Ceramic substrate with high temperature resistance

Abstract

The utility model relates to ceramic base circuit board technical field, concretely relates to a kind of ceramic base circuit board of high temperature resistance, including ceramic base material and circuit layer, buffer layer is fixed between ceramic base material and circuit layer, the bottom surface of circuit layer is fixed with metal heat sink by brazing, the top end of circuit layer is coated with ceramic glaze, the middle part of above-mentioned multilayer board structure is all set with connecting hole and through hole, annular groove is set up on the surface of metal heat sink and ceramic glaze, connecting cylinder is fixed in through hole, connecting cylinder includes cylinder body, sealing plate fixed in the top end of cylinder body and connecting plate fixed in the bottom end of cylinder body, the metal heat sink fixed on the bottom surface of circuit layer by brazing, using copper or aluminium base plate and the material with high thermal conductivity, can quickly export the heat generated when circuit layer works;The groove of the top end and bottom of metal heat sink is distributed with interval, increases the heat dissipation area, speeds up heat dissipation speed, avoids that circuit board is influenced due to high temperature accumulation and working performance.

Description

Technical Field

[0001] This utility model relates to the field of ceramic-based circuit board technology, and specifically to a high-temperature resistant ceramic-based circuit board. Background Technology

[0002] With the rapid development of electronic information technology, circuit boards are increasingly widely used in aerospace, automotive electronics, industrial control and many other fields. Especially in some special scenarios, extremely high requirements are placed on the high-temperature resistance of circuit boards. For example, in high-temperature environments such as aircraft engine compartments and around automobile engines, circuit boards need to operate stably for a long time and withstand continuous high temperature tests.

[0003] However, traditional circuit boards have significant shortcomings in high-temperature resistance. Commonly used resin-based circuit boards have poor heat resistance in their substrates, and are prone to deformation and aging in environments exceeding 150°C, leading to the shedding of circuit layers and a decline in insulation performance, severely affecting the normal operation of equipment. Even some metal-based circuit boards, although having improved heat dissipation performance, experience weakened adhesion between the metal and circuit layers at high temperatures, and the metal itself has limited resistance to high-temperature oxidation, making it difficult to meet the requirements of long-term high-temperature operation.

[0004] Ceramic materials are widely used in circuit board substrates due to their excellent high-temperature resistance, insulation, and chemical stability. However, existing ceramic-based circuit boards still have shortcomings in their structural design. On the one hand, the difference in thermal expansion coefficients between the ceramic substrate and the circuit layer is significant. Under high-temperature environments, the stress generated by thermal expansion and contraction can easily lead to cracking or separation of the circuit layer from the substrate, affecting the service life of the circuit board. On the other hand, the heat dissipation structure design of traditional ceramic-based circuit boards is unreasonable. The heat generated by the circuit layer during operation is difficult to dissipate quickly. The accumulation of heat not only reduces the performance of the circuit board but also further exacerbates the damage caused by thermal stress. Utility Model Content

[0005] Technical problems to be solved

[0006] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a high-temperature resistant ceramic-based circuit board, which can effectively solve the problems in the existing technology.

[0007] Technical solution

[0008] This utility model provides a high-temperature resistant ceramic-based circuit board, including a ceramic substrate and a circuit layer. A buffer layer is fixed between the ceramic substrate and the circuit layer. A metal heat sink is fixed to the bottom surface of the circuit layer by brazing. A ceramic glaze is coated on the top of the circuit layer. A connecting hole and a through hole are opened in the middle of the multilayer board structure. Annular grooves are opened on the surfaces of the metal heat sink and the ceramic glaze. A connecting cylinder is fixed in the through hole. The connecting cylinder includes a cylinder body, a sealing plate fixed to the top of the cylinder body, and a connecting plate fixed to the bottom of the cylinder body. A side groove is opened through the side wall of the cylinder body.

[0009] Furthermore, the buffer layer is one or more of nickel, molybdenum, or tungsten alloy, and the buffer layer and the circuit layer adopt a distributed solder joint design.

[0010] Furthermore, the metal heat sink has grooves at both the top and bottom, which are spaced apart on its surface, and the depth of the grooves is less than half the thickness of the circuit layer.

