Heat dissipation devices and electronic equipment

Abstract

This application provides a heat dissipation device and an electronic device, belonging to the field of heat dissipation technology. The heat dissipation device includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component includes a first body and at least one first leg. The second heat dissipation component includes a second body and at least one second leg. The first body and the second body are spaced apart, and the gap between the first body and the second body is used to accommodate at least a portion of the device to be dissipated. Each first leg and at least one second leg capable of heat exchange with it form a corresponding relationship. The projection of each first leg on a projection plane at least partially coincides with the projection of the corresponding second leg on the projection plane. The projection plane is a plane that penetrates through the first body and the second body, and the projection plane is parallel to a first direction, which is the arrangement direction of the first body and the second body. This arrangement can maximize the heat dissipation capacity of each heat dissipation component, thereby improving the heat dissipation capacity of the electronic device.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and electronic device. Background Technology

[0002] Currently, to improve the static heat dissipation performance of electronic devices, two or more heat sinks are installed inside. In related technologies, the circuit board is placed between two heat sinks, and the circuit board contacts the heat sinks on both sides through a thermally conductive medium (such as a thermal pad) to control the temperature of the circuit board within a reasonable range. However, in these technologies, the heat dissipation capacity of the heat sinks located on both sides of the circuit board is not fully utilized, resulting in low heat dissipation capacity of the electronic device. Utility Model Content

[0003] This application provides a heat dissipation device and an electronic device that can maximize the heat dissipation capacity of each heat dissipation component to improve the heat dissipation capacity of the electronic device.

[0004] In a first aspect, embodiments of this application provide a heat dissipation device for dissipating heat from a device to be cooled. The heat dissipation device includes a first heat dissipation component and a second heat dissipation component. The first heat dissipation component includes a first body and at least one first leg. The second heat dissipation component includes a second body and at least one second leg. The first body and the second body are spaced apart, and the gap between the first body and the second body is used to accommodate at least a portion of the device to be cooled. Each first leg and at least one second leg capable of heat exchange with it form a corresponding relationship. The projection of each first leg on a projection plane at least partially coincides with the projection of the corresponding second leg on the projection plane. The projection plane is a plane penetrating through the first body and the second body, and the projection plane is parallel to a first direction, which is the arrangement direction of the first body and the second body.

[0005] In this embodiment, along a direction perpendicular to the first direction, the projection of the first foot on the projection plane at least partially overlaps with the projection of the second foot on the projection plane. This means that at least a portion of the sidewall of the first foot is disposed opposite to the sidewall of the second foot along a direction perpendicular to the first direction. Through heat exchange between the sidewall of the first foot and the corresponding sidewall of the second foot, the heat exchange between the first foot and the corresponding second foot can achieve synergistic heat conduction between the first and second heat sinks. This can evenly distribute the heat on the first and second heat sinks, and the first and second heat sinks can release heat outwards synchronously. This can improve the overall heat capacity of the electronic device, fully utilize the heat dissipation capacity of the first and second heat sinks, and enhance the heat dissipation performance of the electronic device.

[0006] In some possible implementations, along a first direction, at least one end face of the first leg away from the first body is provided with a first groove, the first groove being used to accommodate at least a portion of the second leg.

[0007] In this way, by inserting the second pin into the first groove, while ensuring a large heat exchange area between the first and second pins, the stacking size of the first and second pins in the direction perpendicular to the first direction can be reduced. This further reduces the impact of the first and second pins on the dimensions of the electronic device in the direction perpendicular to the first direction, thereby further reducing the size of the electronic device and further reducing the difficulty of miniaturizing the electronic device.

[0008] In some possible implementations, at least a portion of the inner wall of at least one first groove is spaced apart from the outer wall of the second leg.

[0009] In this way, by setting a gap between the inner wall of the first groove and the outer wall of the second leg, the difficulty of inserting the second leg into the first groove can be reduced, which helps to reduce the assembly difficulty of the first heat sink and the second heat sink and improve the assembly efficiency of the heat dissipation device.

[0010] In some possible implementations, the heat dissipation device further includes at least one first thermally conductive medium, at least a portion of which is disposed between the groove sidewall of at least one first groove and the sidewall of the second leg, and the first thermally conductive medium is in contact with at least one of the first leg and the second leg.

