102 and the second local area of ​​the second rear cover 202. With this configuration, the dielectric material 110 disposed in the second rear cover 202 can further reduce the resonant frequency of the resonant cavity, thereby further reducing the dip in the antenna efficiency curve of the antenna structure 70 and improving the communication performance of the antenna structure 70.

[0112] In the above example, the first back cover 102 can be a conductive back cover. For example, the material of the first back cover 102 can include steel, copper, aluminum and other materials. At this time, the dielectric layer is set on the outer surface of the first back cover 102 facing the second middle frame 20. This setting can avoid the first back cover 102 from affecting the dielectric material 110, so that the dielectric material 110 can reduce the resonant frequency of the resonant cavity.

[0113] In the above example, the medium material 110 can be stacked on the outer surface of the first back cover 102. For example, the medium material 110 can be bonded to the outer surface of the first back cover 102 with adhesive. Of course, in the implementation mode where the medium material 110 has a certain degree of adhesion, the medium material 110 can also be directly pasted on the outer surface of the first back cover 102.

[0114] In some examples, a decorative layer (such as colored ink, transparent adhesive, etc.) may be provided on the outer surface of the first back cover 102. Correspondingly, the medium material 110 may be disposed between the decorative layer and the first back cover 102, or the medium material 110 may be disposed on the side of the decorative layer away from the first back cover 102. Of course, the material of the decorative layer may also include the medium material 110. This application embodiment does not limit this.

[0115] Please refer to Figure 11 In some examples, the first back cover 102 is a conductive back cover, and the first back cover 102 includes an insulating region 107. For example, the insulating region 107 may include a window or hole provided on the first back cover 102. The window or hole may be used for light transmission or decoration, and this embodiment of the application does not limit this. The window or hole may also be filled with insulating material. Correspondingly, the dielectric material 110 is located in the insulating region. This arrangement can prevent the first back cover 102 from affecting the dielectric material 110, so that the dielectric material 110 can reduce the resonant frequency of the resonant cavity.

[0116] In the above example, the dielectric material 110 may be located on the outer surface of the first rear cover 102 facing the second middle frame 20. And / or, the dielectric material 110 may be located on the inner surface of the first rear cover 102 away from the second middle frame 20. And / or, the dielectric material 110 may be embedded within the first rear cover 102, i.e., the dielectric material 110 may be embedded within the insulating material in the window or hole. And / or, the material of the first rear cover 102 may include the dielectric material 110, i.e., the insulating material in the window or hole may include the dielectric material 110. With this configuration, the dielectric material 110 at the insulating region 107 can reduce the resonant frequency of the resonant cavity.

[0117] Please refer to Figure 12 In some examples, the first back cover 102 is an insulating back cover, which can prevent the first back cover 102 from affecting the frequency shift effect of the dielectric material on the resonant frequency of the resonant cavity. Exemplarily, the material of the insulating back cover may include resin, rubber, ceramics, etc., and the embodiments of this application are not limited thereto.

[0118] In the above example, the dielectric material 110 can be located on the outer surface of the first back cover 102 facing the second middle frame 20. This increases the distance between the dielectric layer material and the conductors on the first and second middle frames 10 and 20, thereby ensuring the frequency shift effect of the dielectric material 110. Alternatively, the dielectric material 110 can be located on the inner surface of the first back cover 102 away from the second middle frame 20. With this configuration, the dielectric material 110 is not visible from the outside of the foldable electronic device, thus improving the aesthetic appeal of the foldable electronic device. Alternatively, the dielectric material 110 can be embedded within the first back cover 102. This configuration avoids the dielectric material 110 occupying space in the foldable electronic device, facilitating miniaturization. Alternatively, the material of the first back cover 102 includes the dielectric material 110. With this configuration, using the dielectric material 110 to fabricate the first back cover 102 reduces the volume of the foldable electronic device compared to using an additional dielectric material 110, while also avoiding the dielectric material 110 occupying space.

[0119] It is understood that the implementation of the medium material 110 in the second local area of ​​the second rear cover 202 is roughly similar to the implementation of the medium material 110 in the first rear cover 102, and will not be described again here.

[0120] In the implementation where the dielectric material 110 is disposed on the inner surface of the first back cover 102, the projection of the dielectric material 110 on the first back cover 102 can at least partially cover the projections of the first battery 103 and / or the first circuit board 104 on the first back cover 102. That is, the dielectric material 110 is disposed directly opposite the first battery 103 and / or the first circuit board 104. Since the areas of the first battery 103 and the first circuit board 104 are relatively large, the dielectric material 110 is not affected by other structures, thus allowing for a larger area of ​​the dielectric material 110 and ensuring its frequency shifting effect.

[0121] In the above embodiments, the dielectric material 110 may be in the form of a thin sheet; or, the dielectric material 110 may be in the form of dots and arranged in an array in the same plane; or, the dielectric material 110 may be in the form of a strip; or, the dielectric material 110 may be in the form of a column, etc. The embodiments of this application do not limit the shape of the dielectric material 110.

[0122] In the above embodiment, the area of ​​the dielectric material 110 disposed in the first back cover 102 is 5%-80% (5%, 10%, 20%, 80%, etc.) of the area of ​​the first back cover 102. With this setting, the area range of the dielectric material 110 is large, which can be applied to different foldable electronic devices.

[0123] In some examples, the area of ​​the dielectric material 110 in the first back cover 102 is 20%-80% (20%, 30%, 40%, 80%, etc.) of the area of ​​the first back cover 102. This setting ensures that the area of ​​the dielectric material 110 is large enough, thereby ensuring the frequency shift effect of the dielectric material 110, so as to move the resonant frequency of the resonant cavity to outside the communication frequency band of the antenna structure 70.

[0124] In the above embodiments, the thickness of the dielectric material 110 is 0.05mm-0.3mm (e.g., 0.05mm, 0.1mm, 0.2mm, 0.3mm, etc.). This setting ensures the frequency shift effect of the dielectric material 110 while avoiding excessive thickness of the dielectric material 110, which would take up too much space in the foldable electronic device.

[0125] Please refer to Figures 10-12In some embodiments, the dielectric material 110 includes a first dielectric material 111, the first dielectric material 111 having a permeability greater than 1 (e.g., 2, 3, 4, etc.). The permeability can be an integer or a decimal (e.g., 1.5, 6.3, etc.), and this application does not impose any limitation on this. The first local region includes the magnetic field strength point between the conductor on the first middle frame 10 and the conductor on the second middle frame 20, that is, the first dielectric material 111 is set near the magnetic field strength point of the resonant cavity. With this setting, by setting a magnetic material with a permeability greater than 1 at the magnetic field strength point, the resonant frequency of the resonant cavity can be reduced. It can be understood that the magnetic field strength point of the resonant cavity is the point where the magnetic field is relatively strong when the resonant cavity is excited to generate resonance. This magnetic field strength point can be a region where the magnetic field is stronger than that of other regions. The setting of the first dielectric material 111 near the magnetic field strength point can be understood as the projection of the first dielectric material 111 covering at least part of the projection of the magnetic field strength point in a plane parallel to the first back cover 102.

