Microphone and electronic device

Abstract

The utility model discloses a kind of microphone and electronic equipment, it is related to microphone technical field, wherein, microphone includes substrate and shell, the one side of substrate is equipped with sensing chip and ASIC chip, the shell and the substrate are jointly configured to form containing cavity, the sensing chip and the ASIC chip are located in the containing cavity, the shell is configured as non-metal conductive material, one of the shell and the substrate is equipped with connecting buckle, the other is equipped with buckle slot, the connecting buckle is buckled in the buckle slot.The technical scheme provided by the utility model aims at reducing the weight of microphone, to realize the lightweight design of product.

Description

Technical Field

[0001] This utility model relates to the field of microphone technology, and in particular to a microphone and electronic device. Background Technology

[0002] With the rapid development of consumer electronics, especially the widespread adoption of smartphones, tablets, wearable devices, and smart home devices, the performance requirements for microphones are increasing. In related technologies, microphone housings are made of metal and fixed to a substrate through methods such as bonding or welding. However, while metal housings provide good electromagnetic shielding and structural strength, they also significantly increase product weight, hindering lightweight design. Utility Model Content

[0003] The main objective of this invention is to propose a microphone and electronic device that aims to reduce the weight of the microphone in order to achieve a lightweight design.

[0004] To achieve the above objectives, the microphone proposed in this utility model includes:

[0005] A substrate, on one side of which a sensor chip and an ASIC chip are mounted; and

[0006] The housing and the substrate together form a receiving cavity, the sensing chip and the ASIC chip are located in the receiving cavity, the housing is configured to be made of non-metallic conductive material, one of the housing and the substrate is provided with a connecting buckle, and the other is provided with a buckle groove, the connecting buckle is fastened to the buckle groove.

[0007] In one embodiment, the housing has an open end, and the connecting buckle includes a base portion and a fastening portion. The base portion protrudes from the end face of the open end, and the fastening portion protrudes from the outer peripheral side of the housing.

[0008] In one embodiment, the thickness of the base portion is less than the thickness of the shell, and it is disposed close to the outer periphery of the shell.

[0009] In one embodiment, the housing has an open end, the end face of which abuts against the substrate.

[0010] In one embodiment, the outer periphery of the open end is sealed to the substrate by adhesive.

[0011] In one embodiment, the housing is configured as a carbon fiber reinforced polymer.

[0012] In one embodiment, the connecting buckle is integrally formed into the housing.

[0013] In one embodiment, the thickness of the housing is 0.08 mm to 0.12 mm.

[0014] In one embodiment, the substrate includes at least two circuit layers, with a reinforcing layer sandwiched between adjacent circuit layers, the reinforcing layer being configured as a carbon fiber reinforced polymer.

[0015] In one embodiment, an insulating adhesive layer is provided between adjacent reinforcing layers and circuit layers, and the substrate is formed by compression molding.

[0016] In one embodiment, the circuit layer includes a first circuit layer exposed in the receiving cavity, the reinforcing layer includes a first reinforcing layer adjacent to the first circuit layer, the fastening groove is formed in the first circuit layer and the first reinforcing layer, and the connecting buckle includes a base portion and a fastening portion, the base portion passing through the first circuit layer and the fastening portion fastening to the first reinforcing layer.

[0017] This invention also proposes an electronic device that includes the aforementioned microphone.

[0018] In this invention, the non-metallic conductive material shell provides electromagnetic shielding, which helps ensure the microphone's performance. Compared to traditional metal shells, the non-metallic conductive material shell has a lower density, significantly reducing the overall weight of the microphone while maintaining structural strength and shielding performance. This facilitates lightweight design. Furthermore, the non-metallic conductive material has a higher specific modulus and yield strength, maintaining structural shape stability even under extremely thin-walled conditions, significantly improving the microphone's resistance to deformation and ensuring consistent acoustic performance and long-term reliability. Further, this invention utilizes a mechanical fastening structure with connecting clips and slots to create a stable mechanical interlock between the shell and the substrate, enhancing the microphone's vibration and shock resistance, ensuring the sealing integrity of the cavity and the stability of the internal chip's operating environment. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the structure of an embodiment of the microphone provided by this utility model;

[0021] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0022] Figure 3 for Figure 2 A schematic diagram of the structure before assembly of a local part of the component.

