Connecting a flat cable, a display screen and an electronic device
Patent Information
- Application Number
- CN202522011522.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-18
- Publication Date
- 2026-09-08
- Estimated Expiration
- 2035-09-18
AI Technical Summary
[0005]本实用新型的主要目的是提出一种连接排线,旨在解决现有屏幕的连接排线引入屏蔽膜可能导致传输线路的阻抗特性发生变化,造成阻抗不匹配的问题
[0016]The beneficial effects of this utility model's technical solution are as follows: By placing the power lines and signal transmission lines on the first surface of the flexible circuit board and the ground line on the second surface in a layered layout design, when the flexible circuit board is connected to a display screen in practical applications, the second surface with the ground line can be in close contact with the back panel of the display screen, while the first surface with the signal transmission lines faces the device casing, forming an optimized structure with the ground layer as the electromagnetic energy release channel. This allows the ground layer to effectively absorb and release the electromagnetic radiation energy generated by the signal transmission lines during high-speed data transmission, avoiding the use of traditional shielding film technology. This eliminates impedance mismatch problems caused by additional shielding materials, ensuring the transmission integrity and signal quality of high-speed differential signals such as MIPI and LVDS, and effectively preventing screen display abnormalities. Simultaneously, since no additional shielding film material and corresponding manufacturing processes are required, the production cost and process complexity of the flexible circuit board are reduced.
Smart Images

Figure CN224733884U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of display screen technology, and in particular to a connecting cable, display screen, and electronic device. Background Technology
[0002] Flexible printed circuits (FPCs), as an important connection medium, are widely used in the aforementioned devices, undertaking the signal transmission task between the display screen and the motherboard. Traditional FPC designs typically employ a double-layer or single-layer trace structure, integrating various transmission lines such as power lines, signal lines, and ground lines, including high-speed / high-current transmission lines such as MIPI signal lines, LVDS signal lines, and backlight power lines. These high-speed signal lines generate strong electromagnetic radiation during data transmission, especially in low-frequency areas used in radio frequency (such as the B5 / B8 bands in 4G), which can easily cause serious interference to nearby antenna systems. Therefore, how to effectively solve the electromagnetic interference problem of FPCs and ensure the stable radio frequency performance of smart terminal devices has become an important technical issue that urgently needs to be addressed in the industry.
[0003] To address electromagnetic interference issues in FPCs, existing technologies typically employ the solution of adding a shielding film. Specifically, these solutions involve adding an additional metal shielding layer or shielding film material to the FPC, utilizing the electromagnetic shielding properties of metal materials to suppress the outward propagation of electromagnetic radiation generated by high-speed signal lines, thereby reducing interference to surrounding radio frequency devices.
[0004] However, existing shielding film technologies have the following drawbacks. The introduction of a shielding film may alter the impedance characteristics of the transmission line, causing impedance mismatch problems, which in turn affect the integrity and transmission quality of high-speed differential signals such as MIPI or LVDS. This degradation of signal integrity directly leads to problems such as abnormal screen display, decreased image quality, and display latency in smart terminal devices during actual use, severely impacting the user experience. Utility Model Content
[0005] The main purpose of this invention is to propose a connecting cable that aims to solve the problem that the introduction of a shielding film into the existing screen connecting cable may cause changes in the impedance characteristics of the transmission line, resulting in impedance mismatch.
[0006] To achieve the above objectives, this utility model proposes a connecting cable for a display screen, which includes: A flexible circuit board having a first surface and a second surface opposite to each other, the first surface being provided with power lines and signal transmission lines for transmitting image data, and the second surface being provided with a ground line.
[0007] In some embodiments, one end of the flexible circuit board is configured with a via; the first surface is provided with a first exposed copper area, and the second surface is provided with a second exposed copper area electrically connected to the ground wire, wherein the first exposed copper area is electrically connected to the second exposed copper area through the via.
[0008] In some embodiments, multiple vias are provided, and the distance between adjacent vias is t, which satisfies: t≥0.3mm.
[0009] In some embodiments, the second surface is further provided with a third exposed copper area electrically connected to the ground wire, the third exposed copper area being located at the other end of the flexible circuit board.
[0010] In some embodiments, the first surface is further provided with an annular exposed copper area, the annular exposed copper area being disposed along the edge of the flexible circuit board; and / or The second surface is also provided with an annular exposed copper area, which is provided along the edge of the flexible circuit board.
