Electronic device

Abstract

The application provides an electronic device, which comprises a circuit board, a shielding cover and a shaping cover, a plurality of electronic devices are arranged on the circuit board, the shielding cover is arranged on the circuit board and covers at least part of the electronic devices, the edge of the shielding cover is connected with the circuit board and is electrically connected with the circuit board, and the shaping cover is arranged on the side, away from the circuit board, of the shielding cover and is used for shaping the shielding cover. In the electronic device, the shielding cover and the shaping cover can be flexibly adjusted according to the height and layout of the electronic devices, so that the material cost, manufacturing cost and maintenance cost can be reduced, and the installation efficiency is improved.

Description

Technical Field

[0001] This application relates to electromagnetic shielding technology, and more particularly to an electronic device. Background Technology

[0002] Printed circuit boards are widely used in power supply and electronic control products. With the increasing functional requirements, interference between signals inside the printed circuit board and electromagnetic emissions to the outside world need to be well shielded.

[0003] Existing technologies typically use shielding covers made of sheet metal to achieve signal shielding. However, sheet metal covers need to be manufactured specifically according to the height and layout of electronic components, which is costly and necessitates improvement. Utility Model Content

[0004] This application provides an electronic device that reduces the material cost, manufacturing cost, and maintenance cost of the shielding structure.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] This application provides an electronic device, including: a circuit board on which a plurality of electronic devices are disposed; a shielding cover on which the shielding cover is laid and covers at least some of the electronic devices, the edge of the shielding cover being connected to and electrically connected to the circuit board; and a shaping cover disposed on the side of the shielding cover away from the circuit board for shaping the shielding cover.

[0007] As an optional implementation, the electronic device further includes: a connecting part disposed on the circuit board and located between two adjacent electronic devices, wherein the two opposite ends of the connecting part are respectively connected to the shield and the circuit board; and the shield and the circuit board are electrically connected through the connecting part.

[0008] As an optional implementation, the connecting part is made of conductive foam.

[0009] As an optional implementation, the shield includes: a shield body portion disposed opposite to the circuit board; a support portion connected to the edge of the shield body portion and extending toward the circuit board, the support portion and the shield body portion jointly covering at least a portion of the electronic components; and an edge portion connected to the edge of the support portion, extending in contact with the circuit board and connected to the circuit board, the edge portion being electrically connected to the circuit board.

[0010] As an alternative implementation, the edge is connected to the circuit board using conductive adhesive.

[0011] As an optional implementation, the electronic device further includes an isolation layer disposed on the side of the shield facing the circuit board, located between the electronic device and the shield, for isolating the shield from the electronic device.

[0012] As an optional implementation, the release layer is set as release paper.

[0013] As an optional implementation, the shielding cover is made of aluminum foil.

[0014] As an alternative implementation, the shaping cover is made of plastic; or, the shaping cover is made of PET plastic.

[0015] As an optional implementation, the thickness of the shaping cover is set to be greater than or equal to 1 mm and less than or equal to 5 mm.

[0016] The electronic device of this application has a shielding cover that covers at least some electronic components and whose edges are connected to the circuit board. A shaping cover is set on the side of the shielding cover away from the circuit board to shape the shielding cover. The shielding cover can be adjusted to a preset shape according to electronic components of different heights, and the shaping cover can be shaped according to the preset shape of the shielding cover. In this way, the shielding structure formed by the shielding cover and the shaping cover does not require special manufacturing. During installation, it is only necessary to lay the shielding cover on the circuit board and connect the edges, and set the shaping cover on the side of the shielding cover away from the circuit board. The shape can be flexibly adjusted according to the height and layout of the electronic components. This reduces material costs, manufacturing costs and maintenance costs, and improves installation efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a partial structural diagram of an electronic device in one embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the shielding structure in one embodiment of this application.

[0020] Explanation of reference numerals in the attached figures:

[0021] 100. Circuit board; 110. Electronic device; 200. Shielding cover; 210. Cover body; 220. Support part; 230. Edge part; 300. Shaping cover; 400. Connecting part; 500. Isolation layer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0023] In the existing technology, a shielding cover made of sheet metal is used to achieve signal shielding. However, the sheet metal cover needs to be made according to the specific height and layout of the electronic device, which is costly.

