Curved surface fitting Bluetooth earphone mainboard

Abstract

The utility model discloses a kind of curved surface adhering type bluetooth headset mainboards, it is related to flexible circuit board technical field, including curved surface shell, the bottom of the curved surface shell both ends is fixed with limit frame, and the opposite side of two sides limit frame inside is provided with clamping groove, two sides The limit frame is located at the bottom of the curved surface shell both ends parallel arrangement, and two sides limit frame is mirror image relative ''L'' shape structure.The application provides a kind of curved surface adhering type bluetooth headset mainboard, by being arranged limit frame in the bottom of the curved surface shell both ends parallel, and in the opposite side ''L'' shape structure limit frame relative surface clamping groove and the limit cooperation of FPC body outer edge, by the clamping limit of FPC body two sides, to avoid adhesive shrinkage phenomenon in aging process, cause the delamination phenomenon between the periphery of flexible circuit board and the inner wall of curved surface shell, make air penetrate along gap to inside, further accelerate the aging speed of adhesive, guarantee the stability of FPC body bonding.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, specifically a curved surface-fitting Bluetooth headset motherboard. Background Technology

[0002] Flexible circuit boards are highly reliable and extremely flexible printed circuit boards made with polyimide or polyester film as the substrate. Due to their good flexibility, they can be attached to flexible objects and bend within a certain range.

[0003] Traditional techniques for bonding flexible circuit boards to the inner wall of curved surfaces typically use adhesives. However, these adhesives age and shrink over time, leading to reduced bonding strength. This can cause the flexible circuit board to delaminate and detach from the inner wall of the curved surface. Furthermore, when the flexible circuit board is bonded to the curved surface, air can easily remain between them, causing the flexible circuit board to bubble and fail to adhere tightly to the curved surface, thus affecting its usability. Utility Model Content

[0004] The purpose of this invention is to provide a curved surface-fitting Bluetooth headset motherboard to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a curved surface fitting Bluetooth headset motherboard, including a curved shell, with limiting frames fixed at both ends of the bottom of the curved shell, and slots opened on the inner opposite surfaces of the limiting frames on both sides.

[0006] Furthermore, the limiting frames on both sides are arranged parallel to each other at the bottom ends of the curved shell, and the limiting frames on both sides are mirror-image "L" shaped structures.

[0007] Furthermore, the inner wall of the curved shell is provided with an arc-shaped curved surface, and the inner wall of the curved shell is coated with an adhesive layer.

[0008] Furthermore, the adhesive layer is bonded to the FPC body at one end away from the arc-shaped inner wall of the curved shell, and the FPC body is matched with the adjacent slots on both sides.

[0009] Furthermore, the FPC body has symmetrical slots on both outer edges, and the slots are funnel-shaped, gradually widening from the inside to the outside.

[0010] Furthermore, the FPC body has air holes in the middle, and the air holes are arranged in a linear array along the length of the FPC body.

[0011] Compared with the prior art, the present invention has the following beneficial effects: 1. In use, this utility model sets parallel limiting frames at both ends of the bottom of the curved shell, and under the limiting action of the corresponding slots of the "L"-shaped limiting frames on both sides and the outer edge of the FPC body, the FPC body is clamped and limited on both sides to prevent the adhesive from shrinking during the aging process, which would cause delamination between the periphery of the flexible circuit board and the inner wall of the curved shell, allowing air to penetrate into the interior along the gap, further accelerating the aging speed of the adhesive and ensuring the stability of the FPC body bonding.

[0012] 2. In use, this utility model has symmetrically opened funnel-shaped slots on both outer edges of the FPC body, which gradually expand from the inside to the outside. This reduces the restrictions on the FPC body when bending, allowing it to fit onto different curved surfaces without causing bulges. The air holes arranged in a straight array along the length of the central part can expel air when the FPC body is bonded to the inner wall of the curved shell through the adhesive layer, thus avoiding the formation of air bubbles that may affect the bonding effect. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of the device of this utility model; Figure 2 This is a cross-sectional view of the device of this utility model; Figure 3 This is a schematic diagram of the FPC body structure of this utility model.

[0014] In the diagram: 1. Curved shell; 2. Limiting frame; 3. Slot; 4. Adhesive layer; 5. FPC body; 6. Groove; 7. Air hole. Detailed Implementation

[0015] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but should not be used to limit the scope of this utility model.