[0126] In some examples, the permeability of the first dielectric material 111 is greater than or equal to 10 (e.g., 10, 20, 30, etc.). This setting ensures that the first dielectric material 111 has sufficient permeability to guarantee the frequency shift effect of the first dielectric material 111 on the resonant frequency of the resonant cavity.

[0127] It is understood that the embodiments of this application do not limit the first dielectric material 111. For example, the first dielectric material 111 may include resin and magnetic powder, with the magnetic powder doped in the resin and in the form of a thin sheet. The magnetic powder may include iron-silicon-aluminum powder, etc. Of course, the first dielectric material 111 may also include ferrite, thin film material, nanocrystal, etc.

[0128] Please refer to Figures 10-12 In some embodiments, the dielectric material 110 includes a second dielectric material 112, the dielectric constant of which is greater than or equal to 2 (e.g., 2, 3, 4, etc.). The dielectric constant can be an integer or a decimal (e.g., 2.5, 5.5, etc.), and this application embodiment does not impose such limitations. The first local region includes the electric field strength point between the conductor on the first middle frame 10 and the conductor on the second middle frame 20, that is, the electric field strength point of the second dielectric material 112 is set near the resonant cavity. By setting the dielectric material with a dielectric constant greater than or equal to 2 at the electric field strength point, the resonant frequency of the resonant cavity can be reduced. It can be understood that the electric field strength point of the resonant cavity is the point where the electric field is stronger when the resonant cavity is excited to resonate. This electric field strength point can be a region where the electric field is stronger than that of other regions. The setting of the second dielectric material 112 near the electric field strength point can be understood as the projection of the second dielectric material 112 covering at least part of the projection of the electric field strength point in a plane parallel to the first back cover 102.

[0129] In some examples, the dielectric constant of the second dielectric material 112 is greater than or equal to 6 (e.g., 6, 7, 8, etc.). This setting ensures that the dielectric constant of the second dielectric material 112 is sufficiently large to guarantee the frequency shift effect of the second dielectric material 112 on the resonant frequency of the resonant cavity. Exemplarily, the second dielectric material 112 may include at least one of ceramic, resin, and rubber, and this application embodiment does not limit this.

[0130] It is understandable that when a resonant cavity is excited to resonate, both the electric and magnetic fields within it undergo periodic alternation, and these fields follow a sinusoidal distribution. Based on the distribution of the electric and magnetic fields within the resonant cavity, the resonance of the cavity can be divided into multiple modes, each of which can be distinguished using TMa and b, where a represents the direction along the width of the foldable electronic device (…). Figure 7 In the x-direction, the number of periods of the electric and magnetic field distributions of the resonant cavity, b is the number of periods along the direction parallel to the hinge structure 301. Figure 7 In the y-direction, the number of periods of the electric and magnetic field distributions of the resonant cavity.

[0131] Please refer to Figure 13 , Figure 13 for Figure 7 The electric field distribution of the first part 801 and the second part 802 in the closed state of the foldable electronic device shown. Figure 1 , Figure 14 for Figure 7 The magnetic field distribution of the first part 801 and the second part 802 in the closed state of the foldable electronic device shown. Figure 2 ; Figure 13 and Figure 14 The density of the filler lines is positively correlated with the strength of the corresponding electric and magnetic fields; that is, the greater the filler line density, the stronger the electromagnetic and magnetic fields. Figure 13 and Figure 14 It can be seen that along the x-direction, the number of periods of the electric field and magnetic field distribution is approximately 0.5 periods, and along the y-direction, the number of periods of the electric field and magnetic field distribution is approximately 1 period. The corresponding mode is TM0.5,1 mode.

[0132] In TM0.5,1 mode, the magnetic field strength point in the first part 801 is located at the middle position of the first back cover 102 along the y-direction, correspondingly, as Figure 15 As shown, the first medium material 111 is disposed in the middle position of the first rear cover 102. Figure 16The S-curve diagrams before and after the first dielectric material 111 are shown. Curves L5 and L7 are the return loss curve and antenna efficiency curve before the first dielectric material 111 is installed, respectively. Curves L6 and L8 are the return loss curve and antenna efficiency curve after the first dielectric material 111 is installed, respectively. From curves L5 and L6, it can be seen that the resonant frequency of the resonant cavity is significantly reduced after the first dielectric material 111 is installed. Furthermore, from curves L7 and L8, it can be seen that the antenna efficiency pit of the antenna structure 70 is eliminated after the first dielectric material 111 is installed, thereby improving the communication performance of the antenna structure 70.

[0133] It is understandable that the resonant cavity is an equivalent RLC parallel circuit (where R is the equivalent resistance, L is the equivalent inductance, and C is the equivalent capacitance, all three connected in parallel), and satisfies... And L∝μ′, where f is the frequency and μ′ is the real part of the permeability. Therefore, after filling with the first dielectric material 111, the permeability increases, the equivalent inductance increases accordingly, and thus the resonant frequency of the resonant cavity decreases.

[0134] Figure 17 The S-curves of the resonant cavity are shown for different magnetic permeabilities. Figure 17 Curves k1-k5 represent the return loss curves for permeabilities of 32, 16, 8, 4, and 1, respectively, while curves k6-k10 represent the antenna efficiency curves for permeabilities of 32, 16, 8, 4, and 1, respectively. Figure 17 It can be seen that as the permeability increases, the resonant frequency of the resonator cavity decreases, that is, the first dielectric material 111 has a more obvious effect on the frequency shift of the resonator cavity.

[0135] In this embodiment, the resonant cavity is equivalent to an RLC parallel circuit, and the resonant cavity also satisfies... R∝μ′, where Q is the quality factor, μ″ is the imaginary part of the permeability (unless otherwise specified in the embodiments of this application, the permeability is understood as the real part of the permeability), and the imaginary part of the permeability can also be understood as the magnetic loss. It can be seen that after filling with the first dielectric material 111, the magnetic loss increases, the equivalent resistance increases accordingly, and the quality factor decreases accordingly.

[0136] Figure 18 The S-curves of the resonant cavity under different magnetic losses are shown. Figure 18 Curves k11-k11 represent the return loss curves for magnetic losses of 16, 8, 4, and 0, respectively, while curves k6-k10 represent the antenna efficiency curves for magnetic losses of 16, 8, 4, and 0, respectively. Figure 18 It can be seen that as the magnetic loss increases, the quality factor of the resonator cavity decreases, and the pit of the return loss curve of the resonator cavity becomes wider and shallower.

