Power supply device

Abstract

The present application relates to a power supply device, a main circuit board includes a first side, a second side, a third side and a fourth side, the first side and the second side are arranged opposite and extend along a first direction, the third side and the fourth side are arranged opposite and extend along a second direction, an input / output module is arranged on the main circuit board and adjacent to the fourth side, an EMI module is arranged on the main circuit board and adjacent to the third side, a power conversion module is arranged on the main circuit board and between the input / output module and the EMI module and adjacent to the input / output module, a capacitor module is arranged on the main circuit board and adjacent to the first side, the EMI module and the power conversion module, a PFC inductor module and a power semiconductor module are arranged on the main circuit board and between the EMI module and the power conversion module and between the capacitor module and the second side.

Description

Technical Field

[0001] This case relates to the field of power electronics technology, and in particular to a power supply device. Background Technology

[0002] Due to the rapid growth in power demand within data center infrastructure, miniaturization and high power density are becoming the development trends for power supply devices. However, the current arrangement of various modules in power supply devices is not entirely rational, posing challenges to their continued development. First, an unreasonable module layout leads to low internal space utilization, limiting further increases in power density. Furthermore, an inappropriate space configuration can cause localized heat accumulation, affecting heat dissipation and consequently reducing the stability and reliability of the power system. Additionally, power devices (such as power switches) and magnetic components (such as inductors and transformers) within the power supply device generate electromagnetic interference during operation, which can easily couple to other modules within the power supply, affecting the overall performance of the power supply.

[0003] Therefore, developing a power supply device that overcomes the above-mentioned deficiencies is an urgent need at present. Utility Model Content

[0004] The purpose of this invention is to provide a power supply device in which a capacitor module is adjacent to an EMI module and a power conversion module, and a PFC inductor module and a power semiconductor module are located between the EMI module and the power conversion module, and between the capacitor module and a second side of the main circuit board. Therefore, the power supply device of this invention can reduce the interference of the power semiconductor module and the PFC inductor module on the input / output modules within a fixed space, thereby optimizing the electromagnetic compatibility characteristics of the power supply device. Furthermore, since the transmission paths of the input / output modules of the power supply device of this invention are adjacent to the first side, the space utilization of the power supply device can be improved within a limited space, even with a relatively large capacitor module, while also improving the transmission path and blocking electromagnetic interference.

[0005] To achieve the above objectives, this application provides a power supply device comprising a main circuit board, an input / output module, an EMI module, a power conversion module, a capacitor module, a PFC inductor module, and a power semiconductor module. The main circuit board includes a first side, a second side, a third side, and a fourth side. The first and second sides are disposed opposite each other and extend along a first direction, while the third and fourth sides are disposed opposite each other and extend along a second direction. The input / output module is disposed on the main circuit board and adjacent to the fourth side. The EMI module is disposed on the main circuit board and adjacent to the third side. The power conversion module is disposed on the main circuit board, located between the input / output module and the EMI module, and adjacent to the input / output module. The capacitor module is disposed on the main circuit board and adjacent to the first side, the EMI module, and the power conversion module. The PFC inductor module and the power semiconductor module are disposed on the main circuit board, located between the EMI module and the power conversion module, and between the capacitor module and the second side.

[0006] In some embodiments, the input / output module provides an input signal, the transmission path of which is adjacent to the first side.

[0007] In some embodiments, the input signal is transmitted to the EMI module along the internal circuitry of the main circuit board.

[0008] In some embodiments, the power supply device further includes an input connection board disposed on the main circuit board and adjacent to the first side, wherein the input signal is transmitted to the EMI module via the internal circuitry of the input connection board.

[0009] In some embodiments, the power supply device further includes a flying wire adjacent to the first side, wherein the input signal is transmitted to the EMI module via the flying wire.

[0010] In some embodiments, the EMI module is adjacent to the first side and the second side, and the capacitor module is located between the EMI module and the power conversion module.

[0011] In some embodiments, the EMI module is located between the capacitor module and the second side, and the capacitor module is located between the third side and the power conversion module.

