Integrated eis optical image stabilization camera module, control circuit thereof and electronic device

Abstract

The utility model relates to an integrated EIS optical anti -shake camera module and control circuit, electronic equipment, including sensor module, MCU control module, drive module, storage module, motor module and gyroscope module, MCU control module is connected with sensor module, drive module, storage module and gyroscope module electricity respectively, the drive module includes X axle drive chip U8, Y axle drive chip U9 and Z axle drive chip U3, X axle drive chip U8, Y axle drive chip U9 and Z axle drive chip U3 are connected with motor module respectively. The utility model can reduce integrated EIS optical anti -shake camera module's overall hardware cost.

Description

Technical Field

[0001] This utility model relates to the field of camera module technology, specifically to an integrated EIS optical image stabilization camera module and its control circuit and electronic equipment. Background Technology

[0002] In the consumer electronics field, image stabilization camera modules have become one of the core components of devices such as smartwatches and smartphones. By adjusting the position of the lens or image sensor in real time, they can counteract the impact of device shake on image quality and effectively improve the clarity of the shot.

[0003] Most current mainstream optical image stabilization solutions use a single driver chip to simultaneously control the lens's X, Y, and Z axes. To meet the requirements of multi-axis synchronous drive, this type of single driver chip needs to integrate complex multi-channel drive circuits, signal processing units, and power control modules, which significantly increases the difficulty of chip development and the complexity of manufacturing processes, directly driving up the chip's procurement cost.

[0004] Therefore, it is necessary to develop a new integrated EIS optical image stabilization camera module and its control circuit and electronic equipment. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated EIS optical image stabilization camera module and its control circuit and electronic equipment, so as to reduce the overall hardware cost of the integrated EIS optical image stabilization camera module.

[0006] In a first aspect, the control circuit of the integrated EIS optical image stabilization camera module of this utility model includes a sensor module, an MCU control module, a drive module, a storage module, a motor module and a gyroscope module, wherein the MCU control module is electrically connected to the sensor module, the drive module, the storage module and the gyroscope module respectively. The drive module includes an X-axis drive chip U8, a Y-axis drive chip U9, and a Z-axis drive chip U3. The X-axis drive chip U8, Y-axis drive chip U9, and Z-axis drive chip U3 are respectively connected to the motor module.

[0007] Optionally, the X-axis drive chip U8 and the Y-axis drive chip U9 are both AW86033A, and the Z-axis drive chip U3 is AW86016. The SDA pin of the X-axis drive chip U8 is connected to pin 4 of the voltage conversion chip U7 of the MCU control module, and the SCL pin of the X-axis drive chip U8 is connected to pin 3 of the voltage conversion chip U7. The SDA pin of the Y-axis drive chip U9 is connected to pin 4 of the voltage conversion chip U7, and the SCL pin of the Y-axis drive chip U9 is connected to pin 3 of the voltage conversion chip U7. The SDA pin of the Z-axis drive chip U3 is connected to pin 4 of the voltage conversion chip U7, and the SCL pin of the Z-axis drive chip U9 is connected to pin 3 of the voltage conversion chip U7.

[0008] Optionally, the sensor module includes a photosensitive chip U1, capacitors C1 to C6, and capacitors C18 to C20. The photosensitive chip U1 is model OV08D10-GA5A-001A. The AVDD pin of the photosensitive chip U1 is grounded through capacitor C4, the VH pin of the photosensitive chip U1 is grounded through capacitor C1, the VN1 pin of the photosensitive chip U1 is grounded through capacitor C2, the VN2 pin of the photosensitive chip U1 is grounded through capacitor C3, the DOVDD pin of the photosensitive chip U1 is grounded through capacitor C5, and the DVDD pin of the photosensitive chip U1 is grounded through capacitor C6. Furthermore, capacitors C18, C19, and C20 are connected in parallel with capacitor C6.