[0011] In this way, by providing a first heat-conducting medium between the sidewall of the first groove and the sidewall of the second foot, the efficiency of heat exchange between the first foot and the second foot can be improved, which helps to improve the heat dissipation performance of electronic devices.

[0012] In some possible implementations, the first heat-conducting medium is a liquid heat-conducting medium, such as a thermally conductive gel. Because of its fluidity, the liquid heat-conducting medium can completely fill the gap between the sidewalls of the first groove and the sidewalls of the second foot, thus helping to improve the heat exchange efficiency between the first foot and the second foot.

[0013] In some possible implementations, at least one portion of the first heat-conducting medium is located between the sidewall of the first groove and the sidewall of the second leg, and another portion is located between the bottom of the first groove and the end face of the second leg away from the second body.

[0014] In this way, the inner wall of the first groove can exchange heat with the second pin through the first heat-conducting medium, which can improve the heat exchange efficiency between the first pin and the second pin and help improve the heat dissipation performance of electronic devices.

[0015] In some possible implementations, at least one first thermally conductive medium is located between the sidewall of the first groove and the sidewall of the second leg, and the bottom of the first groove contacts the end face of the second leg away from the second body.

[0016] In this way, while keeping the height of the second leg and the depth of the first groove constant, the heat exchange area between the first and second legs can be increased, thereby improving the heat exchange efficiency between the first and second legs and enhancing the heat dissipation performance of the electronic device. Furthermore, when the first and second legs are located between the first and second bodies, it helps to reduce the size of the heat dissipation device in the first direction.

[0017] In some possible implementations, the inner wall of at least one first groove is spaced apart from the outer wall of the second leg.

[0018] This further reduces the difficulty of inserting the second leg into the first groove, which helps to improve the assembly efficiency of the first and second heat sink components.

[0019] In some possible implementations, at least one sidewall of the first groove is in direct contact with the sidewall of the second leg. This arrangement can also improve the heat exchange efficiency between the first and second legs.

[0020] In some possible implementations, the bottom of at least one first groove directly contacts the end face of the second foot furthest from the second body. This arrangement, while keeping the height of the second foot and the depth of the first groove constant, increases the heat exchange area between the first and second feet, thereby improving their heat exchange efficiency and enhancing the heat dissipation performance of the electronic device. Furthermore, when the first and second feet are located between the first and second bodies, it helps to reduce the size of the heat dissipation device in the first direction.

[0021] In some possible implementations, at least one of the first and second feet that are in direct contact is elastic. This arrangement reduces the difficulty of achieving direct contact between the inner wall of the first groove and the outer wall of the second foot.

[0022] In some possible implementations, along the first direction, at least one second leg has a second groove on its end face away from the second body that accommodates at least a portion of the corresponding first leg.

[0023] In this way, by inserting the first pin into the second groove, while ensuring a large heat exchange area between the second pin and the first pin, the stacking size of the second pin and the first pin in the direction perpendicular to the first direction can be reduced. This can further reduce the influence of the second pin and the first pin on the size of the electronic device in the direction perpendicular to the first direction, further reduce the volume of the electronic device, and further reduce the difficulty of miniaturizing the electronic device.

[0024] In some possible implementations, at least a portion of the inner wall of at least one second groove is spaced apart from the outer wall of the first leg. For example, the inner wall of the second groove is partially spaced apart from the outer wall of the first leg. By providing a gap between the inner wall of the second groove and the outer wall of the first leg, the difficulty of inserting the first leg into the second groove can be reduced, which helps to reduce the assembly difficulty of the first and second heat sinks and improve the assembly efficiency of the heat dissipation device.

[0025] In some possible implementations, the heat dissipation device further includes at least one second thermally conductive medium, at least a portion of which is disposed between the groove sidewall of at least one second groove and the sidewall of the first leg, and the second thermally conductive medium is in contact with at least one of the first leg and the second leg.

[0026] In this way, by providing a second heat-conducting medium between the sidewall of the second groove and the sidewall of the first leg, the efficiency of heat exchange between the second leg and the first leg can be improved, which helps to improve the heat dissipation performance of electronic devices.

