Heat dissipating device, circuit board assembly, and electronic device

Abstract

This application provides a heat dissipation device, a circuit board assembly, and an electronic device. The heat dissipation device includes: an outer casing having a flow channel comprising an inlet section, a flow section, and an outlet section connected sequentially; the outer casing having a first side surface and a second side surface that are bent and connected, the inlet section passing through the first side surface and the outlet section passing through the second side surface; an impeller disposed within the flow section of the flow channel and rotatably connected to the outer casing; and a power mechanism connected to the impeller for driving the impeller to rotate relative to the outer casing, thereby driving airflow within the flow channel. The heat dissipation device of this application has a small size and can be directly mounted on a circuit board close to the chip, providing better heat dissipation for the chip.

Description

Technical Field

[0001] This application relates to the field of electronics, specifically to a heat dissipation device, a circuit board assembly, and an electronic device. Background Technology

[0002] With the continuous development of electronic products, the integration and performance of chips are constantly improving, leading to a corresponding increase in chip power consumption. High power consumption generates a large amount of heat, and if it cannot be dissipated in a timely and effective manner, it will affect the chip's performance, reliability, and lifespan. In related technologies, the air-cooling devices for chips in electronic products typically use heat sinks to absorb the heat from the chip, and the airflow generated by a fan carries away the heat after passing over the heat sink, thus cooling the chip. However, this method has low heat dissipation efficiency and occupies a large space. Utility Model Content

[0003] This application provides a heat dissipation device with a small size, which can be directly mounted on a circuit board close to the chip, and has a better heat dissipation effect on the chip.

[0004] A first aspect of this application provides a heat dissipation device, the heat dissipation device comprising:

[0005] The outer cover has a flow channel, which includes an air inlet section, a flow section and an air outlet section connected in sequence. The outer cover has a first side and a second side that are bent and connected. The air inlet section passes through the first side and the air outlet section passes through the second side.

[0006] An impeller, the impeller being disposed within the flow section of the flow channel and rotatably connected to the outer casing; and

[0007] A power mechanism connected to the impeller is used to drive the impeller to rotate relative to the outer casing, thereby driving airflow within the flow channel.

[0008] Furthermore, the impeller includes a rotating shaft and a plurality of blades; the plurality of blades are arranged at intervals around the rotating shaft, and the thickness of the end of each blade near the rotating shaft is less than the thickness of the end of the blade away from the rotating shaft.

[0009] Furthermore, the air inlet of the air inlet section and the air outlet of the air outlet section are arranged counterclockwise around the rotating shaft, and the plurality of blades are arc-shaped structures, arranged counterclockwise and the arc-shaped openings of the plurality of blades all face counterclockwise.

[0010] or,

[0011] The air inlet of the air inlet section and the air outlet of the air outlet section are arranged at intervals in a clockwise direction around the rotating shaft. The multiple blades are arc-shaped and are arranged in a clockwise direction, with the arc-shaped openings of the multiple blades all facing clockwise.

[0012] Furthermore, the thickness of the blade gradually increases from the end near the rotating shaft to the end away from the rotating shaft, the radius of curvature of the end of the blade near the rotating shaft is 0.03 mm, and the radius of curvature of the end of the blade away from the rotating shaft is 0.18 mm.

[0013] Alternatively, the blades may have an arc-shaped structure and be of uniform thickness.

[0014] Furthermore, the radial dimension of the air outlet section gradually decreases from the end closer to the flow section to the end farther away from the flow section;

[0015] Alternatively, the radial dimensions of the air outlet sections are equal.

[0016] Furthermore, the outer cover includes a cover body, a first mounting part, and a second mounting part; the cover body has the flow channel, a first side surface, and a second side surface; the first mounting part and the second mounting part are spaced apart on the first side surface of the cover body, and the first mounting part and the second mounting part are respectively located at opposite ends of the air inlet section;

[0017] and / or;

[0018] The first mounting part and the second mounting part have different shapes. The shape of the first mounting part can be at least one of the following: cylindrical, cuboid, prism, frustum, and truncated pyramid. The shape of the second mounting part can be at least one of the following: cylindrical, cuboid, prism, frustum, and truncated pyramid.

[0019] Furthermore, at least part of the surface of the cover portion facing away from the first mounting portion and the second mounting portion is planar.

[0020] Furthermore, the cover portion includes a first through hole and a second through hole disposed opposite to each other;

[0021] The impeller includes a first connecting portion, a second connecting portion, a rotating shaft, and a plurality of blades; the first connecting portion and the second connecting portion are spaced apart, and the plurality of blades are disposed between the first connecting portion and the second connecting portion and spaced around the outer periphery of the rotating shaft, with each blade's opposite ends connected to the first connecting portion and the second connecting portion respectively; the rotating shaft includes a first rotating shaft portion and a second rotating shaft portion, the first rotating shaft portion being disposed on the side of the first connecting portion opposite to the second connecting portion and rotatably passing through a first through hole, and the second rotating shaft portion being located on the side of the second connecting portion facing the first connecting portion; the impeller has a third through hole penetrating the second connecting portion and at least a portion of the second rotating shaft portion;

[0022] The power mechanism includes a connected power unit and a power output shaft. The power unit is used to drive the power output shaft to rotate relative to the power unit. The power unit is located on the side of the cover part near the second connecting part and connected to the cover part. The power output shaft passes through the second through hole and the third through hole in sequence to drive the impeller to rotate.

