Multifunctional ceramic heating device

Abstract

The utility model discloses a multifunctional ceramic heating device, which comprises a ceramic sheet main body and a plurality of lead wires at least partially penetrating through the ceramic sheet main body, the ceramic sheet main body comprises a plurality of functional layers which are stacked and closely attached to each other, the lead wires are connected to one or more of the functional layers, and the plurality of functional layers comprise at least one of a heating layer, an outer shell, a heating wire lead wire layer, a shielding layer, a thermistor layer and a thermistor lead wire layer. The utility model aims to solve the problems of insufficient power, large size and heavy weight of the existing heating device.

Description

[0001] This application claims priority to Chinese Patent Application No. 2024225248607 (titled: A Multifunctional Ceramic Heater, priority date October 18, 2024). Technical Field

[0002] This utility model belongs to the field of temperature control technology for chip testing equipment, and in particular relates to a multifunctional ceramic heater. Background Technology

[0003] In the vast field of the semiconductor industry, temperature control and heat dissipation technology plays a crucial role, especially in the packaging and testing of semiconductor chips. In advanced testing systems such as ATE (Automatic Test Equipment) and SLT (System-Level Testing), the thermal head is a core technology component. Its precise temperature control capabilities, regional temperature control strategies, temperature uniformity assurance, and high-speed response mechanism to temperature fluctuations are all the cornerstones for ensuring the accuracy and stability of testing.

[0004] With the rapid development of cutting-edge packaging technologies such as SOC (System-on-a-Chip), SIP (System-in-Package), and Chiplet, chip design is increasingly trending towards larger size, higher power, and greater complexity. A single chip may integrate multiple small chips with different functions, performance characteristics, and manufacturing processes. These chips vary greatly in thickness and heat dissipation, bringing unprecedented challenges to subsequent testing. Therefore, the design of modern temperature control heads not only needs to achieve highly uniform temperature distribution at the chip contact surface, but also needs to possess powerful heat dissipation capabilities, a compact size, excellent heat transfer efficiency, and be equipped with a temperature sensing system that can provide comprehensive coverage rather than single-point monitoring, in order to fully adapt to and exceed the stringent testing requirements of these new chips.

[0005] The heatsinks currently used in these chip tests face the following significant challenges:

[0006] Insufficient power: The output power of traditional heaters is difficult to match the high power requirements of emerging chips, especially when testing high-performance heat-generating components such as AI chips, where they are inadequate.

[0007] Vulnerability issues: Existing heaters, such as electric heating rods (cartridge heaters), are prone to overheating and burning out during use, which reduces the reliability and lifespan of the system.

[0008] Heating unevenness: Existing heaters often fail to ensure uniform temperature distribution of the object being heated during the heating process, which may adversely affect test results or application effects.

[0009] Large and thick volume: for certain types of heaters, especially ceramic heaters, the thickness often exceeds 1.5 mm, which is particularly inconvenient in application scenarios with limited space, and limits the design flexibility and integration degree.

[0010] Lack of monitoring: most existing heaters do not have a built-in comprehensive temperature sensing system, making it difficult to feed back the heating status in a timely and accurate manner, which affects the precise control and safety guarantee of the heating process. Summary of Utility Model

[0011] In view of the above disadvantages of the prior art, the object of the present utility model is to solve the problems of insufficient power, large and thick volume of the existing heater.

[0012] The present application provides a multifunctional ceramic heater, comprising: a ceramic sheet main body and a plurality of lead wires at least partially penetrating through the ceramic sheet main body, wherein the ceramic sheet main body comprises a plurality of functional layers arranged in a stacked manner and closely attached to each other, the lead wires are connected to one or more of the functional layers, and the plurality of functional layers comprise a heating layer and at least one of an outer casing, a heating wire lead layer, a shielding layer, a thermistor layer and a thermistor lead layer.

[0013] Further, the heating layer comprises a heating wire, heating layer leads and a heating layer base plate, wherein the heating wire is coiled and flatwise arranged on the heating layer base plate and connected with the heating layer leads.