[0012] In some embodiments, the EMI module is adjacent to the first side and the second side, and the capacitor module is located between the EMI module and the input / output module, and the power conversion module is located between the capacitor module and the second side.

[0013] In some embodiments, the EMI module is located between the capacitor module and the second side, and the capacitor module is located between the third side and the input / output module, with the power conversion module located between the capacitor module and the second side.

[0014] In some embodiments, the capacitor module is located between the first side and the power semiconductor module, and the power semiconductor module is located between the capacitor module and the PFC inductor module.

[0015] In some embodiments, a first airflow channel is provided between the capacitor module and the power semiconductor module, and a second airflow channel is provided between the power semiconductor module and the PFC inductor module.

[0016] In some embodiments, the capacitor module is located between the first side and the PFC inductor module, and the PFC inductor module is located between the capacitor module and the power semiconductor module.

[0017] In some embodiments, a first airflow channel is provided between the capacitor module and the PFC inductor module, and a second airflow channel is provided between the PFC inductor module and the power semiconductor module.

[0018] In some embodiments, the power supply device further includes an auxiliary power module disposed on the main circuit board, adjacent to the second side, and located between the power semiconductor module and the power conversion module.

[0019] In some embodiments, the power supply device further includes an auxiliary power module disposed on the main circuit board, adjacent to the second side, and located between the PFC inductor module and the power conversion module.

[0020] In some embodiments, the power conversion module includes at least one transformer arranged sequentially on the main circuit board from a first side toward a second side.

[0021] In some embodiments, the power conversion module further includes a plurality of first filter capacitors disposed on the main circuit board and located between at least one transformer and the output / input module.

[0022] In some embodiments, the power conversion module further includes a resonant module, which includes a resonant capacitor plate and a resonant inductor module. The resonant capacitor plate includes a plurality of resonant capacitors and is disposed on the main circuit board and adjacent to at least one transformer and capacitor module.

[0023] In some embodiments, the resonant inductor module is disposed on the main circuit board and adjacent to the resonant capacitor board.

[0024] In some embodiments, the resonant inductor module includes at least one resonant inductor, and each resonant inductor is integrated with a corresponding transformer.

[0025] In some embodiments, the power conversion module further includes a plurality of rectifier switches and a plurality of second filter capacitors, wherein the plurality of second filter capacitors and the plurality of rectifier switches are respectively disposed on the projection surface of the corresponding transformer on the main circuit board.

[0026] In some embodiments, the power conversion module further includes multiple rectifier boards, each rectifier board including multiple rectifier switches and multiple second filter capacitors, each rectifier board being inserted on the main circuit board and adjacent to the corresponding transformer.

[0027] In some embodiments, the input / output module includes an input terminal and an output terminal, wherein the input terminal is connected to an EMI module and the output terminal is connected to a power conversion module. Attached Figure Description

[0028] Figure 1 This is a schematic block diagram of the layout of the power supply device in the first embodiment of this case;

[0029] Figure 2 for Figure 1 A schematic diagram of the topology of one type of three-phase circuit of the power supply device shown;

[0030] Figure 3 This is a schematic block diagram of the layout of the power supply device in the second embodiment of this case;

[0031] Figure 4A This is a schematic diagram of the input signal transmission in the power supply device of this case;

[0032] Figure 4B This is a schematic block diagram of the layout of the power supply device in the third embodiment of this case;

[0033] Figure 4C This is a schematic block diagram of the layout of the power supply device in the fourth embodiment of this case;

[0034] Figure 4D This is a schematic block diagram of the layout of the power supply device according to the fifth embodiment of this case;

[0035] Figure 5 This is a schematic block diagram of the layout of the power supply device in the sixth embodiment of this case;

[0036] Figure 6 This is a schematic block diagram of the layout of the power supply device in the seventh embodiment of this case;

[0037] Figure 7 This is a schematic block diagram of the layout of the power supply device in the eighth embodiment of this case;

[0038] Figure 8 This is a schematic block diagram of the layout of the power supply device in the ninth embodiment of this case;

[0039] Figure 9 This is a schematic block diagram of the layout of the power supply device according to the tenth embodiment of this case;

[0040] Figure 10A for Figure 1 A schematic block diagram showing the detailed component layout of the power conversion module of the power supply device in a first embodiment.