[0023] Furthermore, the outer cover also includes a support portion, which is disposed on one side of the cover body and is disposed away from the first mounting portion. The support portion is used to support the power mechanism.

[0024] And / or,

[0025] The power mechanism also includes a limiting part, which is disposed on the surface of the power mechanism facing the power output shaft and surrounds the power output shaft. The limiting part passes through the third through hole and cooperates with the third through hole to limit the relative position of the power mechanism and the outer cover.

[0026] Secondly, embodiments of this application provide a circuit board assembly, which includes:

[0027] Circuit board, the circuit board having ventilation holes;

[0028] A chip, which is mounted on the circuit board and is positioned close to the ventilation hole;

[0029] A controller, which is mounted on the circuit board and electrically connected to the chip; and

[0030] The heat dissipation device described in the first aspect of this application is disposed on the same side of the circuit board as the chip. The air inlet of the air inlet section of the heat dissipation device is disposed corresponding to the ventilation hole, and the air outlet of the air outlet section faces the chip. The power mechanism of the heat dissipation device is electrically connected to the controller and is used to operate under the control of the controller.

[0031] Thirdly, embodiments of this application provide an electronic device, which includes the circuit board assembly described in the second aspect of this application.

[0032] The heat dissipation device of this application embodiment includes an outer cover, an impeller, and a power mechanism. The outer cover has a flow channel, which includes an air inlet section, a flow section, and an air outlet section connected in sequence. The outer cover has a first side and a second side that are bent and connected. The air inlet section passes through the first side, and the air outlet section passes through the second side. The impeller is disposed in the flow section of the flow channel and is rotatably connected to the outer cover. The power mechanism is connected to the impeller and is used to drive the impeller to rotate relative to the outer cover, thereby driving airflow within the flow channel. When the heat dissipation device of this application is installed on a circuit board, the air outlet of the air outlet section blows air onto the chip on the circuit board, thereby improving the heat dissipation efficiency of the heat dissipation device on the chip, resulting in higher reliability and longer service life for the chip. In addition, the heat dissipation device of this application can be directly installed on the circuit board, so that when the circuit board assembly is used in electronic devices, it does not occupy additional volume outside the circuit board of the electronic device, thus better reducing the size of the electronic device. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the heat dissipation device according to an embodiment of this application.

[0035] Figure 2 This is an exploded structural diagram of a heat dissipation device according to an embodiment of this application.

[0036] Figure 3 This is another perspective structural schematic diagram of a heat dissipation device according to an embodiment of this application.

[0037] Figure 4 This is an exploded structural diagram of a heat dissipation device according to another embodiment of this application.

[0038] Figure 5 This is a side view of a heat dissipation device according to an embodiment of this application.

[0039] Figure 6 This is a heat dissipation device according to an embodiment of the present application. Figure 5 A schematic diagram of the cross-sectional structure along the AA direction.

[0040] Figure 7 This is a schematic structural diagram of an impeller according to an embodiment of this application.

[0041] Figure 8 This is another embodiment of the heat dissipation device along Figure 5 A schematic diagram of the cross-sectional structure along the AA direction.

[0042] Figure 9 This is another embodiment of the heat dissipation device along Figure 5 A schematic diagram of the cross-sectional structure along the AA direction.

[0043] Figure 10 This is a schematic diagram of the heat dissipation device according to another embodiment of this application.

[0044] Figure 11 This application Figure 10 An exploded view of the heat dissipation device in the embodiment.

[0045] Figure 12 This is a schematic diagram of the structure of the outer cover according to an embodiment of this application.

[0046] Figure 13 This is a structural schematic diagram of an impeller from another perspective of one embodiment of this application.

[0047] Figure 14 This is a schematic diagram of the structure of a circuit board assembly according to an embodiment of this application.

[0048] Figure 15 This application Figure 14 A partial exploded view of the circuit board assembly in the embodiment.

[0049] Figure 16 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0050] Explanation of reference numerals in the attached figures:

[0051] 100-Heat dissipation device, 10-Outer cover, 11-Flow channel, 111-Air inlet section, 112-Flow section, 113-Air outlet section, 12-First side, 13-Second side, 14-Cover body, 141-First through hole, 142-Second through hole, 15-First mounting part, 16-Second mounting part, 17-Bearing part, 30-Impeller, 31-Shaft, 311-First shaft part, 311a-Through hole, 312-Second shaft part, 32-Blade, 33-First connecting part, 34-Second connecting part, 35-Third through hole, 50-Power mechanism, 51-Power part, 52-Power output shaft, 53-Limiting part, 200-Circuit board assembly, 210-Circuit board, 211-Ventilation hole, 212-First mounting hole, 213-Second mounting hole, 220-Chip, 230-Controller, 300-Electronic device. Detailed Implementation

[0052] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0053] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0054] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0055] It should be noted that, for ease of explanation, the same reference numerals denote the same components in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0056] With the continuous development of electronic products, the integration and performance of chips are constantly improving, leading to a corresponding increase in chip power consumption. High power consumption generates a large amount of heat, and if it cannot be dissipated in a timely and effective manner, it will affect the chip's performance, reliability, and lifespan. In related technologies, the air-cooling devices for chips in electronic products typically use heat sinks to absorb the heat from the chip, and the airflow generated by a fan carries away the heat after passing over the heat sink, thus cooling the chip. However, this method has low heat dissipation efficiency and occupies a large space. In view of this, this application provides a heat dissipation device.

