Triple-band antenna

Abstract

A three-frequency antenna includes an antenna structure and a main plate. The antenna structure includes a circuit board, a first radiation layer, a second radiation layer, a third radiation layer and an electrode layer. The first radiation layer is arranged on the front surface of the circuit board. The second radiation layer is arranged on the front surface of the circuit board and is located on one side and above the first radiation layer. The third radiation layer is arranged on the top surface and the back surface of the circuit board and is electrically connected with the second radiation layer. The electrode layer is arranged on the front surface, the back surface and the bottom surface of the circuit board and is electrically connected with the second radiation layer. The main plate includes a solder pad and a signal feed layer. The electrode layer, the first radiation layer, the solder pad and the signal feed layer are electrically fixed to generate three 2.4 GHz, 5 GHz-7 GHz frequency band paths for signal transmission.

Description

Technical Field

[0001] This utility model relates to an antenna, and more particularly to a tri-band antenna in which the antenna structure is side-mounted and soldered onto a motherboard, and is applicable to the Wi-Fi 7 band. Background Technology

[0002] With the rapid development of wireless network technology, Wi-Fi has become an indispensable part of our daily lives. The different numbers from Wi-Fi 5 to Wi-Fi 6 represent different advancements and changes in each generation.

[0003] Traditional Wi-Fi 5 uses the 5GHz band with a maximum bandwidth of 160MHz and employs 256-QAM modulation technology, achieving a maximum transmission rate of 3.5Gbps. This enables Wi-Fi 5 to provide high-speed wireless connectivity, making it suitable for high-bandwidth applications such as HD video streaming and online gaming. While its high-speed transmission capabilities can meet the needs of most homes and small businesses, it only supports the 5GHz band, its signal weakens when passing through walls and obstacles, and it also has certain limitations in terms of multi-device connectivity.

[0004] Therefore, to overcome the technological limitations of Wi-Fi 5, the sixth-generation communication technology, Wi-Fi 6, was developed. Wi-Fi 6 supports dual-band technology on both 2.4GHz and 5GHz bands, with a maximum bandwidth of 160MHz, but employs the more advanced 1024-QAM modulation technology, increasing the maximum transmission rate to 9.6Gbps. It introduces Orthogonal Frequency Division Multiple Access (OFDMA) and Multiple User-Multiple Input Multiple Output (MU-MIMO) technologies, significantly improving multi-device connection efficiency and data transmission stability. While Wi-Fi 6 offers higher transmission rates, lower latency, and higher data efficiency, making it suitable for home and medium-sized enterprise environments with multiple devices connected simultaneously, its limitations on the 6GHz band and its insufficient transmission distance restrict the full realization of its speed advantages. This is because Wi-Fi 6 has poor penetration in the 6GHz band, potentially leading to shorter signal transmission distances.

[0005] Therefore, how to make the antenna structure extend the signal transmission distance and improve the transmission rate is the main problem to be solved by this utility model. Utility Model Content

[0006] Therefore, the main purpose of this utility model is to solve the shortcomings of the traditional method. This utility model redesigns the antenna structure so that the antenna structure can be used as a (Wi-Fi 7) tri-band antenna and supports the frequency bands of 2.4GHz, 5GHz to 7GHz. In addition to having a higher transmission rate, it has excellent penetration and can transmit signals to a greater distance.

[0007] To achieve the above objectives, this utility model provides a tri-band antenna, comprising: an antenna structure and a main board. The antenna structure includes: a circuit board, a first radiating layer, a second radiating layer, a third radiating layer, and an electrode layer. The circuit board is a square body, having a front surface, a back surface, a top surface, a bottom surface, and two side surfaces. The first radiating layer is disposed on the front surface of the circuit board. The second radiating layer is disposed on the front surface of the circuit board, located to one side and above the first radiating layer. The third radiating layer is disposed on the top surface and the back surface of the circuit board and is electrically connected to the second radiating layer. The electrode layer is disposed on the front surface, the back surface, and the bottom surface of the circuit board and is electrically connected to the second radiating layer. The main board includes at least: a pad and a signal feed layer. The electrode layer, the first radiating layer, the pad, and the signal feed layer are electrically fixed to generate three frequency band paths for signal transmission.