[0011] In some embodiments, the width of the annular exposed copper area is less than or equal to 0.5 mm.
[0012] In some embodiments, the first exposed copper area includes a first sub-exposed copper area and a second sub-exposed copper area, the grounding distance between the first sub-exposed copper area and the second sub-exposed copper area is D, and satisfies: D≤λ / 10.
[0013] In some embodiments, one end of the flexible circuit board is provided with a first plug terminal for connecting to the display screen, and the other end of the flexible circuit board is provided with a second plug terminal for connecting to the motherboard.
[0014] The present invention further proposes a display screen, including the connecting cable for the display screen in the aforementioned embodiment, wherein the display screen has a metal back plate, and the second exposed copper area and the third exposed copper area are electrically connected to the metal back plate by conductive adhesive.
[0015] The present invention further proposes an electronic device, including the display screen of the aforementioned embodiment.
[0016] The beneficial effects of this utility model's technical solution are as follows: By placing the power lines and signal transmission lines on the first surface of the flexible circuit board and the ground line on the second surface in a layered layout design, when the flexible circuit board is connected to a display screen in practical applications, the second surface with the ground line can be in close contact with the back panel of the display screen, while the first surface with the signal transmission lines faces the device casing, forming an optimized structure with the ground layer as the electromagnetic energy release channel. This allows the ground layer to effectively absorb and release the electromagnetic radiation energy generated by the signal transmission lines during high-speed data transmission, avoiding the use of traditional shielding film technology. This eliminates impedance mismatch problems caused by additional shielding materials, ensuring the transmission integrity and signal quality of high-speed differential signals such as MIPI and LVDS, and effectively preventing screen display abnormalities. Simultaneously, since no additional shielding film material and corresponding manufacturing processes are required, the production cost and process complexity of the flexible circuit board are reduced. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the ribbon cable used for a display screen according to the present invention; Figure 2 for Figure 1 A magnified view of a section at point A in the middle; Figure 3 This is a structural schematic diagram of an embodiment of the ribbon cable used for a display screen according to the present invention.
[0018] Explanation of icon numbers: 10. Connect the ribbon cable; 100. Flexible circuit board; 110, First surface; 111, Power line; 112, Signal transmission line; 113, First exposed copper area; 113a, First sub-exposed copper area; 113b, Second sub-exposed copper area; 120. Second surface; 121. Ground line; 122. Second exposed copper area; 123. Third exposed copper area; 100a, via; 130. Circular exposed copper area; 200. First plug-in terminal; 300. Second plug-in terminal.
[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0020] The solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.
[0021] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0022] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.
[0023] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.
[0024] Reference Figure 1 , Figure 2 and Figure 3 This utility model embodiment proposes a connection cable 10 for a display screen. The connection cable 10 for the display screen includes a flexible circuit board 100. The flexible circuit board 100 has a first surface 110 and a second surface 120 opposite to each other. The first surface 110 is provided with a power line 111 and a signal transmission line 112 for transmitting image data. The second surface 120 is provided with a ground line 121.
[0025] In this embodiment, the connecting cable 10 is mainly used for electrical connection between the motherboard and the display screen, providing a reliable transmission bridge for image data transmission, and also carrying power supply function. The connecting cable 10 uses a flexible printed circuit board 100 (FPC) as the basic carrier. The flexible printed circuit board 100 is composed of a multi-layer structure, including a flexible substrate such as polyimide (PI) or polyester (PET), a conductive copper foil layer, a cover film layer, and a reinforcing plate. The required conductive line pattern is formed on the flexible substrate through etching, lamination and other processes, thereby realizing the layout of power line 111, signal transmission line 112 and ground line 121.
[0026] Specifically, signal transmission line 112 mainly includes MIPI (Mobile Industry Processor Interface) differential pair signal lines for transmitting high-speed image data; LVDS (Low Voltage Differential Signaling) signal lines for low-power differential signal transmission; and various control signal lines such as reset signal lines and clock signal lines. Power lines 111 include positive power line 111VDD (powering the display logic circuit), negative power line 111VSS (ground power), and backlight power line 111BL (powering the backlight module), providing stable power to the various functional modules of the display. Ground line 121, as the circuit's reference potential point, not only provides a circuit loop but, more importantly, functions as an electromagnetic shielding layer.