[0057] Figure 1 This is a schematic diagram of the heat dissipation device 100 according to an embodiment of this application. Figure 2 This is an exploded structural diagram of a heat dissipation device 100 according to an embodiment of this application. Figure 3 This is another perspective structural schematic diagram of a heat dissipation device 100 according to an embodiment of this application. Figure 4 This is an exploded structural diagram of a heat dissipation device 100 according to another embodiment of this application. Figure 5 This is a side view of a heat dissipation device 100 according to an embodiment of this application. Figure 6 A heat dissipation device 100 according to an embodiment of this application is along Figure 5 A schematic diagram of the cross-sectional structure along the AA direction.

[0058] Please see Figures 1 to 6 This application provides a heat dissipation device 100, which includes an outer cover 10, an impeller 30, and a power mechanism 50. The outer cover 10 has a flow channel 11, which includes an air inlet section 111, a flow section 112, and an air outlet section 113 connected in sequence. The outer cover 10 has a first side surface 12 and a second side surface 13 that are bent and connected. The air inlet section 111 passes through the first side surface 12, and the air outlet section 113 passes through the second side surface 13. The impeller 30 is disposed in the flow section 112 of the flow channel 11 and is rotatably connected to the outer cover 10. The power mechanism 50 is connected to the impeller 30 and is used to drive the impeller 30 to rotate relative to the outer cover 10, so as to drive the airflow to flow in the flow channel 11.

[0059] The heat dissipation device 100 of this application embodiment can be applied to a circuit board assembly of an electronic device and can be directly mounted on the circuit board of the circuit board assembly to dissipate heat from the chips on the circuit board. When the heat dissipation device 100 is mounted on the circuit board, the air outlet of the air outlet section 113 is oriented towards the chip. When the heat dissipation device 100 is mounted on the circuit board, the power mechanism 50 of the heat dissipation device 100 can be electrically connected to the power supply circuit of the circuit board, and the power supply circuit of the circuit board directly supplies power to the power mechanism 50.

[0060] Optionally, the chip can be, but is not limited to, a memory chip, a system-on-a-chip, a processor, or other chip that generates a large amount of heat.

[0061] Understandably, the outer cover 10 is wrapped around the outer periphery of the impeller 30. It is also understood that the outer cover 10 has a hollow structure.

[0062] It should be noted that when the power mechanism 50 is started, it drives the impeller 30 to rotate. The rotation of the impeller 30 drives the airflow from the air inlet section 111 into the flow section 112 and out through the air outlet section 113. When the heat dissipation device 100 is installed on the circuit board, the airflow from the air outlet section 113 flows towards the chip and blows directly onto the chip, thereby better dissipating heat from the chip and improving heat dissipation efficiency.

[0063] The heat dissipation device 100 of this application embodiment includes an outer cover 10, an impeller 30, and a power mechanism 50. The outer cover 10 has a flow channel 11, which includes an air inlet section 111, a flow section 112, and an air outlet section 113 connected in sequence. The outer cover 10 has a first side surface 12 and a second side surface 13 that are bent and connected. The air inlet section 111 passes through the first side surface 12, and the air outlet section 113 passes through the second side surface 13. The impeller 30 is disposed in the flow section 112 of the flow channel 11 and is rotatably connected to the outer cover 10. The power mechanism 50 is connected to the impeller 30 and is used to drive the impeller 30 to rotate relative to the outer cover 10, so as to drive the airflow to flow in the flow channel 11. When the heat dissipation device 100 of this application is installed on the circuit board, the air outlet of the air outlet section 113 blows air towards the chip on the circuit board, thereby improving the heat dissipation efficiency of the heat dissipation device 100 on the chip, thus making the chip have higher reliability and service life. In addition, the heat dissipation device 100 of this application can be directly installed on the circuit board, so that when the circuit board assembly is used in electronic devices, it does not occupy the extra volume outside the circuit board in the electronic device, and can better reduce the size of the electronic device.

[0064] Figure 7 This is a schematic diagram of the impeller 30 according to an embodiment of this application from one perspective.

[0065] Please see Figure 7 In some embodiments, the impeller 30 includes a shaft 31 and a plurality of blades 32; the plurality of blades 32 are spaced apart around the shaft 31, and the thickness of the end of each blade 32 near the shaft 31 is less than the thickness of the end of the blade 32 away from the shaft 31.

[0066] "Multiple" means two or more. Specifically, the number of blades 32 of the impeller 30 can be two, three, four, five, six, seven, eight, etc. In the schematic diagram of the accompanying drawings of this application, the number of blades 32 is illustrated by example as six, and should not be construed as a limitation on the impeller 30 and the heat dissipation device 100 of the embodiments of this application.

[0067] Optionally, the rotating shaft 31 and the plurality of blades 32 can be an integral structure, and the rotating shaft 31 and the plurality of blades 32 can be formed in the same process. In other embodiments, the rotating shaft 31 and the plurality of blades 32 can also be formed separately and then assembled into one.

[0068] Optionally, multiple blades 32 are evenly arranged to form a circular structure. Understandably, the ends of multiple blades 32 near the shaft 31 are on the same circle, and the ends of multiple blades 32 away from the shaft 31 are on the same circle.

[0069] It should be noted that when the impeller 30 rotates, the impeller 30 rotates around the shaft 31 as the central axis, and multiple blades 32 rotate around the shaft 31.