[0027] In some possible implementations, the second heat-conducting medium is a liquid heat-conducting medium, such as a thermally conductive gel. Because of its fluidity, the liquid heat-conducting medium can completely fill the gap between the sidewall of the second groove and the sidewall of the first foot, helping to improve the heat exchange efficiency between the second foot and the first foot.

[0028] In some possible implementations, at least one portion of the second heat-conducting medium is located between the sidewall of the second groove and the sidewall of the first leg, and another portion is located between the bottom of the second groove and the end face of the first leg away from the first body.

[0029] In this way, the inner wall of the second groove can exchange heat with the first pin through the second heat-conducting medium, which can improve the heat exchange efficiency between the second pin and the first pin and help improve the heat dissipation performance of electronic devices.

[0030] In some possible implementations, at least one second heat-conducting medium is located between the sidewall of the second groove and the sidewall of the first leg, and the bottom of the second groove contacts the end face of the first leg away from the first body.

[0031] In this way, while keeping the height of the first leg and the depth of the second groove constant, the heat exchange area between the second leg and the first leg can be increased, thereby improving the heat exchange efficiency between the second leg and the first leg and enhancing the heat dissipation performance of the electronic device. Furthermore, when the second leg and the first leg are located between the first body and the second body, it helps to reduce the size of the heat dissipation device in the first direction.

[0032] In some possible implementations, the inner wall of at least one second groove is spaced apart from the outer wall of the first leg.

[0033] This further reduces the difficulty of inserting the first support into the second groove, which helps to improve the assembly efficiency of the first and second heat sinks.

[0034] In some possible implementations, at least one sidewall of the second groove is in direct contact with the sidewall of the first foot. This arrangement can also improve the heat exchange efficiency between the first and second feet.

[0035] In some possible implementations, the bottom of at least one second groove directly contacts the end face of the first leg away from the first body. This arrangement, while keeping the height of the first leg and the depth of the second groove constant, increases the heat exchange area between the first and second legs, thereby improving their heat exchange efficiency and enhancing the heat dissipation performance of the electronic device. Furthermore, when the first and second legs are located between the first and second bodies, it helps to reduce the size of the heat dissipation device in the first direction.

[0036] In some possible implementations, at least one of the first and second feet that are in direct contact is elastic. This arrangement reduces the difficulty of achieving direct contact between the inner wall of the second groove and the outer wall of the first foot.

[0037] In some possible implementations, at least one first foot and a corresponding second foot are arranged side by side along a direction perpendicular to the first direction. This arrangement, with portions of the sidewalls of the first foot and the second foot facing each other along a direction perpendicular to the first direction, also enables heat exchange between the first and second feet, achieving coordinated heat conduction between the first and second heat sinks.

[0038] In some possible implementations, the sidewall of at least one first leg is in direct contact with the sidewall of at least one corresponding second leg.

[0039] In this way, the sidewall of the first foot is in direct contact with the sidewall of the second foot, which can improve the heat transfer efficiency between the first foot and the second foot, and help improve the heat dissipation performance of electronic devices.

[0040] In some possible implementations, at least one of the first and second feet that are in direct contact is elastic. This arrangement reduces the difficulty of achieving direct contact between the sidewalls of the first and second feet, ensuring tight contact between them. Alternatively, deformation of the first foot and / or the second foot can facilitate assembly of the first foot with its corresponding second foot, further reducing the difficulty of assembly.

[0041] In some possible implementations, the sidewall of at least one first leg is spaced apart from the sidewall of at least one corresponding second leg, which can reduce the difficulty of assembling the first leg and the second leg and improve the assembly efficiency of the first heat sink and the second heat sink.

[0042] In some possible implementations, the outer wall of at least one first leg is spaced apart from the outer wall of at least one corresponding second leg. This arrangement can further reduce the difficulty of assembling the first and second legs, and further improve the assembly efficiency of the first and second heat sinks.

[0043] In some possible implementations, the heat dissipation device further includes a third thermally conductive medium, at least a portion of which is disposed between the sidewall of at least one first leg and the sidewall of at least one corresponding second leg, the third thermally conductive medium being in contact with at least one of the first leg and the second leg.

