Backboard structure of multi-layer waterproof adhesive layer and communication equipment

Abstract

This disclosure provides a multi-layer waterproof adhesive backplane structure and a communication device. The multi-layer waterproof adhesive backplane structure includes a backplane body, a waterproof adhesive layer, an adhesive layer at the bonding points, an insulating tape layer, a retaining ring, and a module cover. The backplane body has a module mounting groove with a camera through-hole inside. The waterproof adhesive layer is applied along the periphery of the camera through-hole, and an insulating tape layer is disposed on the outer edge of the waterproof adhesive layer, contacting the edge of the waterproof adhesive layer. The adhesive layer at the bonding points is disposed along the edge of the module mounting groove, and the module cover is installed in the module mounting groove. The retaining ring is disposed between the insulating tape layer and the module cover. A multi-layer sealing system is constructed through the waterproof adhesive layer, the outer insulating tape layer, and the adhesive layer at the edge of the module mounting groove, improving waterproof sealing performance. The retaining ring presses the insulating tape layer, ensuring a tight fit between the insulating tape layer and the backplane body, further improving waterproof sealing and durability.

Description

Technical Field

[0001] This disclosure relates to the technical field of backplane manufacturing, and in particular to a backplane structure with a multi-layer waterproof adhesive layer and a communication device. Background Technology

[0002] As competition in the smartphone market intensifies, consumers are increasingly demanding higher durability and water resistance from high-end smartphones. The camera module is a key functional area on the back of the phone, and its installation location involves optical components, circuit connections, and mechanical openings, thus requiring a high level of waterproof sealing.

[0003] Currently, when a single layer of adhesive is used to seal between the module and the backplate, the single layer of adhesive is prone to cracking or peeling off from the contact surface due to stress concentration caused by temperature changes or mechanical stress. This can lead to the sealing of the camera module's mounting holes, which is prone to sealing failure over long-term use and cannot meet the waterproof performance requirements of the camera module.

[0004] For example, prior art document CN202020659685.1 discloses a high-protection mobile phone case back panel, including a body protective component and a lens protective component. The body protective component includes a back panel body, with a corresponding protective flange extending upwards along the outer edge of the back panel body. The lens protective component includes a lens protection plate, which is integrally mounted on the back panel body. A corresponding baffle flange is provided between the lens protection plate and the back panel body. When the back panel body and the lens protection plate are bonded together with a single layer of adhesive, long-term use under temperature changes or mechanical stress may lead to a risk of seal failure. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a backplate structure and communication equipment with a multi-layer waterproof adhesive layer that has better waterproof sealing and durability.

[0006] The purpose of this disclosure is achieved through the following technical solution: A multi-layer waterproof adhesive backplate structure includes a backplate body, a waterproof adhesive layer, an adhesive layer at the bonding point, an insulating tape layer, a retaining ring, and a module cover. The backplate body has a module mounting groove, and a camera through hole is provided in the module mounting groove. The waterproof adhesive layer is applied along the periphery of the camera through hole. An insulating tape layer is provided on the outer edge of the waterproof adhesive layer. The insulating tape layer is in contact with the edge of the waterproof adhesive layer. The adhesive layer is provided along the edge of the module mounting groove. The module cover is installed in the module mounting groove. The retaining ring is provided between the insulating tape layer and the module cover. The retaining ring is pressed against the insulating tape layer.

[0007] In one embodiment, the back panel body is further provided with a power connection hole, and part of the insulating tape layer covers the power connection hole.

[0008] In one embodiment, the insulating tape layer has a first positioning hole, the back plate body has a second positioning hole, and the module cover has a positioning protrusion, which passes through the first positioning hole and the second positioning hole in sequence.

[0009] In one embodiment, the back panel body includes an outer texture layer, a composite board layer, a graphic layer, a liquid crystal composite layer, an electroplating layer, and a cover ink layer stacked sequentially.

[0010] In one embodiment, the liquid crystal composite layer includes a transfer adhesive layer, a gradient liquid crystal layer, and a transfer layer stacked sequentially.

[0011] In one embodiment, the thickness of the transfer adhesive layer is 10μm-20μm, the thickness of the gradient liquid crystal layer is 10μm-15μm, and the thickness of the transfer layer is 10μm-15μm.

[0012] In one embodiment, the adhesive layer at the bonding point is an epoxy resin adhesive layer or an acrylic adhesive layer.

