Photovoltaic junction box and photovoltaic module
Patent Information
- Application Number
- CN202521988435.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-16
- Publication Date
- 2026-09-08
- Estimated Expiration
- 2035-09-16
AI Technical Summary
[0004]基于此,本实用新型提供一种光伏接线盒及光伏组件,以解决传统光伏接线盒的二极管与输出线缆之间的焊接连接容易因虚焊引发接触电阻增大、局部过热甚至电弧打火等问题,导致可靠性较差的问题
本实用新型的光伏接线盒,通过三个腔道交汇构建封闭式连接腔,将二极管管脚与输出线缆的电气连接点隐藏于第一散热件的内部,隔绝氧气接触,从根源上杜绝焊点氧化,提升了焊接可靠性;通过三个腔道形成了几何约束边界,将第三腔道作为焊料输送专用通道,将三者的交汇区(连接腔)作为焊接区域,使得预置的焊料块在熔化后可以通过第三腔道定向导流至指定焊接区域,确保焊料可以完全覆盖指定焊接区域中的待焊点,而且基于熔融焊料的自流平特性,可以实现焊料对连接界面的全包裹浸润焊接,提升焊接效果。而且二极管的管脚和焊点内置于第一散热件的腔道中,使得第一散热件可以对二极管管脚及其焊接点形成全方位的包裹,增大了散热面积,显著提升了散热效率。
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Figure CN224733691U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic module technology, and in particular to a photovoltaic junction box and a photovoltaic module. Background Technology
[0002] As a key connecting component between photovoltaic cells and external electrical equipment, the photovoltaic junction box's main function is to connect and protect solar photovoltaic modules, connect the power generated by the photovoltaic cells to external lines, and conduct the electrical energy generated by the photovoltaic cells through cables.
[0003] Traditional photovoltaic junction boxes typically include components such as busbars, terminals, diodes, heat sinks, and output cables. The busbars, terminals, diode pins, and output cables are soldered sequentially within the junction box. Due to the numerous soldering points, there is a high risk of cold solder joints. In particular, cold solder joints between diodes and output cables can easily lead to increased contact resistance, localized overheating, or even arcing, resulting in poor reliability. Utility Model Content
[0004] Based on this, the present invention provides a photovoltaic junction box and a photovoltaic module to solve the problem that the welding connection between the diode and the output cable of the traditional photovoltaic junction box is prone to problems such as increased contact resistance, local overheating or even arcing caused by poor soldering, resulting in poor reliability.
[0005] On the one hand, the present invention provides a photovoltaic junction box, including a box body and electrical components disposed in the box body; The electrical components include diodes, a first heat sink, and output cables; The first heat sink has a first cavity, a second cavity, and a third cavity that are interconnected, and the three cavities form a connecting cavity at their intersection inside the first heat sink. The diode's pins are inserted into the first cavity and extend into the connection cavity, and the output cable is inserted into the second cavity and extends into the connection cavity; The opening end of the third cavity is provided with a first solder block. The first solder block is used to flow into the connection cavity along the third cavity after melting, to solder the diode pins and the output cable and electrically connect them to the photovoltaic module.
[0006] In one embodiment, the inner wall of the third cavity is provided with a solder layer; or, The inner walls of the first cavity, the second cavity, and the third cavity are all provided with a solder layer.
[0007] In one embodiment, the first cavity and the second cavity are horizontally extended, the third cavity is vertically extended, and the opening end of the third cavity is located above the first heat sink.
[0008] In one embodiment, the first cavity, the second cavity, and the third cavity are orthogonally distributed.
[0009] In one embodiment, the total amount of the first solder block and the solder layer is configured such that, after melting, it at least fills the first cavity, the second cavity, and the third cavity.
[0010] In one embodiment, the electrical component further includes a first polarity busbar covering the first solder block, the first polarity busbar having a first through hole coaxially aligned with the third cavity; The amount of the first solder block is such that after melting, it overflows from the opening end of the third cavity to the first through hole, so that the first solder block is electrically connected to the first polarity busbar.
