Temperature control device for camera and semiconductor testing machine

Abstract

The application relates to a camera temperature control device and a semiconductor testing machine. The camera temperature control device is used for heat transfer control of a camera arranged on a machine, and comprises an inner end heat exchange assembly, an outer end heat exchange assembly and a heat pipe connected between the inner end heat exchange assembly and the outer end heat exchange assembly. The inner end heat exchange assembly is arranged close to the camera and comprises a thermoelectric unit and an inner end fan. The inner end fan blows cold or heat generated by the thermoelectric unit to the camera to control the temperature of the camera. The outer end heat exchange assembly is arranged close to the outer side of the machine and comprises an outer end radiator and an outer end fan. The outer end fan blows the heat or cold of the heat pipe to the outer side of the machine. The camera temperature control device and the semiconductor testing machine can improve the anti-environmental temperature change interference capability of the camera, keep the temperature of the camera basically constant, and thus ensure the positioning accuracy stability of the camera.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a camera temperature control device and a semiconductor testing machine. Background Technology

[0002] Currently, in wafer testing, the probe station relies on a high-precision camera module to position itself relative to the wafer. The positioning accuracy of the camera module is significantly affected by its hardware temperature. To ensure the positioning accuracy between the probe station and the wafer, the temperature of the camera module hardware needs to be kept relatively constant during testing. Therefore, thermal management of the camera module is necessary.

[0003] Current thermal management solutions for probe station camera modules primarily rely on air cooling. This involves creating small holes around the camera module components and blowing pressurized dry gas into the camera cavity to dissipate heat. However, this cooling solution is relatively weak against changes in ambient temperature. During wafer testing, the wafer is supported by a chuck assembly, and the chuck assembly's position and operating conditions significantly impact the camera module's thermal performance. For example, when the chuck assembly is directly beneath the camera module and operating at high temperatures, the camera module experiences significant convective heat transfer from the chuck assembly's surface, leading to a continuous rise in hardware temperature and decreased positioning accuracy. Conversely, when the chuck assembly is directly beneath the camera module and operating at low temperatures, the camera module's hardware temperature will decrease. Therefore, existing cooling solutions struggle to maintain a constant camera module temperature when ambient temperatures change, thus affecting positioning accuracy.

[0004] Therefore, it is necessary to propose a new technical solution to overcome the shortcomings of existing technologies. Utility Model Content

[0005] Based on this, this application provides a camera temperature control device and a semiconductor testing machine, which can improve the camera's ability to resist interference from changes in ambient temperature and maintain the camera temperature basically constant, thereby ensuring the stability of the camera's positioning accuracy.

[0006] Therefore, this application adopts the following technical solution: a camera temperature control device for controlling the heat transfer temperature of a camera mounted on a machine base. The camera temperature control device includes an inner heat exchange component, an outer heat exchange component, and a heat pipe thermally connected between the inner and outer heat exchange components. The inner heat exchange component is located close to the camera and includes a thermoelectric unit and an inner fan. The inner fan blows the cold or heat generated by the thermoelectric unit onto the camera to control its temperature. The outer heat exchange component is located close to the outside of the machine base and includes an outer heat sink and an outer fan. The outer fan blows the heat or cold energy guided by the heat pipe to the outer heat sink onto the outside of the machine base.

[0007] In some embodiments, the inner heat exchange assembly includes an inner heat sink that is thermally connected to the thermoelectric unit, and the inner fan drives airflow through the inner heat sink to the camera.

[0008] In some embodiments, the inner fan is positioned between the inner heat sink and the camera to draw airflow through the inner heat sink.

[0009] In some embodiments, the camera includes a housing with an air inlet, and an internal fan is disposed at the air inlet to blow airflow into the interior of the housing.

[0010] In some embodiments, the inner heat exchange assembly includes an inner heat exchange plate disposed between the thermoelectric unit and the inner heat sink to thermally connect the thermoelectric unit and the inner heat sink.