[0009] Optionally, the MCU control module includes a microcontroller U5, a voltage conversion chip U7, resistors R1 to R6, capacitors C10 to C17, and capacitor C21. The microcontroller U5 is an STM32L432KCU6TR. The STM_VDD2.8 pin of the microcontroller U5 is grounded through capacitor C17, and capacitors C11 to C17 are connected in parallel. The voltage conversion chip U7, model PCA9306DCUR, is used for level conversion. Pin 5 of the voltage conversion chip U7 is connected to the STM_SDA pin of the microcontroller U5, and pin 6 of the voltage conversion chip U7 is connected to the STM_SCL pin of the microcontroller U5. Pins 7 and 8 of the voltage conversion chip U7 are connected, and the connection point between pins 7 and 8 of the voltage conversion chip U7 is connected to the STM_VDD2.8 pin of the microcontroller U5 via resistor R2. The connection point between pins 7 and 8 of the voltage conversion chip U7 is also connected via capacitor. C21 is connected to DGND; one end of resistor R3 is connected to resistor R2, and the other end of resistor R3 is connected to the STM_SDA pin of microcontroller U5; one end of resistor R4 is connected to resistor R2, and the other end of resistor R4 is connected to the STM_SCL pin of microcontroller U5; one end of resistor R5 is connected to resistor R2, and the other end of resistor R5 is connected to the STM_OISSCL pin of microcontroller U5; one end of resistor R6 is connected to resistor R2, and the other end of resistor R6 is connected to the STM_OISSDA pin of microcontroller U5.

[0010] Optionally, the storage module includes a storage chip U2, the storage chip U2 being model P24C128F-D4H-MIR, and the SCL pin of the storage chip U2 being connected to pin 3 of the voltage conversion chip U7 of the MCU control module, the SCL pin of the X-axis drive chip U8, the SCL pin of the Y-axis drive chip U9, and the SCL pin of the Z-axis drive chip U3, respectively. The SDA pin of the storage chip U2 is connected to pin 4 of the voltage conversion chip U7, the SDA pin of the X-axis drive chip U8, the SDA pin of the Y-axis drive chip U9, and the SDA pin of the Z-axis drive chip U3, respectively.

[0011] Optionally, the motor module includes a motor chip U6, a capacitor C9, a capacitor C22, and a capacitor C23; The AFVDD pin of the motor chip U6 is connected to AFGND via capacitor C9, the AFVDD pin of the motor chip U6 is also connected to AFGND via capacitor C22, and the AFVDD pin of the motor chip U6 is also connected to AFGND via capacitor C23. The OUTN-Z pin of the motor chip U6 is connected to the OUTN pin of the Z-axis drive chip U3, and the OUTP-Z pin of the motor chip U6 is connected to the OUTP pin of the Z-axis drive chip U3. The OUTN-X pin of the motor chip U6 is connected to the OUT1 pin of the X-axis drive chip U8, and the OUTP-X pin of the motor chip U6 is connected to the OUT2 pin of the X-axis drive chip U8. The OUTN-Y pin of the motor chip U6 is connected to the OUT1 pin of the Y-axis drive chip U9, and the OUTP-Y pin of the motor chip U6 is connected to the OUT2 pin of the Y-axis drive chip U9.

[0012] Optionally, the gyroscope module includes a gyroscope chip U4, a capacitor C7, and a capacitor C8, wherein the gyroscope chip U4 is of model LSM6DSOETR; The VDDIO pin of the gyroscope chip U4 is grounded through capacitor C7, and the VDDIO pin of the gyroscope chip U4 is also connected to the STM_VDD2.8 pin of the microcontroller U5 of the MCU control module. The VDD pin of the gyroscope chip U4 is grounded through capacitor C8, and the VDD pin of the gyroscope chip U4 is also connected to the STM_VDD2.8 pin of the microcontroller U5. The SDX pin of the gyroscope chip U4 is connected to the STM_MISO pin of the microcontroller U5, the SCX pin of the gyroscope chip U4 is connected to the STM_CLK pin of the microcontroller U5, and the CSB pin of the gyroscope chip U4 is connected to the STM_CS pin of the microcontroller U5.