[0013] In one embodiment, the waterproof adhesive layer is a polyurethane waterproof adhesive layer or a silicone rubber waterproof adhesive layer.

[0014] In one embodiment, the insulating tape layer is a polyimide film tape layer or a polyester film tape layer.

[0015] A communication device includes a mobile phone frame and a back panel structure comprising the multi-layer waterproof adhesive layer described in any of the above embodiments, wherein the multi-layer waterproof adhesive layer back panel structure is mounted on the mobile phone frame.

[0016] Compared with the prior art, this disclosure has at least the following advantages: The aforementioned multi-layer waterproof adhesive backplate structure, through the waterproof adhesive layer around the camera through-hole, the outer insulating tape layer, and the adhesive layer at the edge of the module mounting groove, constructs a multi-layer sealing system, improving waterproof sealing performance and effectively preventing moisture from seeping into the inner side of the backplate through the camera module openings and seams. The retaining ring is set between the insulating tape layer and the module cover. By pressing the insulating tape layer with the retaining ring, the retaining ring compensates for the shrinkage or slight aging of the insulating tape layer during long-term use, ensuring that the insulating tape layer is tightly attached to the backplate body, thereby improving the waterproof sealing and durability of the multi-layer waterproof adhesive backplate structure. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a backplate structure with a multi-layer waterproof adhesive layer according to an embodiment. Figure 2 for Figure 1 An exploded view of the multi-layer waterproof adhesive backing structure shown. Figure 3 for Figure 1 A partial cross-sectional view of the multi-layer waterproof adhesive layer shown; Figure 4 for Figure 1 The diagram shows a partial structural diagram of the multi-layer waterproof adhesive layer. Figure 5 for Figure 1 The diagram shows the hierarchical structure of the main back panel. Figure 6 for Figure 1 The diagram shows another layer of the back panel structure. Detailed Implementation

[0019] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments: like Figures 1 to 3 As shown, it is a multi-layer waterproof adhesive backplate structure 10 according to an embodiment of the present disclosure. The multi-layer waterproof adhesive backplate structure 10 includes a backplate body 100, a waterproof adhesive layer 200, an adhesive layer 300, an insulating tape layer 400, a pressure ring 500, and a module cover 600. The backplate body 100 has a module mounting groove 101, and a camera through hole 102 is provided in the module mounting groove 101.

[0023] Furthermore, the waterproof adhesive layer 200 is coated along the periphery of the camera through hole 102, and an insulating tape layer 400 is provided on the outer edge of the waterproof adhesive layer 200. The insulating tape layer 400 contacts the edge of the waterproof adhesive layer 200. The adhesive layer 300 is provided along the edge of the module mounting groove 101. The module cover 600 is installed in the module mounting groove 101. The retaining ring 500 is disposed between the insulating tape layer 400 and the module cover 600, and the retaining ring 500 presses against the insulating tape layer 400.

[0024] In this embodiment, the backplate body 100 is used to support and install components, and the module mounting groove 101 is used to precisely accommodate and fix the camera module; the waterproof adhesive layer 200 acts as a core waterproof layer to seal the gap between the camera module and the backplate body 100, preventing moisture intrusion; the insulating tape layer 400 is used for electrical insulation and forms a second waterproof barrier; the adhesive layer 300 firmly bonds the module cover 600 to the module mounting groove 101, and at the same time, the adhesive layer 300 forms a seal on the periphery of the camera module; the module cover 600 presses the retaining ring 500 and the insulating tape layer 400 onto the backplate body 100.

[0025] The aforementioned multi-layer waterproof adhesive backplate structure 10, through the waterproof adhesive layer 200 set around the camera through hole 102, the outer insulating tape layer 400, and the adhesive layer 300 at the edge of the module mounting groove 101, constructs a multi-layer sealing system, which improves the waterproof sealing performance and effectively prevents water vapor from seeping into the inner side of the backplate through the camera module opening and seam. The retaining ring 500 is set between the insulating tape layer 400 and the module cover 600. By retaining the insulating tape layer 400, the retaining ring 500 compensates for the shrinkage or slight aging of the insulating tape layer 400 during long-term use, ensuring that the insulating tape layer 400 is tightly attached to the backplate body 100, thereby improving the waterproof sealing and durability of the multi-layer waterproof adhesive backplate structure 10.