[0041] Figure 10B for Figure 1 A schematic block diagram showing the detailed component layout of the power conversion module of the power supply device in a second embodiment;

[0042] Figure 10C for Figure 1 A detailed component layout block diagram of the third embodiment of the power conversion module of the power supply device shown; and

[0043] Figure 10D for Figure 1 A schematic block diagram showing the detailed component layout of the power conversion module of the power supply device in a fourth embodiment.

[0044] The reference numerals in the attached figures are explained as follows:

[0045] 1, 1a, 1b, 1c, 1d, 1e: Power supply devices

[0046] 10: Input terminals

[0047] 11: Output terminals

[0048] 2a: EMI module

[0049] 21: EMI circuit

[0050] 2b: PFC module

[0051] 22: PFC inductor

[0052] 23: PFC power semiconductor switch

[0053] 24: PFC output capacitor

[0054] 2c: LLC module

[0055] 25: LLC primary-side power switch

[0056] 263: Resonant capacitor

[0057] 264: Resonant Inductor

[0058] 26: Transformer

[0059] 265: LLC secondary rectifier switch

[0060] C1: LLC output capacitor

[0061] 3: Main circuit board

[0062] 31: First side

[0063] 32: Second side

[0064] 33: Third side

[0065] 34: Fourth side

[0066] X: First direction

[0067] Y: Second direction

[0068] 41: Input / Output Module

[0069] 42: Capacitor Module

[0070] 43, 43a, 43b: Power conversion modules

[0071] 431: Transformer

[0072] 432: First filter capacitor

[0073] 433: Resonance Module

[0074] 433a: Resonant capacitor plate

[0075] 433b: Resonant Inductor Module

[0076] 433c: Resonant capacitor

[0077] 433d: Resonant inductor

[0078] 434: Rectifier switch

[0079] 435: Second filter capacitor

[0080] 44: EMI Module

[0081] 45: Power Semiconductor Module

[0082] 46: PFC inductor module

[0083] 47: Rectifier Board

[0084] 5: Input connection section

[0085] 61: First Airflow

[0086] 62: Second air duct

[0087] 7: Auxiliary power supply module Detailed Implementation

[0088] Some typical embodiments that embody the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and illustrations therein are essentially for illustrative purposes and not intended to limit this invention.

[0089] The terms "comprising," "including," "having," and "containing" used in this case are all open-ended terms, meaning they include but are not limited to. The following detailed description of some embodiments of this case is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other, and similar concepts or processes may not be repeated in some embodiments.

[0090] Please see Figure 1 and Figure 2 ,in Figure 1 This is a schematic block diagram of the layout of the power supply device according to the first embodiment of this case. Figure 2 for Figure 1 The diagram shows one type of three-phase circuit topology for a power supply device; it should be understood that this application is not limited thereto. Figure 2 As shown, the power supply device 1 in this embodiment receives and converts AC power supplied by an external power source via input terminal 10, and supplies power to a load (not shown) via output terminal 11. Specifically, the circuit topology corresponding to the power supply device 1 includes three circuit modules: EMI module 2a, PFC module 2b, and LLC module 2c. EMI module 2a is connected to input terminal 10 and includes EMI circuit 21. EMI circuit 21 includes a common-mode inductor, an X capacitor (a type of safety capacitor), and a Y capacitor (another type of safety capacitor) (not shown) to eliminate electromagnetic interference in the circuit. PFC module 2b is used to control the waveform of the input current to synchronize it with the waveform of the input voltage, thereby improving the power factor. For example, in a three-phase totem-pole PFC circuit, PFC module 2b includes six PFC inductors 22, twelve PFC power semiconductor switches 23, and two PFC output capacitors 24. Each phase of the three-phase totem-pole PFC circuit includes two PFC inductors 22 and four PFC power semiconductor switches 23, and the three-phase totem-pole PFC circuit shares two PFC output capacitors 24. It should be noted that the PFC output capacitor 24 can be a single capacitor or the equivalent capacitance of multiple capacitors. LLC module 2c includes an LLC primary-side power switch 25, a resonant capacitor 263, a resonant inductor 264, a transformer 26, an LLC secondary-side rectifier switch 265, and an LLC output capacitor C1. It should be noted that the LLC output capacitor C1 can be the equivalent capacitance of multiple capacitors.

