Foldable mainboard structure

Abstract

The utility model provides a foldable mainboard structure relates to the technical field of circuit board, including folding mainboard unit and fixed mainboard unit, folding mainboard unit bottom is fixed with the hinge, the other end of hinge is fixed in fixed mainboard unit bottom, and the bottom of fixed mainboard unit is provided with assembly slot no.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a foldable motherboard structure. Background Technology

[0002] The motherboard, also known as a printed circuit board, is an indispensable basic component in modern electronic devices. It achieves electrical connection and mechanical fixation between electronic components by etching fine copper conductive lines on an insulating substrate. Its surface is also covered with a solder mask layer and a marking layer to prevent soldering errors and mark the location of components. Circuit boards are widely used in everything from simple household appliances to complex computers, communication equipment and aerospace fields. They are the core carrier for electronic devices to realize their functions, and their quality directly affects the performance and reliability of the equipment.

[0003] In existing technologies, traditional motherboards are usually not foldable. This characteristic brings many limitations, restricting the shape and size of electronic devices and making it difficult to achieve thinness and portability. Especially in the fields of wearable devices and flexible electronics, the rigid structure of traditional motherboards has become a bottleneck. The inability to fold motherboards limits space utilization and makes it difficult to adapt to complex spatial layout requirements. The rigidity of the motherboard leads to wasted internal space. In addition, rigid motherboards are more likely to be damaged by impacts during transportation and storage. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a foldable motherboard structure.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a foldable motherboard structure, including a foldable motherboard unit and a fixed motherboard unit. A hinge is fixed to the bottom of the foldable motherboard unit, and the other end of the hinge is fixed to the bottom of the fixed motherboard unit. A component groove is formed at the bottom of the fixed motherboard unit. A clamping shaft 1 and a clamping shaft 2 are provided on the inner wall of the component groove 1. A clamping sliding groove is formed on the inner wall of the component groove 1. The clamping sliding groove is formed at both ends of the clamping shaft 1 and the clamping shaft 2. A clamping slider is fixed at both ends of the clamping shaft 1 and the clamping shaft 2. The clamping slider slides on the inner wall of the clamping sliding groove. Springs are fixed on both sides of the clamping slider. The other end of the spring is fixed to the inner wall of the clamping sliding groove. A clamping seat is fixed at the bottom of the foldable motherboard unit.

[0006] Preferably, both the folding motherboard unit and the fixed motherboard unit have a component slot two on one side, and an adsorption magnet one is fixed to the inner wall of the component slot two. Both the folding motherboard unit and the fixed motherboard unit have a component slot three on one side, and an adsorption magnet two is fixed to the inner wall of the component slot three. The magnetic poles of two adjacent adsorption magnets one are opposite magnetic poles, and the magnetic poles of two adjacent adsorption magnets two are opposite magnetic poles. In the prior art, folding motherboards often lack an effective fixing device after unfolding, which makes them prone to movement or shaking. This instability directly affects the normal operation of electronic components on the motherboard, leading to problems such as loose connections, signal transmission interruptions, or performance degradation. Especially during device operation, the shaking of the motherboard can cause collisions between internal components, thereby damaging sensitive electronic components. In addition, this unstable structure also reduces the overall reliability and service life of the device. To address these problems, this utility model adopts a magnetic adsorption fixing structure. When the folding motherboard unit unfolds and aligns with the fixed motherboard unit, the adsorption magnet one in component slot two and the adsorption magnet one in component slot three... When the two magnets are brought close together, since the magnetic poles of the adjacent magnets are opposite poles, they will generate a strong attraction based on the principle that opposite poles attract each other. This will tightly attract the folding motherboard unit to the fixed motherboard unit, significantly improving the stability and reliability of the device. By introducing a reliable fixing mechanism, such as magnetic attraction, snap-locking, or other mechanical fixing methods, it is possible to effectively prevent the motherboard from moving or shaking after unfolding, thereby ensuring the secure connection of electronic components, avoiding signal transmission interruption and performance degradation. This improvement can reduce the collision of internal components caused by motherboard shaking, protect sensitive electronic components from damage, and extend the service life of the device.

