Modular debug pod

Abstract

The utility model discloses a modular debugging base relates to electronic equipment debugging device technical field. Modular debugging base, including main unit, magnetic attraction interface and heat dissipation air duct, the magnetic attraction interface is located in the inside of main unit, the heat dissipation air duct is connected in the bottom of main unit, the magnetic attraction interface includes: the locating bin and the sliding slot, the locating bin is set up in the inside of main unit, the locating bin inside is connected with rubidium magnet, and the rubidium magnet provides adsorption force, ensures that module and base are closely attached, prevent accidental drop, the modular debugging base, the utility model provides adsorption force by setting magnetic attraction interface, utilizes rubidium magnet, ensures that module and base are closely attached, prevent accidental drop, guarantee the conductivity stability through the elastic pressure of spring needle simultaneously, has improved the stability of module connection and conductivity, the utility model discloses a heat dissipation air duct and heat dissipation fan are set up, and good heat dissipation system is formed.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment debugging devices, specifically a modular debugging base. Background Technology

[0002] In the research and development and production of electronic devices, debugging bases are commonly used tools.

[0003] Existing debugging bases are mostly monolithic structures with limited functionality, making it difficult to flexibly combine functional modules to meet different debugging needs. Existing debugging bases also perform poorly in terms of module connection stability and conductivity, easily leading to poor contact and thus affecting debugging efficiency. Furthermore, existing debugging bases have inadequate heat dissipation; during prolonged debugging, heat buildup can easily cause component performance degradation or even damage.

[0004] Existing debugging bases are inadequate in terms of module connection stability and conductivity, which can easily lead to poor contact and affect the efficiency of debugging work. Existing debugging bases also have poor heat dissipation, which can easily cause component performance to degrade or even damage the components due to heat accumulation. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a modular debugging base, which solves the problems of poor stability and conductivity of existing debugging bases in terms of module connection, which easily leads to poor contact and affects the efficiency of debugging work; and the poor heat dissipation of existing debugging bases, which easily leads to the degradation of component performance or even damage to components due to heat accumulation.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a modular debugging base, comprising: Main unit; A magnetic interface is located inside the main body unit. A heat dissipation assembly is connected to the bottom of the main unit; The magnetic interface includes: The positioning compartment is located inside the main unit. A neodymium magnet is snapped into the inside of the positioning compartment. The neodymium magnet provides an attractive force to ensure that the module fits tightly with the base and prevents accidental detachment. A chute is located outside the positioning chamber, and a spring pin is connected to the inside of the chute. When the module is adsorbed, the spring pin is compressed, and the spring pin is in close contact with the expansion module by pressure.

[0007] Preferably, the main body unit has a function key on its top, and a function board mounting compartment is provided inside the main body unit, with a function board located inside the function board mounting compartment.

[0008] Preferably, a fastener is connected to the side wall of the functional panel mounting compartment, and the fastener is used to fix the functional panel.

[0009] Preferably, a conductive welding plate is snapped into the inner side of the slide groove, the conductive welding plate is connected to the outer side of the spring pin, and a contact is connected to the outer side of the conductive welding plate.

[0010] Preferably, the heat dissipation component includes: The first heat dissipation duct is located below the functional board mounting compartment and is connected to the first air inlet. The second heat dissipation duct is located below the first heat dissipation duct and is connected to a second air inlet.

[0011] Preferably, the heat dissipation component has a connecting hole on its inner side, and a cooling fan is provided inside the connecting hole.

[0012] Preferably, four sets of connecting holes are provided, two of which correspond to the first air inlet, and the cooling fans provided in the two sets of connecting holes are used to blow air into the inside of the first cooling duct.

[0013] Preferably, four sets of connecting holes are provided, with the other two sets corresponding to the second air inlet. The cooling fans provided in the other two sets of connecting holes are used to blow air into the inside of the second cooling duct.

[0014] Preferably, a support strip is provided on the inner side of the heat dissipation duct, and the support strip is evenly and linearly distributed on the inner side of the first heat dissipation duct and the second heat dissipation duct.