[0070] Optionally, the extension direction of the blade 32 is parallel to the extension direction of the first side surface 12 and parallel to the extension direction of the second side surface 13.

[0071] In this embodiment, the thickness of each blade 32 at the end near the rotating shaft 31 is less than the thickness of the end of the blade 32 away from the rotating shaft 31. This results in the blade 32 having a lower Reynolds number, which can better reduce the rotational resistance of the impeller 30 and increase the airflow of the heat dissipation device 100 when the power mechanism 50 drives the impeller 30 to rotate.

[0072] Figure 8 This is another embodiment of the heat dissipation device 100 along the edge of the present application. Figure 5 A schematic diagram of the cross-sectional structure along the AA direction.

[0073] Please see Figure 8 In some embodiments, the air inlet of the air inlet section 111 and the air outlet of the air outlet section 113 are arranged counterclockwise around the rotating shaft 31 (as shown by arrow M in the figure). The plurality of blades 32 are arc-shaped structures, and the plurality of blades 32 are arranged counterclockwise with the arc-shaped openings of the plurality of blades 32 all facing counterclockwise.

[0074] Understandably, each blade 32 bends in a counterclockwise direction, thus giving the blade 32 an arc-shaped structure.

[0075] In this embodiment, the air inlet of the air inlet section 111 and the air outlet of the air outlet section 113 are arranged counterclockwise around the rotating shaft 31 at intervals. The plurality of blades 32 have an arc-shaped structure, are arranged counterclockwise, and the arc-shaped openings of the plurality of blades 32 all face counterclockwise. In this way, when the power mechanism 50 drives the impeller 30 to rotate counterclockwise, a larger airflow can be driven to enter from the air inlet section 111 and flow out from the air outlet section 113, increasing the air volume of the heat dissipation device 100, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0076] Please see again Figure 6 In other embodiments, the air inlet of the air inlet section 111 and the air outlet of the air outlet section 113 are arranged at intervals around the rotating shaft 31 in a clockwise direction (as shown by arrow N in the figure). The plurality of blades 32 are arc-shaped structures, and the plurality of blades 32 are arranged in a clockwise direction with the arc-shaped openings of the plurality of blades 32 all facing the clockwise direction.

[0077] Understandably, each blade 32 bends in a clockwise direction, thus giving the blade 32 an arc-shaped structure.

[0078] In this embodiment, the air inlet of the air inlet section 111 and the air outlet of the air outlet section 113 are arranged at intervals clockwise around the rotating shaft 31 (as shown by arrow N in the figure). The plurality of blades 32 have an arc-shaped structure, and the plurality of blades 32 are arranged in a clockwise direction with their arc-shaped openings all facing clockwise. In this way, when the power mechanism 50 drives the impeller 30 to rotate clockwise, a larger airflow can be driven to enter from the air inlet section 111 and flow out from the air outlet section 113, increasing the air volume of the heat dissipation device 100 and thus improving the heat dissipation efficiency of the heat dissipation device 100.

[0079] Optionally, the shape of the air outlet of the air outlet section 113 can be a regular or irregular shape such as a rectangle or a circle. The number of air outlets can be one or more, and multiple air outlets are arranged at intervals.

[0080] Please see again Figure 6 and Figure 8 In some embodiments, the thickness of the blade 32 gradually increases from the end near the rotating shaft 31 to the end away from the rotating shaft 31, the radius of curvature of the end of the blade 32 near the rotating shaft 31 is 0.03 mm, and the radius of curvature of the end of the blade 32 away from the rotating shaft 31 is 0.18 mm.

[0081] In this embodiment, the thickness of the blade 32 gradually increases from the end near the rotating shaft 31 to the end away from the rotating shaft 31, thereby giving the blade 32 a lower Reynolds number. When the power mechanism 50 drives the impeller 30 to rotate, it can better reduce the resistance of the impeller 30 rotation, increase the air volume of the heat dissipation device 100, and improve the heat dissipation efficiency of the heat dissipation device 100.

[0082] Figure 9 The heat dissipation device 100 is another embodiment of this application. Figure 5 A schematic diagram of the cross-sectional structure along the AA direction.

[0083] Please see Figure 9 In other embodiments, the blades 32 have an arc-shaped structure and a uniform thickness. In this embodiment, the uniform thickness of the blades 32 facilitates the forming and fabrication of the impeller 30 during integral molding, thereby reducing the production cost of the impeller 30.

[0084] Please see again Figure 6 and Figure 8 In some embodiments, the radial dimension of the air outlet section 113 gradually decreases from the end closer to the flow section 112 to the end farther away from the flow section 112.

[0085] Understandably, the radial dimension of the air outlet of the air outlet section 113 is smaller than the radial dimension of the side of the air outlet section 113 closest to the flow section 112.

[0086] In this embodiment, the radial dimension of the air outlet section 113 gradually decreases from the end near the flow section 112 to the end away from the flow section 112, thereby forming a Venturi effect air outlet section 113. After the fluid flows through the flow section 112 and flows out of the air outlet section 113, the diameter gradually decreases. Therefore, the reduced air outlet can increase the flow velocity and pressure of the fluid when it flows through the air outlet section 113, thereby increasing the flow velocity of the fluid and improving the heat dissipation effect of the heat dissipation device 100.

