Waterproof circuit board assembly

Abstract

A waterproof circuit board assembly, characterized in that it comprises a mother board, a connector, a sealing layer, an inner mold and an outer mold. The mother board comprises a mother board body; the connector is arranged on the front surface of the mother board body, and the connector is provided with a connecting socket; the sealing layer comprises a glue filling shell and sealing glue, the glue filling shell is arranged on the front surface of the mother board body, and the glue filling shell and the mother board body form a containing space which is closed at the bottom and open at the top, and the sealing glue is filled in the containing space; the inner mold covers the mother board, the connector and the sealing layer, and exposes the connecting socket of the connector; and the outer mold covers the inner mold.

Description

Technical Field

[0001] This utility model relates to the field of electrical components, and in particular to a waterproof circuit board assembly. Background Technology

[0002] PCBA stands for Printed Circuit Board Assembly, one of the most important components in electronic devices. A PCBA mainly consists of three parts: a printed circuit board, electronic components, and solder. It provides circuit connections and heat dissipation, and is widely used as an important component in 3C products such as computers and related products, communication products, and consumer electronics.

[0003] Because PCBAs are used to solder various electronic components, and different electronic components have different impact resistance and temperature resistance, such as inductors and crystal oscillators, which are not impact resistant, the pressure during injection molding can damage the circuit board assembly shell and cause varying degrees of damage to the electronic components. They are not waterproof and ultimately fail to meet the usage requirements. Utility Model Content

[0004] This utility model proposes a waterproof circuit board assembly to enhance its pressure resistance and waterproof performance. The waterproof circuit board assembly includes:

[0005] Mother plate, including the mother plate body;

[0006] A connector is disposed on the front side of the motherboard body, and the connector is provided with a connection port;

[0007] The sealing layer includes a potting shell and a sealant. The potting shell is disposed on the front side of the mother plate body and forms an accommodating space that is sealed on all sides and at the bottom and open at the top. The sealant fills the accommodating space.

[0008] The inner mold covers the motherboard, the connector, and the sealing layer, exposing the connector's connection port.

[0009] The outer mold covers the inner mold and exposes the connector's connection port.

[0010] Furthermore, in the waterproof circuit board assembly described above, the connector is connected to the motherboard body by soldering, with the solder joints located on the back of the motherboard body; the motherboard includes an adhesive backing layer disposed on the back of the motherboard body to protect the solder joints.

[0011] Furthermore, in the waterproof circuit board assembly described above, the potting shell is provided with a protective cover that covers the inductor on the front side of the motherboard body.

[0012] Furthermore, in the waterproof circuit board assembly described above, the sidewall of the potting shell is provided with a cantilever buckle for snap-fit ​​connection with the motherboard body.

[0013] The advantage of this invention lies in the fact that the design of the sealant and backing adhesive layer achieves the waterproof function of the circuit board assembly. A protective cover is provided on the potting shell to enclose the inductor element, protecting it and preventing damage from the injection pressure generated during injection molding. Attached Figure Description

[0014] Figure 1 This is a three-dimensional schematic diagram of the present invention.

[0015] Figure 2 This is an exploded view of the present invention.

[0016] Figure 3 This is a three-dimensional schematic diagram of the present invention after the inner mold is covered.

[0017] Figure 4 This is a three-dimensional schematic diagram of the connector of this utility model connected to the motherboard.

[0018] Figure 5 This is a three-dimensional schematic diagram of the potting shell of this utility model.

[0019] Figure 6 This is a three-dimensional schematic diagram of the glue-filled shell of this utility model connected to the mother plate. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "one side," "one end," and "one side," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0024] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0025] The accompanying drawings illustrate various structural schematic diagrams according to embodiments disclosed in this invention. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0026] like Figures 1 to 3 As shown, the waterproof circuit board assembly of this utility model includes a motherboard 1, a connector 2, a sealing layer 3, an inner mold 4, and an outer mold 5. The sealing layer 3 and the connector 2 are both disposed on the motherboard 1. The inner mold 4 covers the motherboard 1 and the sealing layer 3, and partially covers the connector 2. The outer mold 5 covers the inner mold 4.