[0011] In some embodiments, the thermoelectric unit, the inner heat spreader, the inner heat sink, and the inner fan are arranged in a stacked manner.

[0012] In some embodiments, the external heat sink has a plurality of heat dissipation fins, and the external fan is disposed at one end of the heat dissipation fins in the extension direction to drive airflow along the extension direction of the heat dissipation fins.

[0013] In some embodiments, the external heat exchange assembly includes an external heat exchange plate disposed between the heat pipe and the external heat sink to thermally connect the heat pipe and the external heat sink.

[0014] In some embodiments, the camera temperature control device includes a temperature controller and a temperature sensor, the temperature sensor being disposed inside the camera and electrically connected to the temperature controller.

[0015] This application also adopts the following technical solution: a semiconductor testing machine, the semiconductor testing machine including a frame, a chuck device, a camera and a camera temperature control device as described in any of the above embodiments, wherein the camera and the camera temperature control device are fixed on the frame, the chuck device is used to carry the semiconductor and is placed below the camera so that the camera can take pictures and position the semiconductor.

[0016] The camera temperature control device provided in this application includes an inner heat exchange component, an outer heat exchange component, and a heat pipe thermally connected between the inner and outer heat exchange components. The inner and outer heat exchange components form a bidirectional heat transfer system through the heat pipe. The inner heat exchange component uses a thermoelectric unit to exchange heat and control the camera. The heat exchange energy is transferred to the outer heat exchange component and discharged through the heat pipe. This temperature control device is less affected by changes in ambient temperature, maintaining a basically constant camera temperature and ensuring the camera's positioning accuracy. Furthermore, the thermoelectric unit can cool or heat the camera according to different operating conditions. In high-temperature conditions, the thermoelectric unit operates in cooling mode, with an inner fan precisely directing the cooling energy to the camera. In low-temperature conditions, it switches to heating mode to compensate for camera temperature, thus maintaining a basically constant camera temperature under different operating conditions. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of an embodiment of the semiconductor testing machine of this application.

[0019] Figure 2 This is a three-dimensional view of the camera temperature control device and the camera and frame assembly of this application.

[0020] Figure 3 This is a three-dimensional view of the camera temperature control device and the camera and frame as described in this application.

[0021] Figure 4 This is a three-dimensional exploded view of the camera temperature control device and the camera and frame of this application.

[0022] Figure 5 This is a cross-sectional view of the camera temperature control device and the camera and frame of this application.

[0023] The components are labeled as follows: 100, Semiconductor testing machine; 10, Frame; 20, Camera; 201, Housing; 202, Air inlet; 30, Chuck assembly; 40, Camera temperature control device; 1, Inner heat exchange assembly; 11, Thermoelectric unit; 12, Inner heat spreader; 13, Inner radiator; 14, Inner fan; 2, Outer heat exchange assembly; 21, Outer radiator; 22, Outer fan; 3, Heat pipe; 4, Temperature controller; 41, Temperature sensor. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0025] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0029] This application provides a camera temperature control device and a semiconductor testing machine including the camera temperature control device, solving the problem in the prior art where the camera is greatly affected by changes in ambient temperature, making it difficult to maintain a constant temperature and resulting in decreased positioning accuracy. The technical solution of this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Please see Figures 1 to 5 As shown, this application provides a camera temperature control device 40 for heat transfer and temperature control of a camera 20 mounted on a machine base. The camera temperature control device 40 includes an inner heat exchange component 1, an outer heat exchange component 2, and a heat pipe 3 thermally connected between the inner heat exchange component 1 and the outer heat exchange component 2. The inner heat exchange component 1 is disposed close to the camera 20 and includes a thermoelectric unit 11 and an inner fan 14. The inner fan 14 blows the cold or heat generated by the thermoelectric unit 11 onto the camera 20 to control its temperature. The outer heat exchange component 2 is disposed close to the outside of the machine base and includes an outer heat sink 21 and an outer fan 22. The outer fan 22 blows the heat or cold energy guided by the heat pipe 3 to the outer heat sink 21 onto the outside of the machine base.

