Circuit board structure for cosmetic mask

Abstract

The application discloses a circuit board structure applied to a beauty mask, which comprises a flexible substrate printed with a circuit layer; the circuit layer is provided with a first area for welding an LED and a second area for welding an FPC; the flexible substrate is coated with a light shielding layer covering the circuit layer, and the light shielding layer is provided with a through hole for light emission of the LED. The application aims to improve the flexibility of the circuit, improve the wearing experience of users, ensure the stable performance of the circuit, and modularize the light-emitting area of the mask, so as to facilitate the assembly of modules.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards for beauty masks. Background Technology

[0002] Currently, the most commonly used circuitry in beauty masks is FPC (Flexible Printed Circuit). However, FPC circuitry suffers from poor flexibility, causing users to notice excessive rigidity when using beauty masks, resulting in poor wearing comfort and severely impacting the user experience. Utility Model Content

[0003] To address the aforementioned issues, this technical solution provides a circuit board structure for use in beauty masks.

[0004] To achieve the above objectives, the technical solution is as follows:

[0005] Circuit board structures used in beauty masks include;

[0006] A flexible substrate, wherein a circuit layer is printed on the flexible substrate;

[0007] The circuit layer is provided with a first area for soldering LEDs and a second area for soldering FPCs;

[0008] The flexible substrate is coated with a light-shielding layer covering the circuit layer, and the light-shielding layer has through holes for LED light emission.

[0009] The structure includes a flexible substrate, a circuit layer, an upper white light-shielding ink layer, and a lower black and white light-shielding ink layer. Specifically, the flexible substrate uses 0.025mm thick pl material to provide a good flexible foundation for the circuit. During the printing of the silver line circuit layer, a 0.12-0.15mm area is reserved for the position of the LED chip. The lower line is the LED bonding and conduction circuit. The white light-shielding layer is on top of the silver line circuit and can cover the lower silver paste circuit. It has reserved a light-emitting position to avoid the circuit from interfering with the light of the LED. The LED chip is bonded to the first area through a flip-chip process and encapsulated with soft encapsulant. The FPC is soldered to the circuit with ACF conductive adhesive to achieve circuit connection. Finally, the upper and lower lines are assembled and bonded through an adhesive layer.

[0010] In some embodiments, the flexible substrate is made of PL material with a thickness of 0.025 mm.

[0011] In some embodiments, the second region is welded to the FPC via a welding window.

[0012] In some embodiments, the FPC is attached to the second region using conductive adhesive.

[0013] In some embodiments, the LEDs are flip-chip soldered onto the circuit layer.

[0014] In some embodiments, the light-shielding layer includes a white light-shielding ink layer on the circuit layer, and a black light-shielding ink layer and a white light-shielding ink layer on the reverse side of the circuit layer.

[0015] In some embodiments, the light-shielding layer is further provided with a protective film with a thickness of 0.025 mm.

[0016] The beneficial effects of this application are:

[0017] This application aims to improve the flexibility of the circuit, enhance the user's wearing experience, ensure the stability of the circuit performance, and modularize the light-emitting area of ​​the mask to facilitate the assembly of modules. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model. Figure 1 ;

[0020] Figure 2 This is a schematic diagram of the structure of an embodiment of the present utility model. Figure 2 ;

[0021] Figure 3 This is a schematic diagram of the mask structure according to an embodiment of the present invention. Detailed Implementation

[0022] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0023] Please refer to Figure 1-3 As shown, the circuit board structure used in beauty masks includes:

[0024] Flexible substrate 1, wherein a circuit layer 2 is printed on the flexible substrate 1;

[0025] The circuit layer 2 is provided with a first area for soldering LEDs and a second area for soldering FPCs;

[0026] The flexible substrate 1 is coated with a light-shielding layer 3 covering the circuit layer 2, and the light-shielding layer 3 is provided with through holes for LED light emission.

[0027] Reference Figure 1This utility model discloses a flexible circuit printing structure for a beauty mask. The substrate is made of a flexible material with a thickness of 0.025mm. Silver lines are printed on the substrate, with a 0.15mm margin reserved for bonding LED chips. The lower line is the LED bonding and conduction line. A white light-shielding layer is placed on top of the silver lines, completely covering the lower silver paste lines, leaving only the LED light emission position at the corresponding LED chip location. The LED chips are bonded to the 0.15mm margin using a flip-chip process. The soldering windows of the flexible circuit are connected to the FPC using ACF conductive adhesive, and the upper and lower lines are bonded together using an adhesive layer formed by printed adhesive.