[0091] Furthermore, Figure 2 The circuit topology diagram corresponds to Figure 1 The actual circuit structure described herein includes a power supply device 1 comprising a main circuit board 3, an input / output module 41, a capacitor module 42, a power conversion module 43, an EMI module 44, a power semiconductor module 45, and a PFC inductor module 46. Figure 2The component placement is described below. Input terminal 10 is located at input / output module 41. EMI module 2a is located at EMI module 44. In PFC module 2b, PFC inductor 22 is located at PFC inductor module 46, all PFC power semiconductor switches 23 are located at power semiconductor module 45, and PFC output capacitor 24 is located at capacitor module 42. In LLC module 2c, LLC primary-side power switch 25 is located at power semiconductor module 45, and resonant inductor 264, resonant capacitor 263, transformer 26, LLC secondary-side rectifier switch 265, and LLC output capacitor C1 are located at power conversion module 43. LLC output capacitor C1 in power conversion module 43 is connected to output terminal 11, which is located at input / output module 41.

[0092] Specifically, in the actual structural portion, the main circuit board 3 includes a first side 31, a second side 32, a third side 33, and a fourth side 34. The first side 31 and the second side 32 are arranged opposite each other and extend along a first direction X. The third side 33 and the fourth side 34 are located between the first side 31 and the second side 32, arranged opposite each other, and extend along a second direction Y. In this embodiment, the first direction X is perpendicular to the second direction Y; for example, the first direction X is the X-axis direction, and the second direction Y is the Y-axis direction. An input / output module 41 is disposed on the main circuit board 3 and adjacent to the fourth side 34. An EMI module 44 is disposed on the main circuit board 3 and adjacent to the first side 31, the second side 32, and the third side 33, and located between the first side 31 and the second side 32. A power conversion module 43 is disposed on the main circuit board 3 and located between the input / output module 41 and the EMI module 44, and adjacent to the input / output module 41. The capacitor module 42 is adjacent to the first side 31, the EMI module 44, and the power conversion module 43, and in this embodiment, the capacitor module 42 is further located between the EMI module 44 and the power conversion module 43. The power semiconductor module 45 is disposed on the main circuit board 3 and is located between the EMI module 44 and the power conversion module 43, and between the capacitor module 42 and the second side 32. The PFC inductor module 46 is disposed on the main circuit board 3 and is located between the EMI module 44 and the power conversion module 43, and between the capacitor module 42 and the second side 32, wherein the capacitor module 42 is located between the first side 31 and the power semiconductor module 45, and the power semiconductor module 45 is located between the capacitor module 42 and the PFC inductor module 46.

[0093] As can be seen from the above, in this invention, the capacitor module 42 of the power supply device 1 is adjacent to the EMI module 44 and the power conversion module 43, while the PFC inductor module 46 and the power semiconductor module 45 are located between the EMI module 44 and the power conversion module 43, and between the capacitor module 42 and the second side 32 of the main circuit board 3. Therefore, the power supply device 1 of this invention can reduce the interference of the power semiconductor module 45 and the PFC inductor module 46 to the input / output module 41 in a fixed space, thereby optimizing the electromagnetic compatibility characteristics of the power supply device 1, and improving the space utilization of the power supply device 1 within a limited space.