[0007] Preferably, a heat dissipation fin one is fixed to the top of the folding motherboard unit, and a heat dissipation fin two is fixed to the top of the fixed motherboard unit. The heat dissipation fin one and heat dissipation fin two are arranged symmetrically, and thermal grease is applied evenly to the bottom of both heat dissipation fin one and heat dissipation fin two. In the prior art, folding motherboards typically lack a dedicated heat dissipation structure, which brings significant drawbacks. Because folding motherboards generate heat during use, the lack of effective heat dissipation measures leads to heat accumulation, causing the motherboard temperature to rise. Excessive temperature reduces the performance of electronic components and may even cause component failure or damage, affecting the stability and lifespan of the device. Furthermore, high temperatures can cause deformation of the motherboard's plastic or flexible materials, further affecting its folding function and structural integrity. To address these problems, this invention employs a finned heat dissipation structure. Heat dissipation fin one and heat dissipation fin two are respectively fixed to the top of the folding motherboard unit and the fixed motherboard unit, and are arranged symmetrically. By increasing the heat dissipation area, they dissipate the heat generated by the motherboard... The heat is quickly conducted into the air. The thermal grease applied to the bottom of the heat sink fins fills the tiny gaps between the fins and the motherboard, improving heat conduction efficiency. When the motherboard generates heat during operation, the heat is first transferred to the heat sink fins through the thermal grease, and then dissipated into the surrounding environment by the large surface area of ​​the fins. This effectively reduces the motherboard temperature, significantly improving its performance and reliability. By introducing effective heat dissipation measures, the heat accumulation generated by the motherboard during operation can be effectively reduced, avoiding component performance degradation, failure, or even damage caused by high temperatures. This not only improves the operational stability of the device and extends its service life, but also prevents the deformation of the motherboard material caused by high temperatures, ensuring the normal operation of the folding function and the integrity of the structure.

[0008] Preferably, a protective sleeve one is detachably fixed to the surface of the folding motherboard unit, and a protective sleeve two is detachably fixed to the surface of the fixed motherboard unit. The detachable and fixed protective sleeves one and two on the surfaces of the folding motherboard unit and the fixed motherboard unit respectively effectively improve the motherboard's protective performance. This design prevents the motherboard from being damaged by external physical impacts, dust contamination, liquid corrosion, etc., during use, transportation, or storage, thereby extending the motherboard's service life.

[0009] Preferably, the first and second protective sleeves are made of silicone. The silicone material provides comprehensive protection for both the folding and fixing of the motherboard unit. Silicone has good flexibility, maintaining stability during folding and unfolding, and will not be damaged by repeated folding, thus effectively protecting the structural integrity of the motherboard.

[0010] Preferably, the engaging area of ​​the locking seat has an arc surface, and the surface of the arc surface is smooth. The smooth arc surface at the engaging area of ​​the locking seat significantly improves the performance and reliability of the folding motherboard structure. The smooth arc surface design reduces the friction between the locking seat and the locking shaft, making the folding motherboard unit fold and unfold more smoothly and easily. At the same time, reducing friction also reduces wear caused by long-term use, extending the service life of the locking seat and related components.

[0011] Preferably, both the first and second protective sleeves have heat dissipation holes arranged in an array on their surfaces. This array of heat dissipation holes effectively improves the heat dissipation performance of the folding motherboard. The design of the heat dissipation holes promotes airflow, allowing the heat generated by the motherboard during operation to be quickly dissipated to the outside, preventing heat accumulation and overheating. This optimized heat dissipation not only helps maintain the normal operating temperature of electronic components but also extends their lifespan.