[0044] In this way, by setting a third heat-conducting medium between the sidewalls of the first and second feet, the efficiency of heat exchange between the first and second feet can be improved, so as to give full play to the heat dissipation capacity of the first and second heat sinks and help improve the heat dissipation performance of electronic devices.

[0045] In some possible implementations, along the first direction, at least one first foot and a corresponding second foot are located between the first body and the second body.

[0046] By placing the first and second feet between the first and second bodies, the impact of the first and second feet on the dimensions of the electronic device in the direction perpendicular to the first direction can be reduced, facilitating the miniaturization design of the electronic device. Additionally, the impact on the dimensions of the electronic device in the first direction can also be reduced, contributing to the miniaturization design of the electronic device.

[0047] In some possible implementations, at least one of the first and second heat sinks is a metal heat sink; for example, both the first and second heat sinks can be metal heat sinks. This configuration helps to improve the heat dissipation capacity of the first and / or second heat sinks, thereby further enhancing the heat dissipation capacity of the heat dissipation device.

[0048] In some possible implementations, at least one of the first and second heat sinks is a radiator; for example, both the first and second heat sinks can be radiators. This gives the first and / or second heat sinks a large heat dissipation area, resulting in better heat dissipation capabilities.

[0049] Secondly, embodiments of this application provide an electronic device including a heat-dissipating component and a heat dissipation device as described in any of the first aspects. At least a portion of the heat-dissipating component is located between a first body and a second body, and the first heat dissipation element and the second heat dissipation element can dissipate heat from the heat-dissipating component to ensure that the temperature of the heat-dissipating component is within a reasonable range.

[0050] In some possible implementations, the device to be cooled includes a circuit board and electronic components mounted on the circuit board.

[0051] In some possible implementations, one of the first and second heat sinks is a heat sink, and the other is part of the electronic device's housing. The housing is the external component of the electronic device that is visible to the user when the device is in its complete state, and both the heat sink and the device to be cooled are located inside the housing. This configuration, utilizing a part of the external component as the first and / or second heat sink, can reduce the number of parts in the electronic device while improving its heat dissipation performance.

[0052] In some possible implementations, the first or second heat sink, which is part of the housing, is a metal heat sink. For example, when the bottom shell of the housing serves as the first or second heat sink, the bottom shell is a metal heat sink. This configuration can improve the heat dissipation performance of the electronic device.

[0053] In some possible implementations, the electronic device also includes a housing, with the heat dissipation device and the device to be cooled located inside the housing.

[0054] In some possible implementations, the electronic device is one of the following products: a panel, a router, or a switch. These products incorporate a heat dissipation device to improve their heat dissipation performance. Attached Figure Description

[0055] Figure 1 A cross-sectional schematic diagram of an electronic device provided in an embodiment of this application;

[0056] Figure 2 for Figure 1 A three-dimensional structural diagram of the first and second heat sink components;

[0057] Figure 3 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0058] Figure 4 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0059] Figure 5 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0060] Figure 6 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0061] Figure 7 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0062] Figure 8 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0063] Figure 9 for Figure 8 A three-dimensional structural diagram of the first and second heat sink components;

[0064] Figure 10 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0065] Figure 11 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0066] Figure 12 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application;

[0067] Figure 13 This is another structural schematic diagram of the electronic device provided in the embodiments of this application.

[0068] Explanation of reference numerals in the attached figures:

[0069] 10. First heat sink; 11. First main body; 12. First support leg; 13. First groove;

[0070] 20. Second heat sink; 21. Second main body; 22. Second support leg; 23. Second groove;

[0071] 30. First heat transfer medium;

[0072] 40. Second heat-conducting medium;

[0073] 50. Third heat transfer medium;

[0074] 60. Fourth heat transfer medium;

[0075] 100. Heat dissipation device;

[0076] 200. Devices to be cooled; 210. Circuit board; 220. Electronic components. Detailed Implementation

[0077] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0078] This application provides an electronic device, which may include, but is not limited to, a panel, a mobile WiFi device (E5), a smart speaker, a smart door lock, a router, a customer premises equipment (CPE), an in-vehicle device, a handheld mobile terminal, a base station, a security device, a router, a laptop computer, a switch, and other terminal devices.

[0079] Electronic devices can be panel-type products, cylindrical products, etc. Additionally, electronic devices can also be products embedded in recesses in walls.