[0137] In the above embodiments, the first dielectric material 111 has a loss tangent value tan D, where tan D = μ″ / μ′. Please refer to... Figure 19 , Figure 19 The S-curves are plotted for different loss tangent values. Figure 19 Curves k18-k21 represent the return loss curves with loss tangent values ​​of 0.25, 0.5, 1, 2, 5, and 10, respectively. Figure 19 It can be seen that the resonant frequency of the resonant cavity is approximately 670MHz when the loss tangent is 0.25, approximately 664MHz when the loss tangent is 0.5, approximately 642MHz when the loss tangent is 1, approximately 603MHz when the loss tangent is 2, approximately 543MHz when the loss tangent is 5, and approximately 537MHz when the loss tangent is 10. In other words, increasing the loss tangent (from 0.25 to 0.5) first increases the absorption loss of the first dielectric material 111, while the resonant frequency remains almost unchanged, but the return loss pit becomes shallower. As the loss tangent continues to increase (greater than 1), impedance mismatch gradually appears at the interface between the first dielectric material 111 and the nearby air or the first back cover 102. The magnetic field gradually bypasses the first dielectric material 111, effectively changing the shape of the resonant cavity, thus causing the resonant frequency to shift further to lower frequencies. When the loss tangent reaches a certain level (e.g., greater than 5), electromagnetic waves will hardly enter the first dielectric material 111. The electromagnetic waves bypass the area where the first dielectric material 111 is located. At this time, the frequency shift is mainly related to the shape of the first dielectric material 111.

[0138] In TM0.5,1 mode, the electric field strength points in the first part are located at both ends of the first back cover 102 along the y-direction, correspondingly, as... Figure 20 As shown, the second medium material 112 can be respectively disposed at both ends of the first rear cover 102 along the y direction. Figure 21 The S-curve diagrams before and after the second dielectric material 112 are shown. Curves L9 and L11 are the return loss curve and antenna efficiency curve before the second dielectric material 112 is installed, respectively. Curves L10 and L12 are the return loss curve and antenna efficiency curve after the second dielectric material 112 is installed, respectively. From curves L9 and L10, it can be seen that the resonant frequency of the resonant cavity is significantly reduced after the second dielectric material 112 is installed. Furthermore, from curves L11 and L12, it can be seen that the antenna efficiency pit of the antenna structure 70 is eliminated after the second dielectric material 112 is installed, thereby improving the communication performance of the antenna structure 70.

[0139] It is understandable that the resonant cavity is an equivalent RLC parallel circuit (where R is the equivalent resistance, L is the equivalent inductance, and C is the equivalent capacitance, all three connected in parallel), and satisfies... And C∝ε′, where f is the frequency and ε′ is the real part of the dielectric constant. Therefore, after filling with the second dielectric material 112, the equivalent capacitance increases, thereby reducing the resonant frequency of the resonant cavity.

[0140] Figure 22 The S-curves of the resonant cavity are shown for different dielectric constants. Figure 22 Curves m1-m5 are the return loss curves corresponding to dielectric constants of 0, 4, 16, 32, and 64, respectively. Figure 22 It can be seen that as the dielectric constant increases, the resonant frequency of the resonator cavity decreases, meaning that the second dielectric material 112 has a more significant effect on the frequency shift of the resonator cavity.

[0141] In this embodiment, the resonant cavity is equivalent to an RLC parallel circuit, and the resonant cavity also satisfies... R∝ε″, where Q is the quality factor, ε″ is the imaginary part of the dielectric constant (unless otherwise specified in the embodiments of this application, the dielectric constant is understood as the real part of the dielectric constant), and the imaginary part of the dielectric constant can also be understood as the dielectric loss. Therefore, it can be seen that after filling with the second dielectric material 112, the dielectric loss increases, the equivalent resistance increases accordingly, and the quality factor decreases accordingly.

[0142] Figure 23 The S-curves of the resonant cavity under different dielectric losses are shown. Figure 23 Curves m6-m9 represent the return loss curves for magnetic losses of 4, 16, 32, and 64, respectively, and the antenna efficiency curves for magnetic losses of 4, 16, 32, and 64, respectively. Figure 23 It can be seen that as the magnetic loss increases, the quality factor of the resonator cavity decreases, and the pit of the return loss curve of the resonator cavity becomes wider and shallower.

[0143] In the above embodiments, the second dielectric material 112 also has a loss tangent of tan D, where tan D = ε″ / ε′. Similar to the first dielectric material 111, the increase in the loss tangent will first increase the absorption loss of the second dielectric material 112 (e.g., from 0.25 to 0.5), the resonant frequency of the resonant cavity remains almost unchanged, but the return loss pit becomes shallower; as the loss tangent continues to increase (e.g., greater than 1), impedance mismatch gradually appears at the interface between the second dielectric material 112 and the nearby air or the first back cover 102, and the electric field gradually bypasses the second dielectric material 112, which is equivalent to changing the shape of the resonant cavity, thereby causing the resonant frequency to shift further to lower frequencies. When the loss tangent reaches a certain level (e.g., greater than 5), electromagnetic waves will hardly enter the second dielectric material 112, as the electromagnetic waves bypass the region where the second dielectric material 112 is located. At this time, the frequency shift is mainly related to the shape of the second dielectric material 112.

[0144] Please refer to Figure 24 , Figure 24 for Figure 7 The electric field distribution of the first part 801 and the second part 802 in the closed state of the foldable electronic device shown. Figure 2 , Figure 25 for Figure 7 The magnetic field distribution of the first part 801 and the second part 802 in the closed state of the foldable electronic device shown. Figure 2 ; Figure 24 and Figure 25 The density of the filler lines is positively correlated with the strength of the corresponding electric and magnetic fields; that is, the greater the filler line density, the stronger the electromagnetic and magnetic fields. Figure 24 and Figure 25 It can be seen that along the x-direction, the number of periods of the electric field and magnetic field distribution is approximately 1.5 periods, and along the y-direction, the number of periods of the electric field and magnetic field distribution is approximately 1 period. The corresponding mode is TM1.5,1 mode.

[0145] Of course, the resonant cavity mode in this embodiment can also be TM0.5,0 mode, TM1.5,0 mode, TM0.5,2 mode, etc. This embodiment does not limit the mode of the resonant cavity.

[0146] In this embodiment, the electric field strength point refers to the location with a relatively high intensity of the electric field generated within the resonant cavity at the target frequency band; this location can be a point or a region. The magnetic field strength point refers to the location with a relatively high intensity of the magnetic field generated within the resonant cavity at the target frequency band; this location can be a point or a region. The resonant cavity mode corresponds to the frequency band, and different modes correspond to different frequency bands. The positions of the electric field strength point and the magnetic field strength point of the resonant cavity may be different in different modes. Therefore, the positions of the first dielectric material 111 and the second dielectric material 112 can be reasonably set according to the mode. When the target frequency band is low (the target frequency band is a low-frequency band, such as a frequency less than or equal to 1 GHz), the antenna structure is greatly affected by the resonant cavity. Therefore, in this embodiment, setting the first dielectric material 111 near the magnetic field strength point corresponding to the low-frequency band and setting the second dielectric material 112 near the electric field strength point corresponding to the low-frequency band can significantly reduce the influence of the resonant cavity on the antenna structure and improve the communication performance of the antenna structure.

[0147] like Figure 12 and Figure 26 As shown, exemplarily, in TM0.5,1 mode, the magnetic field strength point is located at the middle position of the resonant cavity along the y-direction (length direction). Correspondingly, the first local region includes the central region of the first back cover 102, which can be the middle position of the first back cover 102 along the y-direction (length direction), so that the first dielectric material 111 is located near the magnetic field strength point of the resonant cavity. In some examples, the first battery 103 is generally disposed in the middle position of the first accommodating cavity 101, and the first battery 103 corresponds to the central region of the first back cover 102; in this case, the first dielectric material 111 on the first back cover 102 can be disposed facing the first battery 103.