[0023] Explanation of icon numbers:

[0024] 100, Substrate; 101, Clip-on slot; 102, Acoustic hole; 110, Circuit layer; 111, First circuit layer; 120, Reinforcing layer; 121, Second reinforcing layer;

[0025] 200. Shell; 201. Open end; 202. Receiving cavity; 210. Connecting buckle; 211. Base part; 212. Fastening part;

[0026] 310. Sensor chip; 320. ASIC chip; 330. Glue.

[0027] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0029] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0030] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] This utility model proposes a microphone.

[0032] Please see Figures 1 to 3 In one embodiment of this utility model, the microphone includes a substrate 100 and a housing 200. A sensor chip 310 and an ASIC (Application-Specific Integrated Circuit) chip 320 are mounted on one side of the substrate 100. The housing 200 and the substrate 100 together form a receiving cavity 202. The sensor chip 310 and the ASIC chip 320 are located in the receiving cavity 202. The housing 200 is made of a non-metallic conductive material. One of the housing 200 and the substrate 100 is provided with a connecting buckle 210, and the other is provided with a buckle groove 101. The connecting buckle 210 is fastened to the buckle groove 101.

[0033] The substrate 100 has a sound hole 102 corresponding to the sensing chip 310. The sensing chip 310 can be a MEMS (Micro-Electro-Mechanical System) chip. After the sound wave enters the receiving cavity 202 through the sound hole 102, it acts on the diaphragm of the sensing chip 310. The sensing chip 310 converts the sound pressure into an electrical signal and transmits the electrical signal to the ASIC chip 320. The ASIC chip 320 integrates functional modules for processing the electrical signal.

[0034] In this invention, the non-metallic conductive shell 200 provides electromagnetic shielding, which helps ensure the microphone's performance. Compared to traditional metal shells, the non-metallic conductive shell 200 has a lower density, significantly reducing the overall weight of the microphone while maintaining structural strength and shielding performance, thus facilitating lightweight product design.

[0035] Non-metallic materials have low surface energy and a significantly different coefficient of thermal expansion compared to the substrate 100 material. Furthermore, the contact area between the housing 200 and the substrate 100 is limited. Traditional adhesive or welding methods are prone to problems such as interface delamination and aging-related detachment, affecting long-term reliability. This invention addresses this by establishing a mechanical interlocking structure between the connecting buckle 210 and the buckle groove 101, creating a stable mechanical interlock between the housing 200 and the substrate 100. This improves the microphone's vibration and shock resistance, ensuring the sealing integrity of the receiving cavity 202 and the stability of the internal chip's operating environment.

[0036] Furthermore, while traditional metal housings possess a certain degree of rigidity, the trend towards miniaturization has led to continuously thinner housing walls, making the ductility of metal materials a disadvantage. Thin-walled metal structures are prone to plastic deformation under stress, resulting in volume changes in the housing cavity 202, which in turn affects the microphone's acoustic response characteristics, and in severe cases, may even cause diaphragm contact or signal interruption. In contrast, non-metallic conductive materials have higher specific modulus and yield strength, enabling them to maintain structural shape stability even under extremely thin-walled conditions, significantly improving the microphone's resistance to deformation and ensuring consistent acoustic performance and long-term reliability.

[0037] In one embodiment, the housing 200 has an open end 201, and the connecting buckle 210 includes a base portion 211 and a fastening portion 212. The base portion 211 protrudes from the end face of the open end 201, and the fastening portion 212 protrudes from the outer periphery of the housing 200. That is, a receiving space is formed by the base plate 100 covering the open end 201 of the housing 200, the connecting buckle 210 is disposed on the housing 200, and the fastening groove 101 is formed on the base plate 100. Specifically, a stepped structure is formed at the connection between the base portion 211 and the fastening portion 212 on the outer periphery of the housing 200. The shape of the fastening groove 101 matches the shape of the connecting buckle 210. After the connecting buckle 210 is inserted into the fastening groove 101, it is restricted from being pulled out by the stepped structure, thereby ensuring the connection stability between the base plate 100 and the housing 200. In other embodiments, the connecting buckle 210 may also be configured as a protrusion on the outer or inner periphery of the housing 200, or the connecting buckle 210 may be disposed on the substrate 100 and the buckle groove 101 may be disposed on the housing 200.