[0080] In related technologies, electronic devices include a housing, a circuit board assembly, and a heat sink. The housing includes a metal bottom shell and a top shell, which together form a cavity housing the circuit board assembly and the heat sink. The circuit board assembly includes a circuit board and electronic components mounted on it. The circuit board assembly is located between the metal bottom shell and the heat sink. Both sides of the circuit board assembly are indirectly in contact with the metal bottom shell and the heat sink via thermal pads. These thermal pads transfer heat from the circuit board assembly to the metal bottom shell and the heat sink, respectively, allowing the metal bottom shell and the heat sink to work together to dissipate heat from the circuit board assembly.

[0081] However, the difference in heat between the metal base and the heat sink means that the actual heat dissipation capacity of the metal base and the heat sink is different. In other words, the heat dissipation capacity of the metal base or the heat sink is not fully utilized, resulting in poor heat dissipation performance of electronic devices.

[0082] Therefore, in one embodiment, a plurality of first protrusions are provided on the metal base shell, and a plurality of second protrusions are provided on the heat sink. The first and second protrusions correspond one-to-one, and are stacked along the thickness direction of the circuit board. The end face of the corresponding first protrusion contacts the end face of the second protrusion. A plurality of through holes are provided on the circuit board, each corresponding to one first and one second protrusion. Each through hole is used to allow the end face of the corresponding first protrusion to contact the end face of the second protrusion. By providing contacting first and second protrusions, heat transfer can occur between the metal base shell and the heat sink, achieving synergistic thermal conductivity. This improves the overall thermal capacity of the electronic device, fully utilizes the heat dissipation capabilities of the metal base shell and the heat sink, and enhances the heat dissipation performance of the electronic device.

[0083] However, in order to increase the contact area between the first and second protrusions, the through hole is designed with a large diameter. When the size of the circuit board remains unchanged, the actual usable area of ​​the circuit board is reduced, which will increase the difficulty of placing the same number of electronic components on the circuit board.

[0084] In one implementation, by increasing the size of the circuit board, the contact area between the first and second protrusions is designed to be large, thus ensuring that the actual usable area of ​​the circuit board meets the arrangement requirements of the same number of electronic devices. However, this approach leads to an increase in the size of the electronic device, making it difficult to achieve miniaturization. Therefore, how to improve the heat dissipation performance of the electronic device while achieving miniaturization has become an urgent problem to be solved.

[0085] Figure 1 This is a cross-sectional schematic diagram of an electronic device provided in an embodiment of this application. In the figure, the X-axis is a second direction, the Y-axis is a third direction, and the Z-axis is a first direction. Any two of the first, second, and third directions are perpendicular to each other. In some embodiments, the first direction can be the thickness direction of the electronic device, the second direction can be the length direction of the electronic device, and the third direction can be the width direction of the electronic device. Alternatively, in some embodiments, the first direction can be the thickness direction of the circuit board 210, the second direction can be the length direction of the circuit board 210, and the third direction can be the width direction of the circuit board 210. In some embodiments, the first direction is the arrangement direction of the first body 11 and the second body 21.

[0086] It should be noted that the structure of the heat dissipation device 100 in each figure is for illustrative purposes only and does not constitute a limitation on the specific structure of the heat dissipation device 100.

[0087] Therefore, in the embodiments of this application, such as Figure 1 As shown, the electronic device includes a heat-dissipating device 200 and a heat dissipation device 100. The heat dissipation device 100 is used to dissipate heat from the heat-dissipating device 200 so that the temperature of the heat-dissipating device 200 is within a reasonable range.

[0088] The heat-dissipating device 200 may include, but is not limited to, a circuit board 210, electronic devices 220 mounted on the circuit board 210, cables, and other components. The electronic devices 220 may include, but are not limited to, processors, radio frequency chips, and memory. The following description uses the example of the heat-dissipating device 200 being constructed via a circuit board 210 and electronic devices 220 mounted on the circuit board 210.

[0089] In this embodiment, the thickness direction of the heat dissipation device 100 can be parallel to the thickness direction of the electronic device, the length direction of the heat dissipation device 100 can be parallel to the length direction of the electronic device, and the width direction of the heat dissipation device 100 can be parallel to the width direction of the electronic device.

