High-density connector module without soldering fixation mechanism and its stacked connector

Abstract

The present application provides a high-density connector module without welding fixation mechanism and a stacked connector thereof, which is connected to a circuit board without welding. The stacked connector includes an intermediate seat body, a plurality of wire harness terminal groups and a plurality of carrier plate terminal groups. Each wire harness terminal group is inserted into the intermediate seat body from a first side of the intermediate seat body, and can be detached or replaced relative to the intermediate seat body without damaging the structure. Each carrier plate terminal group is inserted into the intermediate seat body from a second side of the intermediate seat body, and can be detached or replaced relative to the intermediate seat body without damaging the structure. In this way, the stacked connector adopts a double-sided plug-in architecture without welding, which not only simplifies the connection process, but also improves the efficiency of modular assembly and maintenance.

Description

Technical Field

[0001] This application relates to a high-density connector module, and more particularly to a high-density connector module that employs an outer frame and multiple stacked connectors, wherein the wire harness terminal groups and carrier board terminal groups of the stacked connectors are both designed with a double-sided plug-in and solderless architecture. Background Technology

[0002] Traditional probe card connector technology typically employs a one-piece molded body structure, directly integrating various conductive terminals and wiring modules within the body to achieve high-density signal connections. As the number of probes and test point density of components under test (DUTs) increases, the outer diameter of some traditional probe card connectors can even exceed 500 mm. However, this large and one-piece structure is increasingly facing several technical bottlenecks, such as limited mold size, shrinkage deformation during injection molding, and decreased terminal insertion accuracy, all of which further affect manufacturing yield and product reliability.

[0003] Furthermore, in the aforementioned structure, conductive terminals and wiring modules mostly need to be inserted and positioned at the initial stage of assembly. If some terminals have abnormal contact or transmission lines fail, staff often have to disassemble the entire structure for replacement, resulting in high maintenance costs and difficulty in quickly troubleshooting. Especially in application scenarios with more than tens of thousands of contacts, the feasibility of maintenance and replacement becomes a major limitation in practical applications, which adversely affects testing efficiency and operational stability.

[0004] Furthermore, some high-density connectors use soldering to connect multiple conductive terminals to circuit board lines in order to improve the reliability of electrical contact. However, soldering is a high-temperature process, which can easily generate thermal stress on the plastic body and surrounding components. This is not only detrimental to subsequent maintenance and disassembly, but may also cause negative consequences such as metal oxidation or solder cracking. Therefore, how to effectively solve the aforementioned problems is an important issue of this application. Utility Model Content

[0005] In order to stand out in the highly competitive market, the creator, with years of professional experience in the design, processing and manufacturing of various power or signal connectors, and adhering to the spirit of continuous improvement, has finally developed a high-density connector module and its stacked connector without a soldering fixing mechanism after long-term research and experimentation. It is hoped that the advent of this application will gain market favor.

[0006] The purpose of this application is to provide a stackable connector without a soldering fixing mechanism, which connects to a circuit board without soldering. The connector includes an intermediate base, multiple wire harness terminal groups, and multiple carrier board terminal groups. The intermediate base has multiple mounting slots, each extending through a first side and a second side of the intermediate base. Multiple wire harness terminal groups are inserted into each mounting slot from the first side of the intermediate base and can be disassembled or replaced relative to the intermediate base without damaging the structure. Each wire harness terminal group includes a first base and multiple wire harness terminals, each wire harness terminal being fixed to the first base. The first end of each wire harness terminal is electrically connected to a transmission line; the second end of each wire harness terminal protrudes from the first base and is accommodated in the same mounting slot. Multiple carrier board terminal groups are inserted into each mounting slot from the second side of the intermediate base and can be disassembled or replaced relative to the intermediate base without damaging the structure. Each of the carrier terminal groups includes a second base and multiple carrier terminals, with each carrier terminal fixed to the second base. The first end of each carrier terminal protrudes from the second base and directly contacts the second end of each corresponding wire harness terminal; the second end of each carrier terminal extends outward from the second side of the intermediate seat and presses against the circuit board without soldering. Thus, this stacked connector employs a double-sided plug-in and solderless architecture, simplifying the connection process and improving modular assembly and maintenance efficiency.

