An airborne transceiver combination structure with miniaturization and high-efficiency heat dissipation function

Abstract

The utility model discloses a miniaturization has airborne transceiving combination structure with efficient heat dissipation function relates to radio frequency device technical field, wherein, miniaturization has airborne transceiving combination structure with efficient heat dissipation function including casing and heat dissipation module, and the casing is detachably connected and the upper casing and lower casing constitute. The upper casing contains the upper layer accommodation cavity, and the inside has the transmission subassembly with the abutment of roof board, the lower casing contains the lower layer accommodation cavity, and the built -in receiving subassembly and control module, and transmission subassembly, receiving subassembly and control module are mutually electric connection, signal connection. The heat dissipation module is by first radiating component and second radiating component constitute, and first radiating component contains the heat dissipation fin group of upper casing outside and the heat dissipation fan corresponding transmission subassembly, and second radiating component contains the heat dissipation fin of casing inboard and control module and the abutment of lower casing. The technical scheme provided by the utility model can provide a kind of airborne transceiving combination structure with efficient heat dissipation function of miniaturization with smaller volume and better heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency device technology, and in particular to a miniaturized airborne transceiver assembly structure with efficient heat dissipation function. Background Technology

[0002] In radio frequency (RF) devices, the transmitting component, especially the power amplifier, is a crucial part. The power amplifier generates a significant amount of heat during operation, requiring timely heat dissipation to prevent excessive heat buildup that could damage components and disrupt the normal operation of the RF device. Current RF devices typically achieve heat dissipation by increasing the device's size and incorporating heat sinks, but this significantly increases the device's volume and weight. Utility Model Content

[0003] The main objective of this invention is to propose a miniaturized airborne transceiver assembly structure with efficient heat dissipation, aiming to provide a miniaturized airborne transceiver assembly structure with small size and good heat dissipation effect.

[0004] To achieve the above objectives, the present invention proposes a miniaturized airborne transceiver assembly structure with efficient heat dissipation, comprising:

[0005] The housing includes an upper housing with an upper accommodating cavity and a lower housing with a lower accommodating cavity, the upper housing and the lower housing being detachably connected, a transmitting component being disposed in the upper accommodating cavity and abutting against the top plate of the upper housing, a receiving component and a control module being disposed in the lower accommodating cavity, the transmitting component, the receiving component and the control module being electrically connected, and the transmitting component and the receiving component being signal connected;

[0006] The heat dissipation module includes a first heat dissipation assembly disposed on the top plate of the upper housing and a second heat dissipation assembly disposed on the bottom plate of the lower housing. The first heat dissipation assembly includes a heat dissipation fin group and a heat dissipation fan disposed on the outer side of the upper housing. The heat dissipation fan is disposed corresponding to the emission assembly. The second heat dissipation assembly includes a heat dissipation fin disposed on the inner side of the housing. The heat dissipation fin abuts against the control module and the lower housing.

[0007] In one embodiment, a duplexer is further provided inside the upper housing. The duplexer is signal-connected to the transmitting component and the receiving component, and the duplexer and the transmitting component are arranged along the width or length direction of the upper housing.

[0008] In one embodiment, the heat dissipation fin group includes a first fin group and a second fin group, wherein the spacing between adjacent heat dissipation fins in the first fin group is smaller than the spacing between adjacent heat dissipation fins in the second fin group, the first fin group is configured to correspond to the transmitting component, and the second fin group is configured to correspond to the duplexer.

[0009] In one embodiment, the second heat dissipation component includes a thermally conductive buffer pad sandwiched between the control module and the heat sink.

[0010] In one embodiment, the top wall of the upper accommodating cavity is provided with a first groove with the opening facing downward, the transmitting component is disposed in the first groove, and the miniaturized airborne transceiver assembly structure with efficient heat dissipation function further includes a first sealing cover, the first sealing cover is disposed on the opening of the first groove, and a shielding strip is sandwiched between the first sealing cover and the first groove.

[0011] In one embodiment, the top wall of the lower accommodating cavity is provided with a second groove with the opening facing downward, the receiving component is disposed in the second groove, and the miniaturized airborne transceiver assembly structure with efficient heat dissipation function further includes a second sealing cover, the second sealing cover is disposed at the opening of the second groove, and the shielding strip is sandwiched between the second sealing cover and the second groove.