[0011] In one embodiment, the electrical component further includes a second heat sink and a second polarity busbar; The second heat sink has the same structure as the first heat sink. The diode has a first pin and a second pin. The first pin is connected to the first heat sink, and the second pin is connected to the first cavity or the second cavity of the second heat sink. The second heat sink has a second solder block at the opening end of the third cavity. The second polarity busbar is connected to the second solder block and has a second through hole. The number of second solder blocks is the same as that of the first solder block.
[0012] In one embodiment, the portion of the first pin and / or the second pin inserted into the cavity is flat.
[0013] In one embodiment, the first heat sink and the second heat sink are made of copper or aluminum.
[0014] On the other hand, the present invention also provides a photovoltaic module, which includes the photovoltaic junction box of any of the above embodiments.
[0015] Compared with the prior art, this utility model has at least the following beneficial effects: This photovoltaic junction box utilizes a closed connection cavity constructed by the convergence of three cavities. This conceals the electrical connection points between the diode pins and the output cable within the first heat sink, isolating them from oxygen and preventing solder joint oxidation at its source, thus improving welding reliability. The three cavities form a geometric constraint boundary, with the third cavity serving as a dedicated solder delivery channel and the intersection area (connection cavity) as the welding area. This allows pre-placed solder blocks to flow directionally through the third cavity to the designated welding area after melting, ensuring complete coverage of the solder joints. Furthermore, the self-leveling properties of the molten solder enable full encapsulation and wetting of the connection interface, enhancing welding performance. Moreover, the diode pins and solder joints are integrated within the cavities of the first heat sink, allowing it to comprehensively enclose the diode pins and their solder joints, increasing the heat dissipation area and significantly improving heat dissipation efficiency. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of a photovoltaic junction box in one embodiment; Figure 2 This is a schematic diagram of the structure of an electrical component in one embodiment; Figure 3 This is a schematic diagram of the structure of the first heat sink in one embodiment.
[0017] The reference numerals in the accompanying drawings include: 100 - Electrical components; 110 - Diode; 111 - Pin 1; 112 - Pin 2; 120 - First heat sink; 121 - First cavity; 122 - Second cavity; 123 - Third cavity; 124 - Connecting cavity; 130 - Second heat sink; 140 - Output cable; 151 - First solder block; 152 - Second solder block; 160 - First polarity busbar; 161 - First through hole; 170 - Second polarity busbar; 171 - Second through hole; 200-Box body. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.
[0019] As described in the background section, the soldered connection between the diode and the output cable in traditional photovoltaic junction boxes is prone to problems such as increased contact resistance, localized overheating, and even arcing due to poor soldering, resulting in poor reliability. This problem is mainly because the solder joints between the diode and the output cable are currently exposed to air, which accelerates the oxidation of the solder joints, thus leading to poor reliability.
[0020] To address the aforementioned issues, this utility model provides a photovoltaic junction box that hides the electrical connection points (soldering points) of the output cables and diodes inside a heat sink, isolating them from air contact, eliminating the risk of poor soldering caused by solder joint oxidation, enhancing heat dissipation, and preventing localized overheating of the soldering points, thereby improving connection reliability.
[0021] Specifically, such as Figure 1 As shown, the photovoltaic junction box provided in this embodiment of the present invention includes a box body 200 and an electrical component 100 disposed in the box body 200; Electrical component 100 includes diode 110, first heat sink 120 and output cable 140; The first heat sink 120 has a first cavity 121, a second cavity 122 and a third cavity 123 that are interconnected. The three cavity 123 form a connecting cavity 124 at the junction inside the first heat sink 120. The pins of diode 110 are inserted into the first cavity 121 and extend to the connection cavity 124, and the output cable 140 is inserted into the second cavity 122 and extends to the connection cavity 124. The opening end of the third cavity 123 is provided with a first solder block 151. The first solder block 151 is used to flow into the connection cavity 124 along the third cavity 123 after melting, to solder the pins of the diode 110 and the output cable 140 and electrically connect them to the photovoltaic module, specifically, to the busbar of the photovoltaic module.