[0011] Furthermore, the cylinder has a hollow structure, and both the sealing plate and the connecting plate are hollow annular structures. The bottom end of the cylinder is interference-fitted and fixed to the middle of the connecting plate.

[0012] Furthermore, the depth of the annular groove is consistent with the thickness of the sealing plate and the connecting plate.

[0013] Furthermore, the metal heat sink is made of one or more of copper or aluminum substrates.

[0014] Beneficial effects

[0015] In this invention, a metal heat sink fixed to the bottom surface of the circuit layer by brazing is made of a material with high thermal conductivity, such as copper or aluminum substrate, which can quickly dissipate the heat generated during the operation of the circuit layer. The grooves spaced at the top and bottom of the metal heat sink increase the heat dissipation area without affecting structural strength, accelerating heat dissipation and preventing the circuit board from being affected by high temperature buildup. In terms of protection, the ceramic glaze coated on the top of the circuit layer has excellent high-temperature resistance, insulation, and corrosion resistance, effectively protecting the circuit layer from external high-temperature environments and chemical corrosion, while also preventing oxidation and extending the service life of the circuit board. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is an exploded view of the structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the metal heat sink in this utility model;

[0020] Figure 4 This is an exploded view of the structure of the middle cylinder of this utility model;

[0021] Figure 5 This is a cross-sectional view of the structure of this utility model.

[0022] The labels in the diagram represent: 1. Ceramic substrate; 2. Buffer layer; 3. Circuit layer; 4. Ceramic glaze; 41. Through hole; 42. Annular groove; 5. Metal heat sink; 51. Groove; 6. Connecting cylinder; 61. Cylinder body; 62. Side groove; 63. Sealing plate; 64. Connecting plate; 7. Connecting hole. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0024] The present invention will be further described below with reference to the embodiments.

[0025] Example: A high-temperature resistant ceramic-based circuit board, as shown in the attached figure. Figure 1 -Appendix Figure 5 The multilayer board structure includes a ceramic substrate 1 and a circuit layer 3. A buffer layer 2 is fixed between the ceramic substrate 1 and the circuit layer 3. A metal heat sink 5 is fixed to the bottom surface of the circuit layer 3 by brazing. The top of the circuit layer 3 is coated with a ceramic glaze 4, which is bonded to the substrate by high-temperature sintering (800-1000℃), which is both insulating and anti-oxidation, and does not affect heat dissipation. A connecting hole 7 and a through hole 41 are provided in the middle of the multilayer board structure. An annular groove 42 is provided on the surface of the metal heat sink 5 and the ceramic glaze 4. A connecting cylinder 6 is fixed in the through hole 41. The connecting cylinder 6 includes a cylinder body 61, a sealing plate 63 fixed to the top of the cylinder body 61, and a connecting plate 64 fixed to the bottom of the cylinder body 61. A side groove 62 is provided through the side wall of the cylinder body 61.

[0026] The buffer layer 2 is made of one or more of nickel, molybdenum, or tungsten alloys (CTE approximately 5-10 ppm / ℃), and alleviates thermal stress through a gradient CTE. For example, a "ceramic-molybdenum layer-copper circuit" structure can be adopted, where the CTE of molybdenum is between that of ceramic and copper, reducing interface temperature difference deformation. The buffer layer 2 and the circuit layer 3 employ a distributed solder joint design. The buffer layer 2 between the ceramic substrate 1 and the circuit layer 3 is made of materials such as nickel, molybdenum, or tungsten alloys. Utilizing their good ductility and high-temperature resistance, it can effectively alleviate the stress caused by the difference in thermal expansion coefficients between the ceramic substrate 1 and the circuit layer 3, preventing cracking or peeling due to thermal expansion and contraction in high-temperature environments. Simultaneously, the distributed solder joint design between the buffer layer 2 and the circuit layer 3 not only enhances the strength of the connection but also disperses stress, further improving the overall stability and fatigue resistance of the circuit board structure.