[0013] Secondly, the integrated EIS optical image stabilization camera module of this utility model adopts the control circuit of the integrated EIS optical image stabilization camera module as described in this utility model.

[0014] Thirdly, the present invention provides an electronic device that employs the integrated EIS optical image stabilization camera module as described in the present invention.

[0015] Optionally, the electronic device is a smartwatch.

[0016] This utility model has the following advantages: 1. Significantly reduces costs, balancing economy and practicality. This invention employs a design with three independent driving chips, replacing the traditional single multi-axis driving chip with X-axis driving chip U8, Y-axis driving chip U9 (both model AW86033A), and Z-axis driving chip U3 (model AW86016). These three chips are single-axis / specific-axis driving chips with simple functions, making them easier to develop and produce. Their market procurement cost is far lower than that of high-end driving chips integrating multi-axis functions. While ensuring image stabilization performance, this significantly reduces the overall hardware cost of the integrated EIS optical image stabilization camera module, better meeting the cost control requirements of consumer electronics devices. 2. Improve module reliability and reduce maintenance risks. Each of the three driver chips is independently responsible for driving a single axis, and the driving functions between axes do not interfere with each other. If a driver chip fails, only the faulty chip needs to be replaced to restore the image stabilization function of the corresponding axis, without scrapping the entire module, effectively reducing the maintenance cost and scrap rate of the camera module. At the same time, the circuit structure of the single-axis driver chip is simpler and the stability during operation is higher, reducing signal interference or functional conflicts caused by multi-axis integration, and improving the long-term reliability of the entire integrated EIS optical image stabilization camera module.

[0017] 3. Ensure image stabilization performance and achieve precise multi-axis adjustment. The MCU control module controls the operation of three drive chips, which, combined with real-time jitter data collected by the gyroscope module, can precisely drive the motor to move the lens to complete displacement compensation in the X, Y, and Z directions. Each axis drive is independent and responds quickly, effectively counteracting jitter in different directions, ultimately achieving image stabilization comparable to traditional multi-axis drive chips, ensuring that the captured video or photos remain clear and stable. Attached Figure Description

[0018] Figure 1 This is a schematic block diagram of the control circuit of the integrated EIS optical image stabilization camera module in the embodiments of this application; Figure 2 This is a circuit diagram of the image sensor module in an embodiment of this application; Figure 3 This is a circuit diagram of the MCU control module in an embodiment of this application; Figure 4 This is a circuit diagram of the gyroscope module in an embodiment of this application; Figure 5 This is a circuit diagram of the EEPROM storage module in an embodiment of this application; Figure 6 This is a circuit diagram of the driving module in an embodiment of this application; Figure 7 This is a circuit diagram of the motor module in an embodiment of this application; Figure 8 This is a circuit diagram of the connector in an embodiment of this application; Figure 9 This is a schematic diagram of the integrated EIS optical image stabilization camera module in the embodiments of this application.

[0019] Figure 9 The following are the reference numerals in the attached diagram: 1. Lens, 2. Motor, 3. Filter, 4. Bracket bracket, 5. Rigid-flex board, 6. Gyroscope, U1. Photosensitive chip, U3. Z-axis drive chip, U5. Microcontroller, J1. Connector. Detailed Implementation

[0020] The following description, with reference to the accompanying drawings and preferred embodiments, illustrates the implementation of the technical solution of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be understood that the preferred embodiments are only for illustrating this utility model and not for limiting the scope of protection of this utility model.