[0031] The camera temperature control device 40 provided in this application includes an inner heat exchange component 1, an outer heat exchange component 2, and a heat pipe 3 thermally connected between the inner heat exchange component 1 and the outer heat exchange component 2. The inner heat exchange component 1 and the outer heat exchange component 2 form a bidirectional heat transfer system through the heat pipe 3. The inner heat exchange component 1 uses a thermoelectric unit 11 to exchange heat with the camera 20 for temperature control. The heat exchange energy is transferred to the outer heat exchange component 2 and discharged through the heat pipe 3. This temperature control device is less affected by changes in ambient temperature, maintaining a basically constant temperature for the camera 20 and ensuring the positioning accuracy of the camera 20. In addition, the thermoelectric unit 11 used in this temperature control device can cool or heat the camera 20 according to different operating conditions. In high-temperature conditions, the thermoelectric unit 11 operates in cooling mode, and the inner fan 14 precisely directs the cooling energy to the camera 20. In low-temperature conditions, it switches to heating mode to compensate for the temperature of the camera 20, so as to maintain a basically constant temperature for the camera 20 under different operating conditions.

[0032] Please see Figure 1 As shown in this embodiment, the camera temperature control device 40 is used to control the temperature of the camera 20 used in the semiconductor testing machine 100. Specifically, the semiconductor testing machine 100 includes a frame 10, a chuck device 30, a camera 20, and the camera temperature control device 40. The camera 20 and the camera temperature control device 40 are fixed on the frame 10. The chuck device 30 is used to carry the semiconductor and is placed below the camera 20, so that the camera 20 can take pictures and position the semiconductor. The camera temperature control device 40 is used to precisely control the temperature of the camera 20 to ensure that its temperature is basically constant, thereby ensuring positioning accuracy.

[0033] Please refer to the following: Figures 2 to 4As shown, in this embodiment, the frame 10 is U-shaped, with two longitudinally extending support beams and a crossbeam connected to the top of the two support beams. The two support beams are used to connect and fix the frame 10 to other components (such as a workbench), and the camera 20 is mounted on the crossbeam. The camera 20 is an industrial camera. In this embodiment, the camera 20 is generally rectangular, but its shape is not limited to this in other embodiments. The camera 20 includes a housing 201, on which an air inlet 202 is provided. The air inlet 202 is used to allow temperature-controlled airflow to blow into the interior of the housing 201 to control the temperature of components such as the image sensor, main control circuit, power supply circuit, and motor inside the camera 20. The chuck device 30 can move within the space of the U-shaped frame 10 during operation, so that the camera 20 can position the semiconductor carried on the chuck device 30. In this embodiment, the semiconductor carried on the chuck device 30 is a semiconductor wafer. In this embodiment, the chuck device 30 includes a chuck, a chuck temperature control system for controlling the temperature of the chuck, and an adsorption system for generating adsorption force on the surface of the chuck to adsorb semiconductors. The chuck temperature control system includes, for example, a heating element and a liquid cooling system, and the adsorption system includes, for example, a negative pressure device and a suction channel. The specific structure of the chuck device 30 can be implemented with reference to existing solutions, and this application does not limit it.

[0034] Please see Figures 2 to 5 As shown, the camera temperature control device 40 includes an inner heat exchange component 1, an outer heat exchange component 2, and a heat pipe 3 that is thermally connected between the inner heat exchange component 1 and the outer heat exchange component 2. The inner heat exchange component 1 is located close to the camera 20 and is used for heat exchange with the camera 20; the outer heat exchange component 2 is located close to the outside of the machine and is used to discharge heat or cold to the outside of the machine; the heat pipe 3 serves as a medium for heat transfer, realizing bidirectional heat transfer between the inner and outer ends.