[0007] Optionally, the second end of the carrier terminal is provided with at least one inclined section, a portion of which is used to press against the circuit board, and the aforementioned portion is not completely located within the vertical projection range of the mounting groove where the carrier terminal is located.

[0008] Optionally, the projection positions of the second ends of the corresponding wire harness terminals and the carrier plate terminals are different.

[0009] Optionally, the first end of the carrier plate terminal is fixed to the second substrate, and only one contact surface is exposed outside the second substrate to directly contact the second end of the wire harness terminal, while the other surfaces are enclosed in the second substrate.

[0010] Optionally, the mounting groove wall is provided with at least one first stop block, each of the first stop blocks being used to prevent the wire harness terminal group from continuously moving toward the second side of the mounting groove.

[0011] Optionally, the mounting groove wall is provided with at least one second stop block, each second stop block being used to prevent the carrier plate terminal from continuously moving toward the first side of the mounting groove.

[0012] Optionally, the first base has a first connecting part, and the mounting groove has a first mating part. When the wire harness terminal group is inserted into the corresponding mounting groove of the intermediate seat, the first connecting part and the first mating part are matched and engaged with each other.

[0013] Optionally, the second base is provided with a second connecting part, and the mounting groove is provided with a second mating part. When the carrier plate terminal group is inserted into the corresponding mounting groove of the intermediate seat, the second connecting part and the second mating part are matched and engaged with each other.

[0014] Another objective of this application is to provide a high-density connector module without a soldering fixing mechanism, the high-density connector module being connected to a circuit board in a solderless manner, comprising an outer frame and a plurality of stacked connectors as described in the foregoing objective. The outer frame is provided with a plurality of through slots. Each of the stacked connectors is respectively fixed to each of the through slots.

[0015] Optionally, each of the stacked connectors is secured to the outer frame with at least one screw.

[0016] To further illustrate the purpose, technical features, and effects of this application, specific embodiments are described in detail below with reference to the accompanying drawings. However, the drawings provided are for reference and illustration only and are not intended to limit this application. Attached Figure Description

[0017] Figure 1 This is a top perspective view of the high-density connector module of this application;

[0018] Figure 2 This is a partial bottom perspective view of the high-density connector module of this application;

[0019] Figure 3 This is an exploded view of the stacked connector of this application;

[0020] Figure 4 This is a three-dimensional cross-sectional view of the intermediate support body of this application;

[0021] Figure 5A This is a perspective view of the wire harness terminal assembly of this application;

[0022] Figure 5B This is an exploded view of the wire harness terminal assembly of this application;

[0023] Figure 6 This is a cross-sectional view at a depth of the stacked connector of this application;

[0024] Figure 7A This is a perspective view of the carrier board terminal assembly of this application;

[0025] Figure 7B This is an exploded view of the carrier terminal assembly of this application; and

[0026] Figure 8 This is a cross-sectional view at another depth of the stacked connector of this application. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description of the embodiments of the "high-density connector module and its stacked connector without a soldering fixing mechanism" disclosed in this application, in conjunction with specific embodiments and with reference to the accompanying drawings, provides further details. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, it should be stated in advance that the accompanying drawings of this application are only simple schematic illustrations and are not depictions based on actual dimensions. Although this document provides examples of parameters containing specific values, it should be understood that the parameters do not need to be exactly equal to the corresponding values, but can approximate the corresponding values ​​within acceptable error tolerances or design constraints. In addition, unless the context clearly indicates or defines it, the meanings of "a," "the," and "the" in this application include the plural.

[0028] It should be understood that although terms such as "first," "second," etc., may be used herein to describe various components or signals, each described component or signal should not be limited by the foregoing terms, which are primarily used to distinguish one component from another or one signal from another. Furthermore, directional terms mentioned in subsequent embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the scope of protection of this application. Additionally, the term "or" as used herein may, depending on the specific circumstances, include any combination of one or more of the associated listed items.