[0094] Please continue reading. Figure 1 In this embodiment, a first air duct 61 is provided between the capacitor module 42 and the power semiconductor module 45, and a second air duct 62 is provided between the power semiconductor module 45 and the PFC inductor module 46, so that the capacitor module 42, the power semiconductor module 45 and the PFC inductor module 46 can achieve better heat dissipation by utilizing the two air ducts. Since the power semiconductor module 45 is a high-power device, it can be dissipated more easily.

[0095] Please see Figure 3 This is a schematic block diagram of the layout of the power supply device in the second embodiment of this case. Compared to Figure 1 The power supply device 1 shown in this embodiment further includes an auxiliary power supply module 7, which is disposed on the main circuit board 3, adjacent to the second side 32, and located between the PFC inductor module 46 and the power conversion module 43.

[0096] Please see Figure 4A This is a schematic diagram of the input signal transmission in the power supply device of this case. The input / output module 41 provides the input signal (as indicated by the arrow in the diagram), and the transmission path of the input signal is adjacent to the first side 31. This design, even with the relatively large size of the capacitor module 42, can block interference from the power switching transistors in the power semiconductor module 45 and the magnetic components in the PFC inductor module 46 on the input signal. Please refer to... Figure 4B This is a schematic block diagram of the layout of the power supply device in the third embodiment of this case. Compared to Figure 1 The power supply device 1 shown in this embodiment further includes an input connection portion 5. In this embodiment, the input connection portion 5 is an input connection board disposed on the main circuit board 3 and adjacent to the first side 31 of the main circuit board 3. The input signal is transmitted to the EMI module 44 via the internal circuitry of the input connection board. Please refer to... Figure 4C This is a block diagram showing the layout of the power supply device in the fourth embodiment of this case. Compared to Figure 1The power supply device 1 shown in this embodiment further includes an input connection part 5. In this embodiment, the input connection part 5 is a flying wire, directly connected between the input / output module 41 and the EMI module 44, adjacent to the first side 31 of the main circuit board 3, wherein the input signal is transmitted to the EMI module 44 via the flying wire. Please refer to... Figure 4D This is a block diagram showing the layout of the power supply device according to the fifth embodiment of this case. Compared to Figure 1 The power supply device 1 shown in this embodiment can transmit its input signal without passing through the input connection board. Instead, the input signal of the power supply device 1d can be transmitted to the EMI module 44 along the internal circuit of the main circuit board 3, wherein the transmission path of the input signal is adjacent to the first side 31 of the main circuit board 3.

[0097] In one embodiment, the positions of the power semiconductor module and the PFC inductor module can be adjusted as needed. Please refer to [link / reference]. Figure 5 This is a block diagram showing the layout of the power supply device in the sixth embodiment of this case. Compared to Figure 1 The capacitor module 42 of the power supply device 1 shown is located between the first side 31 and the power semiconductor module 45, and the power semiconductor module 45 is located between the capacitor module 42 and the PFC inductor module 46, as shown. Figure 5 As shown, in this embodiment, the capacitor module 42 of the power supply device 1e is located on the first side 31 and the PFC inductor module 46, with the PFC inductor module 46 located between the capacitor module 42 and the power semiconductor module 45. In this embodiment, a first airflow channel 61 exists between the capacitor module 42 and the PFC inductor module 46, and a second airflow channel 62 exists between the PFC inductor module 46 and the power semiconductor module 45. This allows the capacitor module 42, the power semiconductor module 45, and the PFC inductor module 46 to achieve better heat dissipation using the two airflow channels. Since the power semiconductor module 45 is a high-power device, it is easier to dissipate heat. Furthermore, in this embodiment, the power supply device 1e also includes an auxiliary power supply module 7, which is disposed on the main circuit board 3, adjacent to the second side 32, and located between the power semiconductor module 45 and the power conversion module 43.