[0028] Reference Figure 2 First, silver lines are printed on a 0.025mm substrate, with a 0.15mm margin reserved for LED chip bonding. Next, a white light-shielding layer is printed, with a reserved position for LED light emission. Then, the LED chip is bonded to the reserved position using a flip-chip process and dried at 220°C for about 1 minute. After that, the circuit is tested, and after passing the test, a soldering window is punched out. ACF conductive adhesive is applied to the soldering window and an FPC is attached. ACF hot pressing is then performed to solder the two together. A continuity test is then performed, and after passing the test, adhesive is printed to bond the upper and lower lines together. Finally, the shape is punched out, and after passing the test and inspection, it is shipped out.

[0029] In this embodiment, the flexible substrate 1 is made of PL material with a thickness of 0.025 mm.

[0030] In this embodiment, the second region is welded to the FPC through a welding window.

[0031] In this embodiment, the FPC is attached to the second region using conductive adhesive.

[0032] In this embodiment, the LED is soldered onto the circuit layer 2 using a flip-chip method.

[0033] In this embodiment, the light-shielding layer 3 includes a white light-shielding ink layer on the circuit layer 2, and a black light-shielding ink layer and a white light-shielding ink layer on the reverse side of the circuit layer 2.

[0034] In this embodiment, the light-shielding layer 3 is further provided with a protective film with a thickness of 0.025 mm.

[0035] The beneficial effects of this application are:

[0036] High flexibility and comfortable to wear: The silver wire circuit is printed on a 0.025mm substrate, which greatly improves the flexibility of the circuit and reduces its hardness compared to traditional FPC circuits. It is easy to assemble and clean, and the user's comfort when wearing the beauty mask is significantly improved.

[0037] Stable circuit performance: The silver wire reserves a 0.1mm-0.15mm space for bonding LED chips, ensuring the stability and reliability of LED chip bonding; the flip-chip bonding process for LED chips, combined with drying conditions of 220°C for about 1 minute, further ensures the stability of the connection between LED chips and circuits, reducing the occurrence of problems such as poor contact.

[0038] Excellent lighting effect: The upper white light-blocking layer can effectively cover the lower silver paste circuit, leaving only the position for LED light emission, avoiding the silver circuit to block and interfere with the LED light, so that the light of the LED can better act on the skin and enhance the beauty effect.

[0039] Reasonable process and efficient production: The entire manufacturing process is clear and reasonable. From circuit printing to final testing, inspection and shipment, each link is closely connected, which helps to improve production efficiency, ensure the stability of product quality, and is suitable for large-scale production.

[0040] The above description is only a preferred embodiment of this application and is not intended to limit the scope of implementation of this application. Any other embodiments whose principles and basic structures are the same as or similar to those of this application are within the protection scope of this application.

Claims

1. A wiring board structure for a cosmetic mask, characterized by, include; A flexible substrate (1) having a circuit layer (2) printed on it; The circuit layer (2) is provided with a first area for soldering LEDs and a second area for soldering FPCs; The flexible substrate (1) is coated with a light-shielding layer (3) covering the circuit layer (2), and the light-shielding layer (3) is provided with through holes for LED light emission.

2. The wiring board structure for a cosmetic mask according to claim 1, characterized in that: The flexible substrate (1) is made of PL material with a thickness of 0.025 mm.

3. The wiring board structure for a cosmetic mask according to claim 1, characterized in that: The second area is welded to the FPC through a welding window.

4. The wiring board structure for a cosmetic mask according to claim 3, characterized in that: The FPC is attached to the second area using conductive adhesive.

5. The wiring board structure for a cosmetic mask according to claim 1, characterized in that: The LEDs are soldered onto the circuit layer (2) using a flip-chip method.

6. The wiring board structure for a cosmetic mask according to claim 1, wherein: The light-shielding layer (3) includes a white light-shielding ink layer on the circuit layer (2), and a black light-shielding ink layer and a white light-shielding ink layer on the reverse side of the circuit layer (2).

7. The wiring board structure for a cosmetic mask according to claim 1, characterized in that: The light-shielding layer (3) is also provided with a protective film with a thickness of 0.025 mm.

Images