[0027] like Figure 2 and Figure 4 As shown, the motherboard 1 includes a motherboard body 11 and an adhesive backing layer 12. The motherboard body 11 is provided with various electronic components, including inductors 13. The pins on the connector 2 pass through the pin holes of the motherboard body 11 and are fixed to the front side of the motherboard body 11 (the side with electronic components) by soldering. The solder joints (not shown in the figure) are located on the back side of the motherboard body. The adhesive backing layer 12 is coated on the back side of the motherboard body 11 to protect the solder joints and provide waterproofing. The adhesive backing layer 12 is a conformal adhesive.

[0028] like Figure 2 As shown, the connector 2 is provided with a connection socket 21 for inserting external circuits.

[0029] like Figure 2 , Figure 5 and Figure 6 As shown, the sealing layer 3 includes a potting shell 31 and sealant 32. The potting shell 31 is disposed on the front side of the motherboard body 11, forming a receiving space 33 with the motherboard body 11 that is sealed on all four sides and open at the top. The electronic components disposed on the motherboard body 11 are all distributed within the receiving space 33. The sealant 32 is also potted into the receiving space 33 to protect the electronic components.

[0030] Preferably, the potting housing 31 is provided with a protective cover 311 and a tail wing 312. The protective cover 311 covers the inductor 13 to protect the inductor 13 from damage caused by the pressure of injection molding. The tail wing is attached to the top of the connector 2 to reinforce the connector 2.

[0031] Preferably, the side wall of the glue-filling shell 31 is provided with a cantilever buckle 313, which is fastened to the mother plate body 11 to connect the glue-filling shell 31 and the mother plate body 11, ensuring the sealing of the accommodating space 33 and preventing glue leakage when the sealant 32 is poured.

[0032] In a preferred embodiment of this utility model, the molding material of the potting shell 31 is Nylon + 25%GF, which has high hardness and is resistant to the pressure generated during injection molding.

[0033] like Figure 3 As shown, the inner mold 4 covers the mother plate 1, the sealing layer 3 and the connector 2, and exposes the connection port 21 of the connector 2.

[0034] like Figure 1 As shown, the outer mold 5 covers the inner mold 4 and exposes the connection port 21.

[0035] The advantage of this invention lies in the fact that the design of the sealant 32 and the backing adhesive layer 12 achieves the waterproof function of the circuit board assembly. By setting a protective cover 311 on the potting shell 31 to cover the inductor 13, the inductor 13 is protected and the injection pressure generated during injection molding is prevented from damaging the inductor 13.

[0036] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A waterproof circuit board assembly, characterized in that, include: Mother plate, including the mother plate body; A connector is disposed on the front side of the motherboard body, and the connector is provided with a connection port; The sealing layer includes a potting shell and a sealant. The potting shell is disposed on the front side of the mother plate body and forms an accommodating space that is sealed on all sides and at the bottom and open at the top. The sealant fills the accommodating space. The inner mold covers the motherboard, the connector, and the sealing layer, exposing the connector's connection port. The outer mold covers the inner mold and exposes the connector's connection port.

2. The waterproof circuit board assembly as described in claim 1, characterized in that, The connector is connected to the motherboard body by welding, and its solder joints are located on the back of the motherboard body; the motherboard includes an adhesive backing layer, which is disposed on the back of the motherboard body to protect the solder joints.

3. The waterproof circuit board assembly as described in claim 1, characterized in that, The potting shell is equipped with a protective cover that covers the inductor on the front side of the motherboard body.

4. The waterproof circuit board assembly as described in claim 1, characterized in that, The side wall of the glue-filling shell is provided with a cantilever buckle for snap-fit ​​connection with the mother plate body.

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