[0024] To overcome the shortcomings of the prior art, this application provides an electronic device in which a shielding cover covers at least some electronic components and its edges are connected to a circuit board. A shaping cover is disposed on the side of the shielding cover away from the circuit board to shape the shielding cover. The shielding cover can be adjusted to a preset shape according to electronic components of different heights, and the shaping cover can be shaped according to the preset shape of the shielding cover. In this way, the shielding structure formed by the shielding cover and the shaping cover does not require special manufacturing. During installation, it is only necessary to lay the shielding cover on the circuit board and connect its edges, and place the shaping cover on the side of the shielding cover away from the circuit board. The shape can be flexibly adjusted according to the height and layout of the electronic components. This reduces material costs, manufacturing costs, and maintenance costs, and improves installation efficiency.

[0025] See Figure 1 This application provides an electronic device that may include a circuit board 100 on which a plurality of electronic devices 110 are disposed, such as power devices, radio frequency modules, high frequency chips, etc.

[0026] See Figure 1 In some embodiments, the electronic device may further include a shielding cover 200 and a shaping cover 300. The shielding cover 200 is laid on the circuit board 100 and covers at least a portion of the electronic components 110. The edge of the shielding cover 200 is connected to the circuit board 100, and the shielding cover 200 is electrically connected to the circuit board 100. The shaping cover 300 is disposed on the side of the shielding cover 200 opposite to the circuit board 100 and is used to shape the shielding cover 200.

[0027] In some exemplary embodiments, the shield 200 is a downward-opening cover, and the shield 200 is made of materials such as aluminum foil, copper foil, conductive cloth, metal woven mesh (copper mesh, nickel-copper alloy mesh, stainless steel mesh, etc.).

[0028] Since the electronic devices 110 (such as RF modules and high-frequency chips) on the circuit board 100 generate electromagnetic radiation during operation, when the shielding cover 200 is laid on the circuit board 100 and covers these electronic devices 110, the shielding cover 200 uses the reflection and absorption of electromagnetic waves through its metallic material. Furthermore, since the shielding cover 200 is also connected to the circuit board 100, which is typically grounded, the shielding cover 200 absorbs the electromagnetic waves and conducts them to the ground plane of the circuit board 100 through edge connections, forming a discharge path for interference current and reducing the performance degradation of electronic devices caused by signal crosstalk. For example, the high-frequency energy generated by the RF devices will be absorbed by the shielding cover 200 and conducted to the ground plane of the circuit board 100 through edge connections.

[0029] In addition, since the shield 200 is laid on the circuit board 100 and covers some electronic components 110, interference signals such as power frequency magnetic fields and radio frequency radiation in the external environment (such as mobile phone base station signals and electromagnetic radiation from other electronic devices) are difficult to penetrate the shield 200 and enter the interior, which can effectively protect the electronic components 110 (such as precision sensors and analog circuits) from external electromagnetic noise.

[0030] Because the shielding cover 200 is made of flexible materials such as aluminum foil, it is prone to deformation when used for a long time or subjected to vibration and impact, which increases the gap between it and the circuit board 100, and may even cause the shielding cover 200 to break.

[0031] In this embodiment, a shaping cover 300 is provided on the side of the shielding cover 200 away from the circuit board 100. The shaping cover 300 is attached to the shielding cover 200 and uses its own strength to fix the shielding cover 200 in a preset shape, thereby reducing the probability of the shielding cover 200 collapsing, warping, or deforming under external force, and improving the service life of the shielding cover 200 and its reliability in harsh environments.

[0032] In addition, the shaping cover 300 can also serve as a protective layer for the shielding cover 200. During equipment assembly, transportation, or daily maintenance, it prevents external forces from directly acting on the shielding cover 200, causing scratches and dents. During long-term use, it isolates dust, moisture, and other pollutants from directly contacting the shielding cover 200, thus extending the service life of the shielding cover 200.

[0033] In addition, the shaping cover 300 can also be made of some materials with shape plasticity, so that the shaping cover 300 can adjust the preset shape of the shielding cover 200 according to the electronic devices 110 of different heights, so as to adapt to the scenario where multiple electronic devices 110 of different heights are set on the circuit board 100.

