A power bank circuit structure with temperature protection and illumination

Abstract

The utility model discloses a kind of power bank circuit structure with temperature protection and lighting, including main control module, battery charging module, discharging module and protection module, battery charging module is connected with main control module, discharging module and protection module respectively for power supply, the main control module includes MCU chip U1, MOS tube, LED lamp D5 and pilot lamp, MOS tube, LED lamp D5 and pilot lamp are connected with MCU chip U1 respectively, and MCU chip U1 is connected with button K1 by capacitor C1.The utility model has illumination function and overvoltage protection function, improves product quality, has charge-discharge pilot lamp, and it is convenient to check.

Description

Technical Field

[0001] This utility model relates to power banks, specifically a power bank circuit structure with temperature protection and lighting. Background Technology

[0002] Power banks, as portable power sources, can charge mobile electronic devices such as smartphones. With the increasing functionality of smartphones, people often need to use power banks as temporary power sources when outdoors. Current power banks typically only require charging functionality. Furthermore, existing power banks suffer from poor circuitry coordination and limited visibility during charging and discharging. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a power bank circuit structure with temperature protection and illumination.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A power bank circuit structure with temperature protection and illumination includes a main control module, a battery charging module, a discharging module, and a protection module. The battery charging module is connected to the main control module, the discharging module, and the protection module for power supply. The main control module includes an MCU chip U1, a MOSFET, an LED D5, and an indicator light. The MOSFET, LED D5, and indicator light are connected to the MCU chip U1. The MCU chip U1 is connected to a button K1 via a capacitor C1. The MCU chip U1 is connected to an external charging detection unit, a battery charging detection unit, a voltage detection unit, and a temperature detection unit. The voltage detection unit includes resistors R16, R18, and R19, which are connected in series. One end of resistor R16 is connected to the MCU chip U1, and the other end is connected to resistors R18 and R19. Resistor R18 is grounded. The MCU chip U1 is connected to the protection module in sequence via an EMI bead L8, a capacitor C9, and a diode D6.

[0006] As a further improvement, the external charging detection unit includes a transistor Q4 and a resistor R7. The collector of transistor Q4 is connected to the MCU chip U1, the emitter of transistor Q4 is grounded, and the resistor R7 is connected to the base of transistor Q4. The resistor R7 receives the signal from the discharge module.

[0007] As a further improvement, the battery charging detection unit includes a capacitor C13, a resistor R3 and a resistor R12. The capacitor C13 and the resistor R13 are connected in parallel and then connected to the resistor R12 and connected to the MCU chip U1. The resistor R12 receives the signal from the battery charging module, and the resistor R3 and the capacitor C13 are grounded.

[0008] As a further improvement, the MOSFETs include MOSFETs Q1, Q2, Q3, and Q4. The drain terminals of MOSFETs Q1, Q2, Q3, and Q4 are connected in parallel and then connected to LED D5. The gate terminals of MOSFETs Q1, Q2, Q3, and Q4 are connected in parallel and then connected to resistors R1 and R2. Resistors R1 and R2 are connected in parallel and R2 is grounded. The sources of MOSFETs Q1, Q2, Q3, and Q4 are grounded. Resistor R1 is connected to MCU chip U1. Indicator D5 is connected to capacitor C2 and diode D6.

[0009] As a further improvement, the indicator light includes LEDs D1, D2, D3, and D4 connected in parallel. LED D1 is connected to resistor R4, LED D2 is connected to resistor R5, LED D3 is connected to resistor R13, and LED D4 is connected to resistor R14. Resistors R3, R4, R13, and R14 are connected in parallel and then connected to EMI ferrite bead L8.

[0010] As a further improvement, the temperature detection unit includes a resistor R6 and a capacitor C10. The capacitor C10 is connected to the resistor R6, the resistor R6 is connected to the MCU chip U1, the resistor R6 is connected to the protection module, and the capacitor C10 is grounded.