[0026] like Figure 2 and Figure 4As shown, in one embodiment, the back panel body 100 also has a power connection hole 103, and a portion of the insulating tape layer 400 covers the power connection hole 103. In this embodiment, a connecting wire needs to pass through the power connection hole 103. By extending the insulating tape layer 400 partially through the power connection hole 103, direct contact between the connecting wire and the back panel body 100 at the power connection hole 103 is prevented, thereby improving the electrical insulation at the location of the power connection hole 103.

[0027] like Figure 2 As shown, in one embodiment, the insulating tape layer 400 has a first positioning hole 401, the back plate body 100 has a second positioning hole 104, and the module cover 600 has a positioning protrusion 610. The positioning protrusion 610 passes through the first positioning hole 401 and the second positioning hole 104 in sequence. In this embodiment, the positioning protrusion 610, the first positioning hole 401, and the second positioning hole 104 cooperate to ensure that the position of the insulating tape layer 400 relative to the back plate body 100 is accurate, avoiding misalignment of the insulating tape layer 400 and ensuring that the pressure ring 500 can be accurately pressed into the predetermined position of the insulating tape layer 400. At the same time, the positioning protrusion 610 guides the installation position of the module cover 600, improving the installation stability of the module cover 600 and the back plate body 100.

[0028] like Figure 5 As shown, in one embodiment, the back panel body 100 includes a textured outer layer 110, a composite board layer 120, a graphic layer 130, a liquid crystal composite layer 140, an electroplating layer 150, and a cover ink layer 160 stacked sequentially. In this embodiment, the liquid crystal composite layer 140 enables the back panel body 100 to form a gradient pattern with rich colors and natural transitions. The textured outer layer 110 is cured with UV acrylic resin, which can effectively protect the underlying layers and prevent scratches and wear. The graphic layer 130 is an ink layer for printing logo information. The composite board layer 120 is used to provide structural rigidity. The electroplating layer 150 is used to provide a metallic texture. The cover ink layer 160 is used for bottom coating and light shielding.

[0029] like Figure 5 As shown, in one embodiment, the liquid crystal composite layer 140 includes a transfer adhesive layer 141, a gradient liquid crystal layer 142, and a transfer layer 143 stacked sequentially. In this embodiment, the gradient liquid crystal layer 142 is used to form a gradient pattern with rich colors and natural transitions; the transfer adhesive layer 141 is used to transfer and attach the gradient liquid crystal layer 142 to the composite board layer 120; and the transfer layer 143 is used to improve the adhesion between the gradient liquid crystal layer 142 and the electroplated layer 150. like Figure 5 and Figure 6As shown, in one embodiment, the thickness of the transfer adhesive layer 141 is 10μm-20μm, the thickness of the gradient liquid crystal layer 142 is 10μm-15μm, and the thickness of the transfer layer 143 is 10μm-15μm. In this embodiment, the thickness of the outer texture layer 110 is 6μm-12μm; the thickness of the pattern layer 130 is 3μm-5μm; the thickness of the composite board layer 120 is 0.4mm-0.8mm; the thickness of the electroplating layer 150 is 300nm-450nm; the thickness of the cover ink layer 160 is 30μm-40μm; the thickness of the transfer adhesive layer 141 is, but not limited to, 15μm; the thickness of the gradient liquid crystal layer 142 is, but not limited to, 12μm; and the thickness of the transfer layer 143 is, but not limited to, 15μm. Further, the specific process flow is as follows: composite board → logo → adhesive transfer of pattern liquid crystal → transfer electroplating → cover → imprinting outer texture → CNC.

[0030] In one embodiment, the adhesive layer 300 is an epoxy resin adhesive layer or an acrylic adhesive layer. In this embodiment, the epoxy resin adhesive layer provides extremely high bonding strength and chemical resistance, ensuring a firm connection between the module cover 600 and the backplate body 100. The acrylic adhesive layer combines high strength and toughness with a fast curing speed, further enhancing the firm connection between the module cover 600 and the backplate body 100.

[0031] In one embodiment, the waterproof adhesive layer 200 is a polyurethane waterproof adhesive layer 200 or a silicone rubber waterproof adhesive layer 200. In this embodiment, the polyurethane waterproof adhesive layer has excellent abrasion resistance, flexibility, and high adhesion, and the cured adhesive layer has good elasticity and strength. The silicone rubber waterproof adhesive has good high and low temperature resistance. The waterproof adhesive layer 200 provides durable and reliable sealing and waterproof performance.