[0014] Further, the thermistor layer comprises a thermistor wire, thermistor layer leads and a thermistor layer base plate, wherein the thermistor wire is coiled and flatwise arranged on the thermistor layer base plate and connected with the thermistor layer leads.

[0015] Specifically, the heating wire or the thermistor wire is arranged in such a manner that the heating wire or the thermistor wire is coiled and flatwise arranged in two inner and outer regions in a shape of a Chinese character 'hui', or in two left-right or upper-lower regions in a shape of a Chinese character 'lü', or in four independent regions in a shape of a Chinese character 'tian', respectively, or specially customized regions with special shapes divided according to actual requirements.

[0016] Specifically, the ceramic sheet main body comprises:

[0017] the outer casing, the heating wire lead layer, one or more heating layers, the shielding layer, the thermistor lead layer, the thermistor layer, the shielding layer and the outer casing which are sequentially stacked;

[0018] or a heating wire lead layer, one or more heating layers, a shielding layer, a thermistor lead layer, a thermistor layer and a shielding layer which are sequentially stacked;

[0019] or an outer casing, a heating wire lead layer, one or more heating layers, a thermistor lead layer, a thermistor layer and an outer casing which are sequentially stacked;

[0020] Alternatively, it may include a shell, a heating wire lead layer, one or more heating layers, a shielding layer, and a shell arranged in sequence.

[0021] Furthermore, the shielding layer is an electromagnetic shielding layer, used to reduce electromagnetic interference from the heating layer to the thermistor layer or the outside world.

[0022] Specifically, it has one shielding layer located between the thermistor layer and the heating resistor layer; or it has at least two shielding layers, with the thermistor layer disposed between at least two shielding layers. If there are multiple shielding layers, the outermost shielding layer can also prevent electromagnetic interference from the heating wire from leaking out.

[0023] Specifically, one end of the lead wire extending outward is configured as a pin-type lead or a flexible wire lead.

[0024] Specifically, the leads of the shielding layer can be used to install and fix the ceramic heater.

[0025] Specifically, one end of the lead wire extending outward is located on both sides of the ceramic sheet body.

[0026] The improvements in this application bring the following advantages: The multifunctional ceramic heater of this application embodiment has multiple functional layers, which can perform multiple functions such as heating, shielding, and temperature measurement. In actual production work, a certain functional layer can be added or removed according to different needs to enhance or reduce a certain function to meet the needs of production work. Moreover, this layered arrangement allows the thickness of the ceramic sheet body to be very thin, for example, close to 1 mm or even thinner. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of a multifunctional ceramic heater according to an embodiment of this application;

[0028] Figure 2 This is an exploded schematic diagram of a multifunctional ceramic heater according to an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of a wiring method for a heating layer or thermistor layer in an embodiment of this application;

[0030] Figure 4 This is a schematic diagram of another wiring method for the heating layer or thermistor layer in an embodiment of this application;

[0031] Figure 5 This is a schematic diagram of another wiring method for the heating layer or thermistor layer in an embodiment of this application;

[0032] The components are as follows: ceramic sheet body-1; lead wire-2; heating layer lead wire-21; thermistor layer lead wire-22; shielding layer lead wire-23; outer shell-3; heating layer-4; heating wire-41; heating layer base plate-42; heating wire lead wire layer-5; shielding layer-6; thermistor layer-7; thermistor wire-71; thermistor layer base plate-72; and thermistor lead wire layer-8. Detailed Implementation

[0033] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0034] Please see Figure 1-5 This application discloses a multifunctional ceramic heater, comprising a ceramic plate body and multiple leads that at least partially penetrate the ceramic plate body. The leads extend outward to connect to external circuitry. The ceramic plate body comprises multiple functional layers stacked and tightly fitted together. The leads are connected to one or more of the functional layers. The multiple functional layers include at least two of the following: a shell, a heating layer, a heating wire lead layer, a shielding layer, a thermistor layer, and a thermistor lead layer. The leads include at least one of the following: heating layer leads, shielding layer leads, and thermistor layer leads.

