Flexible circuit board with open holes and display device

Abstract

This utility model discloses a flexible circuit board with openings and a display device. The flexible circuit board is adapted to connect to a display device. The flexible circuit board includes: a forming area, at least one side of the forming area having a retention area, wherein a central area inside the forming area is equipped with multiple electronic components, the retention area is located outside the central area, the retention area has multiple mechanism holes that penetrate the front and back of the flexible circuit board and are arranged at intervals, and the retention area maintains a predetermined distance from the central area.

Description

Technical Field

[0001] This utility model relates to a flexible circuit board, and more particularly to a flexible circuit board with openings and a display device. Background Technology

[0002] In traditional manufacturing processes, insulating tape was applied to protect electronic components on flexible circuit boards from external environmental charges. Since this tape was directly attached to the components, it could cause the plating on passive components to peel off, leading to component failure. Furthermore, while placing taller ceramic capacitors around shorter passive component resistors during wiring and then covering them with insulating tape could mitigate plating peeling, this arrangement, based on the height difference between the components, would interfere with the wiring process. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a flexible circuit board and display device with openings to address the shortcomings of the prior art, so as to effectively protect electronic components with an insulating adhesive layer without affecting the wiring.

[0004] To solve the above-mentioned technical problems, one of the technical solutions adopted by this utility model is to provide a flexible circuit board. The flexible circuit board is suitable for connecting a display device. The flexible circuit board includes: a forming area, and a retention area is provided on at least one side of the forming area. A plurality of electronic components are installed in a central area inside the forming area. The retention area is located outside the central area. The retention area has a plurality of mechanism holes that penetrate the front and back of the flexible circuit board and are arranged at intervals. The retention area and the central area maintain a predetermined distance.

[0005] Furthermore, the predetermined distance is at least 1.5 millimeters.

[0006] Furthermore, the reserved area surrounds the central area, and multiple mechanism holes are evenly distributed around the multiple electronic components.

[0007] Furthermore, the number of multiple mechanism holes is 4 to 8.

[0008] Furthermore, the flexible circuit board includes a fixed end for connecting a display device and a peripheral area away from the fixed end, a forming area located between the fixed end and the peripheral area, and the peripheral area is provided with a connection interface.

[0009] Furthermore, the connection interface is a gold finger connection interface.

[0010] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is to provide a display device, the display device comprising: a backlight frame, wherein a plurality of support structures are integrally formed on an outer surface of the backlight frame; a flexible circuit board with openings according to any one of the above claims, the flexible circuit board being attached to the outer surface, wherein the plurality of support structures are respectively disposed through the plurality of mechanism holes; and an insulating adhesive layer, the insulating adhesive layer covering the forming area and supporting the plurality of support structures, while maintaining a safe distance from the plurality of electronic components.

[0011] Furthermore, the height of multiple support structures relative to the surface of the reserved area is higher than the height of multiple electronic components relative to the surface of the central area.

[0012] Furthermore, the height of multiple support structures is at least 2 millimeters.

[0013] Furthermore, the insulating adhesive layer is an insulating tape.

[0014] Furthermore, the multiple support structures are multiple columnar structures.

[0015] One of the advantages of this invention is that by setting a high support structure around the electronic components in the central area, the insulating adhesive layer can maintain a safe distance from the electronic components, thus preserving its function of isolating external charges and reducing the risk of the electroplated layer of the electronic components detaching due to the adhesiveness of the insulating adhesive layer. Another advantage of this invention is that the edge electric field switching mode display panel provided by this invention has a gap between the metal reflective layer and the pixel area, allowing light to pass through the gap. In other words, the edge electric field switching mode display panel has a micro-light-transmitting area.

[0016] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0017] Figure 1 A top view of the punching area provided by this utility model.

[0018] Figure 2 The front view of the flexible circuit board connecting the display device provided by this utility model.

[0019] Figure 3 Rear view of the flexible circuit board provided by this utility model for connecting to a display device.

[0020] Figure 4A side view of the flexible circuit board connected to the display device provided by this utility model.