[0015] This utility model discloses a modular debugging base, which has the following beneficial effects: By setting up a magnetic interface and using neodymium magnets to provide adsorption force, the module is ensured to fit tightly with the base, preventing accidental detachment. At the same time, the elastic pressure of the spring pins ensures conductivity stability, improving the stability and conductivity of the module connection. By incorporating heat dissipation components and cooling fans, a robust heat dissipation system is formed, effectively dissipating heat and improving the heat dissipation performance of the test base, thus ensuring the performance and lifespan of the components. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the left side structure of this utility model; Figure 3 This is a cross-sectional view of the side of the present invention. Figure 4 This is a cross-sectional view of the front of the present invention. Figure 5 This is a schematic diagram of the heat dissipation component of this utility model.

[0018] In the diagram: 1. Main unit; 11. Function key; 12. Function board mounting compartment; 13. Function board; 14. Fastener; 2. Magnetic interface; 21. Positioning compartment; 211. Neodymium magnet; 22. Slide groove; 221. Spring pin; 222. Conductive welding plate; 223. Contact point; 3. Heat dissipation assembly; 31. First heat dissipation duct; 311. First air inlet; 32. Second heat dissipation duct; 321. Second air inlet; 33. Connecting hole; 331. Cooling fan; 314. Support bar. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] This application provides a modular debugging base that solves the problems of poor stability and conductivity of existing debugging bases in terms of module connection, which easily leads to poor contact and affects the efficiency of debugging work; and the problem that the heat dissipation effect of existing debugging bases is not ideal, which easily leads to the degradation of component performance or even damage to components due to heat accumulation. This application avoids poor contact and improves heat dissipation performance.

[0021] This utility model discloses a modular debugging base.

[0022] Example 1: According to the appendix Figure 1-5As shown, the device includes a main unit 1, a magnetic interface 2, and a heat dissipation component 3. The magnetic interface 2 is located inside the main unit 1, and the heat dissipation component 3 is connected to the bottom of the main unit 1. The magnetic interface 2 includes a positioning chamber 21 and a sliding groove 22. The positioning chamber 21 is located inside the main unit 1, and a neodymium magnet 211 is snapped into the inside of the positioning chamber 21. The neodymium magnet 211 provides an adsorption force to ensure that the module is tightly attached to the base and prevents accidental detachment. The sliding groove 22 is located outside the positioning chamber 21, and a spring pin 221 is connected to the inside of the sliding groove 22. When the module is adsorbed, the spring pin 221 is compressed, and the elastic pressure ensures the conductivity stability.

[0023] By setting up a magnetic interface 2, the neodymium magnet 211 provides an attractive force to ensure that the module and the base fit tightly and prevent accidental detachment. At the same time, the elastic pressure of the spring pin 221 ensures the conductivity stability, which improves the stability and conductivity of the module connection. By setting up a heat dissipation component 3 and a heat dissipation fan 331, a good heat dissipation system is formed, which can effectively dissipate heat, improve the heat dissipation effect of the debugging base, and ensure the performance and life of the components.

[0024] Furthermore, a function key 11 is provided on the top of the main unit 1, and a function board mounting compartment 12 is provided on the inner side of the main unit 1, with a function board 13 provided on the inner side of the function board mounting compartment 12.

[0025] Furthermore, fasteners 14 are connected to the side wall of the function panel mounting compartment 12, which are used to fix the function panel 13.

[0026] Furthermore, a conductive welding plate 222 is snapped into the inner side of the slide 22, the conductive welding plate 222 is connected to the outer side of the spring pin 221, and a contact 223 is connected to the outer side of the conductive welding plate 222.

[0027] Specifically disclosed, the heat dissipation component 3 includes: a first heat dissipation duct 31 and a second heat dissipation duct 32. The first heat dissipation duct 31 is located below the functional board mounting compartment 12 and is connected to a first air inlet 311. The second heat dissipation duct 32 is located below the first heat dissipation duct 31 and is connected to a second air inlet 321.

[0028] Specifically disclosed, a connecting hole 33 is provided on the inner side of the heat dissipation component 3, and a cooling fan 331 is provided on the inner side of the connecting hole 33.