[0027] The metal heat sink 5 has grooves 51 at both its top and bottom, which are spaced apart on its surface, and the depth of the grooves 51 is less than half the thickness of the circuit layer 3. The metal heat sink 5 is made of one or more copper or aluminum substrates. The metal heat sink 5, which is fixed to the bottom surface of the circuit layer 3 by brazing, is made of materials with high thermal conductivity, such as copper or aluminum substrates, which can quickly dissipate the heat generated by the circuit layer 3 during operation. The grooves 51 spaced apart at the top and bottom of the metal heat sink 5 increase the heat dissipation area and accelerate the heat dissipation speed without affecting the structural strength, thus preventing the circuit board from being affected by high temperature accumulation. The ceramic glaze 4 coated on the top of the circuit layer 3 has excellent high temperature resistance, insulation and corrosion resistance, which can effectively protect the circuit layer 3 from external high temperature environment and chemical corrosion, while preventing the circuit layer 3 from oxidation and extending the service life of the circuit board.

[0028] The cylinder 61 has a hollow structure, and both the sealing plate 63 and the connecting plate 64 are hollow ring structures. The bottom end of the cylinder 61 is interference-fitted and fixed to the middle of the connecting plate 64. The connecting hole 7 and the through hole 41 in the middle of the multilayer board structure, as well as the connecting cylinder 6 fixed in the through hole 41, provide convenience for the installation of the circuit board and the connection with other components.

[0029] The structural design of the connecting cylinder 6, including the cylinder body 61, sealing plate 63, and connecting plate 64, combined with the annular grooves 42 on the surfaces of the metal heat sink 5 and ceramic glaze 4, ensures tight connection and precise positioning of each layer, enhancing the overall structural strength of the circuit board. Furthermore, the side grooves 62 on the sidewalls of the connecting cylinder 6 facilitate the installation and arrangement of circuits, improving the practicality of the circuit board. These side grooves 62 also collect heat between the boards and dissipate it outwards through the hollow structure.

[0030] The depth of the annular groove 42 is consistent with the dimensions of the sealing plate 63 and the connecting plate 64; through the synergistic effect of the multi-layer structure, this high-temperature resistant ceramic-based circuit board performs excellently in terms of high temperature resistance, stability, heat dissipation, protection and ease of installation, and can meet the usage requirements of electronic devices in high-temperature environments.

[0031] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this utility model.

Claims

1. A high-temperature resistant ceramic-based circuit board, characterized in that, The system includes a ceramic substrate (1) and a circuit layer (3). A buffer layer (2) is fixed between the ceramic substrate (1) and the circuit layer (3). A metal heat sink plate (5) is fixed to the bottom surface of the circuit layer (3) by brazing. A ceramic glaze (4) is coated on the top of the circuit layer (3). A connecting hole (7) and a through hole (41) are provided in the middle of the ceramic substrate (1), the buffer layer (2), the circuit layer (3) and the metal heat sink plate (5). An annular groove (42) is provided on the surface of the metal heat sink plate (5) and the ceramic glaze (4). A connecting cylinder (6) is fixed in the through hole (41). The connecting cylinder (6) includes a cylinder body (61), a sealing plate (63) fixed to the top of the cylinder body (61) and a connecting plate (64) fixed to the bottom of the cylinder body (61). A side groove (62) is provided through the side wall of the cylinder body (61).

2. The high-temperature resistant ceramic-based circuit board according to claim 1, characterized in that, The buffer layer (2) and the circuit layer (3) adopt a distributed solder joint design.

3. The high-temperature resistant ceramic-based circuit board according to claim 1, characterized in that, The metal heat sink (5) has grooves (51) at both the top and bottom, and these grooves are spaced apart on its surface. The depth of the grooves (51) is less than half the thickness of the circuit layer (3).

4. The high-temperature resistant ceramic-based circuit board according to claim 1, characterized in that, The cylinder (61) is a hollow structure, and the sealing plate (63) and the connecting plate (64) are both hollow ring structures. The bottom end of the cylinder (61) is interference-fitted and fixed to the middle part of the connecting plate (64).

5. A high-temperature resistant ceramic-based circuit board according to claim 4, characterized in that, The depth of the annular groove (42) is consistent with the thickness of the sealing plate (63) and the connecting plate (64).

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