[0021] Explanation of reference numerals in the attached figures

[0022] Flexible circuit board 100; central area 111; electronic component 1111; assembly area 112; mechanism hole 1121; reserved area 113; connection interface 120; peripheral area 121; display device 200; backlight frame 210; support structure 211; outer surface 212; insulating adhesive layer 220; predetermined distance D1; safety distance D2. Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of the "flexible circuit board with openings and display device" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0024] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0025] First Embodiment

[0026] Please also refer to Figure 1 and Figure 2As shown, this embodiment of the present invention provides a flexible circuit board 100 with openings, suitable for connecting a display device 200. The flexible circuit board 100 includes a bonding area 112. At least one side of the bonding area 112 has a retention area 113. In other words, the flexible circuit board 100 has different area divisions, including a central area 111, a bonding area 112, and a retention area 113. The retention area 113 is located on at least one side of the bonding area 112. More specifically, the retention area 113 is located outside the central area 111, surrounding the central area 111. The central area 111 inside the bonding area 112 is equipped with a plurality of electronic components 1111. The retention area 113 has a plurality of mechanism holes 1121 that penetrate the front and back of the flexible circuit board 100 and are arranged at intervals. The plurality of mechanism holes 1121 are evenly distributed around the plurality of electronic components 1111, and the retention area 113 can be located on all four sides around the central area 111. A predetermined distance D1 is maintained between the central region 111 and the reserved region 113, for example, the predetermined distance D1 is at least greater than 1.5 mm. For example, the flexible circuit board 100 is a copper foil substrate, which has the advantages of being thin, light, and flexible. The composite material of the flexible circuit board 100 may also include flexible polymer materials, such as polyolefins, polyamides, polyols, polyesters, rubber, thermoplastic polymers, polyaromatic hydrocarbons, polymethyl methacrylate, polycarbonate, or other suitable materials, derivatives thereof, and combinations thereof.

[0027] In one embodiment, the electronic component 1111 includes active and passive components, with the passive component being a resistor, capacitor, or inductor. For example, the number of multiple mechanism holes 1121 can be adjusted according to the number of multiple electronic components 1111; the more electronic components 1111 there are, the more mechanism holes 1121 there are, and vice versa. The number of multiple mechanism holes 1121 is from 4 to 8, adjusted relative to the density of the electronic components 1111; when the density of the electronic components 1111 is low, the number of mechanism holes 1121 is 4, and when the density of the electronic components 1111 is high, the number of mechanism holes 1121 is 8.

[0028] In one embodiment, the flexible circuit board 100 includes a fixed end (not shown) for connecting to a display device 200 and a peripheral region 121 away from the fixed end. A bonding area 112 is located between the fixed end and the peripheral region 121, and the peripheral region 121 is provided with a connection interface 120. For example, the connection interface 120 is a gold-plated connector, which is mainly connected to the flexible circuit board 100 through a gold-plated connector. After the gold-plated connector is inserted into the corresponding system end, it achieves the purpose of transmitting data. For example, the fixed end is a bus, which refers to a standardized way of exchanging data between computer components, that is, providing data transmission and control logic for each component in a common way.

[0029] Second Embodiment

[0030] Please also refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 This utility model provides a display device 200, including a flexible circuit board 100, a backlight frame 210, and an insulating adhesive layer 220 according to a first embodiment. For example, the backlight frame 210 is a backlight shell, and the insulating adhesive layer 220 is insulating tape. The insulating tape is used to isolate the electric charge of the external environment and protect the electronic components 1111 in the central area 111 from the influence of the electric charge of the external environment. The outer surface 212 of the backlight frame 210 is integrally formed with a plurality of support structures 211. For example, the height of the plurality of support structures 211 is at least greater than 2 mm, and the plurality of support structures 211 are a plurality of columnar structures (e.g., adhesive pillars). The flexible circuit board 100 is attached to the outer surface 212 of the backlight frame 210.

[0031] In one embodiment, the present invention first pre-drills a mechanism hole 1121 with a diameter of approximately 2 mm on the flexible circuit board 100, and the predetermined distance D1 between the mechanism hole 1121 in this reserved area 113 and the electronic component 1111 in the central area 111 must be at least greater than 1.5 mm. For example, a support structure 211 with a diameter of 2 mm and a height of approximately 2 mm is integrally formed in the corresponding area of ​​the outer surface 212 of the backlight frame 210 (e.g., made of plastic). Multiple support structures 211 are respectively inserted through multiple mechanism holes 1121 and protrude from the reserved area 113. Further, as Figure 3 As shown, the flexible circuit board 100 will be folded back towards the back of the display device 200 and attached to the outer surface 212 of the backlight frame 210. At this time, the mechanism hole 1121 on the flexible circuit board 100 can correspond exactly to the support structure 211 of the backlight frame 210.