[0035] Please see Figures 3 to 5 As shown, in this embodiment, the inner heat exchange assembly 1 includes a thermoelectric unit 11, an inner heat spreader 12, an inner radiator 13, and an inner fan 14. The thermoelectric unit 11, the inner heat spreader 12, the inner radiator 13, and the inner fan 14 are arranged in a stacked manner. The inner radiator 13 is thermally connected to the thermoelectric unit 11, and the inner fan 14 drives airflow through the inner radiator 13 to the camera 20, thereby achieving precise temperature control of the camera 20.

[0036] Specifically, the thermoelectric unit 11 is the heat source or cold source used to generate heat or cold in the inner heat exchange assembly 1. It is specifically a thermoelectric cooler (TEC) or semiconductor cooling chip, and its working principle is based on the Peltier effect. When current passes through the thermoelectric unit 11, one side absorbs heat, which is the cooling side, and the other side releases heat, which is the heating side. By controlling the direction and magnitude of the current, the working mode of the thermoelectric unit 11 can be flexibly switched to adapt to the temperature control requirements under different working conditions. One side of the thermoelectric unit 11 is attached to the inner heat spreader 12 to evenly transfer the generated cold energy to the inner heat sink 13 through the inner heat spreader 12. Then, the airflow blown by the inner fan 14 flows through the inner heat sink 13 into the camera 20. At the same time, the heat released by the other side of the thermoelectric unit 11 is transferred to the outer heat exchange assembly 2 through the heat pipe 3.

[0037] An inner heat spreader 12 is disposed between the thermoelectric unit 11 and the inner heat sink 13 to thermally connect the thermoelectric unit 11 and the inner heat sink 13, and is used to uniformly transfer the heat or cold generated by the thermoelectric unit 11 to the inner heat sink 13. The heat spreader has high thermal conductivity, which can quickly homogenize the temperature of the surface of the thermoelectric unit 11, avoid local overheating or overcooling, and thus improve the accuracy and stability of temperature control. In some embodiments, the inner heat spreader 12 is made of a metal with good thermal conductivity, such as copper or its alloy plates or aluminum or its alloy plates.

[0038] The inner heat sink 13 is thermally connected to the inner heat spreader 12, and is used to further dissipate the heat or cold transferred from the inner heat spreader 12 into the air. The inner heat sink 13 is typically made of aluminum or copper, and has a large heat dissipation area and good heat dissipation performance. In this embodiment, the inner heat sink 13 includes a base plate parallel to and in close contact with the inner heat spreader 12 and multiple heat dissipation fins extending from the surface of the base plate. The heat dissipation fins can increase the heat dissipation area and improve the heat dissipation efficiency.

[0039] An inner fan 14 is positioned between the inner heat sink 13 and the camera 20 to draw airflow through the inner heat sink 13. The inner fan 14 is positioned downstream of the airflow direction, driving the airflow through the inner heat sink 13 towards the camera 20 via suction, resulting in smooth airflow and low airflow resistance. In this embodiment, the inner fan 14 is an axial fan, with its blades' central axis coaxial with the air inlet 202 on the camera 20's housing 201, thus blowing airflow along the axis into the camera 20's housing 201. In cooling mode, the inner fan 14 blows the cool air from the inner heat sink 13 towards the camera 20, lowering its temperature; in heating mode, it blows the heat from the inner heat sink 13 towards the camera 20, raising its temperature.

[0040] The inner heat exchange assembly 1 achieves precise temperature control of the camera 20 through the coordinated operation of the thermoelectric unit 11, the inner heat spreader 12, the inner radiator 13, and the inner fan 14. The flexible operating mode of the thermoelectric unit 11 allows the temperature control device to adapt to the needs of different operating conditions; the uniform heat transfer performance of the inner heat spreader 12 improves the accuracy and stability of temperature control; and the inner radiator 13 and the inner fan 14 together ensure the effective transfer and dissipation of heat or cold.