[0008] In one embodiment of the present invention, the first radiating layer includes a first square metal layer and a second square metal layer electrically connected to the first square metal layer to form a T-shaped first radiating layer; wherein the area of ​​the first square metal layer is larger than the area of ​​the second square metal layer.

[0009] In one embodiment of the present invention, the second radiating layer includes a line-shaped metal segment located on one side of the first radiating layer, with one end electrically connected to the electrode layer and the other end extending into an S-shaped metal segment located above the first radiating layer; the top of the S-shaped metal segment extends to the junction of the top surface and the front surface of the circuit board.

[0010] In one embodiment of the present invention, the first radiating layer and the second radiating layer have a first coupling gap.

[0011] In one embodiment of this utility model, the first coupling distance is 0.1mm to 1mm.

[0012] In one embodiment of this utility model, the first coupling distance is 0.5 mm.

[0013] In one embodiment of the present invention, the electrode layer includes a front electrode layer, a back electrode layer and at least one half-hole electrode layer. The front electrode layer is disposed on the front side of the circuit board, the back electrode layer is disposed on the back side of the circuit board, and the half-hole electrode layer is disposed on the bottom surface of the circuit board and electrically connects the front electrode layer and the back electrode layer; wherein, one of the front electrode layers is electrically connected to the I-shaped metal line segment of the second radiating layer.

[0014] In one embodiment of the present invention, the front and back sides of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area and a second clearance area; wherein, the first clearance area of ​​the motherboard has a pad, the pad including a first pad and a second pad.

[0015] In one embodiment of the present invention, the first pad is L-shaped and has a first line segment and a second line segment. One end of the first line segment has a first pad contact and the first ground layer has a first ground contact, which are electrically connected to a matching component. The first line segment and the second line segment are electrically connected to one of the front electrode layers and one of the back electrode layers of the electrode layer.

[0016] In one embodiment of the present invention, one end of the second pad is electrically connected to the first ground layer, and the other end is electrically connected to one of the front electrode layers and one of the back electrode layers of the electrode layer; wherein, a gap is formed between one side of the second pad and the first ground layer, and the second pad located on the gap has a second pad contact and an electrical connection matching component between the second pad and the first ground layer has a second ground contact.

[0017] In one embodiment of the present invention, a signal feed layer is provided between the first pad and the second pad. The signal feed layer includes a first metal block, a second metal block and a metal line. The second metal block has a second coupling distance and a third coupling distance with the first pad and the first ground layer.

[0018] In one embodiment of this utility model, the second coupling distance and the third coupling distance are 0.1mm to 0.5mm.

[0019] In one embodiment of this utility model, the second coupling distance and the third coupling distance are 0.1 mm.

[0020] In one embodiment of the present invention, the metal line is composed of a first metal line and a second metal line. The first metal line and the second metal line extend into the first grounding layer and have a gap with the first grounding layer. The first metal line and the second metal line have multiple solder points and are electrically connected to the first grounding layer having multiple third grounding contacts.

[0021] In one embodiment of the present invention, the third radiating layer includes a plurality of semi-perforated metal layers and a block metal layer electrically connected to the semi-perforated metal layers; the semi-perforated metal layers are disposed on the top surface of the circuit board, one end of the semi-perforated metal layers is electrically connected to the second radiating layer, and the block metal layer is disposed on the back surface of the circuit board and electrically connected to the other end of the semi-perforated metal layers; wherein the block metal layer occupies approximately one-quarter to one-half of the area of ​​the back surface of the circuit board.

[0022] In one embodiment of the present invention, the third radiating layer further includes at least one conductive pillar that passes through the circuit board, thereby electrically connecting the second radiating layer and the block metal layer of the third radiating layer.

[0023] In one embodiment of the present invention, the third radiating layer further includes a top conductive layer disposed on the top surface of the circuit board, and the top conductive layer electrically connects the second radiating layer and the block metal layer of the third radiating layer.