[0087] Please see again Figure 9 In other embodiments, the radial dimensions of the air outlet section 113 are equal. The equal radial dimensions of the air outlet section 113 facilitate demolding of the outer cover 10 during its molding process, thereby simplifying the manufacturing process of the outer cover 10 and reducing its manufacturing cost.

[0088] Figure 10 This is a schematic diagram of the heat dissipation device 100 according to another embodiment of this application. Figure 11 This application Figure 10 An exploded view of the heat dissipation device 100 in the embodiment. Figure 12 This is a schematic diagram of the structure of the outer cover 10 according to an embodiment of this application.

[0089] Please see Figures 10 to 12 In some embodiments, the outer cover 10 includes a cover portion 14, a first mounting portion 15, and a second mounting portion 16; the cover portion 14 has the flow channel 11, a first side surface 12, and a second side surface 13; the first mounting portion 15 and the second mounting portion 16 are spaced apart on the first side surface 12 of the cover portion 14, and the first mounting portion 15 and the second mounting portion 16 are respectively located at opposite ends of the air inlet section 111.

[0090] In some embodiments, the outer cover 10 is a metal outer cover 10. Understandably, the outer cover 10 is made of metal material, which can improve the thermal conductivity of the outer cover 10, thereby better improving the heat dissipation efficiency of the heat dissipation device 100.

[0091] Optionally, the cover portion 14, the first mounting portion 15, and the second mounting portion 16 are an integral structure, and the cover portion 14, the first mounting portion 15, and the second mounting portion 16 are different parts of the same component. The cover portion 14, the first mounting portion 15, and the second mounting portion 16 can be integrally formed in the same process, such as casting.

[0092] Understandably, when the heat dissipation device 100 is mounted on the circuit board, the first side 12 faces the circuit board. It is also understood that the opening of the air inlet section 111 faces the circuit board.

[0093] When the heat dissipation device 100 is applied to the circuit board assembly, the first mounting part 15 and the second mounting part 16 are inserted through the mounting holes of the circuit board. The relative position of the heat dissipation device 100 and the circuit board is limited by the cooperation of the first mounting part 15 and the second mounting part 16. In addition, the first mounting part 15 and the second mounting part 16 can also be fixed to (e.g., soldered) the circuit board, thereby realizing the installation and fixation of the heat dissipation device 100 and the circuit board.

[0094] In some embodiments, the first mounting portion 15 and the second mounting portion 16 have different shapes. The shape of the first mounting portion 15 can be at least one of cylindrical, cuboid, prism, frustum, and truncated pyramid. The shape of the second mounting portion 16 can be at least one of cylindrical, cuboid, prism, frustum, and truncated pyramid.

[0095] In other embodiments, the first mounting portion 15 and the second mounting portion 16 may also be other regular or irregular shapes.

[0096] For example, the first mounting part 15 is cylindrical and the second mounting part 16 is cuboid.

[0097] In this embodiment, the first mounting portion 15 and the second mounting portion 16 have different shapes. This design helps to prevent mistakes when the heat sink 100 is mounted on the circuit board, reducing the probability of rework due to incorrect installation and improving the installation efficiency of the heat sink 100. The different shapes of the first mounting portion 15 and the second mounting portion 16 can improve the adaptability of the heat sink 100.

[0098] In some embodiments, the surface of the cover portion 14 facing away from the first mounting portion 15 and the second mounting portion 16 is at least partially planar.

[0099] Understandably, the surface of the cover portion 14 facing away from the first side surface 12 is at least partially planar.

[0100] Understandably, the surface of the cover portion 14 that is away from the first mounting portion 15 and the second mounting portion 16 can be entirely flat or partially flat.

[0101] To improve the installation efficiency of the heat dissipation device 100, automated equipment can be used to assemble the heat dissipation device 100 onto the circuit board. In this embodiment, at least part of the surface of the cover portion 14 facing away from the first mounting portion 15 and the second mounting portion 16 is planar. When the heat dissipation device 100 is mounted on the circuit board, this allows for better coordination with the suction nozzle of the automated equipment, facilitating the formation of negative pressure by the suction nozzle and improving the adsorption of the heat dissipation device 100, thereby increasing the assembly efficiency of the heat dissipation device 100 and the circuit board.

[0102] Figure 13 This is a structural schematic diagram of the impeller 30 from another perspective of one embodiment of this application.

[0103] Please see also Figure 7 , Figures 11 to 13 In some embodiments, the cover portion 14 includes a first through hole 141 and a second through hole 142 disposed opposite to each other;

[0104] The impeller 30 includes a first connecting portion 33, a second connecting portion 34, a rotating shaft 31, and a plurality of blades 32. The first connecting portion 33 and the second connecting portion 34 are spaced apart. The plurality of blades 32 are disposed between the first connecting portion 33 and the second connecting portion 34 and spaced around the outer periphery of the rotating shaft 31. The opposite ends of each blade 32 are respectively connected to the first connecting portion 33 and the second connecting portion 34. The rotating shaft 31 includes a first rotating shaft portion 311 and a second rotating shaft portion 312. The first rotating shaft portion 311 is disposed on the side of the first connecting portion 33 away from the second connecting portion 34 and is rotatably inserted through the first through hole 141. The second rotating shaft portion 312 is located on the side of the second connecting portion 34 facing the first connecting portion 33. The impeller 30 has a third through hole 35 that penetrates the second connecting portion 34 and at least part of the second rotating shaft portion 312.