[0029] Furthermore, the terms "substantially" or "approximately" as used herein can refer to the average of a numerical or complex numerical value within a range of deviations from a particular value, which can be recognized or determined by those skilled in the art. This includes taking into account certain specific errors that may occur when measuring the particular value due to limitations of the measurement system or equipment. For example, a numerical value referred to "substantially" can include ±5%, ±3%, ±1%, ±0.5%, ±0.1%, or one or more standard deviations of the particular value.

[0030] This application discloses a high-density connector module without a soldering fixing mechanism and its stacked connector. For ease of explanation of component features and relative positional relationships, the spatial configuration of the component is defined in the following description based on three mutually orthogonal axes: the horizontal axis (X-axis), the vertical axis (Y-axis), and the center axis (Z-axis). Specifically, the horizontal axis (X-axis) refers to the left-right extension direction. Figure 3 The upper left corner is used as the left side direction of the component. Figure 3 The lower right of the axis is defined as the right side of the component; the vertical axis (Y-axis) refers to the forward and backward extension direction, where... Figure 3 The lower left corner serves as the rear side of the component. Figure 3 The upper right of the axis is used as the front direction of the component; the vertical axis (Z-axis) refers to the vertical extension direction. Figure 3 The area above is considered the top (top) side of the component. Figure 3 The area below is used as the bottom (bottom) side direction of the component.

[0031] Please see Figures 1 to 3 As shown, in one embodiment, the high-density connector module S includes an outer frame 1 and a plurality of stacked connectors 2. The outer frame 1 may be disk-shaped, with its central region corresponding to the device under test (e.g., a wafer). The disk may have a plurality of through slots 10 extending vertically to accommodate the corresponding stacked connectors 2. Furthermore, to avoid overly complex diagrams, some diagrams only show a small number of stacked connectors 2, as previously stated.

[0032] As mentioned above, in this embodiment, please refer to... Figures 1 to 3 As shown, each of the stacked connectors 2 can be locked to the outer frame 1 from bottom to top by at least one screw 11, but this is not a limitation. In other embodiments of this application, the stacked connectors 2 can also be assembled to the outer frame 1 by interlocking, snap-fitting, slide rail guidance, or other methods. In addition, the specific shape of the outer frame 1 can be flexibly adjusted according to application requirements and is not limited to a circular configuration.

[0033] Please refer to the following: Figure 3 As shown, the stacked connector 2 includes an intermediate base 21, multiple wire harness terminal groups 23, and multiple carrier board terminal groups 25. The intermediate base 21 can be made of insulating material and has multiple mounting slots 210, each of which is spaced apart from each other and extends from a first side of the intermediate base 21 (i.e., Figure 4 The top side (as shown) extends through to its second side (i.e. Figure 4 (See the bottom side shown). Furthermore, the intermediate seat 21 is provided with at least one threaded hole 212, which allows the threaded member 11 to pass through, so that the intermediate seat 21 is fixed to the outer frame 1 (e.g., the bottom side shown). Figure 2 (As shown).

[0034] Additionally, please refer to Figure 3 As shown, the wire harness terminal group 23 is used to electrically connect to a transmission line L, and can be inserted from the first side of the intermediate base 21 into the corresponding mounting slot 210. It can also be disassembled or replaced relative to the intermediate base 21 without damaging the structure. Specifically, "without damaging the structure" means that during the aforementioned insertion or disassembly operations, no destructive processing (such as cutting, melting, or prying) is required on the wire harness terminal group 23, the intermediate base 21, or its mounting slot 210, nor is irreversible damage to the intermediate base 21 necessary. In other words, the wire harness terminal group 23 and the mounting slot 210 are assembled using a non-destructive method, such as insertion, removal, or snap-fit. This allows for maintenance, replacement, or reinstallation of the wire harness terminal group 23 while maintaining the overall structural integrity of the intermediate base 21. This improves the maintainability and assembly efficiency of the overall high-density connector module S and the stacked connector 2, reduces manufacturing and maintenance costs, and extends the service life of the stacked connector 2.