[0011] As a further improvement, the battery charging module includes a battery BAT1, a connection terminal USB1, and a battery management chip U3. The connection terminal USB1 is connected to resistors R15 and R20 in parallel. Resistors R15 and R20 are connected to an EMI bead L9. The EMI bead L9 is connected to the battery management chip U3 through capacitors C8 and C19 in parallel. The connection terminal USB1 is connected to the battery management chip U3 and resistor R12 in the battery charging detection unit through the EMI bead L1. The battery management chip U3 is connected to an inductor L3, which is connected to resistor R11. Capacitor C18 is connected to both ends of the battery BAT1. The battery BAT1 is connected to the battery management chip U3. The battery management chip U3 is also connected to resistor R8. Resistor R8, capacitor C18, and battery BAT1 are connected to ground. The battery management chip is connected to the MCU chip U1 through resistor R22.

[0012] As a further improvement, the external discharge module includes an IC chip U6, a voltage detection chip U7, a MOSFET Q6, and a connection terminal USB2. The IC chip U6 is connected to the drain of the MOSFET Q6 through an EMI bead L2. The source of the MOSFET Q6 is connected to a resistor R10, which is connected to a resistor R9. The resistor R9 is connected to a capacitor C1, which is grounded. The source of the MOSFET Q6 is connected to the battery BAT1. The IC chip U6 is connected to an EMI bead L2 and a capacitor C2 through an EMI bead L5, which is grounded. The IC chip U6 is connected to the voltage detection chip U7, which is connected to a resistor R7 in the external charging detection unit. USB2 is connected to the IC chip U6 and the voltage detection chip U7 through a diode D7 and an EMI bead L4. An EMI bead L12 is connected in parallel across the two ends of the EMI bead L4. The EMI bead L4 is also connected in parallel to capacitors C4, C6, and C7.

[0013] As a further improvement, the protection module includes a processing chip U2, a MOSFET chip U4, a MOSFET chip U5, and an NTC. One end of the NTC is grounded, and the other end is connected to the MCU chip U3 and the resistor R6 in the temperature detection unit. The MOSFET chip U5 is connected to the battery BAT1 through the resistor R20 and grounded. The MOSFET chip U5 is connected to the MOSFET chip U4, and the processing chip U2 is connected to both the MOSFET chip U4 and the MOSFET chip U5.

[0014] This utility model has the following beneficial technical effects:

[0015] By setting up LED lights, it can serve as illumination. During charging and discharging, a protection module ensures that the power is automatically cut off when the temperature is too high, thus improving safety. Attached Figure Description

[0016] Figure 1 This is a circuit diagram of the main control module of this utility model;

[0017] Figure 2 This is a circuit diagram of the protection module of this utility model;

[0018] Figure 3 This is a circuit diagram of the battery charging module of this utility model;

[0019] Figure 4 This is a circuit diagram of the discharge module of this utility model. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, it should be understood that if terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0023] like Figure 1-4As shown, a power bank circuit structure with temperature protection and illumination includes a main control module, a battery charging module, a discharging module, and a protection module. The battery charging module is connected to the main control module, the discharging module, and the protection module for power supply. The main control module includes an MCU chip U1, a MOSFET, an LED D5, and an indicator light. The MOSFET, LED D5, and indicator light are connected to the MCU chip U1. The MCU chip U1 is connected to a button K1 through a capacitor C1. The MCU chip U1 is connected to an external charging detection unit, a battery charging detection unit, a voltage detection unit, and a temperature detection unit. The voltage detection unit includes resistors R16, R18, and R19, which are connected in series. One end of resistor R16 is connected to the MCU chip U1, and the other end is connected to resistors R18 and R19. Resistor R18 is grounded. The MCU chip U1 is connected to the protection module in sequence via an EMI bead L8, a capacitor C9, and a diode D6.

[0024] Diode D6 conducts through the forward power supply, and the energy stored in capacitor C9 supplies power to MCU chip U1 through EMI ferrite bead L8.