[0024] In one embodiment of the present invention, the third radiating layer further includes at least one block-shaped conductive layer disposed on the top surface of the circuit board, and the block-shaped conductive layer electrically connects the second radiating layer and the block metal layer of the third radiating layer. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of the antenna structure according to the first embodiment of this utility model;

[0026] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the antenna structure from another perspective;

[0027] Figure 3 This is a schematic diagram of the antenna structure and the front of the motherboard according to the first embodiment of this utility model;

[0028] Figure 4 yes Figure 3 A diagram of the back of the motherboard;

[0029] Figure 5 This is an exploded view of the antenna structure and motherboard of the first embodiment of this utility model;

[0030] Figure 6 This is a schematic diagram of the welding assembly of the antenna structure and the motherboard according to the first embodiment of this utility model;

[0031] Figure 7 yes Figure 6 A schematic diagram of the antenna structure and the motherboard from another perspective in the first embodiment;

[0032] Figure 8 This is a three-dimensional schematic diagram of the antenna structure of the second embodiment of this utility model;

[0033] Figure 9 yes Figure 8 A three-dimensional view of the antenna structure of the second embodiment from another side;

[0034] Figure 10 This is a three-dimensional schematic diagram of the antenna structure according to the third embodiment of this utility model;

[0035] Figure 11 yes Figure 10 A three-dimensional view of the antenna structure of the third embodiment from another side;

[0036] Figure 12 This is a three-dimensional schematic diagram of the antenna structure according to the fourth embodiment of this utility model;

[0037] Figure 13 yes Figure 12 A three-dimensional view of the antenna structure of the fourth embodiment. Detailed Implementation

[0038] The technical content and detailed description of this utility model are now explained with reference to the accompanying drawings:

[0039] Please see Figures 1-4 This is a three-dimensional schematic diagram of the antenna structure according to the first embodiment of this utility model. Figure 1 Another perspective of the antenna structure's appearance, a three-dimensional schematic diagram, a front view of the antenna structure and the motherboard of the first embodiment of this utility model, and Figure 3 A schematic diagram of the back of the motherboard. As shown in the figure: The tri-band antenna of this utility model includes an antenna structure 1 and a motherboard (test board) 2. The antenna structure 1 is soldered to the motherboard 2 in a side-standing manner to enable signal transmission and reception of the tri-band antenna.

[0040] The antenna structure 1 includes: a circuit board 11, a first radiating layer 12, a second radiating layer 13, a third radiating layer 14, and an electrode layer 15.

[0041] The circuit board 11 is a square shape, having a front surface 111, a back surface 112, a top surface 113, a bottom surface 114, and two side surfaces 115. In this figure, the circuit board 11 is a printed circuit board.

[0042] The first radiating layer 12 is disposed on the front side 111 of the circuit board 11. The first radiating layer 12 includes a first square metal layer 121 and a second square metal layer 122 electrically connected to the first square metal layer 121 to form a T-shaped first radiating layer 12. The area of ​​the first square metal layer 121 is larger than the area of ​​the second square metal layer 122. In this figure, the first radiating layer 12 is a 5GHz to 7GHz frequency band path.

[0043] The second radiating layer 13 is disposed on the front surface 111 of the circuit board 11, and is located to one side and above the first radiating layer 12. The second radiating layer 13 includes a T-shaped metal segment 131 located to one side of the first radiating layer 12. One end of the T-shaped metal segment 131 is electrically connected to the front electrode layer 151 of one of the electrode layers 15, and the other end extends into an S-shaped metal segment 132 located above the first radiating layer 12. The top of the S-shaped metal segment 132 extends to the junction of the top surface 113 and the front surface 111 of the circuit board 11. In this figure, the second radiating layer 13 is a 2.4 GHz frequency band path.

[0044] It is worth mentioning that there is a first coupling gap 16 between the first radiating layer 12 and the second radiating layer 13. The first coupling gap 16 is used to adjust the antenna impedance to achieve a broadband effect. In this figure, the first coupling gap 16 is 0.1mm to 1mm, preferably 0.5mm.