[0035] Please refer to the above. Figure 3 , Figure 5A and Figure 5B As shown, the wire harness terminal group 23 includes a first base 231 and multiple wire harness terminals 233. The first base 231 is made of insulating material and can be composed of a single component or a combination of multiple components. In this embodiment, the first base 231 can be fixedly covered onto each wire harness terminal 233 by injection molding. Simultaneously, the first base 231 can also be fixed to each transmission line L by injection molding, but this is not a limitation, as long as the first base 231 and each wire harness terminal 233 can be fixed to each other. Furthermore, in this embodiment, the first end of each wire harness terminal 233 (e.g., ...) Figure 5B The top ends shown are respectively positioned in the first base 231 and can be electrically connected to the corresponding transmission lines L. The second end of each of the wire harness terminals 233 (as shown) Figure 5B The bottom ends (shown) protrude from the bottom side of the first base 231 and are housed together in the same mounting groove 210. However, in other embodiments of this application, the first end of the harness terminal 233 may protrude from the top side of the first base 231 to enable electrical connection with the transmission line L. Furthermore, the terms "first end" and "second end" used in this specification may refer not only to the end position of the component but may also include an adjacent section extending inward from that end. This terminology may also be applied to other components mentioned later (e.g., carrier terminal 253, etc.) to facilitate the explanation of the structural or functional characteristics of the end sections of different components.

[0036] To effectively control the insertion position and stability of the wire harness terminal block 23, please refer to [link / reference needed]. Figures 3 to 6As shown, at least one first stop block 214 protrudes from the wall of the mounting groove 210. When the wire harness terminal group 23 is inserted from the first side of the mounting groove 210, its first base 231 can only move to a position against the first stop block 214, and is restricted by it from moving towards the second side of the mounting groove 210. In this way, the wire harness terminal group 23 is prevented from going too deep into the mounting groove 210, thereby ensuring that the wire harness terminal group 23 is stably positioned in the predetermined insertion position. In addition, in this embodiment, the mounting groove 210 is provided with a first mating part 216 (e.g., a protrusion), and the first base 231 is provided with a corresponding first engaging part 2311 (e.g., a groove). When the wire harness terminal group 23 is inserted into the mounting groove 210, the first mating part 216 and the first engaging part 2311 can match and engage with each other to enhance the engagement stability of the wire harness terminal group 23 and the intermediate seat 21. However, in other embodiments of this application, the specific structure of the first mating portion 216 and the first connecting portion 2311 is not limited to protrusions and grooves, but can also be other structural forms that can achieve the mating and positioning function. Furthermore, since the materials (e.g., plastic) used for the intermediate seat 21 and the first base 231 have a certain degree of elasticity, after the wire harness terminal group 23 is inserted into the corresponding mounting slot 210, the user only needs to apply appropriate force to cause the first mating portion 216 and the first connecting portion 2311 to elastically deform, thereby releasing their engagement state so that the wire harness terminal group 23 can be removed from the intermediate seat 21.

[0037] Furthermore, please refer to section 3. Figure 6 As shown, the carrier terminal assembly 25 can be inserted into the corresponding mounting slot 210 from the second side of the intermediate base 21, and can be disassembled or replaced relative to the intermediate base 21 without damaging the structure. The meaning of "without damaging the structure" mentioned above is the same as that described above for the wire harness terminal assembly 23, which also means that during the insertion and removal process, no destructive processing or irreversible damage to the individual components is required. Furthermore, the carrier terminal assembly 25 includes a second base 251 and multiple carrier terminals 253, wherein the second base 251 can be fixedly covered on each of the carrier terminals 253 by injection molding (but is not limited thereto). Furthermore, in this embodiment, the first end of each of the carrier terminals 253 (e.g., Figure 7B The top surfaces shown are respectively fixed to the corresponding second base 251, with only one contact surface exposed outside the second base 251, while the remaining surfaces are enclosed within the second base 251 (e.g., Figure 7A (as shown); the second end of each of the carrier plate terminals 253 (as shown) Figure 7B The bottom end (as shown) extends outward from the second side of the intermediary seat 21 and can directly press against the circuit board P without soldering (e.g., Figure 8(As shown). Furthermore, in other embodiments of this application, the first end of the carrier terminal 253 can also be fully exposed outside the intermediate seat 21, rather than being confined within the second substrate 251.