[0148] In this mode, the electric field strength point is located at one end of the resonant cavity center region along the length direction. Correspondingly, the first local region includes one end of the first back cover 102 along the length direction, so that the second dielectric material 112 is located near the electric field strength point. The first circuit board 104 is generally located at one end of the first battery 103 along the length direction. In this case, the second dielectric material 112 on the first back cover 102 can be positioned directly opposite the first circuit board 104. In some examples, there can be two first circuit boards 104, which are respectively located at both ends of the first battery 103 along the y direction. In this case, the second dielectric material 112 on the first back cover 102 can be positioned directly opposite the two first circuit boards 104.

[0149] It is understandable that a resonant cavity can have multiple modes. By appropriately positioning the first and second dielectric materials, the resonant frequency of a specific mode can be reduced while having minimal impact on the resonant frequencies of other modes, thus enabling the adjustment of a particular mode. For example, the first dielectric material can be positioned near the magnetic field strength point in a certain mode, while avoiding magnetic field strength points in other modes; similarly, the second dielectric material can be positioned near the electric field strength point in a certain mode, while avoiding electric field strength points in other modes, thereby reducing the resonant frequency of only one mode while having minimal impact on other modes.

[0150] Please refer to Figure 26 and Figure 27 In some embodiments, the dielectric material 110 includes a first dielectric material 111 and a second dielectric material 112. Accordingly, the first dielectric material 111 is positioned near the magnetic field strength point of the resonant cavity, and the second dielectric material 112 is positioned near the electric field strength point of the resonant cavity. With this configuration, the first dielectric material 111 and the second dielectric material 112 can simultaneously reduce the resonant frequency of the resonant cavity.

[0151] For example, in TM0.5,1 mode, Figure 7 The magnetic field strength point of the resonant cavity in the folded electronic device shown is located at the middle position along the y-direction, while the electric field strength points are located near both ends of the resonant cavity along the y-direction. Correspondingly, as... Figure 26 and Figure 27 As shown, the first dielectric material 111 can be set near the middle position along the y direction, and there can be two second dielectric materials 112, which are respectively set near the two ends of the resonant cavity along the y direction.

[0152] Figure 28 The S-curve diagram shows the magnetic field strength points of the first dielectric material 111 near the resonant cavity and the electric field strength points of the second dielectric material 112 near the resonant cavity. Figure 28 Curves L13 and L15 represent the return loss curve and antenna efficiency curve before the dielectric material is applied, respectively. Curves L14 and L16 represent the return loss curve and antenna efficiency curve after the first dielectric material 111 and the second dielectric material 112 are applied, respectively. As can be seen from curves L13 and L14, the resonant frequency of the resonant cavity is significantly reduced after the first dielectric material 111 and the second dielectric material 112 are applied. Furthermore, as can be seen from curves L15 and L16, the antenna efficiency pit of the antenna structure 70 is eliminated after the first dielectric material 111 and the second dielectric material 112 are applied, thereby improving the communication performance of the antenna structure 70.

[0153] In some implementations, the first dielectric material 111 and the second dielectric material 112 are stacked, or the first dielectric material 111 and the second dielectric material 112 are doped together. With this configuration, the resonant frequency of the resonant cavity can be reduced simply by placing the dielectric material in the first back cover 102 near the points of strong electric field and / or strong magnetic field of the resonant cavity, without needing to distinguish between the first dielectric material 111 and the second dielectric material 112, making installation more convenient.

[0154] It is understandable that, since the electric field at the point of strong magnetic field in the resonant cavity is close to 0, and the magnetic field at the point of strong electric field is also close to 0, the influence of the second dielectric material 112 near the point of strong magnetic field on the resonant cavity is very small, and the influence of the dielectric material near the point of strong electric field on the resonant cavity is also very small.

[0155] like Figure 29 As shown, the first dielectric 111 and the second dielectric material 112 are spaced apart along the width direction (x direction) of the foldable electronic device, and the first dielectric 111 and the second dielectric material 112 extend along the length direction (y direction) of the foldable electronic device. The first dielectric 111 and the second dielectric material 112 can be located at both the electric field strength point and the magnetic field strength point to reduce the resonant frequency of the resonant cavity. There is no need to precisely set the position of the first dielectric 111 and the second dielectric material 112, which reduces the installation and design difficulty.

[0156] In some embodiments, the flexible display panel 40 includes a display layer and a protective layer stacked on the light-emitting side of the display layer. In the closed state, conductors on the first middle frame 10 and conductors on the second middle frame 20 are spaced apart along a direction perpendicular to the flexible display panel 40, i.e., the conductors on the first middle frame 10 and the conductors on the second middle frame 20 form a resonant cavity. The flexible display panel 40 on the second middle frame 20 is located between the first middle frame 10 and the second middle frame 20, i.e., the flexible display panel 40 on the second middle frame 20 faces the first middle frame 10. A dielectric material 110 is disposed on the protective layer on the second middle frame 20 so that the dielectric material 110 is located within the resonant cavity, thereby reducing the resonant frequency of the resonant cavity. This allows the resonant frequency of the resonant cavity to shift outside the communication frequency band of the antenna structure 70, thereby reducing the dip in the antenna efficiency curve of the antenna structure 70 caused by the resonant cavity, avoiding or weakening the influence of the resonant cavity 80 on the antenna structure 70 within the communication frequency band, and improving the communication performance of the antenna structure 70.

[0157] Please refer to Figure 2In some examples, the electronic device is a double-folding device. In the closed state, the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the second middle frame 20 are both located between the first middle frame 10 and the second middle frame 20, that is, the flexible display panel 40 of the first middle frame 10 faces the flexible display panel 40 of the second middle frame 20. Correspondingly, the conductor on the first middle frame 10 is the display layer in the flexible display panel 40 on the first middle frame 10, and the conductor on the second middle frame 20 is the display layer in the flexible display panel 40 on the second middle frame 20, that is, a resonant cavity is formed between the display layers on the first middle frame 10 and the display layers on the second middle frame 20.

[0158] In the above example, the dielectric material 110 can be disposed as a protective layer on the first middle frame 10 and a protective layer on the second middle frame 20. This arrangement can increase the area of ​​the dielectric material 110, thereby further reducing the resonant frequency of the resonant cavity.

[0159] Please refer to Figure 7 In some examples, the electronic device is a tri-fold device. In the closed state, the first middle frame 10 is located between the second middle frame 20 and the third middle frame 30. The flexible display panel 40 on the second middle frame 10 is located between the first middle frame 10 and the second middle frame 20. Both the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the third middle frame 30 are located between the first middle frame 10 and the third middle frame 30, that is, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the third middle frame 30. Correspondingly, the conductor on the first middle frame 10 can be at least one of the first battery 103, the lines on the first circuit board 104, and the first middle plate 105. The conductor on the second middle frame 20 is the display layer on the second middle frame 20. At least one of the first battery 103, the lines on the first circuit board 104, and the first middle plate 105, together with the display layer on the second middle frame 20, forms a resonant cavity. The dielectric material 110 is disposed on the protective layer of the second middle frame 20 so that the dielectric material 110 is located inside the resonant cavity to reduce the resonant frequency of the resonant cavity.