[0045] The third radiating layer 14 is disposed on the top surface 113 and the back surface 112 of the circuit board 11. The third radiating layer 14 includes a plurality of semi-perforated metal layers 141 and block metal layers 142 electrically connected to these semi-perforated metal layers 141. The semi-perforated metal layers 141 are disposed on the top surface 113 of the circuit board 11, with one end electrically connected to the second radiating layer 13. The block metal layers 142 are disposed on the back surface 112 of the circuit board 11 and electrically connected to the other end of the semi-perforated metal layers 141. The block metal layers 142 occupy approximately one-quarter to one-half of the area of ​​the back surface 112 of the circuit board 11. In this figure, the third radiating layer is a 2.4 GHz frequency band path.

[0046] The electrode layer 15 includes a front electrode layer 151, a back electrode layer 152, and at least one half-hole electrode layer 153. The front electrode layer 151 is disposed on the front side 111 of the circuit board 11, the back electrode layer 152 is disposed on the back side 112 of the circuit board 11, and the half-hole electrode layer 153 is disposed on the bottom surface 114 of the circuit board 11, and electrically connects the front electrode layer 151 and the back electrode layer 152. One of the front electrode layers 151 is electrically connected to a line segment 131 of the second radiating layer 13. The electrode layer 15 provides a surface mount technology (SMT) soldering method for bonding the antenna structure 1 to the pads 25 and the signal feed layer 26 of the motherboard 2.

[0047] More importantly, the design of the semi-hole electrode layer 153 reduces the manufacturing cost of the antenna structure 1, and allows the antenna structure 1 to be electrically fixed to the solder pads 25 on the motherboard 2 without damaging the original motherboard 2 structure.

[0048] The electronic device of this invention has a first ground layer 21, a second ground layer 22, a first clearance area 23, and a second clearance area 24 symmetrically arranged on its front and back sides. The first clearance area 23 of the motherboard 2 has a pad 25, which includes a first pad 251 and a second pad 252. The first pad 251 and the second pad 252 are electrically fixed to the antenna structure 1.

[0049] The first pad 251 is L-shaped and has a first line segment 2511 and a second line segment 2512. One end of the first line segment 2511 has a first pad contact 2513, which can be electrically connected to a matching component (not shown) between itself and the first ground layer 21, which has a first ground contact 211, to adjust the antenna impedance and frequency to achieve the operating frequency band. The first line segment 2511 and the second line segment 2512 are electrically connected to a front electrode layer 151 and a back electrode layer 152 of the electrode layer 15 of the antenna structure 1. In this figure, the matching component is a capacitor or an inductor.

[0050] The second pad 252 has one end electrically connected to the first ground layer 21, and the other end electrically connected to a front electrode layer 151 and a back electrode layer 152 of the electrode layer 15 of the antenna structure 1. Furthermore, a gap 253 is formed between one side of the second pad 252 and the first ground layer 21. A second pad contact 2521 on the second pad 252 and a second ground contact 212 on the first ground layer 21 are electrically connected to a matching component (not shown) to adjust the antenna impedance and frequency to achieve the operating frequency band. In this figure, the matching component is a capacitor or an inductor.

[0051] Additionally, a signal feed layer 26 is provided between the first pad 251 and the second pad 252. This signal feed layer 26 includes a first metal block 261, a second metal block 262, and a metal line 263. The second metal block 262 has a second coupling spacing 27 and a third coupling spacing 28 with respect to the first pad 251 and the first ground layer 21. The second coupling spacing 27 and the third coupling spacing 28 are between 0.1 mm and 0.5 mm, preferably 0.1 mm. The metal line 263 is composed of a first metal line 2631 and a second metal line 2632. The first metal line 2631 and the second metal line 2632 extend into the first ground layer 21 and have a gap 29 between them. Multiple solder points 2633 on the first metal line 2631 and the second metal line 2632 can be electrically connected to multiple third grounding contacts 213 on the first ground layer 21 to form a matching component (not shown) for adjusting the antenna impedance and frequency to achieve the operating frequency band. In this figure, the matching component is a capacitor or an inductor.