[0022] The photovoltaic junction box of this utility model constructs a closed connection cavity 124 by the intersection of three cavities, hiding the electrical connection point between the diode 110 pin and the output cable 140 inside the first heat sink 120, thus isolating oxygen contact. The three cavities form a geometric constraint boundary, with the third cavity 123 serving as a dedicated channel for solder delivery, and the intersection area of the three (connection cavity 124) serving as the welding area. This allows the pre-placed first solder block 151 to be directed to the designated welding area through the third cavity 123 after melting, ensuring that the solder can completely cover the points to be soldered in the designated welding area. Moreover, based on the self-leveling properties of the molten solder, it can achieve full encapsulation and wetting of the connection interface by the solder, improving the welding effect.
[0023] The photovoltaic junction box based on the above embodiments effectively isolates oxygen and moisture by completely enclosing the electrical connection points inside the heat sink, thus preventing solder joint oxidation at the source. The directional flow of solder ensures sufficient soldering and improves soldering reliability. The first heat sink 120 encloses the diode 110 pins and their solder joints, increasing the heat dissipation area and significantly improving heat dissipation efficiency. This solves the problems of poor soldering and overheating caused by traditional exposed solder joints.
[0024] Among them, see Figure 1 In this embodiment, the housing 200 is used to accommodate the electrical component 100. Specifically, it includes a base and a cover (not shown in the figure). The two are detachably connected to form a split housing. The two can be detachably connected by means of snap-fit connection, screw connection, etc. The housing 200 forms an accommodating space, and the electrical component 100 is disposed in the accommodating space, which is protected and sealed by the housing 200.
[0025] In this embodiment, the electrical component 100 is mainly used to realize the functions of current collection, transmission and protection of photovoltaic cell strings through its internal conductive circuit. Among them, the main element in the electrical component 100 that plays a protective role is the diode 110. When some cells are shaded or damaged, the current will bypass the shaded faulty string and flow through the inside of the diode 110, thus protecting the faulty string from being burned out.
[0026] For details, see Figure 1 In this embodiment, diode 110 has two pins, each corresponding to a heat sink. The heat generated by diode 110 during operation can be transferred through the pins to the heat sink and dissipated through the heat sink. In this embodiment, the two pins of diode 110 are defined as first pin 111 and second pin 112, and the two heat sinks are first heat sink 120 and second heat sink 130. Of the two pins, the pin soldered to the output cable 140 is first pin 111, and the other is second pin 112. Correspondingly, of the two heat sinks, the one connected to first pin 111 is first heat sink 120, and the one connected to second pin 112 is second heat sink 130.
[0027] The second heat sink 130 has the same structure as the first heat sink 120, both having a first cavity 121, a second cavity 122, and a third cavity 123. Correspondingly, the connection method between the second pin 112 and the second heat sink 130 is also the same as the connection method between the first pin 111 and the first heat sink 120; that is, the second pin 112 is also inserted into a cavity of the second heat sink 130, which can be either the first cavity 121 or the second cavity 122. Then, it is welded and fixed by melting the second solder block 152 pre-placed at the opening end of the third cavity 123. This configuration ensures that both pins of the diode 110 use the same concealed welding structure, enclosing all solder joints of the diode 110 inside the heat sink. This fundamentally eliminates the risk of poor soldering or arcing caused by exposed solder joints and ensures that both pins of the diode 110 receive equal anti-oxidation welding protection, resulting in good balance.
[0028] It should be noted that the symmetrical design of the cavity structure of the second heat sink 130 and the first heat sink 120 is to unify component specifications, thereby significantly improving production efficiency, reducing mold development and manufacturing costs, and simplifying the assembly process. Operators can complete the assembly without distinguishing between heat sink types. Furthermore, this design ensures that the two pins of the diode 110 obtain completely consistent heat dissipation performance and connection reliability, avoiding performance deviations caused by structural differences. It should be understood that in some embodiments where mold costs and assembly processes are not considered, the cavity structure of the second heat sink 130 can also be set to have only two cavities, namely the third cavity 123 and one of the first cavity 121 and the second cavity 122. Since the second heat sink 130 does not require connecting cables, only one of the first cavity 121 and the second cavity 122 needs to be reserved for inserting the second pin 112.