[0027] During operation, when high-speed image data is transmitted through the connecting cable 10, the signal transmission line 112 will inevitably generate electromagnetic radiation interference. Specifically, when the MIPI signal line transmits high-speed differential signals, it will generate strong high-frequency electromagnetic radiation due to its operating frequency ranging from hundreds of MHz to several GHz; although the LVDS signal line uses low-voltage differential technology, it will also generate electromagnetic radiation during high-speed switching; when the backlight power supply line 111 provides high current drive, its current changes will generate a changing magnetic field around the conductor, thus generating electromagnetic radiation. This electromagnetic radiation has strong interference energy in the low-frequency range of radio frequency use (such as the B5 band 791-821MHz and the B8 band 880-915MHz in 4G), which can easily interfere with nearby antenna systems and lead to a decrease in communication quality.
[0028] In this embodiment, the cabling solves this problem through a unique layered layout design. When the power lines 111 and signal transmission lines 112 on the first surface 110 generate electromagnetic radiation during high-speed transmission, the ground layer 121 on the second surface 120 forms an effective electromagnetic shielding structure. According to the principle of electromagnetic induction, when electromagnetic radiation penetrates the substrate of the flexible circuit board 100 and reaches the ground layer 121, an induced current is generated in the ground layer 121. The magnetic field generated by these induced currents is opposite in direction to the original radiated magnetic field, thereby canceling out part of the electromagnetic radiation energy. At the same time, the ground line 121 forms a complete electrical connection with the ground loop on the motherboard through the second connector 300, quickly conducting the absorbed electromagnetic radiation energy to the ground plane of the motherboard through a low-impedance path. Then, the large-area ground plane of the motherboard effectively disperses and consumes this interference energy, achieving effective suppression of electromagnetic radiation.
[0029] By employing a layered layout design where power lines 111 and signal transmission lines 112 are located on the first surface 110 of the flexible circuit board 100, and ground line 121 is located on the second surface 120, in practical applications, when the flexible circuit board 100 is connected to a display screen, the second surface 120 with ground line 121 can closely adhere to the metal backplate of the display screen, while the first surface 110 with signal transmission lines 112 faces the device casing, forming an optimized structure with the ground line 121 layer serving as the electromagnetic energy release channel. This design allows the ground line 121 layer to effectively absorb and release the electromagnetic radiation energy generated by the signal transmission line 112 during high-speed data transmission, avoiding the use of traditional shielding film technology, eliminating characteristic impedance mismatch problems caused by additional shielding materials, ensuring the transmission integrity and signal quality of high-speed differential signals such as MIPI and LVDS, and effectively preventing problems such as abnormal screen display, flickering, or image distortion.
[0030] Meanwhile, since no additional shielding film material and corresponding complex manufacturing processes are required, the production cost and process complexity of the flexible circuit board 100 are significantly reduced, improving the manufacturability and yield rate of the product. In addition, this layered design also has better mechanical flexibility and reliability, maintaining stable electrical performance and shielding effect even under frequent bending conditions, making it particularly suitable for applications in new display devices such as foldable screens and flip screens.
[0031] See Figure 1 and Figure 2 In this embodiment, one end of the flexible circuit board 100 is constructed with a via 100a; the first surface 110 is provided with a first exposed copper area 113, and the second surface 120 is provided with a second exposed copper area 122 electrically connected to the ground wire 121. The first exposed copper area 113 is electrically connected to the second exposed copper area 122 through the via 100a.
[0032] This embodiment further optimizes the previous one by constructing a via 100a structure penetrating the first surface 110 and the second surface 120 at one end of the flexible circuit board 100. The via 100a is formed by mechanical drilling or laser drilling, and the hole wall is metallized by chemical copper plating or electroplating to ensure electrical conductivity between the upper and lower surfaces. The first surface 110 is provided with a first exposed copper area 113, and the second surface 120 is provided with a second exposed copper area 122 electrically connected to the ground wire 121. The two exposed copper areas are electrically connected through the via 100a to form a complete conductive path.
[0033] The exposed copper area is formed using a selective solder mask removal process. The specific process is as follows: First, a solder mask is coated on the surface of the flexible circuit board 100. Then, a window is created in a predetermined area using photolithography to remove the solder mask in that area, directly exposing the underlying copper foil conductor layer and forming a conductive area that can directly contact the external metal structure. The first exposed copper area 113 is electrically isolated from the ground network 121 on the flexible circuit board 100, while the second exposed copper area 122 is directly electrically connected to the ground network 121 via a conductor. The two exposed copper areas are electrically connected through a metallized via 100a, forming an independent conductive loop system.