[0021] like Figure 1 As shown in the embodiment of this application, a control circuit for an integrated EIS optical image stabilization camera module includes a sensor module, an MCU control module, a drive module, a storage module, a motor module, and a gyroscope module. The MCU control module is electrically connected to the sensor module, drive module, storage module, and gyroscope module. The drive module includes an X-axis drive chip U8, a Y-axis drive chip U9, and a Z-axis drive chip U3; the X-axis drive chip U8, Y-axis drive chip U9, and Z-axis drive chip U3 are respectively connected to the motor module.

[0022] In this embodiment, a design using three independent driving chips is employed, replacing the traditional single multi-axis driving chip with X-axis driving chip U8, Y-axis driving chip U9 (both model AW86033A), and Z-axis driving chip U3 (model AW86016). These three chips are single-axis / specific-axis driving chips with simple functions, making them easier to develop and produce. Their market procurement cost is far lower than that of high-end driving chips integrating multi-axis functions. While ensuring image stabilization performance, this significantly reduces the overall hardware cost of the integrated EIS optical image stabilization camera module, better meeting the cost control requirements of consumer electronics devices. Each of the three driving chips independently handles the driving task of a single axis, and the driving functions between axes do not interfere with each other. If a single driver chip malfunctions, only the faulty chip needs to be replaced to restore the image stabilization function of the corresponding axis, without scrapping the entire module. This effectively reduces the maintenance cost and scrap rate of integrated EIS optical image stabilization camera modules. Simultaneously, the circuit structure of a single-axis driver chip is simpler, resulting in higher stability during operation and reducing signal interference or functional conflicts caused by multi-axis integration, thus improving the long-term reliability of the entire integrated EIS optical image stabilization camera module. Controlled by an MCU module, the three driver chips, combined with real-time jitter data collected by the gyroscope module, can precisely drive the motor to move the lens to complete X, Y, and Z-axis displacement compensation. Each axis drive is independent and responsive, effectively counteracting shake in different directions, ultimately achieving image stabilization comparable to traditional multi-axis driver chips, ensuring that captured videos or photos remain clear and stable.

[0023] like Figure 2 As shown, in one possible embodiment, the sensor module includes a photosensitive chip U1, capacitors C1 to C6, and capacitors C18 to C20.

[0024] Taking the image sensor U1 model OV08D10-GA5A-001A as an example: The AVDD pin of image sensor U1 is grounded via capacitor C4. The VH pin of image sensor U1 is grounded via capacitor C1. The VN1 pin of image sensor U1 is grounded via capacitor C2, and the VN2 pin of image sensor U1 is grounded via capacitor C3. The DOVDD pin of image sensor U1 is grounded via capacitor C5. The DVDD pin of image sensor U1 is grounded via capacitor C6. Capacitors C18, C19, C20, and C6 are connected in parallel.

[0025] like Figure 3 As shown, in one possible embodiment, the MCU control module includes a microcontroller U5, a voltage conversion chip U7, resistors R1 to R6, capacitors C10 to C17, and capacitor C21.

[0026] Taking the STM32L432KCU6TR microcontroller U5 as an example: The STM_VDD2.8 pin of the microcontroller U5 is grounded through capacitor C17, and capacitors C11 to C17 are connected in parallel.

[0027] Taking the voltage conversion chip U7, model number PCA9306DCUR, as an example: Pin 5 of voltage converter chip U7 is connected to the STM_SDA pin of microcontroller U5, and pin 6 of voltage converter chip U7 is connected to the STM_SCL pin of microcontroller U5. Pins 7 and 8 of voltage converter chip U7 are connected, and the connection point between pins 7 and 8 of voltage converter chip U7 is connected to pin 8 of microcontroller U5 via resistor R2. The connection point between pins 7 and 8 of voltage converter chip U7 is also connected to DGND via capacitor C21. One end of resistor R3 is connected to the voltage converter U5. Resistor R2 is connected, and the other end of resistor R3 is connected to the STM_SDA pin of microcontroller U5; one end of resistor R4 is connected to resistor R2, and the other end of resistor R4 is connected to the STM_SCL pin of microcontroller U5; one end of resistor R5 is connected to resistor R2, and the other end of resistor R5 is connected to the STM_OISSCL pin of microcontroller U5; one end of resistor R6 is connected to resistor R2, and the other end of resistor R6 is connected to the STM_OISSDA pin of microcontroller U5.