[0016] like Figures 1 to 2 As shown, a curved surface-fitting Bluetooth headset motherboard includes a curved shell 1, with limiting frames 2 fixed at both ends of the bottom of the curved shell 1, and slots 3 opened on the inner opposite surfaces of the limiting frames 2 on both sides. The limiting frames 2 on both sides are arranged parallel to each other at the bottom ends of the curved shell 1, and the limiting frames 2 on both sides are mirror-shaped "L" structures. The inner wall of the curved shell 1 is provided with an arc-shaped curved surface, and an adhesive layer 4 is applied to the inner wall of the curved shell 1. The specific operation is as follows: By setting the limiting frames 2 parallel at both ends of the bottom of the curved shell 1, and under the limiting cooperation of the corresponding slots 3 of the "L"-shaped limiting frames 2 on both sides and the outer edge of the FPC body 5, the FPC body 5 is limited by the snap-fit ​​on both sides to prevent the adhesive from shrinking during the aging process, which would cause the flexible circuit board to delaminate between the periphery and the inner wall of the curved shell 1, allowing air to penetrate into the interior along the gap, further accelerating the aging speed of the adhesive and ensuring the stability of the bonding of the FPC body 5. like Figures 1 to 3 As shown, the adhesive layer 4 is bonded to one end of the arc-shaped inner wall of the curved shell 1, and the FPC body 5 is limited and matched with the adjacent slot 3 on both sides of the FPC body 5. The outer edges of both sides of the FPC body 5 are symmetrically provided with slots 6, and the slots 6 are in the shape of a trumpet that gradually expands from the inside to the outside. The middle part of the FPC body 5 is provided with air holes 7, and the air holes 7 are arranged in a straight array along the length direction of the FPC body 5. The specific operation is as follows: By symmetrically opening funnel-shaped slots 6 on both outer edges of the FPC body 5, which gradually expand from the inside to the outside, the FPC body 5 is less restricted when bending and can fit into different curved surfaces without causing bulges. The air holes 7 arranged in a straight array along the length direction in the middle can expel air when the FPC body 5 is bonded to the inner wall of the curved shell 1 through the adhesive layer 4, so as to avoid the appearance of air bubbles affecting the bonding effect.

[0017] Working principle: By setting parallel limiting frames 2 at both ends of the bottom of the curved shell 1, and with the limiting action of the corresponding slots 3 of the "L"-shaped limiting frames 2 on both sides and the outer edge of the FPC body 5, the FPC body 5 is limited by the snap-fit ​​on both sides to prevent the adhesive from shrinking during the aging process, which would cause delamination between the periphery of the flexible circuit board and the inner wall of the curved shell 1, allowing air to penetrate inward along the gap, further accelerating the aging speed of the adhesive and ensuring the stability of the bonding of the FPC body 5. By symmetrically opening flared slots 6 on both outer edges of the FPC body 5 from the inside out, the FPC body 5 is less restricted when bending, and can be fitted to different curved surfaces without causing bulging. The air holes 7 arranged in a straight array along the length direction in the middle can expel air when the FPC body 5 is bonded to the inner wall of the curved shell 1 through the adhesive layer 4, avoiding the appearance of air bubbles that affect the bonding effect.

[0018] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A curved surface-fitting Bluetooth headset motherboard, comprising a curved shell (1), characterized in that, The curved shell (1) has a limit frame (2) fixed at both ends of its bottom, and the inner opposite surfaces of the limit frames (2) on both sides are provided with slots (3).

2. The curved surface bonding Bluetooth headset motherboard according to claim 1, characterized in that, The limiting frames (2) on both sides are set parallel to each other at the bottom ends of the curved shell (1), and the limiting frames (2) on both sides are mirror-image "L" shaped structures.

3. The curved surface bonding Bluetooth headset motherboard according to claim 2, characterized in that, The inner wall of the curved shell (1) is provided with an arc-shaped curved surface, and the inner wall of the curved shell (1) is coated with an adhesive layer (4).

4. The curved surface bonding Bluetooth headset motherboard according to claim 3, characterized in that, The adhesive layer (4) is bonded to the FPC body (5) at one end away from the arc-shaped inner wall of the curved shell (1), and the FPC body (5) is limited and matched with the adjacent slot (3) on both sides.

5. A curved surface-fitting Bluetooth headset motherboard according to claim 4, characterized in that, The FPC body (5) has symmetrical slots (6) on both outer edges, and the slots (6) are in the shape of a trumpet opening that gradually expands from the inside to the outside.

6. A curved surface-fitting Bluetooth headset motherboard according to claim 5, characterized in that, The FPC body (5) has air holes (7) in the middle, and the air holes (7) are arranged in a straight array along the length of the FPC body (5).

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