PCB panel

Abstract

The PCB panel provided by the present disclosure comprises a panel main body and a plurality of sub-panel assemblies, wherein each sub-panel assembly comprises a sub-panel body, a BGA packaged component and a connecting plate, the two ends of the connecting plate are connected to the sub-panel body and the panel main body respectively, the BGA packaged component is installed on the sub-panel body, and the BGA packaged component is arranged away from the connecting plate; the connecting plate is used for laser cutting, so that the sub-panel body is separated from the panel main body. The PCB panel uses one side of the connecting position, so that the PCB panel only needs to be cut once on one side when the panel is separated, the panel separation efficiency is improved, and the panel separation time cost is reduced; since the BGA packaged component is arranged away from the connecting plate, the BGA packaged component is less likely to be damaged by external force during subsequent panel separation; in addition, after the component patching is completed, the panel is separated by laser, and the probability of local damage of the sub-panel body or damage of the BGA packaged component is greatly reduced.

Description

Technical Field

[0001] This disclosure relates to the field of PCB technology, and in particular to a PCB panel. Background Technology

[0002] With the diversification of modern electronic digital products, people are becoming increasingly dependent on them, and the requirements for lightweight and miniaturized digital products are also increasing. In order to achieve product miniaturization, the size requirements of PCBA protection boards are also increasing, making the miniaturization of protection board chips very important.

[0003] Conventional DFN packaged components, due to their epoxy resin encapsulation, are large in size and tall in height, which has gradually become unable to meet product size requirements. In recent years, BGA (Ball Grid Array Package) components have become increasingly popular, and more and more product designs are choosing BGA packaged components.

[0004] Currently, there is a type of PCB panel on the market where the PCB board body 11 is typically designed with connection points 12 directly in two width directions. The connection points 12 on both sides are used for cutting and separating the boards, as shown in the structure below. Figure 1 and Figure 2 As shown, after the components are mounted, the board is cut using CNC (Computer Numerical Control) or broken manually. However, both of these methods have low board separation efficiency, require high time costs, and will cause huge stress on the PCB board, resulting in local damage to the PCB board. In severe cases, it can cause the BGA components to break directly. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a PCB panel that is less prone to stress during panel separation and less likely to damage BGA components.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] A PCB panel includes a panel body and multiple sub-panel assemblies. The panel body has multiple spaced connection ports. Each sub-panel assembly is located at a corresponding connection port. Each sub-panel assembly includes a sub-panel body, BGA packaged components, and a connecting plate. The two ends of the connecting plate are respectively connected to the sub-panel body and the panel body. The BGA packaged components are mounted on the sub-panel body and are disposed away from the connecting plate. The connecting plate is used for laser cutting to separate the sub-panel body from the panel body.

[0008] In one embodiment, the width of the connecting plate is smaller than the width of the split plate body.

[0009] In one embodiment, the ratio of the width of the connecting plate to the width of the split plate body is 1:2.

[0010] In one embodiment, each of the panel assembly's connecting plate includes a connecting portion and a cutting portion. The two ends of the cutting portion are respectively connected to the panel body and the connecting portion, and one end of the connecting portion is also connected to the panel body. The cutting portion is used for laser cutting to separate the panel body from the panel body.

[0011] In one embodiment, the cutting portion is a V-shaped cutting portion.

[0012] In one embodiment, the ratio of the depth of the cut portion to the thickness of the slab body is (1:5) to (1:4).

[0013] In one embodiment, the panel body is provided with multiple cutting lines, and each cutting line and the corresponding cutting part are located on the same parallel line.

[0014] In one embodiment, both ends of a portion of the cutting line extend to the adjacent connection port.

[0015] In one embodiment, the ratio of the straight-line distance between the BGA packaged component and the connecting board to the length of the sub-board body is (5:6) to (7:8).

[0016] In one embodiment, the straight-line distance between the partition plate and the main body of the splicing plate is 2mm-3mm.

[0017] Compared with the prior art, this disclosure has at least the following advantages:

[0018] The aforementioned PCB panel no longer uses two connection points, but instead uses one connection point on one side. This means that only one side needs to be cut once during PCB panel separation, improving separation efficiency and reducing separation time costs. Since BGA packaged components are located far from the connection board, they are less likely to be damaged by external forces during subsequent separation. In addition, after component placement, laser separation is used, which, compared to manual breaking or CNC cutting, makes the separated board less susceptible to external forces, thus significantly reducing the probability of localized damage to the separated board or damage to BGA packaged components. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural diagram of a PCB panel in the prior art;

[0021] Figure 2 for Figure 1 The image shown is a partial enlarged view of a prior art PCB panel at point A.