[0098] In some embodiments, to cope with dynamic load changes, more bus capacitors are required, increasing the space occupied by the capacitor modules. Therefore, the position of the capacitor modules can be adjusted as needed. Please refer to [link / reference]. Figure 6 This is a schematic block diagram of the layout of the power supply device in the seventh embodiment of this case. Compared to Figure 5 The capacitor module 42 of the power supply device 1e shown is located between the EMI module 44 and the power conversion module 43, as follows: Figure 6As shown, in this embodiment, the capacitor module 42 of the power supply device 1f is located between the third side 33 and the power conversion module 43, which means that the capacitor module 42 is directly adjacent to the first side 31 and the third side 33, and the EMI module 44 is located between the capacitor module 42 and the second side 32.

[0099] Please see Figure 7 This is a block diagram showing the layout of the power supply device in the eighth embodiment of this case. Compared to Figure 1 The capacitor module 42 of the power supply device 1 shown is located between the EMI module 44 and the power conversion module 43, as follows: Figure 7 As shown, in this embodiment, the capacitor module 42 of the power supply device 1g is located between the third side 33 and the power conversion module 43, which means that the capacitor module 42 is directly adjacent to the first side 31 and the third side 33, and the EMI module 44 is located between the capacitor module 42 and the second side 32.

[0100] Please see Figure 8 This is a block diagram showing the layout of the power supply device in the ninth embodiment of this case. Compared to Figure 5 The capacitor module 42 of the power supply device 1e shown is located between the EMI module 44 and the power conversion module 43, as follows: Figure 8 As shown, in this embodiment, the EMI module 44 of the power supply device 1h is adjacent to the first side 31 and the second side 32, and the capacitor module 42 is located between the EMI module 44 and the input / output module 41, and the power conversion module 43 is located between the capacitor module 42 and the second side 32.

[0101] Please see Figure 9 This is a block diagram showing the layout of the power supply device according to the tenth embodiment of this case. Compared to Figure 5 The capacitor module 42 of the power supply device 1e shown is located between the EMI module 44 and the power conversion module 43, as follows: Figure 9 As shown, in this embodiment, the EMI module 44 of the power supply device 1i is located between the capacitor module 42 and the second side 32, and the capacitor module 42 is located between the third side 33 and the input / output module 41, and the power conversion module 43 is located between the capacitor module 42 and the second side 32.

[0102] Of course, the placement of components within the power supply is not limited to the above-mentioned arrangement and can be adjusted according to actual needs, which will not be elaborated here.

[0103] Please see Figure 10A and cooperate Figure 1 ,in Figure 10A for Figure 1 A schematic block diagram showing the detailed component layout of a first embodiment of the power conversion module of the power supply device. (See attached diagram.) Figure 10AAs shown, the power conversion module 43 further includes at least one transformer 431, multiple first filter capacitors 432, and a resonant module 433. In this embodiment, the power conversion module 43 includes three transformers 431, while the multiple first filter capacitors 432 are schematically represented by a single box. The three transformers 431 are arranged sequentially on the main circuit board 3 from the first side 31 to the second side 32. The multiple first filter capacitors 432 are inserted into the main circuit board 3, and the three transformers 431 are located between the resonant module 433 and the first filter capacitors 432. The resonant module 433 includes multiple resonant capacitors and three resonant inductors, with the resonant inductors located between the multiple resonant capacitors and their corresponding transformers 431.

[0104] Please see Figure 10B and cooperate Figure 1 ,in Figure 10B for Figure 1 A schematic block diagram showing the detailed component layout of a second embodiment of the power conversion module of the power supply device. Compared to Figure 10A The power conversion module 43, such as Figure 10B As shown, the resonant module 433 of the power conversion module 43a in this embodiment further includes a resonant capacitor plate 433a and a resonant inductor module 433b. The resonant capacitor plate 433a is disposed on the main circuit board 3 and is adjacent to at least one transformer 431 and a capacitor module 42. The resonant capacitor plate 433a includes a plurality of resonant capacitors 433c. The resonant inductor module 433b includes at least one resonant inductor 433d, and the number corresponds to the number of transformers 431. In this embodiment, the power conversion module 43 includes three transformers 431 and three resonant inductors 433d, wherein each resonant inductor 433d is integrated with the corresponding transformer 431.