[0029] See Figures 1 to 3 In a specific example, both the first heat sink 120 and the second heat sink 130 are rectangular structures made of a heat-dissipating material. The heat-dissipating material is aluminum or copper, or other materials with good heat dissipation capabilities; aluminum or copper is preferred here, giving the heat sink not only good thermal conductivity but also ease of processing, thus reducing the manufacturing difficulty of the heat sink. The rectangular shape of the first heat sink 120 and the second heat sink 130 is merely an example; they can also be cylindrical, spherical, etc., and are not limited here.
[0030] Furthermore, both the first heat sink 120 and the second heat sink 130 can be made of conductive materials. Similarly, the conductive material can also be aluminum or copper. This allows the first heat sink 120 and the second heat sink 130 to have both good thermal conductivity and electrical conductivity. The excellent electrical conductivity allows the heat sink itself to become a component of the current transmission path, achieving dual-path conductivity, namely the indirect conduction path of the first pin 111 → the first heat sink 120 → the output cable 140 and the direct conduction path of the first pin 111 → the output cable 140. This optimizes the electrical connection impedance and reduces the risk of hot spots through the current sharing effect of the heat sink itself.
[0031] Regarding the arrangement of the cavities in the first heat sink 120 and the second heat sink 130, please refer to... Figure 2 and Figure 3 In this preferred embodiment, the first cavity 121 and the second cavity 122 are both horizontally extended, while the third cavity 123 is vertically extended, with the opening of the third cavity 123 located on the upper side of the heat sink. This structural design allows molten solder to flow naturally downwards along the vertical third cavity 123 under gravity, ensuring complete filling of the connection cavity 124. Furthermore, the horizontally arranged first cavity 121 and second cavity 122 provide stable horizontal insertion guidance for the pins and output cable 140, ensuring precise alignment of their connection positions. The upper-opening third cavity 123, in addition to facilitating the flow of molten solder, also facilitates the pre-positioning and observation of the first solder block 151 or the second solder block 152, improving assembly convenience.
[0032] Furthermore, see Figure 2 and Figure 3 In this embodiment, preferably, the first cavity 121, the second cavity 122, and the third cavity 123 are orthogonally distributed and are all linear cavities. Orthogonal distribution can be understood as the angle between any two of the first cavity 121, the second cavity 122, and the third cavity 123 being 90 degrees. For example, the opening of the third cavity 123 is located on the upper surface of the heat sink, and the openings of the first cavity 121 and the second cavity 122 are located on adjacent side surfaces of the heat sink. Based on this structural design, the relative layout between the output cable 140, the heat sink, and the diode 110 can be optimized, avoiding assembly interference between them.
[0033] It should be understood that when the pin of diode 110 is inserted into the first cavity 121 and extends into the connecting cavity 124, and the output cable 140 is inserted into the second cavity 122 and extends into the connecting cavity 124, the pin of diode 110 and the end of output cable 140 can form a pre-contact in the connecting cavity 124, which firstly constitutes a direct connection circuit and secondly facilitates soldering and fixing.
[0034] Furthermore, in this embodiment, the portion of the first pin 111 and / or the second pin 112 of the diode 110 inserted into the cavity is flat (not shown in the figure), and this flatness is mainly achieved through a flattening process. This design, after flattening, increases the contact area between the pin and the cable, ensuring that the molten solder can completely encapsulate the contact interface, achieving a reliable metallurgical bond.
[0035] See Figure 1 and Figure 2 In this embodiment, the first solder block 151 and the second solder block 152 can be block structures that can completely cover the opening of the third cavity 123, so as to be stably pre-placed on the heat sink.
[0036] Specifically, when the solder on the first heat sink 120 consists only of the first solder block 151, and the solder on the second heat sink 130 consists only of the second solder block 152, the total amount of the first solder block 151 / second solder block 152 should satisfy the following condition: after melting, it should at least fill the first cavity 121, the second cavity 122, and the third cavity 123. That is, the volume of the molten solder formed after the first solder block 151 melts should be at least greater than the sum of the volumes of the first cavity 121, the second cavity 122, and the third cavity 123. The specific value is not limited in this embodiment; the sum of the volumes of the first cavity 121, the second cavity 122, and the third cavity 123 in actual application can be used as the basis. This configuration ensures complete filling of the connection cavity 124 without gaps, eliminates the risk of cold solder joints due to insufficient solder, guarantees the stability of the welding quality, and allows excess solder to overflow through the third cavity 123, forming a quality viewing window for direct observation of the welding quality.