[0034] In some exemplary embodiments, the shaping cover 300 may be made of plastic, which has a certain mechanical strength and can fix the preset shape of the shielding cover 200 and protect the shielding cover 200. In addition, the plastic usually has a certain degree of shape plasticity so that the shielding cover 200 can adapt to the scenario where multiple electronic devices 110 of different heights are set on the circuit board 100.

[0035] In this embodiment, since the shielding cover 200 covers at least part of the electronic components 110 and its edges are connected to the circuit board 100, the shaping cover 300 is disposed on the side of the shielding cover 200 away from the circuit board 100 to shape the shielding cover 200. The shielding cover 200 can be adjusted to a preset shape according to the electronic components 110 of different heights, and the shaping cover 300 can be shaped according to the preset shape of the shielding cover 200. In this way, the shielding structure formed by the shielding cover 200 and the shaping cover 300 does not require special manufacturing. During installation, it is only necessary to lay the shielding cover 200 on the circuit board 100 and achieve edge connection, and place the shaping cover 300 on the side of the shielding cover 200 away from the circuit board 100. The shape can be flexibly adjusted according to the height and layout of the electronic components 110. This reduces material costs, manufacturing costs and maintenance costs, and improves installation efficiency.

[0036] Furthermore, the shaping cover 300 can also be made of PET plastic (polyethylene terephthalate). PET plastic has excellent dimensional stability, with a heat shrinkage rate of ≤0.5% over a wide temperature range of -40℃ to 120℃, and can maintain the preset support shape for a long time.

[0037] Furthermore, the thickness of the shaping cover 300 is set to be greater than or equal to 1 mm and less than or equal to 5 mm, such as 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, etc.

[0038] By setting the thickness of the shaping cover 300 within the above-mentioned range, it is possible to ensure that the shaping cover 300 has a certain strength to protect the shielding cover 200, while also allowing it to have a certain degree of plasticity, making it easy to adjust its own shape, and thus making it easy to adjust the shape of the shielding cover 200.

[0039] See Figure 1 In some embodiments, the electronic device may further include a connection portion 400, which is disposed on the circuit board 100 and located between two adjacent electronic devices 110. The two opposite ends of the connection portion 400 are respectively connected to the shielding cover 200 and the circuit board 100. The shielding cover 200 and the circuit board 100 are electrically connected through the connection portion 400.

[0040] In this embodiment, if the shielding cover 200 is only connected to the circuit board 100 through its edges, the central area is prone to collapse and warping due to lack of support during equipment transportation and use, caused by vibration, impact, or temperature changes. This can lead to loosening of the edge connection points and damage to the electrical connection path. The connecting part 400 is disposed between adjacent electronic components 110, which can provide physical support for the central part of the shielding cover 200, limit its deformation range, ensure that the electrical connection between the shielding cover 200 and the circuit board 100 remains stable, reduce the probability of shielding failure due to structural deformation, and extend the service life of the equipment.

[0041] Furthermore, since the shielding cover 200 and the circuit board 100 are electrically connected via the connecting part 400, the connecting part 400 can serve as a conductive medium between the shielding cover 200 and the circuit board 100, creating an additional electrical connection path between them. This allows the shielding cover 200 to be connected to the circuit board 100 not only through its edges but also through the connecting part 400 to quickly connect to the ground plane of the circuit board 100. This allows the electromagnetic energy absorbed by the shielding cover 200 (such as high-frequency radiation generated by the internal electronic device 110 and external interference signals) to be efficiently conducted to the ground through multiple pathways, preventing electromagnetic leakage caused by energy accumulation in the center of the shielding cover 200 and improving the shielding effect of the shielding cover 200.

[0042] Furthermore, since the connecting part 400 is disposed between adjacent electronic devices 110, the connecting part 400 can also form a physical separation layer between adjacent electronic devices 110 in space through its own structure, further reducing electromagnetic interference between adjacent electronic devices 110.

[0043] In some exemplary embodiments, the connecting portion 400 is configured as conductive foam. Conductive foam refers to conductive cloth wrapped around flame-retardant sponge, which, after a series of treatments, gives it good surface conductivity and can be easily fixed to the device requiring shielding with adhesive tape.