[0105] Please see Figure 10C and cooperate Figure 1 ,in Figure 10C for Figure 1 A schematic block diagram showing the detailed component layout of a third embodiment of the power conversion module of the power supply device. Compared to Figure 10A The power conversion module 43, such as Figure 10C As shown, the power conversion module 43b of this embodiment also includes multiple rectifier switches 434 and multiple second filter capacitors 435. The rectifier switch 434 and the second filter capacitor 435 corresponding to each transformer 431 are disposed on the projection surface of the transformer 431 on the main circuit board 3. The first filter capacitor 432 is used to filter out low-frequency interference in the output signal, and the second filter capacitor 435 is used to filter out high-frequency interference in the output signal. It should be understood that the positional relationship between the rectifier switch 434 and the second filter capacitor 435 on the projection surface in this embodiment is not limited to the figure and can be adjusted according to actual needs.

[0106] Please see Figure 10Dand cooperate Figure 1 ,in Figure 10D for Figure 1 A schematic block diagram showing the detailed component layout of the power conversion module of the power supply device in a fourth embodiment. (See attached diagram.) Figure 10D As shown, the power conversion module 43c of this embodiment further includes one or more rectifier boards 47, for example... Figure 10D The four rectifier boards 47 shown are respectively inserted on the main circuit board 3 around the transformer 431. Each rectifier board 47 includes at least one rectifier switch 434 and at least one second filter capacitor 435. For the sake of simplification, only a single rectifier board 47 is shown to represent the rectifier switch 434 and the second filter capacitor 435 contained therein. Of course, the positional relationship between the rectifier switch 434 and the second filter capacitor 435 is not limited to the figure shown. The number and positional relationship of the rectifier boards 47 corresponding to each transformer 431 are not limited to the above arrangement and can be adjusted according to actual needs.

[0107] In summary, the capacitor module of the power supply device in this invention is adjacent to the EMI module and the power conversion module, while the PFC inductor module and the power semiconductor module are located between the EMI module and the power conversion module, and between the capacitor module and the second side of the main circuit board. Therefore, the power supply device of this invention can reduce the interference of the power semiconductor module and the PFC inductor module to the input and output modules within a fixed space, thereby optimizing the electromagnetic compatibility characteristics of the power supply device. Furthermore, since the transmission paths of the input and output modules of the power supply device in this invention are adjacent to the first side, the space utilization of the power supply device can be improved within a limited space, even with a relatively large capacitor module, while optimizing the transmission path and blocking electromagnetic interference. In addition, the power supply device of this invention has air ducts between the capacitor module, the PFC inductor module, and the power semiconductor module, allowing the capacitor module, the power semiconductor module, and the PFC inductor module to achieve better heat dissipation through two air ducts, and improving the overall heat dissipation capacity of the power supply device.

Claims

1. A power supply device, characterized in that, Include: A main circuit board includes a first side, a second side, a third side and a fourth side, the first side and the second side are disposed opposite to each other and extend along a first direction, and the third side and the fourth side are disposed opposite to each other and extend along a second direction. An input / output module is mounted on the main circuit board and is adjacent to the fourth side; An EMI module is mounted on the main circuit board and is adjacent to the third side; A power conversion module is disposed on the main circuit board, located between the input / output module and the EMI module, and adjacent to the input / output module; A capacitor module is disposed on the main circuit board and is adjacent to the first side, the EMI module, and the power conversion module; and A PFC inductor module and a power semiconductor module are disposed on the main circuit board and located between the EMI module and the power conversion module, and between the capacitor module and the second side.

2. The power supply device as claimed in claim 1, characterized in that, The input / output module provides an input signal whose transmission path is adjacent to the first side.

3. The power supply device as described in claim 2, characterized in that, The input signal is transmitted to the EMI module along the internal circuitry of the main circuit board.