[0034] In practical applications of electronic devices, when the flexible circuit board 100 is installed, the first exposed copper area 113 of the first surface 110 can form an electrical connection with the metal casing of the device through conductive adhesive, elastic contacts, or direct contact. The second exposed copper area 122 of the second surface 120 is then tightly attached to the metal backplate of the display screen and establishes an electrical connection. This forms a complete electromagnetic interference release and return path: metal casing, first exposed copper area 113, via 100a → second exposed copper area 122, display screen metal backplate, ground wire 121 system.
[0035] When the signal transmission line 112 generates electromagnetic radiation, this electromagnetic energy induces eddy currents and induced currents in the surrounding metal structure. In traditional designs, there is a lack of effective electrical connection between the device's metal casing and the display screen's metal backplate, resulting in the induced current failing to form a complete loop and the electromagnetic energy being difficult to dissipate effectively. In this embodiment, a conductive bridge constructed through the exposed copper area and via 100a electrically connects the two originally independent metal structures, allowing the induced current to flow freely in a loop consisting of the casing, the first exposed copper area 113, via 100a, the second exposed copper area 122, the backplate, the ground wire 121, and the motherboard ground plane. According to Lenz's law, the magnetic field generated by these induced currents is opposite in direction to the original interfering magnetic field, effectively canceling out the electromagnetic radiation. At the same time, the electromagnetic energy is converted into heat energy and dissipated through a low-impedance loop.
[0036] By setting exposed copper areas and via structures 100a on the flexible circuit board 100, an effective electrical connection between the metal casing of the device and the metal backplate of the display screen is achieved, and a complete electromagnetic interference suppression circuit system is constructed.
[0037] Compared to traditional solutions that require additional conductive connectors or shielding, the exposed copper area is located at the end of the flexible circuit board 100, which does not affect the impedance characteristics of the signal transmission area and ensures the transmission quality of high-speed signals.
[0038] In some embodiments, multiple vias 100a are provided at intervals, and the distance between adjacent vias 100a is t, which satisfies: t≥0.3mm.
[0039] In this embodiment, a further improvement is made based on the foregoing. Multiple vias 100a are spaced apart within the exposed copper area of the flexible circuit board 100. These vias 100a are staggered between the top layer (first surface 110) and the bottom layer (second surface 120) of the FPC, forming a dense array of electrical connections. The center-to-center distance between adjacent vias 100a is t, and it satisfies the design constraint that t ≥ 0.3 mm.
[0040] In practical applications, the parallel connection of multiple vias 100a reduces the equivalent resistance and inductance between the first surface 110 and the second surface 120, forming a more efficient electromagnetic interference conduction path. When the electromagnetic radiation generated by the signal line induces a current in the metal casing, this current is dispersed through the first exposed copper area 113 to multiple vias 100a. The current carried by each via 100a is relatively small, avoiding the current concentration problem of a single via 100a.
[0041] Due to the design of via spacing t≥0.3mm, sufficient insulation distance is maintained between adjacent vias 100a, avoiding mutual interference and crosstalk between vias 100a. Simultaneously, the parallel effect of multiple vias 100a significantly reduces the overall conduction impedance. According to the parallel resistance formula, the equivalent impedance of n identical vias 100a connected in parallel is approximately 1 / n of the impedance of a single via 100a, thereby greatly improving the conduction efficiency of electromagnetic interference current.
[0042] See Figure 3 In this embodiment, the second surface 120 is also provided with a third exposed copper area 123 for electrically connecting the ground wire 121, and the third exposed copper area 123 is located at the other end of the flexible circuit board 100.
[0043] In this embodiment, in addition to providing a first exposed copper area 113 and a second exposed copper area 122 at one end of the flexible circuit board 100, a third exposed copper area 123 electrically connected to the ground wire 121 is also provided on the second surface 120 at the other end of the flexible circuit board 100 (i.e., the display screen connection end). The symmetrically arranged exposed copper areas at both ends form a more complete electromagnetic shielding and grounding system.
[0044] The third exposed copper area 123 is also manufactured using a solder mask removal process and is directly electrically connected to the ground wire 121 network on the flexible circuit board 100. During installation of the flexible circuit board 100, it can form a good electrical connection with the grounding terminal of the display screen's metal backplate or display module. By setting exposed copper grounding areas at both ends of the ribbon cable, the overall grounding effect and electromagnetic shielding capability are significantly enhanced.