[0038] In one embodiment, the thickness of the base portion 211 is less than the thickness of the housing 200, and it is located close to the outer periphery of the housing 200. This design ensures the overall structural strength of the housing 200 while thinning the base portion 211, which facilitates elastic deformation during assembly and allows for smooth insertion into the retaining slot 101. Simultaneously, reducing the size of the base portion 211 reduces the slot area of ​​the retaining slot 101 on the substrate 100, which helps maintain the structural continuity and mechanical strength of the substrate 100. Positioning the retaining slot 101 on the outer periphery of the substrate 100 effectively avoids the central high-density wiring area, preventing interference or damage to critical signal traces and improving electrical reliability.

[0039] The base portion 211 can be configured as a circumferentially closed structure surrounding the receiving space, and multiple fastening portions 212 are distributed circumferentially at intervals. Alternatively, multiple connecting buckles 210 can be distributed circumferentially at intervals as a whole.

[0040] In one embodiment, the end face of the open end 201 abuts against the substrate 100. This abutment between the end face of the open end 201 and the substrate 100 provides positioning for the engagement of the connecting clip 210 and the latching groove 101, and increases the contact area between the housing 200 and the substrate 100, helping to evenly distribute assembly stress and prevent localized warping or seal failure. In other embodiments, an elastic gasket or functional adhesive layer may also be provided between the end face of the open end 201 and the substrate 100 to compensate for tolerances or enhance cushioning performance.

[0041] In one embodiment, the outer periphery of the open end 201 is sealed to the substrate 100 by adhesive 330. Thus, the adhesive 330 fills the tiny gap between the housing 200 and the substrate 100, forming an airtight barrier that effectively prevents moisture, dust, and other contaminants from entering the receiving cavity 202, improving the product's environmental tolerance level and ensuring the microphone's performance and lifespan. Simultaneously, the bonding effect of the adhesive 330 further enhances the connection stability between the housing 200 and the substrate 100. The adhesive 330 can be epoxy or UV adhesive, combining high strength with rapid curing characteristics to meet the needs of automated production.

[0042] In one embodiment, the housing 200 is configured as a carbon fiber reinforced polymer. This material is prepared by hot pressing, using carbon fiber woven fabric as the reinforcing phase and thermosetting or thermoplastic resin as the matrix. It possesses the combined advantages of high modulus, high strength, and low density, ensuring not only the housing 200's resistance to deformation under thin-walled conditions but also giving it lightweight characteristics. Simultaneously, the carbon fiber network forms a conductive network within the material, achieving electromagnetic shielding without additional plating, simplifying the process and improving reliability. In other embodiments, the housing 200 may also be made of conductive engineering plastic or have a conductive layer coated on the surface of a non-metallic substrate.

[0043] In one embodiment, the connecting buckle 210 is integrally formed into the housing 200. That is, the connecting buckle 210 and the housing 200 are made of the same material, and when both are made of carbon fiber reinforced polymer, they are integrally formed by hot pressing. This integral forming method is suitable for mass production and also helps ensure the connection stability between the housing 200 and the substrate 100. In other embodiments, the connecting buckle 210 and the housing 200 can also be integrally formed by welding after being separately formed.

[0044] In one embodiment, the thickness of the housing 200 is between 0.08 mm and 0.12 mm. This ultra-thin design minimizes the volume and weight of the housing 200 while meeting structural strength and shielding performance requirements, making it suitable for applications such as TWS earphones and wearable devices that are highly sensitive to space and weight. The thickness of the housing 200 can be 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, or 0.12 mm. In other embodiments, while meeting structural strength requirements, the thickness of the housing 200 can be set to other dimensions as needed, such as 0.06 mm, 0.07 mm, 0.13 mm, or 0.14 mm.

[0045] In one embodiment, the substrate 100 includes at least two circuit layers 110, with a reinforcing layer 120 sandwiched between adjacent circuit layers 110. The reinforcing layer 120 is configured as a carbon fiber reinforced polymer. Thus, the high-density interconnection wiring requirements of components such as the ASIC chip 320 can be met through multiple circuit layers 110, while the built-in reinforcing layer 120 significantly improves the overall rigidity and bending resistance of the substrate 100. The carbon fiber reinforced polymer has the advantages of high modulus, high strength, and low density, which, while improving the structural strength of the substrate 100, also helps to achieve a lighter substrate 100, thereby further reducing the weight of the microphone.