[0028] like Figure 6 As shown, in one possible embodiment, the drive module includes an X-axis drive chip U8, a Y-axis drive chip U9, and a Z-axis drive chip U3.

[0029] Taking the X-axis drive chip U8 and Y-axis drive chip U9, both model number AW86033A, and the Z-axis drive chip U3, model number AW86016, as an example: The SDA pin of the X-axis drive chip U8 is connected to pin 4 of the voltage conversion chip U7, and the SCL pin of the X-axis drive chip U8 is connected to pin 3 of the voltage conversion chip U7. The SDA pin of the Y-axis drive chip U9 is connected to pin 4 of the voltage conversion chip U7, and the SCL pin of the Y-axis drive chip U9 is connected to pin 3 of the voltage conversion chip U7. The SDA pin of the Z-axis drive chip U3 is connected to pin 4 of the voltage conversion chip U7, and the SCL pin of the Z-axis drive chip U9 is connected to pin 3 of the voltage conversion chip U7.

[0030] like Figure 5 As shown, in one possible embodiment, the storage module includes a storage chip U2, taking storage chip U2 model P24C128F-D4H-MIR as an example: The SCL pin of the storage chip U2 is connected to pin 3 of the voltage conversion chip U7, the SCL pin of the X-axis drive chip U8, the SCL pin of the Y-axis drive chip U9, and the SCL pin of the Z-axis drive chip U3, respectively.

[0031] The SDA pin of the storage chip U2 is connected to pin 4 of the voltage conversion chip U7, the SDA pin of the X-axis drive chip U8, the SDA pin of the Y-axis drive chip U9, and the SDA pin of the Z-axis drive chip U3, respectively.

[0032] like Figure 7 and Figure 8 As shown, in one possible embodiment, the motor module includes a motor chip U6, capacitor C9, capacitor C22, and capacitor C23, with the following specific connections: The AFVDD pin of motor chip U6 is connected to AFGND via capacitor C9, capacitor C22, and capacitor C23. The OUTN-Z pin of motor chip U6 is connected to the OUTN pin of Z-axis drive chip U3, and the OUTP-Z pin is connected to the OUTP pin of Z-axis drive chip U3. The OUTN-X pin of motor chip U6 is connected to the OUT1 pin of X-axis drive chip U8, and the OUTP-X pin is connected to the OUT2 pin of X-axis drive chip U8. The OUTN-Y pin of motor chip U6 is connected to the OUT1 pin of Y-axis drive chip U9, and the OUTP-Y pin is connected to the OUT2 pin of Y-axis drive chip U9. The OIS_SDA pin of motor chip U6 is connected to pin 5 of connector J1, and the OIS_SCL pin is connected to pin 6 of connector J1.

[0033] like Figure 4 As shown, in one possible embodiment, the gyroscope module includes a gyroscope chip U4, a capacitor C7, and a capacitor C8.

[0034] Taking the gyroscope chip U4 with model number LSM6DSOETR as an example: The VDDIO pin of gyroscope chip U4 is grounded via capacitor C7, and is also connected to the STM_VDD2.8 pin of microcontroller U5. The VDD pin of gyroscope chip U4 is grounded via capacitor C8, and is also connected to the STM_VDD2.8 pin of microcontroller U5. The SDX pin of gyroscope chip U4 is connected to the STM_MISO pin of microcontroller U5, the SCX pin of gyroscope chip U4 is connected to the STM_CLK pin of microcontroller U5, and the CSB pin of gyroscope chip U4 is connected to the STM_CS pin of microcontroller U5.