[0045] When the signal transmission line 112 generates electromagnetic radiation during high-speed data transmission, this electromagnetic energy induces electromotive force and current in the surrounding conductors. The ground layer 121 on the second surface 120, as a nearby conductor, induces current that is out of phase with the radiation source. According to Lenz's law, the magnetic field generated by these induced currents is opposite in direction to the original interfering magnetic field, thus canceling out part of the electromagnetic radiation energy.
[0046] The exposed copper areas at both ends further enhance this process: the second exposed copper area 122, connected to the metal backplate of the display screen, conducts the absorbed electromagnetic interference energy to the large-area metal structure of the backplate for dispersion; the third exposed copper area 123 is directly connected to the grounding system of the display module, providing another low-impedance release path for the interference current. This forms a multi-path interference energy release mechanism: inductive absorption by the ground wire 121, current conduction by the exposed copper areas at both ends, and dispersion and consumption by the metal backplate / grounding system.
[0047] See Figure 2 In this embodiment, the first surface 110 is further provided with an annular exposed copper area 130, which is disposed along the edge of the flexible circuit board 100; and / or The second surface 120 is also provided with an annular exposed copper area 130, which is provided along the edge of the flexible circuit board 100.
[0048] Furthermore, the width of the annular exposed copper area is less than or equal to 0.5 mm.
[0049] In this embodiment, the flexible circuit board 100 is further provided with an annular exposed copper area 130 distributed along the edge. Depending on different application requirements, the following three implementation methods can be adopted: An annular exposed copper area 130 is provided only on the first surface 110. The annular exposed copper area 130 is continuously provided along the entire edge of the flexible circuit board 100, forming a closed annular structure around the signal transmission line 112 and the power line 111.
[0050] An annular exposed copper area 130 is provided only on the second surface 120. The annular exposed copper area 130 is electrically connected to the ground wire 121, forming a continuous grounding loop along the edge of the flexible circuit board 100.
[0051] An annular exposed copper area 130 is provided on both the first surface 110 and the second surface 120. The two annular exposed copper areas 130 are electrically connected through multiple vias 100a distributed along the edge, forming a three-dimensional annular shielding structure.
[0052] The width of the annular exposed copper area 130 is designed to be less than or equal to 0.5 mm. This size ensures sufficient conductive cross-sectional area without excessively occupying the effective wiring space of the flexible circuit board 100. The annular exposed copper area 130 is also manufactured using a solder mask removal process, allowing the copper foil conductor to be directly exposed and form electrical contact with the metal structure or shielding of the equipment.
[0053] The annular exposed copper area 130 is equivalent to constructing a continuous electromagnetic shielding wall at the edge of the flexible circuit board 100, which can effectively block the path of electromagnetic radiation propagating outward. When the electromagnetic energy generated by the signal line attempts to leak from the edge of the flexible circuit board 100, an annular current will be induced in the annular exposed copper area 130. These annular currents generate a reverse magnetic field according to the principle of electromagnetic induction, which effectively suppresses the outward radiation of electromagnetic energy.
[0054] Meanwhile, the annular exposed copper area 130 also acts as an electromagnetic fence, effectively isolating the signal transmission area inside the flexible circuit board 100 from the external environment electromagnetically, preventing external electromagnetic interference from entering the flexible circuit board 100 and affecting signal quality. When the annular exposed copper area 130 is provided on both the first surface 110 and the second surface 120, the resulting three-dimensional annular structure further enhances this shielding effect, similar to the shielding principle of coaxial cables, providing a more stable electromagnetic environment for high-speed signal transmission.
[0055] The 0.5mm width design ensures effective shielding while maximizing the saving of circuit board wiring space, making it particularly suitable for miniaturized, highly integrated electronic device applications.
[0056] See Figure 2 In this embodiment, the first exposed copper area 113 includes a first sub-exposed copper area 113a and a second sub-exposed copper area 113b. The grounding distance between the first sub-exposed copper area 113a and the second sub-exposed copper area 113b is D, and satisfies: D≤λ / 10.
[0057] In this embodiment, because the first surface 110 has the routing layout of signal transmission lines 112 and power lines 111, the first exposed copper area 113 cannot be set as a continuous integral structure. Therefore, it is set in segments, dividing the first exposed copper area 113 into at least a first sub-exposed copper area 113a and a second sub-exposed copper area 113b. A grounding distance D is formed between the two sub-exposed copper areas due to the presence of signal traces, and this distance satisfies the design constraint that D≤λ / 10.