[0025] The battery charging detection unit detects whether the power bank's battery is being charged; the external charging detection unit can detect whether mobile phones or other electronic devices are being charged. The temperature detection unit detects whether the temperature is too high during charging and discharging; if it is, it can disconnect the circuit to ensure safety.

[0026] The MOSFETs include MOSFETs Q1, Q2, Q3, and Q4. The drain terminals of MOSFETs Q1, Q2, Q3, and Q4 are connected in parallel and then connected to LED D5. The gate terminals of MOSFETs Q1, Q2, Q3, and Q4 are connected in parallel and then connected to resistors R1 and R2. Resistors R1 and R2 are connected in parallel and R2 is grounded. The sources of MOSFETs Q1, Q2, Q3, and Q4 are grounded. Resistor R1 is connected to MCU chip U1. Indicator D5 is connected to capacitor C2 and diode D6.

[0027] The indicator light includes LEDs D1, D2, D3, and D4 connected in parallel. LED D1 is connected to resistor R4, LED D2 is connected to resistor R5, LED D3 is connected to resistor R13, and LED D4 is connected to resistor R14. Resistors R3, R4, R13, and R14 are connected in parallel and then connected to EMI ferrite bead L8.

[0028] When button K1 is pressed, the MCU chip processes the signal through pin 15 and outputs different PWM signals through pin 9. These signals are then used to drive MOSFETs Q1, Q2, Q3, and Q4 via resistors R1 and R2 for current limiting and voltage division, thereby controlling the brightness and function of LED D5.

[0029] The external charging detection unit includes a transistor Q4 and a resistor R7. The collector of transistor Q4 is connected to the MCU chip U1, and the emitter of transistor Q4 is grounded. Resistor R7 is connected to the base of transistor Q4 and receives signals from the discharge module. Resistor R7 and transistor Q4 detect whether an external electronic device is being charged. The signal is detected by pin 3 of the MCU chip U1, and the battery voltage is sampled and detected through resistors R19, R18, and R16. The MCU chip U1 then calculates the battery level (BAT1) and displays it via LEDs D1, D2, D3, and D4.

[0030] The battery charging detection unit includes capacitor C13, resistor R3, and resistor R12. Capacitor C13 and resistor R13 are connected in parallel and then connected to resistor R12, which in turn is connected to the MCU chip U1. Resistor R12 receives signals from the battery charging module, while resistor R3 and capacitor C13 are grounded. When an external power source charges the power bank, resistor R12 has a VIN interface. After VIN detection, the voltage is divided by resistors R12, R3, and C13 and sent to pin 13 of the MCU chip. The battery voltage is then sampled and detected by resistors R19, R18, and R16. Through the calculation of the MCU chip U1, the battery power of BAT1 is displayed through LEDs D1, D2, D3, and D4.

[0031] The temperature detection unit includes a resistor R6 and a capacitor C10. Capacitor C10 is connected to resistor R6, which is connected to the MCU chip U1 and the protection module. Capacitor C10 is grounded. The MCU chip U1 detects the temperature at pin 10. When the temperature reaches the set limit, the charging / discharging function of the power bank and the LED D3 function are shut down via pins 2, 7, and 9 of the MCU chip U1, respectively.

[0032] The battery charging module includes a battery BAT1, a connector USB1, and a battery management chip U3. The connector USB1 is connected to resistors R15 and R20 in parallel. Resistors R15 and R20 are connected to an EMI bead L9. The EMI bead L9 is connected to the battery management chip U3 through capacitors C8 and C19 in parallel. The connector USB1 is connected to the battery management chip U3 and resistor R12 in the battery charging detection unit through the EMI bead L1. The battery management chip U3 is connected to an inductor L3, which is connected to resistor R11. A capacitor C18 is connected to both ends of the battery BAT1. The battery BAT1 is connected to the battery management chip U3. The battery management chip U3 is also connected to a resistor R8. The resistor R8, capacitor C18, and battery BAT1 are connected to ground. The battery management chip is connected to pin 6 of the MCU chip U1 through resistor R22.