[0035] like Figure 9 As shown in the embodiments of this application, an integrated EIS optical image stabilization camera module adopts the control circuit of the integrated EIS optical image stabilization camera module as described in the embodiments of this application.

[0036] Typically, an integrated EIS optical image stabilization camera module consists of a rigid-software board 5, a photosensitive chip U1, a filter 3, a lens mount, a lens 1, a microcontroller U5, a gyroscope (its circuitry is the aforementioned gyroscope module), a drive module, a motor 2 (its circuitry is the aforementioned motor module, and it has a built-in Hall sensor), a storage module, a Bracket bracket 4, and a connector J1, etc.

[0037] The rigid-flex board 5 primarily supports the image sensor U1, bracket 4, filter 3, lens 1, microcontroller U5, gyroscope, motor drive module, motor 2, storage module (EEPROM), connector J1, etc. It also transmits image data processed by the image sensor U1 to connector J1 via circuitry and supplies power to the image sensor U1. The image sensor U1 converts visible light passing through the filter 3 into electrical signals. The filter 3 primarily filters out light wavelengths invisible to the human eye, allowing only visible light to pass through, while absorbing stray light emitted between optical lenses. Lens 1 primarily transmits the light signal to be captured to the filter 3 through refraction. Motor 2 primarily drives lens 1 to move along the X, Y, and Z axes, thereby achieving image stabilization. The drive module is mainly used to drive motor 2 to move in the X, Y, and Z directions. The gyroscope is mainly responsible for real-time detection of minute lens jitters and converting the motion signals into electrical signals, which are then transmitted to the MCU to provide accurate dynamic data support for lens 1 displacement compensation. The MCU control module is responsible for coordinating and integrating sensor data, data processing, algorithm execution, and communication coordination. It is a key node connecting the gyroscope, Hall sensor, and drive module. The Hall sensor detects changes in the magnetic field and monitors the displacement state of lens 1 in real time, ensuring the accuracy and stability of lens compensation actions. Connector J1 is responsible for the main control connection between the integrated EIS optical image stabilization camera module and the electronic device to achieve information processing. Connector J1 is also responsible for connecting the integrated EIS optical image stabilization camera module to the circuit board of the electronic device.

[0038] In one possible embodiment, the X-axis drive chip U8 and Y-axis drive chip U9 of the drive module are built into the motor 2. Furthermore, the X-axis drive chip U8 and Y-axis drive chip U9 integrate HALL functionality. The Z-axis drive chip U3 is mounted on the rigid-flex board 5.

[0039] The working principle of an integrated EIS optical image stabilization camera module in this application embodiment is as follows: The motion and vibration of the electronic device are detected by the Hall sensor built into the motor 2 and the gyroscope 6 on the rigid-flex board 5. The movement and rotation of the electronic device are sensed and the data is transmitted to the microcontroller U5 in real time. The microcontroller U5 analyzes the received data to determine what motion and vibration occurred during the shooting process. The integrated EIS optical image stabilization camera module drives the motor 2 through the X-axis drive chip U8, Y-axis drive chip U9, and Z-axis drive chip U3 to adjust the position of the lens 1 mounted on the motor 2 on the X, Y, and Z axes. This allows for real-time correction of the captured video or photos to counteract the shaking of the device and achieve an image stabilization effect.

[0040] In this application embodiment, an electronic device employs an integrated EIS optical image stabilization camera module as described in this application embodiment.

[0041] The following example, using a smartwatch equipped with this integrated EIS optical image stabilization camera module, illustrates its specific applications: During the shooting process, if the user's hand shakes, the lens 1 will shift. At this time, the gyroscope chip U4 detects the shaking signal in real time, converts the direction and amplitude of the shaking into electrical signals, and transmits them to the microcontroller U5 through the SDX and SCX pins.