[0012] In one embodiment, the miniaturized airborne transceiver assembly with efficient heat dissipation function further includes a power module and a third sealing cover. The top wall of the lower accommodating cavity is also provided with a third groove with its opening facing downward. The power module is disposed in the third groove, and the third sealing cover is disposed at the opening of the third groove. The shielding strip is sandwiched between the third sealing cover and the third groove.

[0013] In one embodiment, the housing further includes an upper housing sealing cover and a lower housing sealing cover, the upper housing sealing cover and the lower housing sealing cover respectively covering the lower side of the upper housing and the lower housing, and respectively enclosing the upper receiving cavity and the lower receiving cavity with the upper housing.

[0014] In one embodiment, the first sealing cover, the second sealing cover, the third sealing cover, the upper shell sealing cover plate, and the lower shell sealing cover plate are all made of conductive and magnetic materials.

[0015] In one embodiment, the first sealing cover, the second sealing cover, the third sealing cover, the upper shell sealing cover plate, and the lower shell sealing cover plate are all provided with material reduction grooves.

[0016] In one embodiment, the top plate of the lower housing and the upper housing cover are respectively provided with a first wire passage hole and a second wire passage hole to connect the upper accommodating cavity and the lower accommodating cavity.

[0017] The technical solution of this utility model adopts a layered design, with an upper accommodating cavity and a lower accommodating cavity inside the housing to respectively accommodate the transmitting component, which generates more heat during operation, and the control module and receiving component, which generate less heat. The heat in the upper accommodating cavity is dissipated through heat dissipation fins and a cooling fan, which features a large air volume and small size. The heat in the lower cavity is transferred to the bottom plate of the housing through heat sinks for dissipation, preventing heat from accumulating in the middle of the housing. This ensures the reliability of the miniaturized airborne transceiver assembly with efficient heat dissipation function and enhances the heat dissipation effect of the miniaturized airborne transceiver assembly with efficient heat dissipation function. Since the control module generates more heat than the receiving component in actual operation, the heat sinks mainly dissipate heat for the control module. Furthermore, the layered structure design allows for full utilization of the internal space, thereby reducing the size of the miniaturized airborne transceiver assembly with efficient heat dissipation. The heat dissipation module with high heat dissipation effect can effectively dissipate the heat generated by the transmitting component, receiving component and control module, eliminating the need for additional heat dissipation components and effectively avoiding increasing the size and weight of the miniaturized airborne transceiver assembly with efficient heat dissipation. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 A schematic diagram of an embodiment of the miniaturized airborne transceiver assembly structure with efficient heat dissipation provided by this utility model;

[0020] Figure 2 for Figure 1 A schematic diagram of the structure from another perspective of the embodiment shown;

[0021] Figure 3 for Figure 1 A schematic diagram of the first partial structure of the embodiment shown;

[0022] Figure 4 for Figure 1 A schematic diagram of the second partial structure of the embodiment shown;

[0023] Figure 5 for Figure 1 A schematic diagram of the third partial structure of the embodiment shown;

[0024] Figure 6 for Figure 1 A schematic diagram of the fourth partial structure of the embodiment shown;

[0025] Figure 7 for Figure 1 A schematic diagram of the fifth partial structure of the embodiment shown;

[0026] Figure 8 for Figure 1 A cross-sectional view of the embodiment shown.

[0027] Explanation of icon numbers:

[0028] 100. Shell; 11. Upper shell; 111. Upper accommodating cavity; 112. First groove; 113. First sealing cover; 12. Lower shell; 121. Lower accommodating cavity; 122. Second groove; 123. Second sealing cover; 124. Third groove; 125. Third sealing cover; 13. Upper shell sealing cover plate; 14. Lower shell sealing cover plate; 15. Material reduction groove; 16. First wire passage hole; 17. Second wire passage hole;

[0029] 200. Heat dissipation module; 21. First heat dissipation component; 211. Heat dissipation fin assembly; 212. First fin assembly; 213. Second fin assembly; 214. Heat dissipation fin; 215. Cooling fan; 22. Second heat dissipation component; 221. Heat sink; 222. Thermally conductive buffer pad;

[0030] 300. Control module; 31. Signal transmission interface; 32. Power interface; 33. Data interface;

[0031] 400. Duplexer.