[0033] An external power supply is connected to USB1. Battery BAT1 is a rechargeable battery powered by battery management chip U3. Resistors R15 and R20 simulate the charging output of the charger. Inductor L3, along with pins 3 and 4 of battery management chip U3, generates an oscillation frequency, which, together with resistor R11, creates a constant current charging circuit. MCU chip U1 controls the on / off state of battery management chip U3 via resistor R22.

[0034] The external discharge module includes an IC chip U6, a voltage detection chip U7, a MOSFET Q6, and a connection terminal USB2. The IC chip U6 is connected to the drain of the MOSFET Q6 through an EMI bead L2. The source of the MOSFET Q6 is connected to a resistor R10, which is connected to a resistor R9. The resistor R9 is connected to a capacitor C1, which is grounded. The source of the MOSFET Q6 is connected to the battery BAT1. The IC chip U6 is connected to an EMI bead L2 and a capacitor C2 through an EMI bead L5, which is grounded. The IC chip U6 is connected to the voltage detection chip U7, which is connected to a resistor R7 in the external charging detection unit. USB2 is connected to the IC chip U6 and the voltage detection chip U7 through a diode D7 and an EMI bead L4. An EMI bead L12 is connected in parallel across the two ends of the EMI bead L4. The EMI bead L4 is also connected in parallel to capacitors C4, C6, and C7.

[0035] The EMI bead L2 generates a 5V voltage through pins 6, 7, and 8 of the IC chip U6. Capacitors C4, C, and C7 are filter capacitors. Diode D7 prevents reverse polarity connection and avoids damaging the IC chip U6. The voltage detection chip U7 detects whether a mobile phone is charging and transmits the information to the MCU chip U1 for processing.

[0036] The protection module includes a processing chip U2, a MOSFET chip U4, a MOSFET chip U5, and an NTC thermistor. One end of the NTC is grounded, and the other end is connected to the MCU chip U3 and resistor R6 in the temperature detection unit. MOSFET chip U5 is connected to battery BAT1 and grounded through resistor R20. MOSFET chip U5 is connected to MOSFET chip U4, and processing chip U2 is connected to both MOSFET chip U4 and MOSFET chip U5. Temperature is detected using the NTC thermistor. When the temperature is too high, the MCU chip U1 shuts down the circuit to prevent it from burning out.

[0037] It should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A power bank circuit structure with temperature protection and illumination, characterized in that, The system includes a main control module, a battery charging module, a discharging module, and a protection module. The battery charging module is connected to the main control module, the discharging module, and the protection module for power supply. The main control module includes an MCU chip U1, a MOSFET, an LED D5, and an indicator light. The MOSFET, LED D5, and indicator light are connected to the MCU chip U1. The MCU chip U1 is connected to a button K1 via a capacitor C1. The MCU chip U1 is connected to an external charging detection unit, a battery charging detection unit, a voltage detection unit, and a temperature detection unit. The voltage detection unit includes resistors R16, R18, and R19, which are connected in series. One end of resistor R16 is connected to the MCU chip U1, and the other end is connected to resistors R18 and R19. Resistor R18 is grounded. The MCU chip U1 is connected to the protection module in sequence via an EMI bead L8, a capacitor C9, and a diode D6.

2. The power bank circuit structure with temperature protection and illumination according to claim 1, characterized in that, The external charging detection unit includes a transistor Q4 and a resistor R7. The collector of transistor Q4 is connected to the MCU chip U1, the emitter of transistor Q4 is grounded, and the resistor R7 is connected to the base of transistor Q4. The resistor R7 receives the signal from the discharge module.

3. The power bank circuit structure with temperature protection and illumination according to claim 2, characterized in that, The battery charging detection unit includes a capacitor C13, a resistor R3, and a resistor R12. The capacitor C13 and the resistor R13 are connected in parallel and then connected to the resistor R12 and the MCU chip U1. The resistor R12 receives the signal from the battery charging module, and the resistor R3 and the capacitor C13 are grounded.