[0037] Furthermore, in this embodiment, the inner wall of the third cavity 123 of the first heat sink 120 and the second heat sink 130 is provided with a solder layer (not shown in the figure); or, the inner walls of the first cavity 121, the second cavity 122 and the third cavity 123 are all provided with solder layers. The solder layer here can be understood as solder pre-placed in the cavity. In the initial state, the solder layer has already formed an all-round surround of the soldering point of the diode 110 pin and the output cable 140. Therefore, during soldering, it can form a double melt supply with the corresponding solder block to ensure all-round solder coverage of the soldering point, eliminate the gaps caused by insufficient fluidity of the solder after the solder block melts, and ensure the soldering effect. Moreover, when the solder block is insufficiently filled due to quantity difference or position deviation, the pre-placed solder layer can also automatically fill the gap, reducing the risk of cold solder joint to zero.
[0038] Correspondingly, when the total solder of a single heat sink includes solder blocks and solder layers, the total amount of solder blocks and solder layers should meet the following requirements: after melting, they should at least fill the first cavity 121, the second cavity 122, and the third cavity 123 to avoid the risk of cold solder joints caused by insufficient solder and to ensure the stability of the soldering quality.
[0039] Specifically, in this embodiment, the first solder block 151, the second solder block 152, and the solder layer can all be made of tin solder.
[0040] In this embodiment, the electrical component 100 also includes a busbar, which is used to collect the current of multiple battery strings of the photovoltaic module into the junction box and uniformly transmit it to the external circuit. That is, the busbar plays the role of connecting the battery strings to introduce current.
[0041] In this embodiment, both the first heat sink 120 and the second heat sink 130 are provided with busbars. The structure and arrangement of the busbars on the two heat sinks are the same, but the polarities are different. The busbar connected to the first heat sink 120 is the first polarity busbar 160, and the busbar connected to the second heat sink 130 is the second polarity busbar 170. The first polarity and the second polarity are opposite. The following description uses only the first polarity busbar 160 as an example.
[0042] For details, see Figure 1 and Figure 2 The first polarity busbar 160 is arranged on the upper side of the first heat sink 120, and the first polarity busbar 160 covers the first solder block 151. The first polarity busbar 160 has a first through hole 161 that is coaxially aligned with the third cavity 123. With this configuration, the first solder block 151 can be directly exposed to the heating source through the first through hole 161, ensuring that the first solder block 151 is heated evenly and the melting efficiency is improved. Moreover, the first polarity busbar 160 can also serve as a physical limiting structure to constrain the flow direction of the molten solder, allowing it to preferentially fill the connecting cavity 124 downward along the third cavity 123, while allowing an appropriate amount of solder to overflow upward to the first through hole 161 to form a welding point, thus realizing the electrical connection between the first polarity busbar 160 and the diode 110 / output cable 140. In addition, the coaxial alignment design of the first through hole 161 and the third cavity 123 enables the visualization and monitoring of the welding process. Operators can judge the welding quality in real time by observing the state of solder overflow at the first through hole 161.
[0043] Correspondingly, the amount of the first solder block 151 should further satisfy the requirement that, after melting, it can overflow from the opening end of the third cavity 123 to the first through hole 161. This setting ensures that after welding, some solder can overflow from the opening end of the third cavity 123 into the first through hole 161 of the first polarity busbar 160. After the overflowing solder solidifies, it can form a mushroom-shaped anchoring structure on the first polarity busbar 160, improving the mechanical connection reliability between the first polarity busbar 160 and the heat sink, and also ensuring the electrical connection reliability between the first polarity busbar 160 and the diode 110 / output cable 140.
[0044] Correspondingly, a second polarity busbar 170 is arranged on the upper side of the second heat sink 130, covering the second solder block 152. It has a second through hole 171, which faces the opening end of the third cavity 123 of the second heat sink 130 to achieve a similar function. The quantity of the second solder block 152 is the same as that of the first solder block 151. The total quantity of solder layer in the second solder block 152 and the second heat sink 130 should satisfy the following: after melting, it should at least fill the first cavity 121, the second cavity 122, and the third cavity 123 to avoid the risk of cold solder joints due to insufficient solder and ensure the stability of the soldering quality. The quantity of the second solder block 152 should further satisfy the following: after melting, it should at least overflow from the opening end of the third cavity 123 to the second through hole 171.