[0044] Adhesive or fasteners are prepared on the conductive foam. Using this adhesive or fastener, one end can be precisely attached to a predetermined area between adjacent electronic components 110 on the circuit board 100. When the shielding cover 200 is installed on the circuit board 100, the inner wall of the shielding cover 200 contacts the other end of the conductive foam, and the connection is secured using adhesive or fasteners. This method is simple and reliable, reduces errors from manual operation, and lowers the product defect rate.

[0045] See Figure 1In some embodiments, the shield 200 may further include a cover portion 210, a support portion 220, and an edge portion 230. The cover portion 210 is disposed opposite to the circuit board 100, the support portion 220 is connected to the edge of the cover portion 210 and extends toward the circuit board 100, and the support portion 220 and the cover portion 210 together cover at least a portion of the electronic device 110. The edge portion 230 is connected to the edge of the support portion 220, extends in contact with the circuit board 100, and is connected to the circuit board 100, and the edge portion 230 is electrically connected to the circuit board 100.

[0046] In this embodiment, the cover portion 210 is disposed opposite to the circuit board 100, and the support portion 220 extends from the edge of the cover portion 210 toward the circuit board 100. Together, they enclose a three-dimensional shielding cavity surrounding the electronic device 110. In the vertical direction, the cover portion 210 can directly block the electromagnetic energy radiated upward by the electronic device 110, preventing energy from diffusing upward; the support portion 220 can fill the vertical gap between the cover portion 210 and the circuit board 100, preventing electromagnetic energy from leaking from the side.

[0047] In addition, the support part 220 can also support the cover part 210, so that the cover part 210 can be arranged opposite to the circuit board 100 in the vertical direction to cover part of the electronic device 110.

[0048] Furthermore, since the multiple electronic components 110 on the circuit board 100 are uneven, the cover portion 210 can adjust its shape according to the multiple electronic components 110 in order to adapt to the scenario of multiple electronic components 110 with uneven heights.

[0049] The edge portion 230 is connected to the edge of the support portion 220 and extends in contact with the circuit board 100, forming a tight horizontal contact boundary with the circuit board 100. This increases the contact area between the edge portion 230 and the circuit board 100, improving the stability of the physical connection. Furthermore, the tight connection between the edge portion 230 and the circuit board 100 further reduces the risk of electromagnetic energy leakage between the support portion 220 and the circuit board 100.

[0050] The edge portion 230 is electrically connected to the circuit board 100, thus forming a continuous conductive path, which rapidly conducts the electromagnetic energy absorbed by the shield 200 to the ground plane of the circuit board 100 through the edge portion 230.

[0051] Furthermore, the edge portion 230 is connected to the circuit board 100 by conductive adhesive, thus enabling the edge portion 230 and the circuit board 100 to achieve both physical and electrical connection.

[0052] See Figure 1In some embodiments, the electronic device may further include an isolation layer 500, which is disposed on the side of the shield 200 facing the circuit board 100 and located between the electronic device 110 and the shield 200, for isolating the shield 200 and the electronic device 110.

[0053] In this embodiment, during assembly or vibration, the shield 200 is prone to direct friction or collision with the electronic device 110 (such as protruding capacitors or chip pins). The isolation layer 500 is located between the electronic device 110 and the shield 200 and can serve as a buffer medium to prevent the rigid edge of the shield 200 from scratching the encapsulation layer on the surface of the electronic device 110 (such as the epoxy resin encapsulation of the chip or the ceramic shell of the capacitor). At the same time, it prevents the sharp structure of the electronic device 110 (such as pins) from scratching the conductive coating of the shield 200 (such as the metal plating of the aluminum foil shield 200).

[0054] In some exemplary embodiments, the release layer 500 may be release paper. Release paper, also known as silicone paper or anti-stick paper, mainly serves to isolate sticky objects, such as tape.

[0055] The release paper is thin but has a certain strength, which can form a thin buffer layer between the shield 200 and the electronic device 110, so as to prevent the rigid edge of the shield 200 from scratching the epoxy resin encapsulation or ceramic shell on the surface of the device, and will not increase the distance between the shield 200 and the circuit board 100 due to excessive thickness.

[0056] See Figure 1 and Figure 2 In some embodiments, the electronic device may also install a shielding structure by the following steps:

[0057] Step 1: Provide a connecting part 400 on the circuit board 100. Specifically, the connecting part 400 can be conductive foam. The conductive foam itself is conductive, and its lower end can be attached to the circuit board 100 using conductive adhesive.