[0032] In one embodiment, the insulating tape layer 400 comprises at least one of polyimide film tape, polyester film tape, or silicone tape. In this embodiment, the polyimide film tape has a wide operating temperature range and excellent electrical insulation strength and outstanding mechanical strength, while the polyester film tape, such as Mylar, provides good electrical insulation, high mechanical strength, and excellent chemical resistance.

[0033] This application also provides a communication device, a mobile phone frame, and a backplate structure 10 including the multi-layer waterproof adhesive layer described in any of the above embodiments. The multi-layer waterproof adhesive layer backplate structure 10 is installed on the mobile phone frame. In this embodiment, the multi-layer waterproof adhesive layer backplate structure 10 forms a reliable multi-layer sealing structure at the mounting position of the camera module, improving the waterproof performance of the communication device and thus enhancing its adaptability and service life in humid environments.

[0034] Compared with the prior art, this disclosure has at least the following advantages: The aforementioned multi-layer waterproof adhesive backplate structure 10, through the waterproof adhesive layer 200 set around the camera through hole 102, the outer insulating tape layer 400, and the adhesive layer 300 at the edge of the module mounting groove 101, constructs a multi-layer sealing system, which improves the waterproof sealing performance and effectively prevents water vapor from seeping into the inner side of the backplate through the camera module opening and seam. The retaining ring 500 is set between the insulating tape layer 400 and the module cover 600. By retaining the insulating tape layer 400, the retaining ring 500 compensates for the shrinkage or slight aging of the insulating tape layer 400 during long-term use, ensuring that the insulating tape layer 400 is tightly attached to the backplate body 100, thereby improving the waterproof sealing and durability of the multi-layer waterproof adhesive backplate structure 10.

[0035] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A back panel structure with multiple waterproof adhesive layers, characterized in that, It includes a back plate body, a waterproof adhesive layer, an adhesive layer, an insulating tape layer, a retaining ring, and a module cover. The back plate body has a module mounting groove, and a camera through hole is provided in the module mounting groove. The waterproof adhesive layer is applied along the periphery of the camera through hole. An insulating tape layer is provided on the outer edge of the waterproof adhesive layer. The insulating tape layer is in contact with the edge of the waterproof adhesive layer. The adhesive layer is provided along the edge of the module mounting groove. The module cover is installed in the module mounting groove. The retaining ring is provided between the insulating tape layer and the module cover. The retaining ring is pressed against the insulating tape layer.

2. The backplate structure with a multi-layer waterproof adhesive layer according to claim 1, characterized in that, The back panel body also has an electrical connection hole, and part of the insulating tape layer covers the electrical connection hole.

3. The backplate structure with a multi-layer waterproof adhesive layer according to claim 1, characterized in that, The insulating tape layer has a first positioning hole, the back plate body has a second positioning hole, and the module cover has a positioning protrusion. The positioning protrusion passes through the first positioning hole and the second positioning hole in sequence.

4. The back panel structure with a multi-layer waterproof adhesive layer according to claim 1, characterized in that, The back panel body comprises, in sequence, an outer texture layer, a composite board layer, a graphic layer, a liquid crystal composite layer, an electroplating layer, and a cover ink layer.

5. The backplate structure with a multi-layer waterproof adhesive layer according to claim 4, characterized in that, The liquid crystal composite layer comprises a transfer adhesive layer, a gradient liquid crystal layer, and a transfer layer stacked sequentially.

6. The backplate structure with a multi-layer waterproof adhesive layer according to claim 5, characterized in that, The thickness of the transfer adhesive layer is 10μm-20μm, the thickness of the gradient liquid crystal layer is 10μm-15μm, and the thickness of the transfer layer is 10μm-15μm.

7. The back panel structure with a multi-layer waterproof adhesive layer according to claim 1, characterized in that, The adhesive layer at the bonding point is an epoxy resin adhesive layer or an acrylic adhesive layer.

8. The back panel structure with a multi-layer waterproof adhesive layer according to claim 1, characterized in that, The waterproof adhesive layer is a polyurethane waterproof adhesive layer or a silicone rubber waterproof adhesive layer.

9. The backplate structure with a multi-layer waterproof adhesive layer according to claim 1, characterized in that, The insulating tape layer is a polyimide film tape layer or a polyester film tape layer.

10. A communication device, characterized in that, A mobile phone mid-frame and a back panel structure including a multi-layer waterproof adhesive layer as described in any one of claims 1-9, wherein the multi-layer waterproof adhesive layer back panel structure is mounted on the mobile phone mid-frame.

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