[0045] On the other hand, this utility model embodiment also provides a photovoltaic module, which includes the photovoltaic junction box of any of the above embodiments.
[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0047] It should be noted that the illustrations provided in this embodiment are merely schematic representations of the basic concept of this utility model. The structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and to enable them to understand and read the content disclosed herein. They are not intended to limit the implementation conditions of this utility model. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed herein.
[0048] The orientations or positional relationships indicated by terms such as "upper," "lower," "left," "right," "middle," "longitudinal," "transverse," "horizontal," "inner," "outer," "radial," and "circumferential" used in this specification are based on the orientations or positional relationships shown in the accompanying drawings and are only for the purpose of simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0049] The above embodiments merely illustrate several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A photovoltaic junction box, characterized in that, Includes a housing (200) and electrical components (100) disposed in the housing (200); The electrical component (100) includes a diode (110), a first heat sink (120), and an output cable (140). The first heat sink (120) has a first cavity (121), a second cavity (122) and a third cavity (123) that are interconnected. The three cavity forms a connecting cavity (124) at the junction of the three cavity inside the first heat sink (120). The pin of the diode (110) is inserted into the first cavity (121) and extends to the connection cavity (124), and the output cable (140) is inserted into the second cavity (122) and extends to the connection cavity (124). The opening end of the third cavity (123) is provided with a first solder block (151). The first solder block (151) is used to melt and flow into the connection cavity (124) along the third cavity (123) to solder the pin of the diode (110) and the output cable (140) and electrically connect them to the photovoltaic module.
2. The photovoltaic junction box according to claim 1, characterized in that, The inner wall of the third cavity (123) is provided with a solder layer; or, The inner walls of the first cavity (121), the second cavity (122) and the third cavity (123) are all provided with a solder layer.
3. The photovoltaic junction box according to claim 1, characterized in that, The first cavity (121) and the second cavity (122) are horizontally extended, the third cavity (123) is vertically extended, and the opening end of the third cavity (123) is located on the upper side of the first heat sink (120).
4. The photovoltaic junction box according to claim 3, characterized in that, The first cavity (121), the second cavity (122) and the third cavity (123) are orthogonally distributed.
5. The photovoltaic junction box according to claim 2, characterized in that, The total amount of the first solder block (151) and the solder layer is configured such that, after melting, it at least fills the first cavity (121), the second cavity (122) and the third cavity (123).
6. The photovoltaic junction box according to claim 5, characterized in that, The electrical component (100) further includes a first polarity busbar (160) covering the first solder block (151), the first polarity busbar (160) having a first through hole (161) coaxially aligned with the third cavity (123). The first solder block (151) is configured such that after melting, it overflows from the opening end of the third cavity (123) to the first through hole (161) so that the first solder block (151) is electrically connected to the first polarity busbar (160).
7. The photovoltaic junction box according to claim 6, characterized in that, The electrical component (100) also includes a second heat sink (130) and a second polarity busbar (170); The second heat sink (130) has the same structure as the first heat sink (120). The diode (110) has a first pin (111) and a second pin (112). The first pin (111) is connected to the first heat sink (120), and the second pin (112) is connected to the first cavity (121) or the second cavity (122) of the second heat sink (130). The second heat sink (130) has a second solder block (152) at the opening end of the third cavity (123). The second polar busbar (170) is connected to the second solder block (152) and has a second through hole (172). The configuration of the second solder block (152) is the same as that of the first solder block (151).
8. The photovoltaic junction box according to claim 7, characterized in that, The portion of the first pin (111) and / or the second pin (112) inserted into the cavity is flat.
9. The photovoltaic junction box according to claim 7, characterized in that, The first heat sink (120) and the second heat sink (130) are made of copper or aluminum.
10. A photovoltaic module, characterized in that, Includes the photovoltaic junction box as described in any one of claims 1-9.