[0032] In one embodiment, an insulating adhesive layer 220 covers the bonding area 112 to protect the electronic components 1111 in the central region 111 of the bonding area 112 from the influence of external environmental charges. The insulating adhesive layer 220 is supported on a plurality of support structures 211. The insulating adhesive layer 220 maintains a safe distance D2 from the plurality of electronic components 1111, protecting the plating of the passive components in the electronic components 1111 in the central region 111 from detachment due to the adhesiveness of the insulating adhesive layer 220. In other words, the height of the plurality of support structures 211 relative to the surface of the retention area 113 is greater than the height of the plurality of electronic components 1111 relative to the surface of the central region 111, and the height of the plurality of support structures 211 protruding from the retention area 113 is greater than the height of the plurality of electronic components 1111 in the central region 111. For example, the height of the support structures 211 may be slightly greater than the height of the plurality of electronic components 1111 in the central region 111.

[0033] Figure 4 In this design, an insulating adhesive layer 220 is attached to the flexible circuit board 100 to protect multiple electronic components 1111 in the central region 111. The insulating adhesive layer 220 is supported by a support structure 211, thus preventing the passive components of the electronic components 1111 in the central region 111 from directly contacting the insulating adhesive layer 220, thereby protecting the electroplated layer of the passive components. Furthermore, the insulating adhesive layer 220 may be too sticky, or thermal stress may occur due to temperature changes, potentially causing the electroplated layer on the surface of passive components (such as resistors) to peel off, thereby impairing the function of the passive components. This invention uses a tall support structure 211 to support the insulating adhesive layer 220 between the passive components, preventing direct contact between the insulating adhesive layer 220 and the passive components. This maintains the function of the insulating adhesive layer 220 in isolating external charges and effectively reduces the risk of damage to the electroplated layer of the passive components.

[0034] The explanation of the second embodiment can be referred to the explanation of the first embodiment, and will not be repeated here.

[0035] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of protection of the claims of the present utility model. Therefore, all equivalent technical changes made based on the content of the present utility model specification and drawings are included in the scope of protection of the claims of the present utility model.

Claims

1. A flexible printed circuit board having an opening, characterized by, The flexible circuit board is adapted to connect to a display device, and the flexible circuit board includes: A forming area, wherein at least one side of the forming area is provided with a retention area, wherein a central area of ​​the forming area is provided with multiple electronic components, the retention area is located outside the central area, the retention area is provided with multiple mechanism holes that penetrate the front and back of the flexible circuit board and are arranged at intervals, and the retention area and the central area are maintained at a predetermined distance.

2. The soft circuit board having an opening according to claim 1, wherein, The predetermined distance is at least greater than 1.5 mm.

3. The soft circuit board having an opening according to claim 1, wherein, The reserved area surrounds the central area, and the plurality of mechanism holes are evenly distributed around the plurality of electronic components.

4. The soft circuit board having an opening according to claim 1, wherein, The number of the plurality of mechanism holes is 4 to 8.

5. The soft circuit board having an opening according to claim 1, wherein, The flexible circuit board includes a fixed end for connecting the display device and a peripheral area away from the fixed end. The forming area is located between the fixed end and the peripheral area, and the peripheral area is provided with a connection interface.

6. The soft circuit board having an opening according to claim 5, wherein, The connection interface is a gold finger connection interface.

7. A display device, characterized by The display device includes: A backlight frame, wherein a plurality of support structures are integrally formed on one outer surface of the backlight frame; A flexible circuit board with openings according to any one of claims 1 to 6, the flexible circuit board being attached to the outer surface, wherein the plurality of support structures are respectively disposed through the plurality of mechanism holes; and An insulating adhesive layer covers the punching area and is supported on the plurality of support structures, while maintaining a safe distance from the plurality of electronic components.

8. The display device of claim 7, wherein, The height of the plurality of support structures relative to the surface of the reserved area is higher than the height of the plurality of electronic components relative to the surface of the central area.

9. The display device of claim 7, wherein, The height of the multiple support structures is at least greater than 2 millimeters.

10. The display device of claim 7, wherein, The insulating adhesive layer is an insulating tape.

11. The display device of claim 7, wherein, The multiple support structures are multiple columnar structures.

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