[0012] Beneficial effects:

[0013] 1. In existing technologies, traditional motherboards are typically non-foldable, a characteristic that imposes numerous limitations. It restricts the shape and size of electronic devices, making it difficult to achieve thinner, lighter, and more portable designs. This is especially true in wearable devices and flexible electronics, where the rigid structure of traditional motherboards becomes a bottleneck. Non-foldable motherboards also limit space utilization, making it difficult to adapt to complex spatial layouts. The rigidity of the motherboard leads to wasted internal space. Furthermore, rigid motherboards are more susceptible to damage from impacts during transportation and storage. To address these issues, this invention employs a foldable motherboard structure. This foldable motherboard overcomes the limitations of traditional rigid structures, allowing for more flexible and diverse shapes and sizes of electronic devices, thus achieving thinner, lighter, and more portable designs. It is particularly suitable for the needs of wearable devices and flexible electronics. The foldable motherboard better adapts to complex spatial layouts, improving the utilization rate of internal space and avoiding space waste caused by rigid motherboards. During transportation and storage, the foldable motherboard reduces its volume through folding, lowering the risk of impact damage and thus improving the reliability and lifespan of the device.

[0014] 2. In existing technologies, foldable motherboards often lack effective fixing devices after unfolding, which makes them prone to movement or shaking. This instability directly affects the normal operation of electronic components on the motherboard, leading to problems such as loose connections, signal transmission interruptions, or performance degradation. Especially during device operation, the shaking of the motherboard can cause collisions between internal components, thereby damaging sensitive electronic parts. In addition, this unstable structure also reduces the overall reliability and lifespan of the device. To address these issues, this utility model adopts a magnetic adsorption fixing structure, which can significantly improve the stability and reliability of the device. By introducing a reliable fixing mechanism, such as magnetic adsorption, snap locking, or other mechanical fixing methods, it can effectively prevent the motherboard from moving or shaking after unfolding, thereby ensuring the secure connection of electronic components, avoiding signal transmission interruptions and performance degradation. This improvement can reduce collisions between internal components caused by motherboard shaking, protect sensitive electronic parts from damage, and extend the lifespan of the device.

[0015] 3. In existing technologies, foldable motherboards typically lack dedicated heat dissipation structures, which leads to significant drawbacks. Foldable motherboards generate heat during use, and the lack of effective heat dissipation causes heat accumulation, resulting in elevated motherboard temperatures. Excessive temperatures degrade the performance of electronic components and may even cause component failure or damage, affecting device stability and lifespan. Furthermore, high temperatures can cause deformation of the motherboard's plastic or flexible materials, further impacting its folding function and structural integrity. To address these issues, this invention employs a finned heat dissipation structure, significantly improving its performance and reliability. By introducing effective heat dissipation measures, the heat accumulation generated by the motherboard during operation can be effectively reduced, preventing component performance degradation, failure, or even damage due to high temperatures. This not only improves device operational stability and extends lifespan but also prevents deformation of the motherboard materials caused by high temperatures, ensuring the normal operation of the folding function and structural integrity. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a three-dimensional structural diagram of the back of the foldable motherboard of this utility model;

[0018] Figure 3 This is a cross-sectional view of the folding motherboard clamping mechanism of this utility model;

[0019] Figure 4 This is a cross-sectional view of the magnetic fixing structure of this utility model;

[0020] Figure 5 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 6 for Figure 3 Enlarged view of point B in the middle.

[0022] Legend:

[0023] 1. Folding motherboard unit; 101. Fixed motherboard unit; 102. Hinge; 103. Component slot one; 104. Clamping shaft one; 105. Clamping shaft two; 106. Clamping sliding groove; 107. Clamping slider; 108. Spring; 109. Clamping seat; 2. Component slot two; 201. Component slot three; 202. Adsorption magnet one; 203. Adsorption magnet two; 3. Protective sleeve one; 301. Protective sleeve two; 4. Heat dissipation fin one; 401. Heat dissipation fin two; 5. Curved surface; 6. Heat dissipation through hole. Detailed Implementation

[0024] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0025] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific implementation examples:

[0027] Reference Figure 1-6A foldable motherboard structure includes a foldable motherboard unit 1 and a fixed motherboard unit 101. A hinge 102 is fixed to the bottom of the foldable motherboard unit 1, and the other end of the hinge 102 is fixed to the bottom of the fixed motherboard unit 101. A component groove 103 is provided at the bottom of the fixed motherboard unit 101. A clamping shaft 104 and a clamping shaft 2 105 are provided on the inner wall of the component groove 103. A clamping sliding groove 106 is provided on the inner wall of the component groove 103. The clamping sliding groove 106 is provided at both ends of the clamping shaft 104 and the clamping shaft 2 105. A clamping slider 107 is fixed at both ends of the clamping shaft 104 and the clamping shaft 2 105. The clamping slider 107 slides on the inner wall of the clamping sliding groove 106. A spring 108 is fixed on both sides of the clamping slider 107. The other end of the spring 108 is fixed to the inner wall of the clamping sliding groove 106. A clamping seat 109 is fixed at the bottom of the foldable motherboard unit 1. In existing technologies, traditional motherboards are typically non-foldable, a characteristic that imposes numerous limitations. It restricts the shape and size of electronic devices, making it difficult to achieve thinner, lighter, and more portable designs. This is especially true in wearable devices and flexible electronics, where the rigid structure of traditional motherboards becomes a bottleneck. Non-foldable motherboards also limit space utilization, making it difficult to adapt to complex spatial layouts. Furthermore, the rigidity of the motherboard leads to wasted internal space. In addition, rigid motherboards are more susceptible to damage from impacts during transportation and storage. To address these issues, this invention employs a motherboard folding structure. The folding motherboard unit 1 is connected to the fixed motherboard unit 101 via a hinge 102 at the bottom, achieving the folding function. When the folding motherboard unit 1 is folded, the locking seat 109 at its bottom interacts with the locking shaft 104 and locking shaft 105 in the component slot 103 of the fixed motherboard unit 101. The locking sliders 107 at both ends of the locking shaft slide along the locking sliding groove 106 under the action of the spring 108, thereby locking and fixing the folding motherboard unit 1. The spring 108 provides elastic force to ensure that the locking seat 109 and the locking shaft are tightly engaged and maintain the stability of the folded state. When it needs to be unfolded, an external force is applied to make the locking slider 107 slide and release the folding motherboard unit 1, thereby realizing the folding and unfolding function of the motherboard and meeting the space requirements of the device in different usage scenarios.

[0028] Both the folding motherboard unit 1 and the fixed motherboard unit 101 have a component slot 2 on one side. An adsorption magnet 202 is fixed on the inner wall of the component slot 2. Both the folding motherboard unit 1 and the fixed motherboard unit 101 have a component slot 3 201 on one side. An adsorption magnet 203 is fixed on the inner wall of the component slot 3 201. The magnetic poles of the two adsorption magnets 202 adjacent to each other are opposite magnetic poles. The magnetic poles of the two adsorption magnets 203 adjacent to each other are opposite magnetic poles. In existing technologies, foldable motherboards often lack effective fixing devices after unfolding, which makes them prone to movement or shaking. This instability directly affects the normal operation of electronic components on the motherboard, leading to problems such as loose connections, signal transmission interruptions, or performance degradation. Especially during device operation, the shaking of the motherboard can cause collisions between internal components, thereby damaging sensitive electronic components. In addition, this unstable structure also reduces the overall reliability and service life of the device. To address these issues, this utility model adopts a magnetic adsorption fixing structure. When the foldable motherboard unit 1 is unfolded and aligned with the fixed motherboard unit 101, the adsorption magnet 202 in component slot 2 and the adsorption magnet 203 in component slot 3 approach each other. Since the magnetic poles of the adjacent adsorption magnet 202 and adsorption magnet 203 are opposite magnetic poles, according to the principle of attraction between opposite poles of magnets, they will generate a strong attraction, tightly adsorbing the foldable motherboard unit 1 and the fixed motherboard unit 101 together.