[0105] The power mechanism 50 includes a connected power unit 51 and a power output shaft 52. The power unit 51 is used to drive the power output shaft 52 to rotate relative to the power unit 51. The power unit 51 is located on the side of the cover part 14 near the second connecting part 34 and connected to the cover part 14. The power output shaft 52 passes through the second through hole 142 and the third through hole 35 in sequence to drive the impeller 30 to rotate.

[0106] Optionally, the first through hole 141 is disposed near the first mounting portion 15, and the second through hole 142 is disposed near the second mounting portion 16. Alternatively, the first through hole 141 is disposed near the second mounting portion 16, and the second through hole 142 is disposed near the first mounting portion 15.

[0107] Optionally, the first connecting part 33, the second connecting part 34, the rotating shaft 31 and the multiple blades 32 are an integral structure, and the first connecting part 33, the second connecting part 34, the rotating shaft 31 and the multiple blades 32 are different parts of the same component.

[0108] Understandably, multiple blades 32 are spaced apart around the outer periphery of the first rotating shaft portion 311, and multiple blades 32 are spaced apart around the outer periphery of multiple second rotating shaft portions 312. Understandably, the first rotating shaft portion 311, the first connecting portion 33, the multiple blades 32, and the second connecting portion 34 are arranged sequentially along the extending direction of the blades 32 (i.e., the extending direction of the impeller 30).

[0109] Optionally, the power unit 51 is an electric motor.

[0110] Optionally, the first through hole 141 can be a blind hole or a through hole, the second through hole 142 is a through hole, and the third through hole 35 can be a blind hole or a through hole.

[0111] In this embodiment, the impeller 30, the outer casing 10, and the power output shaft 52 of the power mechanism 50 are coordinated to assemble the impeller 30, the outer casing 10, and the power mechanism 50 together, resulting in a simple structure that is easy to assemble. The compact arrangement of the various parts makes the heat dissipation device 100 smaller and more miniaturized.

[0112] Please see again Figure 7 The first rotating shaft portion 311 has a through hole 311a, which penetrates the surface of the first rotating shaft portion 311 away from the second rotating shaft portion 312 and the surface of the first rotating shaft portion 311 facing the second rotating shaft portion 312.

[0113] In this embodiment, by providing a through hole 311a on the first rotating shaft 311, it is beneficial to prepare the impeller 30, so that the impeller 30 can be integrally formed by injection molding, which can better reduce the preparation difficulty of the impeller 30 and reduce the preparation cost of the impeller 30.

[0114] Please see again Figure 11 In some embodiments, the outer cover 10 further includes a support portion 17, which is disposed on one side of the cover portion 14 and is disposed away from the first mounting portion 15. The support portion 17 is used to support the power mechanism 50.

[0115] In this embodiment, by providing a support part 17 to support the power mechanism 50, the installation of the power mechanism 50 can be made more stable, the impeller 30 can be driven to rotate better, and the air volume of the heat dissipation device 100 can be increased.

[0116] Please see again Figure 11 In some embodiments, the power mechanism 50 further includes a limiting part 53, which is disposed on the surface of the power unit 51 facing the power output shaft 52 and surrounding the power output shaft 52. The limiting part 53 passes through the third through hole 35 and cooperates with the third through hole 35 to limit the relative position of the power mechanism 50 and the outer cover 10.

[0117] Understandably, the power output shaft 52 protrudes toward the limiting part 53 in a direction away from the power part 51. When assembling the heat dissipation device 100, first insert the first rotating shaft part 311 of the impeller 30 into the first through hole 141, then insert the power output shaft 52 of the power mechanism 50 into the third through hole 35 and the second through hole 142, until the limiting part 53 passes through the third through hole 35, so that the impeller 30 can be rotatably mounted on the outer cover 10; finally, fix the power part 51 to the outer cover 10 to complete the assembly of the heat dissipation device 100.

[0118] Optionally, the limiting part 53 abuts against the inner wall of the third through hole 35.

[0119] In this embodiment, by providing a limiting part 53 on the power mechanism 50, the limiting part 53 and the third through hole 35 cooperate to position the power mechanism 50, which is beneficial to the installation of the power mechanism 50.

[0120] Figure 14 This is a schematic diagram of the structure of a circuit board assembly 200 according to an embodiment of this application. Figure 15 This application Figure 14 A partial exploded view of the circuit board assembly 200 in the embodiment.

[0121] Please see Figure 14 and Figure 15 This application embodiment also provides a circuit board assembly 200, which includes a circuit board 210, a chip 220, a controller 230, and a heat dissipation device 100 as described in this application embodiment; the circuit board 210 has ventilation holes 211; the chip 220 is supported on the circuit board 210 and is disposed close to the ventilation holes 211; the controller 230 is supported on the circuit board 210 and electrically connected to the chip 220; the heat dissipation device 100 and the chip 220 are disposed on the same side of the circuit board 210, the air inlet of the air inlet section 111 of the heat dissipation device 100 is disposed corresponding to the ventilation holes 211, the air outlet of the air outlet section 113 faces the chip 220, and the power mechanism 50 of the heat dissipation device 100 is electrically connected to the controller 230 for working under the control of the controller 230.

[0122] Optionally, the chip 220 can be, but is not limited to, a memory chip, a system-on-a-chip, a processor, or other chip that generates a large amount of heat.