4. The power bank circuit structure with temperature protection and illumination according to claim 3, characterized in that, The MOSFETs include MOSFETs Q1, Q2, Q3, and Q4. The drain terminals of MOSFETs Q1, Q2, Q3, and Q4 are connected in parallel and then connected to LED D5. The gate terminals of MOSFETs Q1, Q2, Q3, and Q4 are connected in parallel and then connected to resistors R1 and R2. Resistors R1 and R2 are connected in parallel and R2 is grounded. The sources of MOSFETs Q1, Q2, Q3, and Q4 are grounded. Resistor R1 is connected to MCU chip U1. Indicator D5 is connected to capacitor C2 and diode D6.

5. The power bank circuit structure with temperature protection and illumination according to claim 4, characterized in that, The indicator light includes LEDs D1, D2, D3, and D4 connected in parallel. LED D1 is connected to resistor R4, LED D2 is connected to resistor R5, LED D3 is connected to resistor R13, and LED D4 is connected to resistor R14. Resistors R3, R4, R13, and R14 are connected in parallel and then connected to EMI ferrite bead L8.

6. The power bank circuit structure with temperature protection and illumination according to claim 5, characterized in that, The temperature detection unit includes a resistor R6 and a capacitor C10. The capacitor C10 is connected to the resistor R6, the resistor R6 is connected to the MCU chip U1, the resistor R6 is connected to the protection module, and the capacitor C10 is grounded.

7. The power bank circuit structure with temperature protection and illumination according to claim 6, characterized in that, The battery charging module includes a battery BAT1, a connection terminal USB1, and a battery management chip U3. The connection terminal USB1 is connected to resistors R15 and R20 in parallel. Resistors R15 and R20 are connected to an EMI bead L9. The EMI bead L9 is connected to the battery management chip U3 through capacitors C8 and C19 in parallel. The connection terminal USB1 is connected to the battery management chip U3 and resistor R12 in the battery charging detection unit through the EMI bead L1. The battery management chip U3 is connected to an inductor L3, which is connected to resistor R11. A capacitor C18 is connected to both ends of the battery BAT1. The battery BAT1 is connected to the battery management chip U3. The battery management chip U3 is also connected to a resistor R8. The resistor R8, capacitor C18, and battery BAT1 are connected to ground. The battery management chip is connected to the MCU chip U1 through resistor R22.

8. The power bank circuit structure with temperature protection and illumination according to claim 7, characterized in that, The external discharge module includes an IC chip U6, a voltage detection chip U7, a MOSFET Q6, and a connection terminal USB2. The IC chip U6 is connected to the drain of the MOSFET Q6 through an EMI bead L2. The source of the MOSFET Q6 is connected to a resistor R10, which is connected to a resistor R9. The resistor R9 is connected to a capacitor C1, which is grounded. The source of the MOSFET Q6 is connected to the battery BAT1. The IC chip U6 is connected to an EMI bead L2 and a capacitor C2 through an EMI bead L5, which is grounded. The IC chip U6 is connected to the voltage detection chip U7, which is connected to a resistor R7 in the external charging detection unit. USB2 is connected to the IC chip U6 and the voltage detection chip U7 through a diode D7 and an EMI bead L4. An EMI bead L12 is connected in parallel across the two ends of the EMI bead L4. The EMI bead L4 is also connected in parallel to capacitors C4, C6, and C7.

9. The power bank circuit structure with temperature protection and illumination according to claim 8, characterized in that, The protection module includes a processing chip U2, a MOSFET chip U4, a MOSFET chip U5, and an NTC. One end of the NTC is grounded, and the other end is connected to the MCU chip U3 and the resistor R6 in the temperature detection unit. The MOSFET chip U5 is connected to the battery BAT1 through the resistor R20 and grounded. The MOSFET chip U5 is connected to the MOSFET chip U4. The processing chip U2 is connected to both the MOSFET chip U4 and the MOSFET chip U5.

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