[0022] Figure 3 This is a schematic diagram of the PCB panel structure in one embodiment;

[0023] Figure 4 for Figure 3 The image shows a magnified view of the PCB panel at point B.

[0024] Reference numerals: 10, PCB panel; 100, panel body; 101, connection port; 102, cutting line; 200, sub-panel assembly; 210, sub-panel body; 220, BGA packaged component; 230, connecting board; 231, connecting part; 232, cutting part. Detailed Implementation

[0025] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0029] Please see Figure 3 This is an embodiment of the present invention, a PCB panel 10 containing BGA packaged components 220, including a panel body 100 and multiple sub-panel assemblies 200. The panel body 100 has multiple spaced connection ports 101. Each sub-panel assembly 200 is located at a corresponding connection port 101. Each sub-panel assembly 200 includes a sub-panel body 210, a BGA packaged component 220, and a connecting plate 230. The two ends of the connecting plate 230 are respectively connected to the sub-panel body 210 and the panel body 100. The BGA packaged component 220 is mounted on the sub-panel body 210 and is positioned away from the connecting plate 230. The connecting plate 230 is used for laser cutting to separate the sub-panel body 210 from the panel body 100. That is, after the surface mount is completed, the sub-panel is separated by laser cutting. The laser uses high-energy rays to burn the cutting positions on the connecting plate 230 to separate the sub-panel body 210 from the panel body 100. In this embodiment, the PCB (Printed Circuit Board) is composed of the PCB body 210 and the BGA packaged components 220.

[0030] In the above embodiments, the PCB panel 10 no longer uses two connection points, but uses one connection point, so that the PCB panel 10 only needs to be cut once on one side when separating the boards, which improves the separation efficiency and reduces the separation time cost. Since the BGA packaged components 220 are set far away from the connection board 230, the BGA packaged components 220 are less likely to be damaged by external forces during subsequent separation. In addition, after the components are placed, the separation is carried out by laser separation. Compared with manual breaking or CNC cutting, the separation board 210 is less likely to be subjected to external forces, thereby greatly reducing the probability of partial damage to the separation board 210 or damage to the BGA packaged components 220.

[0031] like Figure 4As shown, in one embodiment, the width D1 of the connecting plate 230 is smaller than the width D2 of the split board body 210. Since cutting the split board requires overcoming resistance, when the width of the connecting plate 230 is smaller than the width of the split board body 210, the difficulty of cutting can be reduced, the efficiency of PCB splitting can be improved, and the stress on the split board body 210 and BGA packaged components 220 can be further reduced. Furthermore, the ratio of the width of the connecting plate 230 to the width of the split board body 210 is 1:2, that is, the width of the connecting plate 230 is half the width of the split board body 210. For example, when the width of the split board body 210 is 8mm, the designed width of the connecting plate 230 is 4mm.

[0032] like Figure 4 As shown, in one embodiment, the connecting plate 230 of each split board assembly 200 includes a connecting portion 231 and a cutting portion 232. The two ends of the cutting portion 232 are respectively connected to the split board body 210 and the connecting portion 231, and one end of the connecting portion 231 is also connected to the panel body 100. The cutting portion 232 is used for laser cutting to separate the split board body 210 from the panel body 100. It can be understood that after the component placement is completed, the cutting portion 232 on the connecting plate 230 is cut by laser cutting, causing the cutting portion 232 to break, thereby separating the split board body 210 from the connecting portion 231, so as to achieve the effect of PCB board splitting. Furthermore, the cutting portion 232 is a V-shaped cutting portion, i.e., V-CUT (not shown in the figure), so that the cutting device needs to overcome less resistance when cutting the cutting portion 232 on the connecting plate 230, effectively reducing the stress generated by the split board body 210 and the BGA packaged components 220. Furthermore, the ratio of the depth of the cutting portion 232 to the thickness of the sheet metal 210 is 1:5 to 1:4. In this embodiment, the ratio is 1:4. For example, if the thickness of the sheet metal 210 is 1.0 mm, and the depth of the designed V-shaped cutting portion 232 is 0.25 mm, the thickness of the cutting portion 232 in its thinnest region is small, making it easier to cut the sheet metal. Furthermore, the V-shaped portion of the cutting portion 232 is provided on both sides. This makes the thickness of the thinnest region of the cutting portion 232 in this design 0.5 mm.