[0123] It should be noted that the ventilation hole 211 penetrates the circuit board 210. The ventilation hole 211 is located in the non-functional area of ​​the circuit board 210, that is, the area without wiring; in other words, the ventilation hole 211 is located away from the wiring area of ​​the circuit board 210.

[0124] Understandably, the air inlet of the air inlet section 111 is connected to the ventilation hole 211.

[0125] When the power mechanism 50 of the heat dissipation device 100 is started, the power output shaft 52 rotates, driving the impeller 30 to rotate, thereby driving the airflow (such as air) from the side of the circuit board 210 away from the heat dissipation device 100 through the ventilation hole 211, into the air inlet section 111, through the flow section 112, through the air outlet section 113 and out, and blown towards the chip 220 to achieve heat dissipation of the chip 220.

[0126] Optionally, the length of the air outlet section 113 along the extension direction of the blade 32 (i.e., perpendicular to the air outlet direction) is greater than or equal to the length of the chip 220. This can better improve the heat dissipation efficiency of the heat dissipation device 100 for the chip 220.

[0127] For a detailed description of other aspects of the heat dissipation device 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0128] Optionally, the circuit board 210 further has a first mounting hole 212 and a second mounting hole 213. The first mounting hole 212 and the second mounting hole 213 are respectively disposed at opposite ends of the ventilation hole 211. The first mounting hole 212 is used to pass through the first mounting portion 15 of the heat dissipation device 100, and the second mounting hole 213 is used to pass through the second mounting portion 16 of the heat dissipation device 100.

[0129] Optionally, the controller 230 may include, but is not limited to, one or more general-purpose processors. These general-purpose processors can be any type of device capable of processing electronic instructions, including central processing units (CPUs), microprocessors, microcontrollers, main processors, controllers, and ASICs, etc. The processor executes various types of digital storage instructions, such as software or firmware programs stored in memory, enabling the computing device to provide a wide range of services.

[0130] The circuit board assembly 200 of this application embodiment includes a circuit board 210, a chip 220, a controller 230, and a heat dissipation device 100 as described in this application embodiment. The air outlet of the air outlet section 113 of the heat dissipation device 100 is directly facing the chip 220, so that the airflow from the heat dissipation device 100 directly dissipates heat from the chip 220, which can better improve heat dissipation efficiency and dissipate the heat generated by the chip 220 in a timely manner, avoiding the chip 220 from overheating and affecting its performance and lifespan. In addition, the heat dissipation device 100 is directly mounted on the circuit board 210, which makes the structure more compact and does not occupy extra space. This can greatly reduce the size of the circuit board assembly 200 and the volume of the electronic device 300 using the circuit board assembly 200, making the electronic device 300 more miniaturized.

[0131] Figure 16 This is a schematic diagram of the structure of an electronic device 300 according to an embodiment of this application.

[0132] Please see Figure 16 This application also provides an electronic device 300, which includes the circuit board assembly 200 described in this application embodiment.

[0133] Optionally, the electronic device 300 may be, but is not limited to, a portable electronic device 300 such as a mobile phone, computer, tablet computer, or laptop computer. Optionally, the electronic device 300 may be, but is not limited to, a transportation device such as a car, sedan, truck, van, or electric vehicle.

[0134] The electronic device 300 of this application embodiment includes a circuit board assembly 200, which includes a heat dissipation device 100. The heat dissipation device 100 includes an outer cover 10, an impeller 30, and a power mechanism 50. The outer cover 10 has a flow channel 11, which includes an air inlet section 111, a flow section 112, and an air outlet section 113 connected in sequence. The outer cover 10 has a first side surface 12 and a second side surface 13 that are bent and connected. The air inlet section 111 passes through the first side surface 12, and the air outlet section 113 passes through the second side surface 13. The impeller 30 is disposed in the flow section 112 of the flow channel 11 and is rotatably connected to the outer cover 10. The power mechanism 50 is connected to the impeller 30 and is used to drive the impeller 30 to rotate relative to the outer cover 10, so as to drive the airflow to flow in the flow channel 11. When the heat dissipation device 100 of this application is installed on the circuit board 210, the air outlet of the air outlet section 113 blows air onto the chip 220 on the circuit board 210, thereby improving the heat dissipation efficiency of the heat dissipation device 100 on the chip 220, thus making the chip 220 have higher reliability and service life. In addition, the heat dissipation device 100 of this application can be directly installed on the circuit board 210, so that when the circuit board assembly 200 is used in the electronic device 300, it does not occupy the extra volume outside the circuit board 210 in the electronic device 300, and can better reduce the size of the electronic device 300.

[0135] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form yet another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A heat dissipation device (100), characterized in that, The heat dissipation device (100) includes: The outer cover (10) has a flow channel (11), which includes an air inlet section (111), a flow section (112) and an air outlet section (113) connected in sequence. The outer cover (10) has a first side (12) and a second side (13) that are bent and connected. The air inlet section (111) passes through the first side (12), and the air outlet section (113) passes through the second side (13). Impeller (30), said impeller (30) being disposed within the flow section (112) of said flow channel (11) and rotatably connected to said outer casing (10); and A power mechanism (50) is connected to the impeller (30) and is used to drive the impeller (30) to rotate relative to the outer casing (10) so as to drive the airflow to flow in the flow channel (11).