[0038] To effectively control the insertion position and stability of the carrier terminal block 25, please refer to [further details]. Figure 3 and Figure 6 As shown, at least one second stop block 215 protrudes from the wall of the mounting groove 210, and the second stop block 215 can be integrally formed with the first stop block 214 (but is not limited thereto). When the carrier terminal group 25 is inserted from the second side of the mounting groove 210, its second base 251 can move at most to the position abutting against the second stop block 215, and is restricted by it from moving towards the first side of the mounting groove 210, thereby ensuring that the wire harness terminal group 23 is stably positioned in the predetermined insertion position. In addition, in this embodiment, the mounting groove 210 is provided with a second mating part 217 (e.g., a protrusion), and the second base 251 is provided with a corresponding second engaging part 2511 (e.g., a groove). When the wire harness terminal group 23 is inserted into the mounting groove 210, the second mating part 217 and the second engaging part 2511 can match and engage with each other to enhance the engagement stability of the carrier terminal group 25 and the intermediate seat 21. However, in other embodiments of this application, the specific structure of the second mating portion 217 and the second connecting portion 2511 is not limited to protrusions and grooves, but can also be other structural forms that can achieve the mating and positioning function. Furthermore, since the material (e.g., plastic) used in the second substrate 251 has a certain degree of elasticity, the user only needs to apply appropriate force to disengage the second mating portion 217 and the second connecting portion 2511, so as to remove the carrier plate terminal group 25 from the intermediate seat 21.

[0039] Please refer to the following: Figures 3 to 8 As shown, when the wire harness terminal group 23 and the carrier board terminal group 25 are respectively inserted into the same mounting slot 210, the second end of the wire harness terminal 233 can contact the first end of the carrier board terminal 253, thereby enabling the transmission line L and the circuit board P to be connected to each other via the stacked connector 2 to transmit power or signals. In this embodiment, the second end of the carrier board terminal 253 is provided with at least one inclined section 2531. A portion of the inclined section 2531 is used to press against the circuit board P, and the aforementioned portion is not completely located within the vertical projection range R in the mounting slot 210 where the carrier board terminal 253 is located. Due to the structure of the inclined section 2531, the carrier board terminal 253 can have a deformation characteristic similar to a spring when in contact with the circuit board P. This not only provides stable contact pressure but also absorbs the slight displacement caused by the insertion action or high-speed transmission temperature rise, thereby improving the contact stability and vibration resistance between the carrier board terminal 253 and the circuit board P, and reducing the risk of signal instability, poor contact, or electrical interference.

[0040] Please refer to the above. Figures 3 to 8 As shown, in this embodiment, the second ends of the corresponding wire harness terminal 233 and carrier terminal 253 in the same mounting slot 210 are projected at different positions in the vertical direction. The second end of the wire harness terminal 233 refers to the part that contacts the first end of the carrier terminal 253, and the second end of the carrier terminal 253 refers to the part that presses against the conductive contacts on the circuit board P. By means of the staggered arrangement of the two parts, the arrangement of the conductive contacts on the circuit board P does not necessarily have to be the same as the high-density arrangement of the wire harness terminal 233, thereby improving the flexibility of the circuit layout of the circuit board P.