[0029] The top of the folding motherboard unit 1 is fixed with a heat sink 4, and the top of the fixed motherboard unit 101 is fixed with a heat sink 401. The heat sink 4 and the heat sink 401 are arranged symmetrically. Thermal grease is applied to the bottom of both the heat sink 4 and the heat sink 401. The thermal grease is evenly applied to the bottom of the heat sink 4 and the heat sink 401. In existing technologies, foldable motherboards typically lack dedicated heat dissipation structures, which leads to significant drawbacks. Because foldable motherboards generate heat during use, the lack of effective heat dissipation causes heat accumulation, raising the motherboard temperature. Excessive temperatures reduce the performance of electronic components and may even cause component failure or damage, affecting the stability and lifespan of the device. Furthermore, high temperatures can cause deformation of the motherboard's plastic or flexible materials, further impacting its folding function and structural integrity. To address these issues, this invention employs a finned heat dissipation structure. Heat dissipation fins 4 and 401 are fixed to the top of the foldable motherboard unit 1 and the fixed motherboard unit 101, respectively, and arranged symmetrically. By increasing the heat dissipation area, they rapidly conduct the heat generated by the motherboard into the air. Thermal grease applied to the bottom of the heat dissipation fins fills the tiny gaps between the fins and the motherboard, improving heat conduction efficiency. When the motherboard generates heat during operation, the heat is first transferred to the heat dissipation fins through the thermal grease, and then dissipated into the surrounding environment by the large surface area of ​​the fins, effectively reducing the motherboard temperature.

[0030] A protective sleeve 3 is detachably fixed to the surface of the folding motherboard unit 1, and a protective sleeve 301 is detachably fixed to the surface of the fixed motherboard unit 101. The detachable and fixed protective sleeves 3 and 301 effectively enhance the motherboard's protective performance. This design prevents damage to the motherboard from external physical impacts, dust contamination, and liquid corrosion during use, transportation, or storage, thereby extending the motherboard's lifespan. The protective sleeves 3 and 301 are made of silicone. The silicone material provides multifaceted protection for the folding motherboard unit 1 and the fixed motherboard unit 101. The silicone material has good flexibility, maintaining stability during folding and unfolding, and will not be damaged by repeated folding, thus effectively protecting the structural integrity of the motherboard. An arc surface 5 is provided at the engagement point of the locking seat 109. The surface of the arc surface 5 is smooth. The smooth arc surface 5 at the engagement point of the locking seat 109 significantly improves the usability and reliability of the folding motherboard structure. The smooth arc surface design reduces the friction between the locking seat and the locking shaft, making the folding motherboard unit 1 fold and unfold more smoothly and operate more easily. At the same time, reducing friction also reduces wear caused by long-term use, extending the service life of the locking seat and related components. Both the protective sleeve 1 3 and the protective sleeve 2 301 have heat dissipation holes 6 arranged in an array. The array of heat dissipation holes 6 on the surfaces of the protective sleeve 1 3 and the protective sleeve 2 301 effectively improves the heat dissipation performance of the folding motherboard. The design of the heat dissipation holes promotes air circulation, allowing the heat generated by the motherboard during operation to be quickly dissipated to the outside through these holes, preventing heat accumulation and overheating of the motherboard. This heat dissipation optimization not only helps maintain the normal operating temperature of electronic components but also extends their service life.