[0046] In one embodiment, an insulating adhesive layer is provided between adjacent reinforcing layers 120 and circuit layers 110, and the substrate 100 is formed by compression molding. Thus, the insulating adhesive layer ensures the insulating fit between the reinforcing layers 120 and circuit layers 110, thereby ensuring the microphone's operating performance. By compression molding the stacked layers, the substrate 100 achieves tight bonding between the materials, improving interlayer adhesion and environmental resistance, which helps ensure the structural strength of the substrate 100. In other embodiments, the reinforcing layers 120 and circuit layers 110 can also achieve insulating fit through other methods.

[0047] In one embodiment, the circuit layer 110 includes a first circuit layer 111 exposed in the receiving cavity 202, the reinforcing layer 120 includes a first reinforcing layer 121 adjacent to the first circuit layer 111, the fastening groove 101 is formed in the first circuit layer 111 and the first reinforcing layer 121, and the connecting buckle 210 includes a base portion 211 and a fastening portion 212, the base portion 211 passing through the first circuit layer 111, and the fastening portion 212 fastening to the first reinforcing layer 121. It should be noted that the notch 101 is located in the non-conductive area of ​​the first circuit layer 111, the base portion 211 passes through the part of the notch 101 located in the first circuit layer 111, and the fastening portion 212 fastens to the part of the notch 101 located in the first reinforcing layer 121. This helps to form a relatively closed electromagnetic shield, ensuring the working performance of the microphone. At the same time, the reinforcing layer 120 has greater structural strength. The fastening of the connecting buckle 210 and the first reinforcing layer 121 helps to improve the connection strength between the substrate 100 and the housing 200, thereby ensuring the structural stability of the microphone.

[0048] This utility model also proposes an electronic device, which includes a microphone. The specific structure of the microphone is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here. Specifically, the electronic device can be a smartphone, tablet computer, wearable device, or smart home device.

[0049] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A microphone, characterized in that, include: A substrate, on one side of which a sensor chip and an ASIC chip are mounted; as well as The housing and the substrate together form a receiving cavity, the sensing chip and the ASIC chip are located in the receiving cavity, the housing is configured to be made of non-metallic conductive material, one of the housing and the substrate is provided with a connecting buckle, and the other is provided with a buckle groove, the connecting buckle is fastened to the buckle groove.

2. The microphone as described in claim 1, characterized in that, The housing has an open end, and the connecting buckle includes a base part and a fastening part. The base part protrudes from the end face of the open end, and the fastening part protrudes from the outer peripheral side of the housing.

3. The microphone as described in claim 2, characterized in that, The thickness of the base portion is less than the thickness of the shell, and it is disposed close to the outer periphery of the shell.

4. The microphone as claimed in claim 1, characterized in that, The housing has an open end, the end face of which abuts against the substrate.

5. The microphone as described in claim 4, characterized in that, The outer periphery of the open end is sealed to the substrate with glue.

6. The microphone as claimed in claim 1, characterized in that, The housing is configured as a carbon fiber reinforced polymer; And / or, the connecting buckle is integrally formed into the housing.

7. The microphone as claimed in claim 1, characterized in that, The thickness of the shell is 0.08 mm to 0.12 mm.

8. The microphone as claimed in any one of claims 1 to 7, characterized in that, The substrate includes at least two circuit layers, and a reinforcing layer is sandwiched between two adjacent circuit layers. The reinforcing layer is configured as a carbon fiber reinforced polymer.

9. The microphone as claimed in claim 8, characterized in that, An insulating adhesive layer is provided between adjacent reinforcing layers and circuit layers, and the substrate is formed by compression molding; And / or, the circuit layer includes a first circuit layer exposed in the receiving cavity, the reinforcing layer includes a first reinforcing layer adjacent to the first circuit layer, the fastening groove is formed in the first circuit layer and the first reinforcing layer, the connecting buckle includes a base portion and a fastening portion, the base portion passes through the first circuit layer, and the fastening portion fastens to the first reinforcing layer.

10. An electronic device, characterized in that, Includes the microphone as described in any one of claims 1 to 9.

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