2. The heat dissipation device (100) according to claim 1, characterized in that, The impeller (30) includes a rotating shaft (31) and a plurality of blades (32); the plurality of blades (32) are arranged at intervals around the rotating shaft (31), and the thickness of the end of each blade (32) near the rotating shaft (31) is less than the thickness of the end of the blade (32) away from the rotating shaft (31).

3. The heat dissipation device (100) according to claim 2, characterized in that, The air inlet of the air inlet section (111) and the air outlet of the air outlet section (113) are arranged counterclockwise around the rotating shaft (31). The plurality of blades (32) are arc-shaped structures, and the plurality of blades (32) are arranged counterclockwise with the arc-shaped openings of the plurality of blades (32) all facing counterclockwise. or, The air inlet of the air inlet section (111) and the air outlet of the air outlet section (113) are arranged clockwise around the rotating shaft (31). The plurality of blades (32) are arc-shaped structures, and the plurality of blades (32) are arranged clockwise with the arc-shaped openings of the plurality of blades (32) all facing clockwise.

4. The heat dissipation device (100) according to claim 2, characterized in that, The thickness of the blade (32) gradually increases from the end near the rotating shaft (31) to the end away from the rotating shaft (31). The radius of curvature of the end of the blade (32) near the rotating shaft (31) is 0.03 mm, and the radius of curvature of the end of the blade (32) away from the rotating shaft (31) is 0.18 mm. Alternatively, the blade (32) may have an arc-shaped structure and the blade (32) may have a uniform thickness.

5. The heat dissipation device (100) according to claim 1, characterized in that, The radial dimension of the air outlet section (113) gradually decreases from the end closer to the flow section (112) to the end farther away from the flow section (112); Alternatively, the radial dimensions of the air outlet section (113) are equal.

6. The heat dissipation device (100) according to claim 1, characterized in that, The outer cover (10) includes a cover body (14), a first mounting part (15) and a second mounting part (16); the cover body (14) has the flow channel (11), a first side surface (12) and a second side surface (13); the first mounting part (15) and the second mounting part (16) are spaced apart on the first side surface (12) of the cover body (14), and the first mounting part (15) and the second mounting part (16) are respectively located at opposite ends of the air inlet section (111); and / or; The first mounting part 15 and the second mounting part (16) have different shapes. The shape of the first mounting part 15 can be at least one of cylindrical, cuboid, prism, frustum, and truncated pyramid. The shape of the second mounting part (16) can be at least one of cylindrical, cuboid, prism, frustum, and truncated pyramid.

7. The heat dissipation device (100) according to claim 6, characterized in that, The surface of the cover portion (14) that is away from the first mounting portion (15) and the second mounting portion (16) is at least partially planar.

8. The heat dissipation device (100) according to claim 6, characterized in that, The cover part (14) includes a first through hole (141) and a second through hole (142) arranged opposite to each other; The impeller (30) includes a first connecting part (33), a second connecting part (34), a rotating shaft (31), and a plurality of blades (32); the first connecting part (33) and the second connecting part (34) are spaced apart, and the plurality of blades (32) are disposed between the first connecting part (33) and the second connecting part (34) and spaced around the outer periphery of the rotating shaft (31), with each blade (32) having its opposite ends connected to the first connecting part (33) and the second connecting part (34) respectively; the rotating shaft ( 31) Includes a first rotating shaft portion (311) and a second rotating shaft portion (312). The first rotating shaft portion (311) is disposed on the side of the first connecting portion (33) away from the second connecting portion (34) and is rotatably inserted through the first through hole (141). The second rotating shaft portion (312) is located on the side of the second connecting portion (34) facing the first connecting portion (33). The impeller (30) has a third through hole (35) penetrating the second connecting portion (34) and at least part of the second rotating shaft portion (312). The power mechanism (50) includes a connected power unit (51) and a power output shaft (52). The power unit (51) is used to drive the power output shaft (52) to rotate relative to the power unit (51). The power unit (51) is located on the side of the cover part (14) near the second connecting part (34) and connected to the cover part (14). The power output shaft (52) passes through the second through hole (142) and the third through hole (35) in sequence to drive the impeller (30) to rotate.

9. The heat dissipation device (100) according to claim 8, characterized in that, The outer cover (10) also includes a support part (17), which is disposed on one side of the cover part (14) and away from the first mounting part 15. The support part (17) is used to support the power mechanism (50). And / or, The power mechanism (50) further includes a limiting part (53), which is disposed on the surface of the power unit (51) facing the power output shaft (52) and surrounds the power output shaft (52). The limiting part (53) passes through the third through hole (35) and cooperates with the third through hole (35) to limit the relative position of the power mechanism (50) and the outer cover (10).

10. A circuit board assembly (200), characterized in that, include: A circuit board having ventilation holes (211); A chip (220) is mounted on the circuit board and is positioned close to the ventilation hole (211); A controller (230), which is mounted on the circuit board and electrically connected to the chip (220); and The heat dissipation device (100) according to any one of claims 1-9, wherein the heat dissipation device (100) and the chip (220) are disposed on the same side of the circuit board, the air inlet of the air inlet section (111) of the heat dissipation device (100) is disposed corresponding to the ventilation hole (211), the air outlet of the air outlet section (113) faces the chip (220), and the power mechanism (50) of the heat dissipation device (100) is electrically connected to the controller (230) for working under the control of the controller (230).

11. An electronic device (300), characterized in that, The electronic device (300) includes the circuit board assembly (200) of claim 10.

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