[0032] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] This invention proposes a miniaturized airborne transceiver assembly structure with efficient heat dissipation.

[0037] Please see Figures 1 to 8 In one embodiment of this utility model, the miniaturized airborne transceiver assembly structure with efficient heat dissipation includes:

[0038] The housing 100 includes an upper housing 11 having an upper accommodating cavity 111 and a lower housing 12 having a lower accommodating cavity 121. The upper housing 11 and the lower housing 12 are detachably connected. The upper accommodating cavity 111 is provided with a transmitting component, which abuts against the top plate of the upper housing 11. The lower accommodating cavity 121 is provided with a receiving component and a control module 300. The transmitting component, the receiving component, and the control module 300 are electrically connected, and the transmitting component and the receiving component are signal connected.

[0039] The heat dissipation module 200 includes a first heat dissipation component 21 disposed on the top plate of the upper housing 11 and a second heat dissipation component 22 disposed on the bottom plate of the lower housing 12. The first heat dissipation component 21 includes heat dissipation fins 211 disposed on the outside of the upper housing 11 and a heat dissipation fan 215 disposed corresponding to the transmitting component. The second heat dissipation component 22 includes heat dissipation fins 221 disposed on the inside of the housing 100. The heat dissipation fins 221 abut against the control module 300 and the lower housing 12.

[0040] The technical solution of this utility model adopts a layered design, so that the housing 100 has an upper accommodating cavity 111 and a lower accommodating cavity 121 to respectively accommodate the transmitting component that generates more heat during operation and the control module 300 and receiving component that generate less heat. The heat in the upper accommodating cavity 111 is dissipated through heat dissipation fins 214 and cooling fan 215, wherein the cooling fan 215 has the characteristics of large air volume and small size. The heat in the lower cavity is transferred to the bottom plate of the housing 100 through heat sink 221 for heat dissipation, so as to avoid the heat in the middle part of the housing 100, thereby ensuring the reliability of the miniaturized airborne transceiver assembly with efficient heat dissipation function and enhancing the heat dissipation effect of the miniaturized airborne transceiver assembly with efficient heat dissipation function. Since the control module 300 generates more heat than the receiving component in actual operation, the heat sink 221 mainly dissipates heat for the control module 300. Furthermore, the layered structure design can make full use of the space inside the housing 100, thereby reducing the volume of the miniaturized airborne transceiver assembly with efficient heat dissipation. The heat dissipation module 200 with high heat dissipation effect can effectively dissipate the heat generated by the transmitting component, receiving component and control module 300, eliminating the need for other heat dissipation components and effectively avoiding increasing the volume and weight of the miniaturized airborne transceiver assembly with efficient heat dissipation.

[0041] In one embodiment, a duplexer 400 is also provided within the upper housing 11. The duplexer 400 is signal-connected to the transmitting and receiving components, and the duplexer 400 and the transmitting component are arranged along the width or length of the upper housing 11. This arrangement helps to disperse heat sources. In miniaturized airborne transceiver assemblies with efficient heat dissipation, the duplexer 400 also generates heat due to signal processing. If their arrangement is unreasonable, it may lead to excessive heat concentration in local areas. For example, if the duplexer 400 and the transmitting component are tightly stacked together in the upper cavity 111, heat cannot be dissipated in time through the first heat dissipation component 21, forming a high-temperature area. Arranging them along the width or length increases the spacing between them, so that each component has a relatively independent heat dissipation space around it, reducing mutual heat interference. In other embodiments, the duplexer 400 may also be located in the lower cavity 121.

[0042] In one embodiment, the heat dissipation fins 211 include a first fin group 212 and a second fin group 213. The spacing between adjacent heat dissipation fins 214 in the first fin group 212 is smaller than the spacing between adjacent heat dissipation fins 214 in the second fin group 213. The first fin group 212 corresponds to the transmitting component, and the second fin group 213 corresponds to the duplexer 400. Since the transmitting component is the main heat-generating component in a miniaturized airborne transceiver assembly with efficient heat dissipation, the spacing between the heat dissipation fins 214 in the first fin group 212 is smaller to achieve optimal heat dissipation. The duplexer 400 generates less heat, and a larger spacing between the heat dissipation fins 214 in the second fin group 213 reduces the weight of the upper part while still providing sufficient heat dissipation. In other embodiments, the first fin group 212 and the second fin group 213 may be omitted, and the spacing between adjacent heat dissipation fins 214 on the upper housing 11 may be uniform.