[0090] Figure 2 for Figure 1 A three-dimensional structural diagram of the first and second heat sink components.

[0091] In the embodiments of this application, such as Figure 2 As shown, the heat dissipation device 100 includes a first heat dissipation component 10 and a second heat dissipation component 20. The first heat dissipation component 10 includes a first body 11 and at least one first support leg 12. The second heat dissipation component 20 includes a second body 21 and at least one second support leg 22. The first body 11 and the second body 21 are aligned along a first direction (e.g., ...). Figure 2 The two bodies are spaced apart in the Z-direction, and the gap between the first body 11 and the second body 21 is used to accommodate at least a portion of the heat dissipation device 200, for example, such as... Figure 1 As shown, the heat dissipation device 200 is disposed between the first body 11 and the second body 21. Each first leg 12 and at least one second leg 22 capable of heat exchange with it are correspondingly positioned along a direction perpendicular to the first direction (e.g., Figure 1 In the X direction, the projection of each first leg 12 at least partially coincides with the projection of the corresponding second leg 22, that is, along the direction perpendicular to the first direction (e.g., in the X direction). Figure 1 In the X direction, the orthographic projection of each first leg 12 on the projection plane at least partially coincides with the orthographic projection of the corresponding second leg 22 on the projection plane. The projection plane can be a plane that passes through the first body 11 and the second body 21, and the projection plane is parallel to the first direction, which can be the arrangement direction of the first body 11 and the second body 21.

[0092] In this embodiment of the application, by arranging at least a portion of the heat dissipation device 200 between the first body 11 and the second body 21, both the first heat sink 10 and the second heat sink 20 can dissipate heat from the heat dissipation device 200, so that the temperature of the heat dissipation device 200 is within a reasonable range.

[0093] Based on this, along a direction perpendicular to the first direction, the orthographic projection of each first leg 12 on the projection plane at least partially overlaps with the orthographic projection of the corresponding second leg 22 on the projection plane. This means that at least a portion of the sidewall of the first leg 12 is arranged opposite to the sidewall of the second leg 22 along a direction perpendicular to the first direction. Through heat exchange between the sidewall of the first leg 12 and the sidewall of the corresponding second leg 22, the heat exchange between the first leg 12 and the corresponding second leg 22 can achieve heat conduction synergy between the first heat sink 10 and the second heat sink 20. The heat on the first heat sink 10 and the second heat sink 20 can be evenly distributed. The first heat sink 10 and the second heat sink 20 can release heat outward synchronously, which can improve the overall heat capacity of the electronic device and fully utilize the heat dissipation capacity of the first heat sink 10 and the second heat sink 20, thereby improving the heat dissipation performance of the electronic device.

[0094] Furthermore, compared to existing technologies that use the contact between the end faces of the first and second protrusions to achieve coordinated heat conduction of the first heat sink 10 and the second heat sink 20, in this embodiment, because the sidewall areas of the first leg 12 and the second leg 22 are larger, the heat exchange area between the first leg 12 and the second leg 22 can be larger, while the dimensions of the first leg 12 and the second leg 22 in the perpendicular direction are smaller, thus having less impact on the dimensions of the electronic device in the perpendicular direction, facilitating miniaturization design of the electronic device. In addition, the first leg 12 and the second leg 22 can be arranged in the narrow space around the circuit board 210, eliminating the need for through holes as in related technologies on the circuit board 210. This maximizes the usable area of ​​the circuit board 210 while keeping its dimensions constant, and also enables miniaturization design of the electronic device.

[0095] It should be noted that when a through hole is provided on the circuit board 210, since the heat exchange area of ​​the first leg 12 and the second leg 22 is the sidewall of the two legs, the size of the first leg 12 and the second leg 22 in the direction perpendicular to the first direction is small, so the diameter of the through hole can be designed as a small diameter hole, which can increase the usable area of ​​the circuit board 210 without changing the size of the circuit board 210.

[0096] It should be noted that the first heat sink 10 may include multiple legs, and the leg in the first heat sink 10 that corresponds to the second leg 22 is the first leg 12. Therefore, when the first heat sink 10 has multiple legs, each leg can be the first leg 12, or, some of the multiple legs may be the first leg 12 that corresponds to the second leg 22 in heat exchange, and the other part may not correspond to the second leg 22.