[0042] After analyzing the shake signal, the microcontroller U5 determines that the X, Y, and Z axis displacement of lens 1 needs adjustment. It then sends control commands to the level conversion chip U7 via the STM_SDA and STM_SCL pins. The level conversion chip U7 converts the level output from the microcontroller U5 to a level compatible with the driver chips and transmits it to the X-axis driver chip U8, Y-axis driver chip U9, and Z-axis driver chip U3. Each driver chip outputs drive signals according to the commands. The X-axis driver chip U8 drives motor 2 to move lens 1 in the X direction, the Y-axis driver chip U9 drives lens 1 in the Y direction, and the Z-axis driver chip U3 drives lens 1 in the Z direction, completing the displacement compensation. Simultaneously, the built-in HALL function of motor 2 provides real-time feedback on the displacement status of lens 1. The microcontroller U5 fine-tunes the drive commands based on the feedback data to ensure image stabilization accuracy and ultimately achieve clear shooting.

[0043] The above embodiments are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. A control circuit for an integrated EIS optical image stabilization camera module, characterized in that, It includes a sensor module, an MCU control module, a drive module, a storage module, a motor module, and a gyroscope module. The MCU control module is electrically connected to the sensor module, the drive module, the storage module, and the gyroscope module, respectively. The drive module includes an X-axis drive chip U8, a Y-axis drive chip U9, and a Z-axis drive chip U3. The X-axis drive chip U8, Y-axis drive chip U9, and Z-axis drive chip U3 are respectively connected to the motor module.

2. The control circuit of the integrated EIS optical image stabilization camera module according to claim 1, characterized in that, The X-axis drive chip U8 and Y-axis drive chip U9 are both AW86033A, and the Z-axis drive chip U3 is AW86016. The SDA pin of the X-axis drive chip U8 is connected to pin 4 of the voltage conversion chip U7 of the MCU control module, and the SCL pin of the X-axis drive chip U8 is connected to pin 3 of the voltage conversion chip U7. The SDA pin of the Y-axis drive chip U9 is connected to pin 4 of the voltage conversion chip U7, and the SCL pin of the Y-axis drive chip U9 is connected to pin 3 of the voltage conversion chip U7. The SDA pin of the Z-axis drive chip U3 is connected to pin 4 of the voltage conversion chip U7, and the SCL pin of the Z-axis drive chip U9 is connected to pin 3 of the voltage conversion chip U7.

3. The control circuit of the integrated EIS optical image stabilization camera module according to claim 1, characterized in that, The sensor module includes a photosensitive chip U1, capacitors C1 to C6, and capacitors C18 to C20. The photosensitive chip U1 is model OV08D10-GA5A-001A. The AVDD pin of the photosensitive chip U1 is grounded through capacitor C4, the VH pin of the photosensitive chip U1 is grounded through capacitor C1, the VN1 pin of the photosensitive chip U1 is grounded through capacitor C2, the VN2 pin of the photosensitive chip U1 is grounded through capacitor C3, the DOVDD pin of the photosensitive chip U1 is grounded through capacitor C5, and the DVDD pin of the photosensitive chip U1 is grounded through capacitor C6. Furthermore, capacitors C18, C19, and C20 are connected in parallel with capacitor C6.

4. The control circuit of the integrated EIS optical image stabilization camera module according to claim 1, characterized in that, The MCU control module includes a microcontroller U5, a voltage conversion chip U7, resistors R1 to R6, capacitors C10 to C17, and capacitor C21. The microcontroller U5 is an STM32L432KCU6TR. The STM_VDD2.8 pin of the microcontroller U5 is grounded through capacitor C17, and capacitors C11 to C17 are connected in parallel. The voltage conversion chip U7 is model PCA9306DCUR and is used to realize level conversion. Pin 5 of the voltage conversion chip U7 is connected to the STM_SDA pin of the microcontroller U5, and pin 6 of the voltage conversion chip U7 is connected to the STM_SCL pin of the microcontroller U5. Pins 7 and 8 of the voltage conversion chip U7 are connected, and the connection point of pins 7 and 8 of the voltage conversion chip U7 is connected to pin STM_VDD2.8 of the microcontroller U5 via resistor R2. The connection point of pins 7 and 8 of the voltage conversion chip U7 is also connected to DGND via capacitor C21. One end of resistor R3 is connected to resistor R2, and the other end of resistor R3 is connected to pin STM_SDA of the microcontroller U5. One end of resistor R4 is connected to resistor R2, and the other end of resistor R4 is connected to pin STM_SCL of the microcontroller U5. One end of resistor R5 is connected to resistor R2, and the other end of resistor R5 is connected to pin STM_OISSCL of the microcontroller U5. One end of resistor R6 is connected to resistor R2, and the other end of resistor R6 is connected to pin STM_OISSDA of the microcontroller U5.