[0031] The working principle of this utility model is as follows: The folding motherboard unit 1 is connected to the fixed motherboard unit 101 via the hinge 102 at the bottom, realizing the folding function. When the folding motherboard unit 1 is folded, the locking seat 109 at its bottom interacts with the locking shaft 104 and locking shaft 105 in the component slot 103 of the fixed motherboard unit 101. The locking sliders 107 at both ends of the locking shaft slide along the locking sliding groove 106 under the action of the spring 108, thereby realizing the locking and fixing of the folding motherboard unit 1. The spring 108 provides elastic force to ensure that the locking seat 109 and the locking shaft are tightly engaged, maintaining the stability of the folded state. When it needs to be unfolded, an external force is applied to make the locking slider 107 slide, releasing the folding motherboard unit 1, thereby realizing the folding and unfolding function of the motherboard and meeting the space requirements of the device in different usage scenarios. When the folding motherboard unit 1 is unfolded and aligned with the fixed motherboard unit 101, the folding motherboard unit 1 is fully unfolded. At the same time, the first magnet 202 in component slot 2 and the second magnet 203 in component slot 3 approach each other. Since the magnetic poles of the adjacent magnets 202 and 203 are opposite poles, according to the principle of attraction between opposite poles of magnets, they will generate a strong attraction force, which will tightly attract the folding motherboard unit 1 and the fixed motherboard unit 101 together. The first heat sink 4 and the second heat sink 401 are fixed on the top of the folding motherboard unit 1 and the fixed motherboard unit 101 respectively, and are arranged symmetrically. By increasing the heat dissipation area, they can quickly conduct the heat generated by the motherboard to the air. The thermal grease applied to the bottom of the heat sink can fill the tiny gaps between the fins and the motherboard, and improve the heat conduction efficiency. When the motherboard generates heat, the heat is first transferred to the heat sink through the thermal grease, and then dissipated to the surrounding environment by the large surface area of ​​the fins, thereby effectively reducing the motherboard temperature.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A foldable motherboard structure, comprising a foldable motherboard unit (1) and a fixed motherboard unit (101), characterized in that: The bottom of the folding motherboard unit (1) is fixed with a hinge (102), and the other end of the hinge (102) is fixed to the bottom of the fixed motherboard unit (101). The bottom of the fixed motherboard unit (101) is provided with a component groove (103). The inner wall of the component groove (103) is provided with a clamping shaft (104) and a clamping shaft (105). The inner wall of the component groove (103) is provided with a clamping sliding groove (106). The clamping sliding groove (106) is provided on the clamping shaft. At both ends of clamping shaft one (104) and clamping shaft two (105), clamping sliders (107) are fixed at both ends of clamping shaft one (104) and clamping shaft two (105). The clamping sliders (107) slide on the inner wall of clamping sliding groove (106). Springs (108) are fixed on both sides of clamping sliders (107). The other end of the springs (108) is fixed to the inner wall of clamping sliding groove (106). A clamping seat (109) is fixed at the bottom of the folding main board unit (1).

2. The foldable motherboard structure according to claim 1, characterized in that: Both the folding motherboard unit (1) and the fixed motherboard unit (101) have a component slot 2 (2) on one side. An adsorption magnet 1 (202) is fixed on the inner wall of the component slot 2 (2). Both the folding motherboard unit (1) and the fixed motherboard unit (101) have a component slot 3 (201) on one side. An adsorption magnet 2 (203) is fixed on the inner wall of the component slot 3 (201). The magnetic poles of the two adsorption magnets 1 (202) adjacent to each other are opposite magnetic poles. The magnetic poles of the two adsorption magnets 2 (203) adjacent to each other are opposite magnetic poles.

3. The foldable motherboard structure according to claim 1, characterized in that: The top of the folding motherboard unit (1) is fixed with a heat dissipation fin one (4), and the top of the fixed motherboard unit (101) is fixed with a heat dissipation fin two (401). The heat dissipation fin one (4) and the heat dissipation fin two (401) are arranged symmetrically. The bottom of the heat dissipation fin one (4) and the heat dissipation fin two (401) are coated with thermal grease. The thermal grease is evenly applied to the bottom of the heat dissipation fin one (4) and the heat dissipation fin two (401).

4. The foldable motherboard structure according to claim 1, characterized in that: The folding motherboard unit (1) is detachably fixed with a protective sleeve one (3), and the fixed motherboard unit (101) is detachably fixed with a protective sleeve two (301).

5. A foldable motherboard structure according to claim 4, characterized in that: The first protective cover (3) and the second protective cover (301) are made of silicone.

6. The foldable motherboard structure according to claim 1, characterized in that: The locking seat (109) has an arc surface (5) at the locking point, and the surface of the arc surface (5) is smooth.

7. A foldable motherboard structure according to claim 4, characterized in that: Both the first protective sleeve (3) and the second protective sleeve (301) have heat dissipation holes (6) on their surfaces, and the heat dissipation holes (6) are arranged in an array.

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