[0043] In one embodiment, the second heat dissipation component 22 includes a thermally conductive buffer pad 222 sandwiched between the control module 300 and the heat sink 221. The thermally conductive buffer pad 222, sandwiched between the control module 300 and the heat sink 221, provides a direct, low-resistance path for heat conduction. The heat generated by the control module 300 during operation can be quickly and efficiently transferred to the heat sink 221 through the thermally conductive buffer pad 222, and then dissipated by the heat sink 221, greatly shortening the distance and time of heat conduction, reducing thermal resistance, and significantly improving heat dissipation efficiency. Furthermore, the thermally conductive buffer pad 222 typically has a certain degree of elasticity and flexibility, effectively buffering external mechanical impacts and vibrations on the control module 300, providing good protection for the control module 300. During equipment use, in the event of collisions, drops, or internal vibrations, the thermally conductive buffer pad 222 can absorb some energy, reducing the risk of damage to the control module 300 due to vibration and extending the service life of the control module 300. In other embodiments, the thermally conductive buffer pad 222 may not be provided.

[0044] In one embodiment, the top wall of the upper accommodating cavity 111 is provided with a first groove 112 with its opening facing downwards. The transmitting component is disposed in the first groove 112. The miniaturized airborne transceiver assembly structure with efficient heat dissipation also includes a first sealing cover 113, which covers the opening of the first groove 112. A shielding strip is sandwiched between the first sealing cover 113 and the first groove 112. The shielding strip sandwiched between the first sealing cover 113 and the first groove 112 can effectively fill the gap between them, providing good electromagnetic shielding performance. It can prevent external electromagnetic interference from entering the area where the transmitting component is located, ensuring the stable operation of the transmitting component, and at the same time, it can prevent the electromagnetic energy generated by the transmitting component during operation from leaking into the external environment, avoiding electromagnetic interference to other electronic devices or systems. Furthermore, the first sealing cover 113 and the upper housing 11 are made of conductive and magnetically conductive materials. The conductive and magnetically conductive materials of the first sealing cover 113 and the upper housing 11 can reflect, absorb, and attenuate electromagnetic waves. When electromagnetic waves encounter conductive and magnetic materials, some of the waves are reflected back, while others induce eddy currents and other electromagnetic effects within the material, leading to absorption and attenuation, further enhancing the shielding effect against electromagnetic interference. This material property, together with the shielding strip, constitutes a multi-layered electromagnetic shielding structure, significantly improving the electromagnetic compatibility of the miniaturized airborne transceiver assembly with efficient heat dissipation. The first sealing cover 113 is positioned over the groove opening and, like the upper housing 11, is made of conductive and magnetic materials. Combined with the presence of the shielding strip, this ensures a complete and continuous electromagnetic shielding structure in the area where the transmitting component is located. There are no weak points or loopholes in the electromagnetic shielding, ensuring the reliability of the shielding effect. Even in complex electromagnetic environments, the miniaturized airborne transceiver assembly with efficient heat dissipation can maintain normal operation and stable performance. Furthermore, although the primary function of the shielding strip is to provide electromagnetic shielding and sealing, it is not completely heat-insulating. To a certain extent, the shielding strip can act as a heat conductor, transferring some of the heat generated by the transmitting component during operation. The first sealing cover 113 and the upper housing 11 are made of conductive and magnetic materials, which typically have good thermal conductivity. Materials with good thermal conductivity can more effectively conduct internal heat to the outside, promoting heat dissipation. For example, when a miniaturized airborne transceiver assembly with efficient heat dissipation is in operation, the heat generated by the transmitting component can be quickly conducted through the conductive and magnetic materials of the first sealing cover 113 and the upper housing 11, and then dissipated to the outside, reducing the accumulation of heat inside, thereby lowering the temperature of the transmitting component and improving its operational stability and reliability.