5. The control circuit of the integrated EIS optical image stabilization camera module according to claim 1, characterized in that, The storage module includes a storage chip U2, the model of which is P24C128F-D4H-MIR. The SCL pin of the storage chip U2 is connected to pin 3 of the voltage conversion chip U7 of the MCU control module, the SCL pin of the X-axis drive chip U8, the SCL pin of the Y-axis drive chip U9, and the SCL pin of the Z-axis drive chip U3, respectively. The SDA pin of the storage chip U2 is connected to pin 4 of the voltage conversion chip U7, the SDA pin of the X-axis drive chip U8, the SDA pin of the Y-axis drive chip U9, and the SDA pin of the Z-axis drive chip U3, respectively.

6. The control circuit of the integrated EIS optical image stabilization camera module according to claim 1, characterized in that, The motor module includes a motor chip U6, capacitor C9, capacitor C22, and capacitor C23; The AFVDD pin of the motor chip U6 is connected to AFGND via capacitor C9, the AFVDD pin of the motor chip U6 is also connected to AFGND via capacitor C22, and the AFVDD pin of the motor chip U6 is also connected to AFGND via capacitor C23. The OUTN-Z pin of the motor chip U6 is connected to the OUTN pin of the Z-axis drive chip U3, and the OUTP-Z pin of the motor chip U6 is connected to the OUTP pin of the Z-axis drive chip U3. The OUTN-X pin of the motor chip U6 is connected to the OUT1 pin of the X-axis drive chip U8, and the OUTP-X pin of the motor chip U6 is connected to the OUT2 pin of the X-axis drive chip U8. The OUTN-Y pin of the motor chip U6 is connected to the OUT1 pin of the Y-axis drive chip U9, and the OUTP-Y pin of the motor chip U6 is connected to the OUT2 pin of the Y-axis drive chip U9.

7. The control circuit of the integrated EIS optical image stabilization camera module according to claim 1, characterized in that, The gyroscope module includes a gyroscope chip U4, a capacitor C7, and a capacitor C8. The model of the gyroscope chip U4 is LSM6DSOETR. The VDDIO pin of the gyroscope chip U4 is grounded through capacitor C7, and the VDDIO pin of the gyroscope chip U4 is also connected to the STM_VDD2.8 pin of the microcontroller U5 of the MCU control module. The VDD pin of the gyroscope chip U4 is grounded through capacitor C8, and the VDD pin of the gyroscope chip U4 is also connected to the STM_VDD2.8 pin of the microcontroller U5. The SDX pin of the gyroscope chip U4 is connected to the STM_MISO pin of the microcontroller U5, the SCX pin of the gyroscope chip U4 is connected to the STM_CLK pin of the microcontroller U5, and the CSB pin of the gyroscope chip U4 is connected to the STM_CS pin of the microcontroller U5.

8. An integrated EIS optical image stabilization camera module, characterized in that, The control circuit of the integrated EIS optical image stabilization camera module as described in any one of claims 1-7 is adopted.

9. An electronic device, characterized in that, The integrated EIS optical image stabilization camera module as described in claim 8 is adopted.

10. The electronic device according to claim 9, characterized in that, The electronic device is a smartwatch.

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