[0029] Specifically disclosed, the connecting holes 33 are provided in four sets, two of which correspond to the first air inlet 311. The cooling fans 331 provided in the two sets of connecting holes 33 are used to blow air into the inside of the first cooling air duct 31.

[0030] It should be emphasized that there are four sets of connecting holes 33, and the other two sets correspond to the second air inlet 321. The cooling fans 331 installed in the other two sets of connecting holes 33 are used to blow air into the inside of the second cooling air duct 32.

[0031] Example 2: According to the appendix Figure 1-5 As shown, the device includes a main unit 1, a magnetic interface 2, and a heat dissipation component 3. The magnetic interface 2 is located inside the main unit 1, and the heat dissipation component 3 is connected to the bottom of the main unit 1. The magnetic interface 2 includes a positioning chamber 21 and a sliding groove 22. The positioning chamber 21 is located inside the main unit 1, and a neodymium magnet 211 is snapped into the inside of the positioning chamber 21. The neodymium magnet 211 provides an adsorption force to ensure that the module is tightly attached to the base and prevents accidental detachment. The sliding groove 22 is located outside the positioning chamber 21, and a spring pin 221 is connected to the inside of the sliding groove 22. When the module is adsorbed, the spring pin 221 is compressed, and the elastic pressure ensures the conductivity stability.

[0032] It should be emphasized that a support strip 314 is provided on the inner side of the heat dissipation component 3. The support strip 314 is evenly and linearly distributed on the inner side of the first heat dissipation air duct 31 and the second heat dissipation air duct 32.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A modular debug pod, comprising: include: Main unit (1); Magnetic interface (2), the magnetic interface (2) is located inside the main body unit (1); Heat dissipation component (3), which is connected to the bottom of the main body unit (1); The magnetic interface (2) includes: Positioning compartment (21), the positioning compartment (21) is opened inside the main body unit (1), and a neodymium magnet (211) is snapped into the inside of the positioning compartment (21). The neodymium magnet (211) provides an adsorption force so that the module fits tightly with the base; The slide (22) is located outside the positioning chamber (21). A spring pin (221) is connected to the inside of the slide (22). When the module is adsorbed, the spring pin (221) is compressed. The spring pin (221) is in close contact with the expansion module by pressure.

2. The modular debugging base station of claim 1, wherein, The main unit (1) is provided with a function key (11) on the top, and a function board installation compartment (12) is provided on the inner side of the main unit (1), and a function board (13) is provided on the inner side of the function board installation compartment (12).

3. The modular debugging base station of claim 2, wherein, The side wall of the functional panel mounting compartment (12) is connected to a fastener (14), which is used to fix the functional panel (13).

4. The modular debugging base station of claim 1, wherein, A conductive welding plate (222) is snapped into the inner side of the slide (22), the conductive welding plate (222) is connected to the outer side of the spring pin (221), and a contact (223) is connected to the outer side of the conductive welding plate (222).

5. The modular debugging base station of claim 1, wherein, The heat dissipation component (3) includes: The first heat dissipation duct (31) is located below the functional board mounting compartment (12) and is connected to the first air inlet (311). The second heat dissipation duct (32) is located below the first heat dissipation duct (31) and is connected to the second air inlet (321).

6. A modular debugging base according to claim 5, characterized in that, The heat dissipation component (3) has a connecting hole (33) on its inner side, and a cooling fan (331) is provided inside the connecting hole (33).

7. A modular debugging base according to claim 6, characterized in that, The connecting hole (33) is provided in four groups, two of which correspond to the first air inlet (311). The cooling fan (331) provided in the two groups of the connecting hole (33) is used to blow air into the inside of the first cooling duct (31).

8. A modular debugging base according to claim 7, characterized in that, The connecting holes (33) are provided in four groups, and the other two groups correspond to the second air inlet (321). The cooling fans (331) provided in the other two groups of the connecting holes (33) are used to blow air into the inside of the second cooling duct (32).

9. A modular debugging base according to claim 5, characterized in that, The heat dissipation component (3) is provided with a support strip (314) on its inner side. The support strip (314) is evenly and linearly distributed on the inner side of the first heat dissipation duct (31) and the second heat dissipation duct (32).

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