[0058] See Figure 2 Step 2: Prefabricate the shielding structure. The shielding structure is a three-layer integrated structure formed by the shaping cover 300, the shielding cover 200, and the isolation layer 500. The shaping cover 300 and the shielding cover 200 can be connected with ordinary glue, and the shielding cover 200 and the isolation layer 500 can be connected with conductive glue.

[0059] Step 3: According to the coverage area size of the electronic device 110 to be shielded on the circuit board 100, cut the pre-formed shielding structure to the corresponding size to ensure that the cut structure can completely cover at least part of the electronic device 110 and that the edges can cover the connection area on the circuit board 100.

[0060] Step 4: Lay the cut shielding structure on the circuit board 100, with the isolation layer 500 facing the side of the circuit board 100 (i.e., the isolation layer 500 is located between the shielding cover 200 and the circuit board 100), and ensure that the shielding structure accurately covers the electronic device 110 to be shielded, thus completing the initial positioning.

[0061] Step 5: Remove the isolation layer 500 at the edge of the shielding cover 200 and the corresponding position of the connecting part 400, and at the same time realize the physical connection and electrical connection between the shielding cover 200 and the circuit board 100, and the physical connection and electrical connection between the connecting part 400 and the shielding cover 200.

[0062] Specifically, the isolation layer 500 at the edge of the shielding cover 200 and at the corresponding position of the connecting part 400 is removed using a laser processing technique. After the isolation layer 500 at the edge of the shielding cover 200 is removed, the conductive adhesive at the edge of the shielding cover 200 is exposed, and the shielding cover 200 and the circuit board 100 are physically and electrically connected using the exposed conductive adhesive. After the isolation layer 500 at the connecting part 400 corresponding to the shielding cover 200 is removed, the conductive adhesive at the corresponding connecting part 400 of the shielding cover 200 is exposed, and the shielding cover 200 and the connecting part 400 are physically and electrically connected using the exposed conductive adhesive.

[0063] It should be noted that the above installation process is described only to facilitate understanding of the technical solution of this application. The order of some of the above steps can be adjusted, and the specific implementation methods can be replaced. That is to say, when installing the shielding structure, it is not necessary to strictly follow the above steps.

[0064] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0065] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0066] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0067] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of devices in use or operation other than those shown in the figures. Devices may have other orientations, and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: A circuit board on which multiple electronic components are disposed; A shielding cover is laid on the circuit board and covers at least part of the electronic components. The edge of the shielding cover is connected to the circuit board and is electrically connected to the circuit board. A shaping cover is disposed on the side of the shielding cover opposite to the circuit board, for shaping the shielding cover.

2. The electronic device according to claim 1, characterized in that, Also includes: A connecting portion is disposed on the circuit board, located between two adjacent electronic components, and its opposite ends are respectively connected to the shielding cover and the circuit board; and, The shielding cover is electrically connected to the circuit board via a connecting part.

3. The electronic device according to claim 2, characterized in that, The connecting part is made of conductive foam.

4. The electronic device according to claim 1, characterized in that, The shielding cover includes: The cover portion is disposed opposite to the circuit board; A support portion is connected to the edge of the cover portion and extends toward the circuit board, wherein the support portion and the cover portion together cover at least a portion of the electronic device; An edge portion is connected to the edge of the support portion, extends into and is connected to the circuit board, and is electrically connected to the circuit board.

5. The electronic device according to claim 4, characterized in that, The edge portion is connected to the circuit board via conductive adhesive.

6. The electronic device according to claim 1, characterized in that, Also includes: An isolation layer is disposed on the side of the shielding cover facing the circuit board, located between the electronic device and the shielding cover, for isolating the shielding cover from the electronic device.

7. The electronic device according to claim 6, characterized in that, The release layer is made of release paper.

8. The electronic device according to claim 1, characterized in that, The shielding cover is made of aluminum foil.

9. The electronic device according to claim 1, characterized in that, The shaping cover is made of plastic; or, The shaping cover is made of PET plastic.

10. The electronic device according to claim 1, characterized in that, The thickness of the shaping cover is set to be greater than or equal to 1 mm and less than or equal to 5 mm.

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