[0035] The close bonding of the multi-layered functional layers described in this application means that, ideally, the gaps between the layers are zero, the bonding is seamless, and no cavities or air bubbles are allowed. Of course, those skilled in the art will understand that in actual operation, it is impossible to achieve a completely ideal state, and a small number of tiny gaps, cavities, and air bubbles should be allowed.

[0036] The preferred material for the ceramic sheet body is ALN (aluminum nitride).

[0037] This ceramic heater has multiple functional layers, providing functions such as heating, shielding, and temperature measurement. In actual production, certain functional layers can be added or removed according to different needs to enhance or reduce a particular function and meet the requirements of production work.

[0038] For example, the ceramic sheet body may include:

[0039] The outer shell, heating wire lead layer, heating layer, shielding layer, thermistor lead layer, thermistor layer, shielding layer and outer shell are stacked in sequence; this arrangement is fully functional and relatively thin, but has lower heating power.

[0040] Alternatively, it may include a shell, a heating wire lead layer, two or more heating layers, a shielding layer, a thermistor lead layer, a thermistor layer, a shielding layer, and a shell arranged in sequence; this arrangement is fully functional and has two or more heating layers, which can achieve very high heating power.

[0041] Alternatively, it may include a heating wire lead layer, one or more heating layers, a shielding layer, a thermistor lead layer, a thermistor layer, and a shielding layer stacked in sequence; other configurations may use an outer shell to protect the other functional layers inside. If not needed, the outer shell layer may be removed in this configuration to reduce the thickness of the final product.

[0042] Alternatively, it may include a shell, a heating wire lead layer, one or more heating layers, a thermistor lead layer, a thermistor layer, and a shell arranged in sequence.

[0043] Alternatively, it may include a shell, a heating wire lead layer, one or more heating layers, a shielding layer, and a shell arranged in sequence.

[0044] In addition, this layered arrangement allows the ceramic sheet body to be made very thin, for example, close to 1mm or even thinner, which is far less than the thickness of ceramic heaters currently on the market (such as 3mm).

[0045] As an example

[0046] like Figure 3 As shown in Figure 4, the heating layer includes a heating wire, heating layer leads, and a heating layer base plate. The heating wire is coiled and laid flat on the heating layer base plate and connected to the heating layer leads. In other words, the heating wire is coiled back and forth against the heating layer base plate. This arrangement not only allows the heating layer to be thinner but also makes the heating of the heating layer more uniform.

[0047] like Figure 3 As shown in Figure 4, the thermistor layer includes a thermistor wire, thermistor layer leads, and a thermistor layer substrate. The thermistor wire is coiled and laid flat on the thermistor layer substrate and connected to the thermistor layer leads. In other words, the thermistor wire is coiled back and forth against the thermistor substrate. This arrangement not only allows for a thinner thermistor layer but also enables more effective measurement of the chip's planar temperature distribution, providing a more detailed understanding of the chip's real-time temperature changes and dynamic distribution.

[0048] like Figure 3 As shown, the heating wire or thermistor wire is divided into inner and outer regions and arranged in a U-shape.

[0049] like Figure 4 As shown, the heating wire or thermistor wire is divided into two areas, left and right or top and bottom, arranged in a spiral shape, or in a flattened shape.

[0050] like Figure 5 As shown, the heating wire or thermistor wire is arranged in four independent spiral sections in a grid pattern.

[0051] Alternatively, the hovering setup can be specially divided into zones according to actual needs.

[0052] The heating wire lead layer is used to guide the heating layer leads to the appropriate positions, such as... Figure 2 As shown, this is to connect different heating layer leads to different heating areas.

[0053] The thermistor lead layer is used to guide the thermistor leads to the appropriate locations, such as... Figure 2 As shown, this allows for the connection of different thermistor layer leads to different temperature measurement working areas.

[0054] As an example

[0055] The shielding layer is an electromagnetic shielding layer. The shielding layer is grounded through the lead wire of the shielding layer to reduce electromagnetic interference from the heating layer to the thermistor layer or the outside world (such as the chip under test).