[0160] It is understandable that in the above examples, the dielectric material 110 can be disposed on the entire protective layer to ensure the uniformity of the display panel; of course, the dielectric material 110 can also be disposed in a third local area of ​​the protective layer, which is a portion of the protective layer. The dielectric material 110 needs to have a certain degree of transparency to avoid affecting the performance of the flexible display panel.

[0161] In the above example, the dielectric material 110 can also be disposed on the light-emitting side and / or light-receiving side of the protective layer. And / or, the material of the protective layer includes the dielectric material 110, that is, by using the dielectric material 110 to make the protective layer, there is no need to set an additional protective layer, which can reduce the size and weight of the foldable electronic device.

[0162] In some embodiments, the dielectric material 110 includes a first dielectric material 111, the first dielectric material 111 having a permeability greater than 1 (e.g., 2, 3, 4, etc.). The first dielectric material 111 is disposed at least at the magnetic field strength point between the conductor on the first middle frame 10 and the conductor on the second middle frame 20, that is, the first dielectric material 111 is disposed near the magnetic field strength point of the resonant cavity. This arrangement, by placing a magnetic material with a permeability greater than 1 at the magnetic field strength point, can reduce the resonant frequency of the resonant cavity. It can be understood that the magnetic field strength point of the resonant cavity is the point where the magnetic field is relatively strong when the resonant cavity is excited to resonate; this magnetic field strength point can be a region where the magnetic field is stronger than in other regions. The first dielectric material 111 being disposed near the magnetic field strength point can be understood as the projection of the first dielectric material 111 covering at least part of the projection of the magnetic field strength point in a plane parallel to the first rear cover 102.

[0163] In some examples, the permeability of the first dielectric material 111 is greater than or equal to 10 (e.g., 10, 20, 30, etc.). This setting ensures that the first dielectric material 111 has sufficient permeability to guarantee the frequency shift effect of the first dielectric material 111 on the resonant frequency of the resonant cavity.

[0164] In some embodiments, the dielectric material 110 includes a second dielectric material 112, the dielectric constant of which is greater than or equal to 2 (e.g., 2, 3, 4, etc.). The second dielectric material 112 is disposed at least at the electric field strength point between the conductors on the first middle frame 10 and the conductors on the second middle frame 20, that is, the second dielectric material 112 is disposed near the electric field strength point of the resonant cavity. This arrangement, by disposing of a dielectric material with a dielectric constant greater than or equal to 2 at the electric field strength point, can reduce the resonant frequency of the resonant cavity. It is understood that the electric field strength point of the resonant cavity is the point where the electric field is stronger when the resonant cavity is excited to resonate; this electric field strength point can be a region where the electric field is stronger than in other regions. The second dielectric material 112 being disposed near the electric field strength point can be understood as the projection of the second dielectric material 112 covering at least a portion of the projection of the electric field strength point in a plane parallel to the first back cover 102.

[0165] In some examples, the dielectric constant of the second dielectric material 112 is greater than or equal to 6 (e.g., 6, 7, 8, etc.). This setting ensures that the dielectric constant of the second dielectric material 112 is sufficiently large to guarantee the frequency shift effect of the second dielectric material 112 on the resonant frequency of the resonant cavity. Exemplarily, the second dielectric material 112 may include at least one of ceramic, resin, and rubber, and this application embodiment does not limit this.

[0166] In some embodiments, the dielectric material includes a first dielectric material 111 and a second dielectric material 112. Accordingly, the first dielectric material 111 is positioned near the magnetic field strength point of the resonant cavity, and the second dielectric material 112 is positioned near the electric field strength point of the resonant cavity. With this configuration, the first dielectric material 111 and the second dielectric material 112 can simultaneously reduce the resonant frequency of the resonant cavity.

[0167] In some implementations, the first dielectric material 111 and the second dielectric material 112 are stacked, or the first dielectric material 111 and the second dielectric material 112 are doped together. With this configuration, the resonant frequency of the resonant cavity can be reduced simply by placing the dielectric material in the protective layer on the second frame 20 near the points of strong electric field and / or strong magnetic field of the resonant cavity, without needing to distinguish between the first dielectric material 111 and the second dielectric material 112, making installation more convenient.

[0168] For example, in TM0.5,1 mode, the magnetic field strength point is located in the central region of the resonant cavity, which can be the middle position of the resonant cavity along the y-direction (length direction). Correspondingly, the first dielectric material 111 is at least disposed in the central region of the protective layer on the second middle frame 20, which can be the middle position of the protective layer along the y-direction (length direction), so that the first dielectric material 111 is located near the magnetic field strength point of the resonant cavity. In this mode, the electric field strength point is located at one end of the resonant cavity along the length direction. Correspondingly, the second dielectric material 112 is at least disposed at one end of the protective layer on the second middle frame 20 along the length direction, so that the second dielectric material 112 is located near the electric field strength point of the resonant cavity.

[0169] Continue to refer to Figure 1 In some embodiments, the foldable electronic device further includes a first frame member 50 and a second frame member 60. The first frame member 50 is disposed on the first middle frame 10 and surrounds the outer periphery of the flexible display panel 40 on the first middle frame 10. The second frame member 60 is disposed on the second middle frame 20 and surrounds the outer periphery of the flexible display panel 40 on the second middle frame 20. The first frame member 50 and the second frame member 60 can cover the edge of the flexible display panel 40. The first frame member 50 can close the gap between the flexible display panel 40 and the first frame 106, and the second frame member 60 can close the gap between the flexible display panel 40 and the second frame 206.

[0170] Please refer to Figure 30For example, the second frame member 60 may include a fixing part 502 and a cover plate 501. The fixing part 502 is disposed between the second frame 206 and the flexible display panel 40, and is connected to the second frame 206. The cover plate 501 is located at one end of the fixing part 502 away from the second middle plate 205, is connected to the fixing part 502, and covers the edge of the flexible display panel 40. The structures of the first frame member 50 and the second frame member 60 are substantially the same, and will not be described in detail here.

[0171] Continue to refer to Figure 1 and Figure 2 In the above embodiment, in the closed state, the conductors on the first middle frame 10 and the conductors on the second middle frame 20 are spaced apart along a direction perpendicular to the flexible display panel 40, that is, the conductors on the first middle frame 10 and the conductors on the second middle frame 20 form a resonant cavity, and the flexible display panel 40 on the second middle frame 20 is located between the first middle frame 10 and the second middle frame 20, that is, the flexible display panel 40 on the second middle frame 20 faces the first middle frame 10; the dielectric material is disposed on the second frame member 60 so that the dielectric material 110 is located inside the resonant cavity, thereby reducing the resonant frequency of the resonant cavity, so that the resonant frequency of the resonant cavity moves outside the communication frequency band of the antenna structure 70, thereby reducing the dip in the antenna efficiency curve of the antenna structure 70 and improving the communication performance of the antenna structure 70.