[0045] In one embodiment, the top wall of the lower accommodating cavity 121 is provided with a second groove 122 with its opening facing downwards. The receiving component is disposed in the second groove 122. The miniaturized airborne transceiver assembly structure with efficient heat dissipation also includes a second sealing cover 123, which covers the opening of the second groove 122. A shielding strip is sandwiched between the second sealing cover 123 and the second groove 122. The miniaturized airborne transceiver assembly structure with efficient heat dissipation also includes a power module and a third sealing cover 125. The top wall of the lower accommodating cavity 121 is also provided with a third groove 124 with its opening facing downwards. The power module is disposed in the third groove 124, and the third sealing cover 125 covers the opening of the third groove 124. A shielding strip is sandwiched between the third sealing cover 125 and the third groove 124. The second sealing cover 123, the third sealing cover 125, and the lower housing 12 are all made of conductive and magnetic materials. In other words, the lower housing 12 employs the same electromagnetic shielding structure as the upper housing 11 to electromagnetically shield the receiving component and power module. The miniaturized airborne transceiver assembly with efficient heat dissipation contains various interference sources, such as the transmitting component and power module. Electromagnetic shielding prevents the receiving component from electromagnetic interference from other internal components, ensuring its normal operation and thus improving the overall performance and stability of the miniaturized airborne transceiver assembly with efficient heat dissipation. The electromagnetic shielding structure helps reduce the bit error rate and noise of the signal, improving the signal-to-noise ratio, thereby improving the quality of the signal received by the receiving component, making the received signal clearer, more stable, and more reliable—crucial for the performance of communication equipment. The power module generates electromagnetic interference during operation, which may affect the normal operation of other components within the miniaturized airborne transceiver assembly with efficient heat dissipation, such as the receiving and transmitting components. Electromagnetic shielding effectively suppresses the electromagnetic interference generated by the power module, reducing its impact on other components and ensuring the stable operation of the miniaturized airborne transceiver assembly with efficient heat dissipation.

[0046] In one embodiment, the housing 100 further includes an upper housing sealing cover 13 and a lower housing sealing cover 14. The upper and lower housing sealing covers are respectively disposed on the lower side surfaces of the upper housing 11 and the lower housing 12, and together with the upper housing 11, they enclose the upper receiving cavity 111 and the lower receiving cavity 121. Further, both the upper housing sealing cover 13 and the lower housing sealing cover 14 are made of conductive and magnetically conductive materials. The upper housing sealing cover 13 and the lower housing sealing cover 14 are made of conductive and magnetically conductive materials and are respectively disposed on the lower side surfaces of the upper housing 11 and the lower housing 12, together with the housing 100, forming the upper and lower receiving cavities 121. This design allows the receiving cavities to form a relatively closed space. Combined with internal electromagnetic shielding measures such as shielding strips, this constitutes a complete electromagnetic shielding cover, further improving the electromagnetic shielding effect on the internal components, more effectively blocking external electromagnetic interference from entering the receiving cavity, and preventing the electromagnetic energy generated by the internal components from leaking to the external environment. The upper shell sealing cover 13 and the lower shell sealing cover 14 can serve as heat conduction paths, transferring heat generated by the internal components of the accommodating cavity to the external environment. This helps reduce the temperature of the internal components, improves heat dissipation efficiency, and ensures stable operation of the equipment. Furthermore, the first sealing cover 113 and the first groove 112, the second sealing cover 123 and the second groove 122, the third sealing cover 125 and the third groove 124, the upper shell sealing cover 13 and the upper shell 11, and the lower shell sealing cover 14 and the lower shell 12 are all fixedly connected by multiple screws. The more screws used for connection, the smaller the fit gap between the connected components, effectively enhancing the electromagnetic shielding effect. In other embodiments, the upper shell sealing cover 13 and the lower shell sealing cover 14 may not be made of conductive or magnetically conductive materials.

[0047] In one embodiment, the lower housing 12 is further provided with a signal transmission interface 31, a power interface 32, and a data interface 33. The signal transmission interface 31, the power interface 32, and the data interface 33 are all electrically connected to the control module 300, and are then electrically connected to the receiving component, the power module, and the transmitting component through the control module 300.

[0048] In one embodiment, the first sealing cover 113, the second sealing cover 123, the third sealing cover 125, the upper shell sealing cover plate 13, and the lower shell sealing cover plate 14 are all provided with material reduction grooves 15. The material reduction grooves 15 can effectively reduce the production material of the upper shell 11 and the lower shell 12, and can also reduce the weight of the miniaturized airborne transceiver assembly structure with efficient heat dissipation function.