[0058] Formula D≤λ / 10: Where λ represents the wavelength of the electromagnetic wave in the medium. For high-speed signals (such as MIPI and LVDS signals) in the flexible circuit board 100, the operating frequency is usually in the range of several hundred MHz to several GHz. According to the electromagnetic wave propagation theory, when the size of the gap between two conductors is much smaller than the wavelength of the electromagnetic wave (usually λ / 10 is taken as the critical value), the gap is equivalent to an electrically small size for the electromagnetic wave and will not form an obvious electromagnetic leakage path.
[0059] Taking a 1GHz signal as an example, its wavelength in air is approximately 30cm, and its wavelength in the flexible circuit board 100 medium is approximately 15cm (considering a relative permittivity of approximately 4), so λ / 10 is approximately 1.5cm. This means that the spacing between the first sub-exposed copper region 113a and the second sub-exposed copper region 113b should be controlled within 1.5cm to ensure that the two separate exposed copper regions can still be regarded as a continuous shielding structure in an electromagnetic sense.
[0060] When the grounding distance D satisfies D≤λ / 10, although the first sub-exposed copper region 113a and the second sub-exposed copper region 113b are physically separated, from the perspective of electromagnetic waves, this gap is too small to form an effective leakage outlet. When electromagnetic waves encounter such a small gap, diffraction occurs, causing the electromagnetic field to remain basically continuous at the gap. The two sub-exposed copper regions behave like a complete shielding structure in terms of electromagnetic shielding effect.
[0061] At the same time, a strong capacitive coupling effect is formed between the two exposed copper areas. At high frequencies, this capacitive coupling provides a certain electrical connection, further enhancing the overall shielding effect.
[0062] See Figure 2 and Figure 3 In this embodiment, one end of the flexible circuit board 100 is provided with a first plug terminal 200 for connecting to the display screen, and the other end of the flexible circuit board 100 is provided with a second plug terminal 300 for connecting to the motherboard.
[0063] In this embodiment, the flexible circuit board 100 is provided with plug terminals with different functions at both ends: one end is provided with a first plug terminal 200 for connecting to the display screen, and the other end is provided with a second plug terminal 300 for connecting to the motherboard, forming a complete electrical connection bridge.
[0064] The first plug-in terminal 200 is located at the end of the flexible circuit board 100 near the display screen. It can be in the form of an FFC (Flat Flexible Cable) connector or a board-to-board connector. The contacts on the terminal form an electrical connection with the signal transmission line 112, power line 111, and ground line 121 of the second surface 120 on the flexible circuit board 100. The contact layout of the first plug-in terminal 200 is fully matched with the interface of the display screen driver board or display module, ensuring that the MIPI signal line, power line 111VDD / VSS, backlight power line BL, etc. can be accurately connected.
[0065] The second connector 300 is located at the other end of the flexible circuit board 100 and is used to connect to the display interface of the motherboard. It also adopts a standardized connector form. The second connector 300 not only carries the function of signal and power transmission, but more importantly, its ground contact 121 forms a reliable electrical connection with the ground plane of the motherboard, providing a stable grounding reference for the entire electromagnetic shielding system.
[0066] With its standardized design featuring plug-in terminals at both ends, the flexible circuit board 100 can be easily installed between the motherboard and the display screen, enabling a plug-and-play connection. The metal contacts of the plug-in terminals also serve as an extension of electromagnetic shielding. For example, after the ground contact 121 forms an electrical connection with the metal structures of the motherboard and the display screen through the plug-in terminals, it further improves the electromagnetic compatibility performance of the entire system.
[0067] This utility model further proposes a display screen, including a connecting cable 10 for the display screen as described in the foregoing embodiments. The specific structure of the connecting cable 10 for the display screen is as described in the above embodiments. Since this display screen adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The display screen has a metal backplate, and the second exposed copper area 122 and the third exposed copper area 123 are electrically connected to the metal backplate through conductive adhesive.
[0068] In this embodiment, the display screen has a metal backplate, which can be made of aluminum alloy or stainless steel. This backplate not only provides structural support and heat dissipation but, more importantly, serves as a crucial component of electromagnetic shielding. The second exposed copper area 122 and the third exposed copper area 123 of the second surface 120 of the flexible circuit board 100 are reliably electrically connected to the metal backplate via conductive adhesive.