[0172] It is understood that the dielectric material 110 can be disposed on the cover plate 501 of the second frame member 60 so that the dielectric material 110 can be located inside the resonant cavity.

[0173] Continue to refer to Figure 1 and Figure 2 In some examples, the foldable electronic device can be a bi-fold device. Accordingly, in the closed state, the flexible display panel 40 on the first middle frame 10 and the flexible display panel 40 on the second middle frame 20 are both located between the first middle frame 10 and the second middle frame 20, that is, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the second middle frame 20. Correspondingly, the conductor on the first middle frame 10 includes the display layer on the first middle frame 10, and the conductor on the second middle frame 20 includes the display layer on the second middle frame 20. The display layers on the first middle frame 10 and the second middle frame 20 form a resonant cavity. A dielectric material 110 can be disposed on the first frame member 50 and the second frame member 60. With this arrangement, the dielectric material 110 on the first frame member 50 and the second frame member 60 can simultaneously reduce the resonant frequency of the resonant cavity, thereby further reducing the resonant frequency of the resonant cavity.

[0174] like Figure 7As shown, in some examples, the foldable electronic device can be a tri-fold device. Accordingly, in the closed state, the flexible display panel 40 on the second middle frame 20 is located between the first middle frame 10 and the second middle frame 20. The flexible display panels 40 on the first middle frame 10 and the third middle frame 30 are located between the first middle frame 10 and the third middle frame 30, that is, the flexible display panel 40 on the second middle frame 20 is positioned facing the first back cover 102 on the first middle frame 10. Accordingly, the conductor on the first middle frame 10 can be at least one of the first battery 103, the first circuit board 104, and the first middle plate 105. The conductor on the second middle frame 20 is the display layer of the flexible display panel 40 on the second middle frame 20. At least one of the first battery 103, the first circuit board 104, and the first middle plate 105, together with the display layer on the second middle frame 20, forms a resonant cavity. The dielectric material 110 is disposed on the second frame member 60, such that the dielectric material 110 is located within the resonant cavity to reduce the resonant frequency of the resonant cavity.

[0175] In the above example, the dielectric material 110 is disposed on the outer surface of the second frame member 60 facing the first middle frame 10, for example, the dielectric material 110 is disposed on the outer surface of the cover plate 501 of the second frame member 60. This arrangement increases the distance between the dielectric material 110 and the display layer on the second middle frame 20, thereby improving the frequency shift effect of the dielectric material 110. And / or, the dielectric material 110 is disposed on the inner surface of the second frame member 60 away from the first middle frame 10, for example, the dielectric material 110 is disposed on the inner surface of the cover plate 501 of the second frame member 60; this arrangement prevents the dielectric material 110 from being observed from the outside, improving the decorative effect of the foldable electronic device. And / or, the dielectric material 110 is embedded within the second frame member 60, for example, the dielectric material 110 is embedded within the cover plate 501 of the second frame member 60; this arrangement avoids the dielectric material 110 occupying space. And / or, the material of the second frame member 60 includes the dielectric material 110; this arrangement eliminates the need for an additional dielectric material 110, facilitating a reduction in the size and weight of the foldable electronic device.

[0176] It is understandable that the medium material 110 can be disposed on the entire second frame member 60. Of course, the medium material 110 can also be disposed on the fourth part of the second frame member 60, which is a part of the second frame member 60.

[0177] Please refer to Figure 8bIn other embodiments, the foldable electronic device can be a tri-fold device. In the closed state, the flexible display panel 40 on the first middle frame 10 is located between the first middle frame 10 and the second middle frame 20, that is, the flexible display panel 40 on the first middle frame 10 faces the flexible display panel 40 on the second middle frame 20. The first middle frame 10 and the third middle frame 30 are both located between the flexible display panels 40 on the first middle frame 10 and the flexible display panels 40 on the third middle frame 30. The resonant cavity 80 includes a first part 801 and a second part 802. The flexible display panel 40 on the first part 801 is formed by the flexible display panel 40 on the second frame 20. A dielectric layer material can be disposed on the first frame member and / or the second frame member for the first part 801, thereby reducing the resonant frequency of the first part 801. This shifts the resonant frequency of the first part 801 outside the communication frequency band of the antenna structure 70, thereby reducing the dip in the antenna efficiency curve of the antenna structure 70 caused by the resonant cavity, avoiding or weakening the impact of the resonant cavity 80 on the antenna structure 70 within the communication frequency band, and improving the communication performance of the antenna structure 70. For the second part 802, a dielectric material can be disposed on a portion of the first back cover 102 and / or a portion of the third back cover 304 on the third frame 30, which can also reduce the resonant frequency of the second part 802. The third back cover 304 covers the third frame 30 and is disposed opposite to the flexible display panel 40 on the third frame 30.

[0178] In some embodiments, the dielectric material 110 includes a first dielectric material 111, the first dielectric material 111 having a permeability greater than 1 (e.g., 2, 3, 4, etc.). The first dielectric material 111 is disposed at least at the magnetic field strength point between the conductors on the first middle frame 10 and the conductors on the second middle frame 20, that is, the first dielectric material 111 is disposed near the magnetic field strength point of the resonant cavity. This arrangement, by disposing of a magnetic material with a permeability greater than 1 at the magnetic field strength point, can reduce the resonant frequency of the resonant cavity. It can be understood that the magnetic field strength point of the resonant cavity is the point where the magnetic field is relatively strong when the resonant cavity is excited to resonate; this magnetic field strength point can be a region where the magnetic field is stronger than that of other regions. The first dielectric material 111 being disposed near the magnetic field strength point can be understood as the projection of the first dielectric material 111 covering at least a portion of the projection of the magnetic field strength point in a plane parallel to the first rear cover 102.

[0179] In some examples, the permeability of the first dielectric material 111 is greater than or equal to 10 (e.g., 10, 20, 30, etc.). This setting ensures that the first dielectric material 111 has sufficient permeability to guarantee the frequency shift effect of the first dielectric material 111 on the resonant frequency of the resonant cavity.

[0180] In some embodiments, the dielectric material includes a second dielectric material 112, the dielectric constant of which is greater than or equal to 2 (e.g., 2, 3, 4, etc.). The second dielectric material 112 is disposed at least at the electric field strength point between the conductors on the first middle frame 10 and the conductors on the second middle frame 20, i.e., near the electric field strength point of the resonant cavity. This arrangement, by placing a dielectric material with a dielectric constant greater than or equal to 2 at the electric field strength point, can reduce the resonant frequency of the resonant cavity. It is understood that the electric field strength point of the resonant cavity is the point where the electric field is stronger when the resonant cavity is excited to resonate; this electric field strength point can be a region where the electric field is stronger than in other regions. The placement of the second dielectric material 112 near the electric field strength point can be understood as the projection of the second dielectric material 112 covering at least a portion of the projection of the electric field strength point in a plane parallel to the first rear cover 102.

[0181] In some examples, the dielectric constant of the second dielectric material 112 is greater than or equal to 6 (e.g., 6, 7, 8, etc.). This setting ensures that the dielectric constant of the second dielectric material 112 is sufficiently large to guarantee the frequency shift effect of the second dielectric material 112 on the resonant frequency of the resonant cavity. Exemplarily, the second dielectric material 112 may include at least one of ceramic, resin, and rubber, and this application embodiment does not limit this.