[0041] In conclusion, please refer to the following: Figures 1 to 8 As shown, for high-density applications requiring tens of thousands of contacts, the high-density connector module S of this application adopts a combined architecture of an outer frame 1 and multiple stacked connectors 2. This eliminates the need to manufacture a large, integrated body, allowing for the positioning and assembly of all terminal components, thus effectively reducing the size limitations and molding risks associated with manufacturing equipment. Furthermore, because the stacked connector 2 has a modular assembly structure, its wire harness terminal group 23 and carrier board terminal group 25 can be respectively inserted into the intermediate base 21, forming a conductive connection and electrically connecting to the circuit board P in a non-soldering manner. This avoids thermal stress problems caused by soldering operations and allows for direct replacement of the wire harness terminal group 23 or carrier board terminal group 25 when repair or replacement is needed, significantly improving overall maintenance efficiency and usage flexibility.

[0042] The above description is merely a preferred and feasible embodiment of this application and does not limit the scope of protection of the claims of this application. Therefore, any equivalent changes that can be conceived by those skilled in the art based on the technical content disclosed in this application without creative effort should be included within the scope of protection of the claims of this application.

Claims

1. A stackable connector with a solderless fixing mechanism, the stackable connector being connected to a circuit board in a solderless manner, characterized in that, The stacked connector includes: A mediator body is provided with multiple mounting slots, each of which passes through a first side and a second side of the mediator body. Multiple wire harness terminal groups are respectively inserted into each of the mounting slots from the first side of the intermediate base, and can be disassembled or replaced relative to the intermediate base without damaging the structure. Each wire harness terminal group includes: A first matrix; and Multiple wire harness terminals are respectively fixed to the first base, wherein the first end of each wire harness terminal is electrically connected to a transmission line; the second end of each wire harness terminal protrudes from the first base and is accommodated in the same mounting groove; and Multiple carrier plate terminal assemblies are respectively inserted into each of the mounting slots from the second side of the intermediate base, and can be disassembled or replaced relative to the intermediate base without damaging the structure. Each carrier plate terminal assembly includes: A second matrix; and Multiple carrier board terminals are fixed to the second base, wherein the first end of each carrier board terminal protrudes from the second base and directly contacts the second end of each corresponding wire harness terminal; the second end of each carrier board terminal extends out of the second side of the intermediate seat and is used to press against the circuit board without soldering.

2. The stacked connector according to claim 1, characterized in that, The second end of the carrier terminal is provided with at least one inclined section, and a portion of the inclined section is used to press against the circuit board, and the portion is not completely located within the vertical projection range of the mounting groove where the carrier terminal is located.

3. The stacked connector according to claim 1, characterized in that, The projection positions of the second ends of the corresponding wire harness terminals and the carrier plate terminals are different.

4. The stacked connector according to claim 1, characterized in that, The first end of the carrier plate terminal is fixed to the second substrate, and only one contact surface is exposed outside the second substrate to directly contact the second end of the wire harness terminal, while the other surfaces are enclosed in the second substrate.

5. The stacked connector according to claim 1, characterized in that, The mounting groove has at least one first stop block protruding from its groove wall. Each first stop block is used to prevent the wire harness terminal group from continuously moving toward the second side of the mounting groove.

6. The stacked connector according to claim 1, characterized in that, The mounting groove has at least one second stop block protruding from its groove wall. Each second stop block is used to prevent the carrier plate terminal from continuously moving toward the first side of the mounting groove.

7. The stacked connector according to claim 1, characterized in that, The first base has a first connecting part, and the mounting groove has a first mating part. When the wire harness terminal group is inserted into the corresponding mounting groove of the intermediate seat, the first connecting part and the first mating part match and engage with each other.

8. The stacked connector according to claim 1, characterized in that, The second base is provided with a second connecting part, and the mounting groove is provided with a second mating part. When the carrier plate terminal group is inserted into the corresponding mounting groove of the intermediate seat, the second connecting part and the second mating part match and engage with each other.

9. A high-density connector module with a solderless fixing mechanism, the high-density connector module being connected to a circuit board in a solderless manner, characterized in that, The high-density connector module includes: An outer frame with multiple through slots; and Multiple stacked connectors as described in any one of claims 1 to 8, each of the stacked connectors being respectively fixed to each of the through slots.

10. The high-density connector module according to claim 9, characterized in that, Each of the stacked connectors is secured to the outer frame with at least one screw.

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