[0041] Please see Figures 2 to 4 As shown, the main function of the external heat exchange component 2 is to dissipate the heat or cold transferred from the heat pipe 3 to the outside of the machine, thereby maintaining the temperature stability of the internal heat exchange component 1 and the camera 20. Specifically, the external heat exchange component 2 is used to dissipate heat to the outside when the internal heat exchange component 1 is cooling, and to dissipate cold to the outside when the internal heat exchange component 1 is heating. The external heat exchange component 2 includes an external radiator 21 and an external fan 22.

[0042] The external heat sink 21 is thermally connected to the heat pipe 3 to further dissipate the heat or cold transferred from the heat pipe 3 into the air. The external heat sink 21 is made of a material with high thermal conductivity, such as aluminum or copper. The external heat sink 21 has several heat dissipation fins to increase the heat dissipation area and improve heat dissipation efficiency. An external fan 22 is located at one end of the heat dissipation fins to drive airflow along the extension direction of the fins, thus ensuring high airflow efficiency.

[0043] Furthermore, the external heat exchange assembly 2 includes an external heat spreader (not shown in the figure), which is disposed between the heat pipe 3 and the external radiator 21 to thermally connect the heat pipe 3 and the external radiator 21. The external heat exchange assembly 2 further includes an external heat spreader, which can be used to uniformly transfer the heat or cold energy transferred from the heat pipe 3 to the external radiator 21. The placement of the external heat spreader can further improve the uniformity and stability of heat dissipation.

[0044] The external heat exchange assembly 2, through the coordinated operation of the external heat exchange plate, external heat sink 21, and external fan 22, effectively dissipates the heat or cold transferred from the heat pipe 3 to the outside of the machine. The large-area heat dissipation fin design of the external heat sink 21 improves heat dissipation efficiency; the driving action of the external fan 22 ensures continuous airflow, further enhancing the heat dissipation effect. The external heat exchange plate further improves the uniformity and stability of heat dissipation.

[0045] Heat pipe 3 is a component connecting the inner heat exchange component 1 and the outer heat exchange component 2. In some embodiments, it is filled with a working medium, such as water or ammonia. The working principle of heat pipe 3 is based on the principle of phase change heat transfer. When the inner heat exchange component 1 generates heat or cold, the working medium inside heat pipe 3 absorbs heat and evaporates into steam. Under the action of pressure difference, the steam flows to the other end of heat pipe 3, namely the outer heat exchange component 2, where it releases heat and condenses into liquid. The liquid then flows back to the inner heat exchange component 1 through capillary action, forming a cycle.

[0046] The heat pipe 3 allows the heat generated during cooling or the cold generated during heating of the camera 20 to be expelled from the machine, preventing any impact on the internal temperature of the machine and ensuring the stability of temperature control in the chuck assembly 30 and the inner heat exchange component 1 of the camera temperature control device 40. Furthermore, the heat pipe 3 possesses advantages such as high thermal conductivity, good isothermal properties, and flexibility. Its high thermal conductivity allows for rapid heat or cold transfer between the inner and outer ends, its good isothermal properties ensure temperature uniformity between the inner and outer ends, and its flexibility allows it to adapt to different layouts and installation requirements. Therefore, the heat pipe 3 significantly improves the temperature control efficiency and stability of the camera temperature control device 40.

[0047] Furthermore, the camera temperature control device 40 also includes a temperature controller 4 and a temperature sensor 41, with the temperature sensor 41 disposed inside the camera 20 and electrically connected to the temperature controller 4. That is, in order to improve the temperature control accuracy and intelligence of the camera temperature control device 40, this application also includes a temperature controller 4 and a temperature sensor 41.