[0056] like Figure 2 As shown, it has at least one shielding layer, with the at least one shielding layer located between the thermistor layer and the heating resistor layer. If there are multiple shielding layers, the outermost shielding layer can also prevent electromagnetic interference from the heating wire from leaking out.

[0057] As an example

[0058] The shielding layer's leads can be used to mount and secure the ceramic heater. These leads can be made relatively thick and robust to support and secure the ceramic heater, for example, by binding it to a crimped structure. Integrating the leads with the mounting structure helps reduce the size and structural complexity of the ceramic heater.

[0059] The end of the lead wire that extends outward can be called a pin. The pin can be set to the common pin type or flexible wire pin that is commonly used in PCBs. Different types of pins can be selected according to actual needs.

[0060] like Figure 1 As shown, the pins are located on both sides of the ceramic plate body, and can also be flexibly changed according to specific needs, such as being mixed and alternately inserted.

[0061] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A multifunctional ceramic heater, characterized in that, Comprises a ceramic sheet main body and a plurality of lead wires at least partially penetrating the ceramic sheet main body, wherein the ceramic sheet main body comprises a plurality of functional layers arranged in a stacked manner and closely attached to each other, the lead wires are connected to one or more of the functional layers, and the plurality of functional layers comprise a heating layer and at least one of an outer shell, a heating wire lead layer, a shielding layer, a thermistor layer and a thermistor lead layer.

2. The ceramic heater according to claim 1, characterized in that, The heating layer comprises a heating wire, heating layer leads and a heating layer base plate, wherein the heating wire is spirally and flatly arranged on the heating layer base plate and connected to the heating layer leads.

3. The ceramic heater according to claim 1, characterized in that, The thermistor layer comprises a thermistor wire, thermistor layer leads and a thermistor layer base plate, wherein the thermistor wire is spirally and flatly arranged on the thermistor layer base plate and connected to the thermistor layer leads.

4. The ceramic heater according to claim 2 or 3, characterized in that, The heating wire or the thermistor wire is arranged in such a manner that it is divided into an inner region and an outer region in a shape of a Chinese character '回', or a left region and a right region or an upper region and a lower region in a shape of a Chinese character '吕', or four independent regions in a shape of a Chinese character '田', and is respectively spirally and flatly arranged.

5. The ceramic heater according to any one of claims 1-3, characterized in that, The ceramic sheet main body comprises: the outer shell, the heating wire lead layer, one or more layers of the heating layer, the shielding layer, the thermistor lead layer, the thermistor layer, the shielding layer and the outer shell which are sequentially stacked; or comprises a heating wire lead layer, one or more heating layers, a shielding layer, a thermistor lead layer, a thermistor layer and a shielding layer which are sequentially stacked; or comprises an outer shell, a heating wire lead layer, one or more heating layers, a thermistor lead layer, a thermistor layer and an outer shell which are sequentially stacked; or comprises an outer shell, a heating wire lead layer, one or more heating layers, a shielding layer and an outer shell which are sequentially stacked.

6. The ceramic heater according to any one of claims 1-3, characterized in that, The shielding layer is an electromagnetic shielding layer configured to reduce electromagnetic interference from the heating layer to the thermistor layer or the outside.

7. The ceramic heater according to claim 6, characterized in that, There is one layer of the shielding layer, and the one layer of shielding layer is located between the thermistor layer and the heating resistor layer; or there are at least two layers of the shielding layer, and the thermistor layer is arranged between the at least two layers of shielding layers.

8. The ceramic heater according to any one of claims 1-3, characterized in that, An end of the lead wire led outward is configured as a pin-type terminal or a flexible wire terminal.

9. The ceramic heater according to any one of claims 1-3, characterized in that, The lead wire of the shielding layer can be used for mounting and fixing the ceramic heater.

10. The ceramic heater according to any one of claims 1-3, characterized in that, The ends of the lead wires led outward are arranged on two sides of the ceramic sheet main body.

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