[0052] It is worth mentioning that the first pad 251 and the first metal block 261, the second metal block 262 and the second pad 252 of the signal feed layer 26 are branch paths, which are used to adjust the antenna impedance and increase the bandwidth to achieve a broadband effect.

[0053] Please see Figure 5 , 6 Figures 7 and 8 are exploded view of the antenna structure and motherboard of the first embodiment of this utility model, and a welding assembly diagram of the antenna structure and motherboard of the first embodiment of this utility model. Figure 6 A schematic diagram of the antenna structure and the motherboard from another perspective in the first embodiment; see also the attached diagram. Figures 1-4 As shown in the figure: The antenna structure 1 of this utility model is soldered to the motherboard 2 using surface mount technology (SMT). The front electrode layer, back electrode layer 152 and half-hole electrode layer 153 of the antenna structure 1 are soldered to the first pad 251 and the second pad 252 of the pad 25 on the motherboard 2 to form an electrical connection. At the same time, the second square metal layer 122 of the first radiating layer 12 is soldered to the first metal block 261 and the second metal block 262 of the signal feed layer 26 to form an electrical junction.

[0054] After the antenna structure 1 is soldered to the motherboard 2, the antenna structure 1 is used for Wi-Fi 7 tri-band antenna support. This tri-band antenna supports 2.4GHz and 5GHz to 7GHz. The first radiating layer 12 is the 5GHz to 7GHz band path, the second radiating layer 13 is the 2.4GHz band path, and the third radiating layer 14 is the 2.4GHz path. The block metal layer 142 of the third radiating layer 14 extends to the back 112 of the circuit board 11 to reduce the frequency and increase the radiation area and efficiency.

[0055] The first coupling spacing 16 between the first radiating layer 12 and the second radiating layer 13 is used to adjust the antenna impedance to achieve a broadband effect. The first pad contact 2513 and the first ground contact 211, the second pad contact 2521 and the second ground contact 212, and the multiple solder points 2633 on the first metal line 2631 and the second metal line 2632, and the multiple third ground contacts 213 on the first ground layer 21, can be electrically connected to matching components (not shown) to adjust the antenna impedance and frequency to achieve the operating frequency band. The first pad 251 and the first metal block 261, the second metal block 262, and the second pad 252 of the signal feed layer 26 form a branch path to adjust the antenna impedance and increase bandwidth to achieve a broadband effect.

[0056] The design of the pads 25 on the motherboard 2 can increase the stability and robustness of the antenna structure 1 during soldering, prevent the antenna structure 1 from shifting or deviating during surface mount technology (SMT) manufacturing, and also increase the pads 25 to firmly grip or fix the antenna structure 1 body, thereby improving the problem of falling when dropped.

[0057] Please see Figure 8 , 9 This is a three-dimensional schematic diagram of the antenna structure of the second embodiment of this utility model. Figure 8 The second embodiment of the antenna structure is shown in a perspective view from another side. As shown in the figure: the antenna structure of this embodiment is roughly the same as that of the first embodiment, except that one or more conductive pillars 143 pass through the circuit board 11, so that the second radiating layer 13 and the block metal layer 142 of the third radiating layer 14 are electrically connected. During the fabrication of the antenna structure 1, the conductive pillars 143 can be fabricated simultaneously, which can save a lot of manufacturing costs.

[0058] Please see Figure 10 , 11 This is a three-dimensional schematic diagram of the antenna structure of the third embodiment of this utility model. Figure 10The third embodiment of the antenna structure is shown in a three-dimensional perspective view from another side. As shown in the figure, the antenna structure of this embodiment is generally the same as that of the first and second embodiments, except that the top surface 113 of the circuit board 11 is provided with a top conductive layer 144. The top conductive layer 144 electrically connects the block metal layer 142 of the second radiating layer 13 and the third radiating layer 14 to improve the transmission and reception capability of the antenna structure 1 and make the antenna structure 1 more efficient.