[0182] In some embodiments, the dielectric material 110 includes a first dielectric material 111 and a second dielectric material 112. Accordingly, the first dielectric material 111 is positioned near the magnetic field strength point of the resonant cavity, and the second dielectric material 112 is positioned near the electric field strength point of the resonant cavity. With this configuration, the first dielectric material 111 and the second dielectric material 112 can simultaneously reduce the resonant frequency of the resonant cavity.

[0183] In some implementations, the first dielectric material 111 and the second dielectric material 112 are stacked, or the first dielectric material 111 and the second dielectric material 112 are doped together. With this configuration, the resonant frequency of the resonant cavity can be reduced simply by placing the dielectric material in the protective layer on the second frame 20 near the points of strong electric field and / or strong magnetic field of the resonant cavity, without needing to distinguish between the first dielectric material 111 and the second dielectric material 112, making installation more convenient.

[0184] In some examples, the first dielectric material 111 and the second dielectric material 112 are stacked and cover the entire outer surface of the first bezel 50 and the second bezel 60 away from the flexible display panel. In other examples, the first dielectric material 111 and the second dielectric material 112 are doped together and cover the entire outer surface of the first bezel 50 and the second bezel 60 away from the flexible display panel.

[0185] It is understood that, in this embodiment of the application, the dielectric material 110 may be disposed in at least one of the first back cover 102, the second back cover 202, the protective layer, the first frame member 50 and the second frame member 60. The position of the dielectric material 110 may be reasonably selected according to the shape of the folded electronic device after folding and the mode of the resonant cavity, so that the dielectric layer material can reduce the resonant frequency of the resonant cavity and thus avoid affecting the antenna structure 70.

[0186] like Figure 31 As shown, in some implementations, in TM0.5,1 mode, the magnetic field strength point is located near the middle position of the resonant cavity along the y-direction. The first dielectric material 111 is at least disposed on a portion of the second frame member 60 at the middle position along the length direction, such that the first dielectric material 111 is located at the magnetic field strength point of the resonant cavity. For example, the first dielectric material 111 is disposed on a portion of the second frame member 60 near the hinge structure, or the first dielectric material 111 is disposed in the central region of the flexible display panel protective layer on the first middle frame 10 and / or the central region of the flexible display panel protective layer on the second middle frame 20. In this mode, the electric field strength point is located near both ends of the resonant cavity along the y-direction. The second dielectric material 112 is at least disposed on a portion of the second frame member 60 at one end along the length direction of the second middle frame 20, such that the second dielectric material 112 is located near the electric field strength point of the resonant cavity; for example, the second dielectric material 112 is located at the corner of the first frame member 50 and the second frame member 60.

[0187] like Figure 32 As shown, in some implementations, in TM1.5,0 mode, the magnetic field strength point is located in the central region of the resonant cavity and away from the hinge structure 301, while the electric field strength point is located on the outermost side of the resonant cavity away from the hinge structure 301 and the innermost side close to the hinge structure 301. Correspondingly, the first dielectric material 111 can be disposed in the middle of the resonant cavity and away from the hinge structure 301. For example, the first dielectric material 111 can be disposed on the protective layer of the first middle frame 10 away from the hinge structure 301 and on the protective layer of the second middle frame 20 away from the hinge structure 301; the second dielectric material 112 can be disposed on the first frame member 50 and the second frame member 60 away from the hinge structure 301 and close to the hinge structure 301.

[0188] In this embodiment, the antenna structure 70 is disposed on the first middle frame 10 and / or the second middle frame 20, and the minimum distance between the dielectric material 110 and the antenna structure 70 is greater than or equal to 5 mm. It is understood that the dielectric material 110 needs to have a certain distance from the antenna structure 70 so that the dielectric material 110 is far from the radiation field of the antenna structure 70, thereby avoiding any impact on the antenna structure 70; for example, the minimum distance between the dielectric material 110 and the antenna structure 70 can be greater than or equal to 5 mm (such as 5 mm, 10 mm, 20 mm, 30 mm, etc.) to ensure sufficient distance between the dielectric material 110 and the antenna structure 70 so that the dielectric material 110 does not affect the radiated signal of the antenna structure 70.

[0189] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A foldable electronic device, characterized in that, include: A first middle frame and a second middle frame, wherein the first middle frame and the second middle frame are foldably connected; A flexible display panel, wherein the flexible display panel is disposed on the first middle frame and the second middle frame; A first back cover is disposed on the first middle frame, and the first back cover is disposed opposite to the flexible display panel on the first middle frame; in the closed state of the foldable electronic device, the conductors on the first middle frame and the conductors on the second middle frame are spaced apart in a direction perpendicular to the flexible display panel, and the first back cover is disposed between the first middle frame and the second middle frame. A medium material is disposed in a first partial area of ​​the first back cover, wherein the first partial area is a portion of the first back cover.

2. The foldable electronic device according to claim 1, characterized in that, The first back cover includes an insulating region, and the dielectric material is located in the insulating region.

3. The foldable electronic device according to claim 1, characterized in that, The first back cover is an insulating back cover.

4. The foldable electronic device according to claim 2 or 3, characterized in that, The medium material is located on the outer surface of the first rear cover facing the second middle frame; And / or, the medium material is located on the inner surface of the first rear cover opposite to the second middle frame; And / or, the medium material is embedded in the first back cover.

5. The foldable electronic device according to claim 1, characterized in that, The first back cover is a conductive back cover, and the dielectric material is located on the outer surface of the first back cover facing the second middle frame.

6. The foldable electronic device according to any one of claims 1-5, characterized in that, The foldable electronic device further includes a third middle frame, which is foldably connected to both the first and second middle frames, and the flexible display panel is also disposed on the third middle frame; in the closed state, the first middle frame is located between the second and third middle frames.

7. The foldable electronic device according to any one of claims 1-5, characterized in that, The foldable electronic device further includes a third middle frame and a second rear cover, the second rear cover being disposed on the second middle frame and the flexible display panel on the second middle frame being disposed opposite to the flexible display panel on the second middle frame; the flexible display panel is also disposed on the third middle frame. Wherein, the third middle frame is foldably connected to the first middle frame, and in the closed state, the first middle frame is located between the second middle frame and the third middle frame; or the third middle frame is foldably connected to the second middle frame, and in the closed state, the second middle frame is located between the first middle frame and the third middle frame; The second back cover is located between the first middle frame and the second middle frame.

8. The foldable electronic device according to claim 7, characterized in that, The medium material is also disposed in a second partial area of ​​the second rear cover, the second partial area being a portion of the second rear cover.

9. The foldable electronic device according to any one of claims 1-8, characterized in that, The foldable electronic device further includes a first battery and a first circuit board. The first middle frame forms a first accommodating cavity. The first battery and the first circuit board are disposed at intervals in the first accommodating cavity along a direction parallel to the first back cover. The projection of the dielectric material on the first back cover can at least cover part of the projection of the first battery and / or the first circuit board on the first back cover.