[0048] In this embodiment, temperature sensor 41 extends into camera 20 via a circuit to monitor the temperature of camera 20 in real time and transmit the temperature signal to temperature controller 4. Temperature controller 4 is located outside camera 20 and is electrically connected to temperature sensor 41 via the aforementioned circuit. It receives the temperature signal transmitted by temperature sensor 41 and controls the operation of thermoelectric unit 11 according to a preset temperature range. Temperature controller 4 can also be configured to adjust the speeds of the inner fan 14 and the outer fan 22 according to actual needs to further optimize temperature control.

[0049] The camera temperature control device 40 possesses automated and intelligent temperature control capabilities through the configuration of the temperature controller 4 and temperature sensor 41. The real-time monitoring function of temperature sensor 41 ensures the accuracy and real-time nature of temperature data; the intelligent control function of temperature controller 4 flexibly adjusts the operation of components such as thermoelectric unit 11, inner fan 14, and outer fan 22 based on temperature data, thereby achieving precise temperature control of the camera 20. This automated and intelligent temperature control method not only improves temperature control efficiency but also reduces the cost and risk of manual intervention. In some embodiments, the temperature controller 4 can receive temperature data and send control signals via wired or wireless remote control.

[0050] This application also provides a semiconductor testing machine 100, which includes a frame 10, a chuck device 30, a camera 20, and a camera temperature control device 40 as described in any of the above embodiments. The camera 20 and the camera temperature control device 40 are fixed to the frame 10, and the chuck device 30 is used to carry semiconductors and is positioned below the camera 20 so that the camera 20 can photograph and position the semiconductors.

[0051] The assembly and operation process of the semiconductor testing machine 100 provided in this application embodiment is as follows.

[0052] Camera 20 is mounted on the crossbeam of frame 10, and an air inlet 202 is provided on its bottom outer casing 201. The inner heat exchange assembly 1 is mounted on the bottom outer casing 201 of camera 20. The thermoelectric unit 11, inner heat spreader 12, inner heat sink 13 and inner fan 14 are arranged in a stacked manner from bottom to top. The air outlet of the inner fan 14 faces the air inlet 202 of camera 20 to ensure that the airflow can flow smoothly to camera 20. The outer heat exchange assembly 2 is installed on the outside of the machine or near the outside of the machine to facilitate the discharge of heat or cold to the outside of the machine. The outer heat sink 21 is in close contact with the end of the heat pipe 3 to ensure good heat conduction. The outer fan 22 is installed on one side of the outer heat sink 21, and its air outlet faces the heat dissipation fins of the outer heat sink 21 to ensure that the airflow can flow smoothly over the heat dissipation fins. The heat pipe 3 is connected between the thermoelectric unit 11 of the inner heat exchange component 1 and the outer heat sink 21 of the outer heat exchange component 2. The temperature sensor 41 is installed inside the camera 20. The temperature controller 4 can be installed in the control cabinet of the machine or near the camera temperature control device 40 for easy operation and monitoring.

[0053] During operation, temperature sensor 41 collects the temperature inside camera 20 and transmits the temperature signal to temperature controller 4. When temperature controller 4 determines that heat dissipation is required based on the temperature signal, it controls the upper end of thermoelectric unit 11 to cool and controls the appropriate cooling power. The cooling capacity of the upper end of thermoelectric unit 11 is conducted to the inner end heat sink 13 through the inner end heat spreader 12. The inner end fan 14 draws airflow through the inner end heat sink 13 and enters the camera 20 through the air inlet 202 at the bottom of camera 20, thereby reducing the internal temperature of camera 20. At the same time, the heat generated at the lower end of thermoelectric unit 11 is conducted to the outer end heat exchange component 2 through heat pipe 3. The heat is blown to the external environment of the machine through the outer end heat sink 21 and the outer end fan 22, which are fixed to the outer side of the machine's sheet metal. Conversely, when the temperature controller 4 determines that the camera 20 needs to be heated based on the temperature signal, it controls the upper end of the thermoelectric unit 11 to heat up. During the heating process, the working process of each component is the same as the cooling process described above, except that the direction of heat and cold transfer is different, which will not be described in detail here.