[0069] Conductive adhesive can be a polymer material containing conductive particles such as silver powder, copper powder, or carbon powder, possessing excellent conductivity and adhesive strength. During assembly, the conductive adhesive is applied to the surfaces of the second exposed copper area 122 and the third exposed copper area 123. Then, the flexible circuit board 100 is bonded to the metal backplate of the display screen. After the conductive adhesive cures, a stable electrical connection path is formed. This connection method is more reliable than mechanical crimping, can adapt to temperature changes and mechanical vibrations, and ensures the stability of the electrical connection during long-term use.
[0070] When the connecting cable 10 transmits high-speed signals, the generated electromagnetic radiation energy is absorbed by the ground layer 121 of the second surface 120. This interference energy is mainly dissipated by being conducted back to the ground plane of the motherboard through the ground system 121. At the same time, the electrical connection between the second exposed copper area 122 and the third exposed copper area 123 and the metal backplate of the display screen provides an additional grounding path and electromagnetic shielding enhancement for the ground system 121. After the metal backplate forms an electrical connection with the equipment casing, it further improves the grounding network and electromagnetic shielding effect of the entire system.
[0071] Because this display screen adopts the technical solutions of all the above embodiments, it possesses all the technical benefits, including excellent electromagnetic compatibility performance, reliable electrical connections, simplified structural design, and good cost control. It is particularly suitable for applications such as high-end mobile devices, automotive display systems, and industrial display equipment where electromagnetic compatibility requirements are stringent.
[0072] The present invention further proposes an electronic device, including the display screen of the aforementioned embodiment.
[0073] In this embodiment, the electronic device can be a smartphone, tablet computer, laptop computer, in-vehicle display terminal, or other electronic products with display functions. Due to the adoption of the connection cable 10 and display screen technology solutions of the aforementioned embodiments, the electronic device exhibits excellent electromagnetic compatibility performance in actual operation.
[0074] The above description is only a part or preferred embodiment of this utility model. Neither the text nor the drawings should limit the scope of protection of this utility model. All equivalent structural transformations made using the content of this utility model specification and drawings under the overall concept of this utility model, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.
Claims
1. A connecting cable for a display screen, characterized in that, The device includes a flexible circuit board having a first surface and a second surface opposite to each other. The first surface is provided with power lines and signal transmission lines for transmitting image data, and the second surface is provided with a ground line.
2. The connecting cable for a display screen according to claim 1, characterized in that, One end of the flexible circuit board is constructed with a via; the first surface is provided with a first exposed copper area, and the second surface is provided with a second exposed copper area electrically connected to the ground wire, and the first exposed copper area is electrically connected to the second exposed copper area through the via.
3. The connecting cable for a display screen according to claim 2, characterized in that, The vias are spaced in multiples, and the distance between adjacent vias is t, which satisfies: t≥0.3mm.
4. The connecting cable for a display screen according to claim 2, characterized in that, The second surface is also provided with a third exposed copper area that is electrically connected to the ground wire, and the third exposed copper area is located at the other end of the flexible circuit board.
5. The connecting cable for a display screen according to claim 2, characterized in that, The first surface is further provided with an annular exposed copper area, which is disposed along the edge of the flexible circuit board; and / or The second surface is further provided with an annular exposed copper area, which is provided along the edge of the flexible circuit board.
6. The connecting cable for a display screen according to claim 5, characterized in that, The width of the annular exposed copper area is less than or equal to 0.5 mm.
7. The connecting cable for a display screen according to claim 3, characterized in that, The first exposed copper area includes a first sub-exposed copper area and a second sub-exposed copper area. The grounding distance between the first sub-exposed copper area and the second sub-exposed copper area is D, and satisfies: D≤λ / 10.
8. The connecting cable for a display screen according to claim 1, characterized in that, One end of the flexible circuit board is provided with a first plug terminal for connecting to the display screen, and the other end of the flexible circuit board is provided with a second plug terminal for connecting to the motherboard.
9. A display screen, characterized in that, The cable includes the connection cable for a display screen as described in any one of claims 1 to 8, wherein the display screen has a metal backplate, and the second exposed copper area and the third exposed copper area are electrically connected to the metal backplate by conductive adhesive.
10. An electronic device, characterized in that, Includes the display screen as described in claim 9.