10. The foldable electronic device according to any one of claims 1-9, characterized in that, The area of ​​the medium material disposed in the first back cover is 5%-80% of the area of ​​the first back cover.

11. The foldable electronic device according to any one of claims 1-10, characterized in that, The dielectric material includes a first dielectric material with a magnetic permeability greater than 1, and the first local region includes a magnetic field strength point between the conductor on the first middle frame and the conductor on the second middle frame.

12. The foldable electronic device according to any one of claims 1-10, characterized in that, The dielectric material includes a first dielectric material with a magnetic permeability greater than 1, and the first local region includes the central region of the first back cover.

13. The foldable electronic device according to claim 11 or 12, characterized in that, The magnetic permeability of the first dielectric material is greater than or equal to 10.

14. The foldable electronic device according to any one of claims 1-13, characterized in that, The dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the first local region includes the electric field strength point between the conductor on the first middle frame and the conductor on the second middle frame.

15. The foldable electronic device according to any one of claims 1-13, characterized in that, The dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the first local region includes one end of the first back cover along its length.

16. The foldable electronic device according to claim 14 or 15, characterized in that, The dielectric constant of the second dielectric material is greater than or equal to 6.

17. A foldable electronic device, characterized in that, include: A first middle frame and a second middle frame, wherein the first middle frame and the second middle frame are foldably connected; A flexible display panel is disposed on a first middle frame and a second middle frame. The flexible display panel includes a display layer and a protective layer stacked on the light-emitting side of the display layer. In the closed state of the foldable electronic device, the conductors on the first middle frame and the conductors on the second middle frame are spaced apart along a direction perpendicular to the flexible display panel, and the flexible display panel on the second middle frame is located between the first middle frame and the second middle frame. The dielectric material is disposed on the protective layer of the second middle frame.

18. The foldable electronic device according to claim 17, characterized in that, The dielectric material is disposed on the light-emitting side and / or light-receiving side of the protective layer; and / or, the material of the protective layer includes the dielectric material.

19. The foldable electronic device according to claim 17 or 18, characterized in that, The foldable electronic device further includes a third middle frame, which is foldably connected to both the first middle frame and the second middle frame, and the flexible display panel is also disposed on the third middle frame; In the closed state, the first middle frame is located between the second middle frame and the third middle frame, and the flexible display panel on the first middle frame is located between the first middle frame and the third middle frame.

20. The foldable electronic device according to claim 17 or 18, characterized in that, The medium material is disposed on the protective layer on the first middle frame and the protective layer on the second middle frame. In the closed state, the flexible display panel on the first middle frame is located between the first middle frame and the second middle frame.

21. The foldable electronic device according to any one of claims 17-20, characterized in that, The dielectric material includes a first dielectric material with a magnetic permeability greater than 1, and the first dielectric material is disposed at least at the magnetic field strength point between the conductor on the first middle frame and the conductor on the second middle frame.

22. The foldable electronic device according to any one of claims 17-20, characterized in that, The dielectric material includes a first dielectric material with a magnetic permeability greater than 1, and the first dielectric material is disposed at least in the central region of the protective layer on the second middle frame.

23. The foldable electronic device according to claim 21 or 22, characterized in that, The magnetic permeability of the first dielectric material is greater than or equal to 10.

24. The foldable electronic device according to any one of claims 17-23, characterized in that, The dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the second dielectric material is disposed at least at the electric field strength point between the conductor on the first middle frame and the conductor on the second middle frame.

25. The foldable electronic device according to any one of claims 17-23, characterized in that, The dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the second dielectric material is disposed at least at one end of the protective layer on the second middle frame along the length direction.

26. The foldable electronic device according to claim 24 or 25, characterized in that, The dielectric constant of the second dielectric material is greater than or equal to 6.

27. A foldable electronic device, characterized in that, include: A first middle frame and a second middle frame, wherein the first middle frame and the second middle frame are foldably connected; A flexible display panel, wherein the flexible display panel is disposed on the first middle frame and the second middle frame; In the closed state of the foldable electronic device, the conductors on the first middle frame and the conductors on the second middle frame are spaced apart along a direction perpendicular to the flexible display panel, and the flexible display panel on the second middle frame is located between the first middle frame and the second middle frame; A first frame member and a second frame member, wherein the first frame member is disposed on the first middle frame and surrounds the outer periphery of the flexible display panel on the first middle frame; and the second frame member is disposed on the second middle frame and surrounds the outer periphery of the flexible display panel on the second middle frame. A dielectric material is disposed on the second frame member.

28. The foldable electronic device according to claim 27, characterized in that, The medium material is disposed on the outer surface of the second frame member facing the first middle frame; and / or, the medium material is disposed on the inner surface of the second frame member away from the first middle frame; And / or, the medium material is embedded within the second frame member.

29. The foldable electronic device according to claim 27 or 28, characterized in that, The foldable electronic device further includes a third middle frame, which is foldably connected to both the first middle frame and the second middle frame, and the flexible display panel is also disposed on the third middle frame; in the closed state, the first middle frame is located between the second middle frame and the third middle frame, and the flexible display panel on the first middle frame is located between the first middle frame and the third middle frame.

30. The foldable electronic device according to claim 27 or 28, characterized in that, The medium material is also disposed on the first frame member; in the closed state, the flexible display panel on the first middle frame is located between the first middle frame and the second middle frame.

31. The foldable electronic device according to any one of claims 27-30, characterized in that, The dielectric material includes a first dielectric material with a magnetic permeability greater than 1, and the first dielectric material is disposed at least at the magnetic field strength point between the conductor on the first middle frame and the conductor on the second middle frame.

32. The foldable electronic device according to any one of claims 27-30, characterized in that, The dielectric material includes a first dielectric material with a magnetic permeability greater than 1, and the first dielectric material is disposed at least on a portion of the second frame member at the middle position along the length direction.

33. The foldable electronic device according to claim 31 or 32, characterized in that, The magnetic permeability of the first dielectric material is greater than or equal to 10.

34. The foldable electronic device according to any one of claims 27-33, characterized in that, The dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the second dielectric material is disposed at least at the electric field strength point between the conductor on the first middle frame and the conductor on the second middle frame.

35. The foldable electronic device according to any one of claims 27-33, characterized in that, The dielectric material includes a second dielectric material, the dielectric constant of which is greater than or equal to 2, and the second dielectric material is disposed at least on a portion of the second frame member along one end of the length direction.

36. The foldable electronic device according to claim 34 or 35, characterized in that, The dielectric constant of the second dielectric material is greater than or equal to 6.

37. The foldable electronic device according to any one of claims 1-36, characterized in that, The thickness of the medium material is 0.05mm-0.3mm.

38. The foldable electronic device according to any one of claims 1-37, characterized in that, The loss tangent of the dielectric material is greater than or equal to 0.

5.

39. The foldable electronic device according to any one of claims 1-38, characterized in that, The foldable electronic device further includes an antenna structure disposed in the first middle frame and / or the second middle frame, wherein the minimum distance between the dielectric material and the antenna structure is greater than or equal to 5 mm.

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