[0054] As can be seen from the above description of the specific embodiments, the camera temperature control device 40 and the semiconductor testing machine 100 provided in this application achieve precise temperature control of the camera 20 through the coordinated operation of the inner heat exchange component 1, the outer heat exchange component 2, and the heat pipe 3. This temperature control device has advantages such as strong resistance to environmental temperature changes, high temperature control efficiency, and good stability, and can effectively solve the problem in some existing technologies where camera modules are greatly affected by environmental temperature changes and it is difficult to maintain a constant temperature, leading to a decrease in positioning accuracy.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A camera temperature control device for controlling the heat transfer temperature of a camera (20) mounted on a machine base, characterized in that, The camera temperature control device (40) includes an inner heat exchange component (1), an outer heat exchange component (2), and a heat pipe (3) thermally connected between the inner heat exchange component (1) and the outer heat exchange component (2). The inner heat exchange component (1) is located close to the camera (20) and includes a thermoelectric unit (11) and an inner fan (14). The inner fan (14) blows the cold or heat generated by the thermoelectric unit (11) toward the camera (20) to control its temperature. The outer heat exchange component (2) is located close to the outside of the machine and includes an outer radiator (21) and an outer fan (22). The outer fan (22) blows the heat or cold energy guided by the heat pipe (3) to the outer radiator (21) toward the outside of the machine.

2. The camera temperature control device as described in claim 1, characterized in that, The inner heat exchange assembly (1) includes an inner heat sink (13) that is thermally connected to the thermoelectric unit (11), and the inner fan (14) drives airflow through the inner heat sink (13) to the camera (20).

3. The camera temperature control device as described in claim 2, characterized in that, The inner fan (14) is located between the inner heat sink (13) and the camera (20) to draw airflow through the inner heat sink (13).

4. The camera temperature control device as described in claim 2, characterized in that, The camera (20) includes a housing (201) with an air inlet (202) on the housing (201) and an inner fan (14) disposed at the air inlet (202) to blow airflow into the housing (201).

5. The camera temperature control device as described in claim 2, characterized in that, The inner heat exchange assembly (1) includes an inner heat exchange plate (12), which is disposed between the thermoelectric unit (11) and the inner heat sink (13) to thermally connect the thermoelectric unit (11) and the inner heat sink (13).

6. The camera temperature control device as described in claim 5, characterized in that, The thermoelectric unit (11), the inner end heat spreader (12), the inner end heat sink (13) and the inner end fan (14) are arranged in sequence.

7. The camera temperature control device as described in claim 1, characterized in that, The external heat sink (21) has a plurality of heat dissipation fins, and the external fan (22) is disposed at one end of the heat dissipation fins in the extension direction to drive airflow along the extension direction of the heat dissipation fins.

8. The camera temperature control device as described in claim 1, characterized in that, The external heat exchange assembly (2) includes an external heat exchange plate, which is disposed between the heat pipe (3) and the external heat sink (21) to conduct heat between the heat pipe (3) and the external heat sink (21).

9. The camera temperature control device as described in claim 1, characterized in that, The camera temperature control device (40) includes a temperature controller (4) and a temperature sensor (41), wherein the temperature sensor (41) is disposed inside the camera (20) and electrically connected to the temperature controller (4).

10. A semiconductor testing machine, characterized in that, The semiconductor testing machine (100) includes a frame (10), a chuck device (30), a camera (20), and a camera temperature control device (40) as described in any one of claims 1 to 9, wherein the camera (20) and the camera temperature control device (40) are fixed on the frame (10), and the chuck device (30) is used to carry the semiconductor and is placed below the camera (20) so that the camera (20) can take pictures and position the semiconductor.

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