[0049] In one embodiment, the top plate of the lower housing 12 and the upper housing cover are respectively provided with a first wire passage hole 16 and a second wire passage hole 17 to connect the upper accommodating cavity 111 and the lower accommodating cavity 121. The first wire passage hole 16 and the second wire passage hole 17 are used to allow connecting wires to pass through, and the wires are used to electrically connect the transmitting component and duplexer 400 in the upper accommodating cavity 111 with the control module 300, receiving module and power supply module in the lower accommodating cavity 121.

[0050] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A miniaturized airborne transceiver assembly structure with efficient heat dissipation, characterized in that, include: The housing includes an upper housing with an upper accommodating cavity and a lower housing with a lower accommodating cavity, the upper housing and the lower housing being detachably connected, a transmitting component being disposed in the upper accommodating cavity and abutting against the top plate of the upper housing, a receiving component and a control module being disposed in the lower accommodating cavity, the transmitting component, the receiving component and the control module being electrically connected, and the transmitting component and the receiving component being signal connected; The heat dissipation module includes a first heat dissipation assembly disposed on the top plate of the upper housing and a second heat dissipation assembly disposed on the bottom plate of the lower housing. The first heat dissipation assembly includes a heat dissipation fin group and a heat dissipation fan disposed on the outer side of the upper housing. The heat dissipation fan is disposed corresponding to the emission assembly. The second heat dissipation assembly includes a heat dissipation fin disposed on the inner side of the housing. The heat dissipation fin abuts against the control module and the lower housing.

2. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 1, characterized in that, The upper housing is also provided with a duplexer, which is signal-connected to the transmitting component and the receiving component, and the duplexer and the transmitting component are arranged in the upper housing along the width or length direction of the upper housing.

3. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 2, characterized in that, The heat dissipation fin group includes a first fin group and a second fin group. The spacing between adjacent heat dissipation fins in the first fin group is smaller than the spacing between adjacent heat dissipation fins in the second fin group. The first fin group is configured to correspond to the transmitting component, and the second fin group is configured to correspond to the duplexer.

4. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 3, characterized in that, The second heat dissipation component includes a thermally conductive buffer pad sandwiched between the control module and the heat sink.

5. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 1, characterized in that, The upper accommodating cavity has a first groove with its opening facing downward on its top wall. The transmitting component is located in the first groove. The miniaturized airborne transceiver assembly with efficient heat dissipation function also includes a first sealing cover. The first sealing cover is located on the opening of the first groove, and a shielding strip is sandwiched between the first sealing cover and the first groove.

6. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 5, characterized in that, The lower accommodating cavity has a second groove with its opening facing downward on its top wall. The receiving component is located in the second groove. The miniaturized airborne transceiver assembly with efficient heat dissipation also includes a second sealing cover. The second sealing cover is located at the opening of the second groove, and the shielding strip is sandwiched between the second sealing cover and the second groove.

7. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 6, characterized in that, The miniaturized airborne transceiver assembly with efficient heat dissipation also includes a power module and a third sealing cover. The top wall of the lower accommodating cavity is provided with a third groove with its opening facing downward. The power module is located in the third groove, and the third sealing cover is located at the opening of the third groove. The shielding strip is sandwiched between the third sealing cover and the third groove.

8. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 7, characterized in that, The housing also includes an upper housing sealing cover and a lower housing sealing cover. The upper housing sealing cover and the lower housing sealing cover are respectively installed on the lower side of the upper housing and the lower side of the lower housing, and respectively enclose the upper accommodating cavity and the lower accommodating cavity with the upper housing.

9. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 8, characterized in that, The first sealing cover, the second sealing cover, the third sealing cover, the upper shell sealing cover plate, and the lower shell sealing cover plate are all made of conductive and magnetic materials. And / or, the first sealing cover, the second sealing cover, the third sealing cover, the upper shell sealing cover plate and the lower shell sealing cover plate are all provided with material reduction grooves.

10. The miniaturized airborne transceiver assembly structure with efficient heat dissipation as described in claim 8, characterized in that, The top plate of the lower housing and the cover plate of the upper housing are respectively provided with a first wire passage hole and a second wire passage hole to connect the upper accommodating cavity and the lower accommodating cavity.

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