[0059] Please see Figure 12 , 13 This is a three-dimensional schematic diagram of the antenna structure according to the fourth embodiment of this utility model. Figure 12 The fourth embodiment of the antenna structure is shown in a perspective view from another side. As shown in the figure, the antenna structure of this embodiment is generally the same as that of the first, second and third embodiments, except that one or more block conductive layers 145 are provided on the top surface 113 of the circuit board 11. The one or more block conductive layers 145 electrically connect the block metal layers 142 of the second radiating layer 13 and the third radiating layer 14 to improve the transmission and reception capability of the antenna structure 1 and make the antenna structure 1 more efficient.

[0060] The above description is only a preferred embodiment of the present utility model and is not intended to limit the scope of patent protection of the present utility model. Therefore, all equivalent changes made based on the content of the present utility model specification or drawings are similarly included within the scope of protection of the present utility model and are hereby explained.

[0061] [Symbol Explanation]

[0062] 1: Antenna Structure

[0063] 11: Circuit Board

[0064] 111: Front

[0065] 112: Back

[0066] 113: Top surface

[0067] 114: Bottom surface

[0068] 115: Side view

[0069] 12: First radiation layer

[0070] 121: First square metal layer

[0071] 122: Second square metal layer

[0072] 13: Second Radiation Layer

[0073] 131: A straight metal line segment

[0074] 132: S-shaped metal segment

[0075] 14: Third Radiation Layer

[0076] 141: Semi-porous metal layer

[0077] 142: Block Metal Layer

[0078] 143: Conductive column

[0079] 144: Top conductive layer

[0080] 145: Bulk conductive layer

[0081] 15: Electrode layer

[0082] 151: Front electrode layer

[0083] 152: Back electrode layer

[0084] 153: Semi-hole electrode layer

[0085] 16: First coupling spacing

[0086] 2: Motherboard

[0087] 21: First grounding layer

[0088] 211: First grounding connection

[0089] 212: Second grounding connection

[0090] 213: Third grounding connection

[0091] 22: Second grounding layer

[0092] 23: First Clear Zone

[0093] 24: Second Clear Zone

[0094] 25: solder pads

[0095] 251: First pad

[0096] 2511: First line segment

[0097] 2512: Second line segment

[0098] 2513: First pad contact

[0099] 252: Second pad

[0100] 2521: Second pad contact

[0101] 253: Spacing

[0102] 26: Signal Feed Layer

[0103] 261: First Metal Block

[0104] 262: Second Metal Block

[0105] 263: Metallic Circuit

[0106] 2631: First Metal Circuit

[0107] 2632: Second metal circuit

[0108] 2633: Welding point

[0109] 27: Second coupling spacing

[0110] 28: Third coupling spacing

[0111] 29: Gap

Claims

1. A tri-band antenna, characterized in that, include: A single antenna structure and a motherboard; The antenna structure includes: A circuit board is a square shape, having a front, a back, a top, a bottom, and two side surfaces. A first radiating layer is disposed on the front side of the circuit board; A second radiating layer is disposed on the front side of the circuit board and is located on one side and above the first radiating layer; A third radiating layer is disposed on the top surface and the back surface of the circuit board and is electrically connected to the second radiating layer; An electrode layer is disposed on the front, back, and bottom surfaces of the circuit board and is electrically connected to the second radiating layer; and The motherboard includes at least: a pad and a signal feed layer; The electrode layer, the first radiating layer, the pad, and the signal feed layer are electrically fixed to generate three frequency band paths for signal transmission.

2. The tri-band antenna according to claim 1, characterized in that, The first radiating layer includes a first square metal layer and a second square metal layer electrically connected to the first square metal layer to form a T-shaped first radiating layer; wherein the area of ​​the first square metal layer is larger than the area of ​​the second square metal layer.

3. The tri-band antenna according to claim 2, characterized in that, The second radiating layer includes a line-shaped metal segment located on one side of the first radiating layer. One end of the line-shaped metal segment is electrically connected to the electrode layer, and the other end extends into an S-shaped metal segment located above the first radiating layer. The top of the S-shaped metal segment extends to the junction of the top surface and the front surface of the circuit board.