4. The power supply device as claimed in claim 2, characterized in that, The power supply device also includes an input connection board disposed on the main circuit board and adjacent to the first side, wherein the input signal is transmitted to the EMI module via the internal circuitry of the input connection board.

5. The power supply device as claimed in claim 2, characterized in that, The power supply device also includes a flying wire adjacent to the first side, through which the input signal is transmitted to the EMI module.

6. The power supply device as claimed in claim 1, characterized in that, The EMI module is adjacent to the first side and the second side, and the capacitor module is located between the EMI module and the power conversion module.

7. The power supply device as claimed in claim 1, characterized in that, The EMI module is located between the capacitor module and the second side, and the capacitor module is located between the third side and the power conversion module.

8. The power supply device as claimed in claim 1, characterized in that, The EMI module is adjacent to the first side and the second side, and the capacitor module is located between the EMI module and the input / output module, and the power conversion module is located between the capacitor module and the second side.

9. The power supply device as claimed in claim 1, characterized in that, The EMI module is located between the capacitor module and the second side, and the capacitor module is located between the third side and the input / output module. The power conversion module is located between the capacitor module and the second side.

10. The power supply device according to any one of claims 6 to 9, characterized in that, The capacitor module is located between the first side and the power semiconductor module, and the power semiconductor module is located between the capacitor module and the PFC inductor module.

11. The power supply device as claimed in claim 10, characterized in that, There is a first airflow channel between the capacitor module and the power semiconductor module, and a second airflow channel between the power semiconductor module and the PFC inductor module.

12. The power supply device according to any one of claims 6 to 9, characterized in that, The capacitor module is located between the first side and the PFC inductor module, and the PFC inductor module is located between the capacitor module and the power semiconductor module.

13. The power supply device as claimed in claim 12, characterized in that, There is a first airflow channel between the capacitor module and the PFC inductor module, and there is a second airflow channel between the PFC inductor module and the power semiconductor module.

14. The power supply device as claimed in claim 1, characterized in that, The power supply device also includes an auxiliary power module, which is disposed on the main circuit board, adjacent to the second side, and located between the power semiconductor module and the power conversion module.

15. The power supply device as claimed in claim 1, characterized in that, The power supply device also includes an auxiliary power module, which is disposed on the main circuit board, adjacent to the second side, and located between the PFC inductor module and the power conversion module.

16. The power supply device as claimed in claim 1, characterized in that, The power conversion module includes at least one transformer, which is arranged sequentially on the main circuit board from the first side toward the second side.

17. The power supply device as claimed in claim 16, characterized in that, The power conversion module also includes multiple first filter capacitors, which are disposed on the main circuit board and located between the at least one transformer and the output / input module.

18. The power supply device as claimed in claim 17, characterized in that, The power conversion module also includes a resonant module, which includes a resonant capacitor plate and a resonant inductor module. The resonant capacitor plate includes multiple resonant capacitors. The resonant capacitor plate is disposed on the main circuit board and is adjacent to the at least one transformer and the capacitor module.

19. The power supply device as claimed in claim 18, characterized in that, The resonant inductor module is mounted on the main circuit board and is adjacent to the resonant capacitor board.

20. The power supply device as claimed in claim 18, characterized in that, The resonant inductor module includes at least one resonant inductor, and each resonant inductor is integrated with a corresponding transformer.

21. The power supply device as claimed in claim 18, characterized in that, The power conversion module also includes multiple rectifier switches and multiple second filter capacitors, which are respectively disposed on the projection surface of the corresponding transformer on the main circuit board.

22. The power supply device as claimed in claim 18, characterized in that, The power conversion module also includes multiple rectifier boards, each containing multiple rectifier switches and multiple second filter capacitors. Each rectifier board is inserted into the main circuit board and is adjacent to the corresponding transformer.

23. The power supply device as claimed in claim 1, characterized in that, The input / output module includes an input terminal and an output terminal. The input terminal is connected to the EMI module, and the output terminal is connected to the power conversion module.

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