[0033] like Figure 3 and Figure 4As shown, in one embodiment, the panel body 100 is provided with multiple cutting lines 102, each cutting line 102 and its corresponding cutting portion 232 being located on the same parallel line. It can be understood that since each sub-panel assembly 200 is connected to the panel body 100, and the multiple sub-panel assemblies 200 are neatly distributed both horizontally and vertically, the cutting portions 232 of the connecting plates 230 of each sub-panel assembly 200 are located on the same parallel line in a single horizontal row, and the cutting portions 232 of the connecting plates 230 of each row of sub-panel assemblies 200 are parallel in a vertical row. When the cutting line 102 and its corresponding cutting portion 232 are located on the same parallel line, it facilitates accurate cutting of the cutting portions 232 on the connecting plates 230 and the cutting lines 102 on the panel body 100 during subsequent PCB board separation, preventing damage to the PCB board caused by misaligned cutting. Furthermore, the two ends of some cutting lines 102 extend to the adjacent connection ports 101, while the two ends of the remaining cutting lines 102 extend to a connection port 101 and the outer side of the panel body 100, respectively.

[0034] like Figure 3 As shown, in one embodiment, the linear distance D between the BGA packaged component 220 and the interconnect 230 is... 31 With the length D of the 210 plate body 32 The ratio is (5:6) to (7:8). In a preferred embodiment, the straight-line distance D... 31 With the length D 32 The ratio is 7:8, ensuring sufficient distance between the BGA packaged component 220 and the connecting board 230, i.e., far away from the connecting board 230. This effectively reduces the stress on the BGA packaged component 220 during PCB depaneling. For example, if the designed depanel board 210 is 30mm long, the straight-line distance between the BGA packaged component 220 and the connecting board 230 is 26mm. Similarly, if the designed depanel board 210 is 40mm long, the straight-line distance between the BGA packaged component 220 and the connecting board 230 is 35mm. In another embodiment, the straight-line distance D... 31 It also indicates the distance between the BGA packaged component 220 and the cutout 232 of the connector board 230.

[0035] like Figure 4 As shown, in one embodiment, the straight-line distance D4 between the partition plate 210 and the panel body 100 is 2mm-3mm. In this embodiment, the straight-line distance between the partition plate 210 and the panel body 100 is 2mm. Specifically, the straight-line distance between one side of the partition plate 210 and the panel body 100 is 2mm.

[0036] Compared with the prior art, this disclosure has at least the following advantages:

[0037] The aforementioned PCB panel 10 no longer uses two connection points, but instead uses a connection point on one side. This allows the PCB panel 10 to be cut only once on one side during separation, improving separation efficiency and reducing separation time costs. Since the BGA packaged components 220 are positioned far from the connection board 230, they are less likely to be damaged by external forces during subsequent separation. Furthermore, after component placement, laser separation is performed, which, compared to manual breaking or CNC cutting, makes the separated board 210 less susceptible to external forces, thus significantly reducing the probability of partial damage to the separated board 210 or damage to the BGA packaged components 220.

[0038] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A PCB panel (10), comprising a panel body (100) and multiple sub-panel assemblies (200), characterized in that, The panel body (100) has multiple spaced connection ports (101). Each panel assembly (200) is located at a corresponding connection port (101). Each panel assembly (200) includes a panel body (210), a BGA packaged component (220), and a connecting plate (230). The two ends of the connecting plate (230) are respectively connected to the panel body (210) and the panel body (100). The BGA packaged component (220) is installed on the panel body (210) and is located away from the connecting plate (230). The connecting plate (230) is used for laser cutting to separate the panel body (210) from the panel body (100).

2. The PCB panel (10) of claim 1, wherein, The width of the connecting plate (230) is smaller than the width of the dividing plate body (210).

3. The PCB panel (10) of claim 2, wherein, The width of the connecting plate (230) is in a ratio of 1:2 to the width of the sub-plate body (210).

4. The PCB panel (10) of claim 1, wherein, Each of the panel assembly (200) has a connecting plate (230) including a connecting part (231) and a cutting part (232). The two ends of the cutting part (232) are respectively connected to the panel body (210) and the connecting part (231), and one end of the connecting part (231) is also connected to the panel body (100). The cutting section (232) is used for laser cutting to separate the panel body (210) from the panel body (100).

5. The PCB panel (10) of claim 3, wherein, The cutting part (232) is a V-shaped cutting part.

6. The PCB panel (10) of claim 4, wherein, The ratio of the depth of the cutting section (232) to the thickness of the partition plate (210) is (1:5) to (1:4).

7. The PCB panel (10) of claim 3, wherein, The panel body (100) is provided with a plurality of cutting lines (102), and each cutting line (102) and the corresponding cutting part (232) are located on the same parallel line.

8. The PCB panel (10) of claim 6, wherein, Both ends of a portion of the cutting line (102) extend to the adjacent connection port (101).

9. The PCB panel (10) of claim 1, wherein, The ratio of the straight-line distance between the BGA packaged component (220) and the connecting board (230) to the length of the sub-board body (210) is (5:6) to (7:8).

10. The PCB panel (10) of claim 1, wherein, The straight-line distance between the partition plate (210) and the main body of the splicing plate (100) is 2mm-3mm.

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