4. The tri-band antenna according to claim 3, characterized in that, There is a first coupling gap between the first radiating layer and the second radiating layer.

5. The tri-band antenna according to claim 4, characterized in that, The first coupling spacing is 0.1mm to 1mm.

6. The tri-band antenna according to claim 5, characterized in that, The first coupling spacing is 0.5 mm.

7. The tri-band antenna according to claim 3, characterized in that, The electrode layer includes a front electrode layer, a back electrode layer, and at least one half-hole electrode layer. The front electrode layer is disposed on the front side of the circuit board, the back electrode layer is disposed on the back side of the circuit board, and the half-hole electrode layer is disposed on the bottom surface of the circuit board and electrically connects the front electrode layer and the back electrode layer. The front electrode layer is electrically connected to the I-shaped metal line segment of the second radiating layer.

8. The tri-band antenna according to claim 7, characterized in that, The motherboard has a first ground layer, a second ground layer, a first clearance area, and a second clearance area on its front and back sides, respectively; wherein, the first clearance area of ​​the motherboard has a pad, and the pad includes a first pad and a second pad.

9. The tri-band antenna according to claim 8, characterized in that, The first pad is L-shaped and has a first line segment and a second line segment. One end of the first line segment has a first pad contact and the first ground layer has a first ground contact, which are electrically connected to a matching component. The first line segment and the second line segment are electrically connected to one of the front electrode layers and one of the back electrode layers of the electrode layer.

10. The tri-band antenna according to claim 9, characterized in that, The second pad has one end electrically connected to the first ground layer and the other end electrically connected to one of the front electrode layers and one of the back electrode layers of the electrode layer; wherein, a gap is formed between one side of the second pad and the first ground layer, and the second pad located on the gap has a second pad contact and an electrical connection matching component between the second pad and a second ground contact on the first ground layer.

11. The tri-band antenna according to claim 10, characterized in that, A signal feed layer is provided between the first pad and the second pad. The signal feed layer includes a first metal block, a second metal block and a metal line. The second metal block has a second coupling distance and a third coupling distance with the first pad and the first ground layer.

12. The tri-band antenna according to claim 11, characterized in that, The second coupling spacing and the third coupling spacing are 0.1mm to 0.5mm.

13. The tri-band antenna according to claim 12, characterized in that, The second coupling spacing and the third coupling spacing are both 0.1 mm.

14. The tri-band antenna according to claim 11, characterized in that, The metal line consists of a first metal line and a second metal line, which extend into the first grounding layer and have a gap with the first grounding layer. The first metal line and the second metal line have multiple solder points that are electrically connected to and matched with multiple third grounding points on the first grounding layer.

15. The tri-band antenna according to claim 1, characterized in that, The third radiating layer includes multiple semi-porous metal layers and block metal layers electrically connected to these semi-porous metal layers. These semi-perforated metal layers are disposed on the top surface of the circuit board, with one end of each semi-perforated metal layer electrically connected to the second radiating layer, and the block metal layer is disposed on the back surface of the circuit board and electrically connected to the other end of each semi-perforated metal layer; wherein the block metal layer occupies approximately one-quarter to one-half of the area of ​​the back surface of the circuit board.

16. The tri-band antenna according to claim 15, characterized in that, The third radiating layer further includes at least one conductive pillar that passes through the circuit board, thereby electrically connecting the second radiating layer to the block metal layer of the third radiating layer.

17. The tri-band antenna according to claim 15, characterized in that, The third radiating layer further includes a top conductive layer disposed on the top surface of the circuit board, and the top conductive layer electrically connects the second radiating layer and the block metal layer of the third radiating layer.

18. The tri-band antenna according to claim 15, characterized in that, The third radiating layer further includes at least one block-shaped conductive layer disposed on the top surface of the circuit board, and the block-shaped conductive layer electrically connects the second radiating layer and the block metal layer of the third radiating layer.

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