[0097] Similarly, the second heat sink 20 may include multiple legs, and the leg in the second heat sink 20 that corresponds to the first leg 12 is the second leg 22. Therefore, when the second heat sink 20 has multiple legs, each leg can be the second leg 22, or a portion of the multiple legs may be the second leg 22 that corresponds to the first leg 12 in heat exchange, and another portion may not correspond to the first leg 12.

[0098] See Figure 2 The first support 12 can be a cuboid structure. Of course, the first support 12 can also be other structures, such as a cylindrical structure, an isosceles trapezoidal column structure, etc.

[0099] join Figure 2 The length direction of the first leg 12 can be (e.g.) Figure 2The centerline of the first leg 12 is perpendicular to the first main body 11 in the Z direction. Therefore, the angle between the centerline of the first leg 12 and the plane on which the first main body 11 is located can be 90°. Of course, the angle between the centerline of the first leg 12 and the plane on which the first main body 11 is located can also be greater than or less than 90°. That is to say, the first leg 12 can be tilted on the first main body 11.

[0100] like Figure 2 As shown, the number of the first leg 12 is four. Of course, the number of the first leg 12 can be more or less than four. For example, the number of the first leg 12 can be one or five.

[0101] In some embodiments, at least one first leg 12 is integrally formed with the first body 11, for example, as shown in the figure. Figure 2 As shown, each of the first legs 12 and the first body 11 is an integral structure.

[0102] In some embodiments, at least one first leg 12 and the first body 11 can be a separate structure. In this case, the first leg 12 can be fixedly connected to the first body 11 by means of adhesive bonding, snap-fitting, etc.

[0103] When there are multiple first legs 12, each first leg 12 and the first body 11 can be an integral structure or a separate structure, or, a part of the multiple first legs 12 and the first body 11 can be an integral structure, and another part of the first body 11 can be a separate structure.

[0104] In some embodiments, the first leg 12 and the second leg 22 correspond one-to-one, for example, as shown in the figure. Figure 2 As shown, there are four first legs 12 and four second legs 22, with each first leg 12 corresponding to one second leg 22.

[0105] In some embodiments, at least one first foot 12 corresponds to a plurality of second feet 22. For example, when there are three first feet 12, one of the three first feet 12 corresponds to one second foot 22, and the other two correspond to three second feet 22.

[0106] When there are multiple first legs 12, the number of second legs 22 corresponding to each first leg 12 may be the same or different. Alternatively, the number of second legs 22 corresponding to a portion of the multiple first legs 12 may be the same, while the number of second legs 22 corresponding to another portion may be different.

[0107] See Figure 2 The second support 22 can be a cuboid structure. Of course, the second support 22 can also be other structures, such as a cylindrical structure, an isosceles trapezoidal column structure, etc.

[0108] join Figure 2 The length direction of the second leg 22 can be (e.g.) Figure 2 The centerline of the second support 22 is perpendicular to the second main body 21 in the Z direction. Therefore, the angle between the centerline of the second support 22 and the plane where the second main body 21 is located can be 90°. Of course, the angle between the centerline of the second support 22 and the plane where the second main body 21 is located can also be greater than or less than 90°. That is to say, the second support 22 can be tilted on the second main body 21.

[0109] like Figure 2 As shown, the number of second legs 22 is four. Of course, the number of second legs 22 can be more or less than four. For example, the number of second legs 22 can be one or five.

[0110] In some embodiments, at least one second leg 22 is integrally formed with the second body 21, for example, as shown in the figure. Figure 2 As shown, each of the second legs 22 and the first body 11 is a two-body structure.

[0111] In some embodiments, at least one second leg 22 and the second body 21 can be a separate structure. In this case, the second leg 22 can be fixedly connected to the second body 21 by means of adhesive bonding, snap-fitting, or other methods.

[0112] When there are multiple second legs 22, each second leg 22 and the second body 21 can be an integral structure or a separate structure, or, one part of the multiple second legs 22 and the second body 21 can be an integral structure, and another part of the second body 21 can be a separate structure.

[0113] See also some possible implementations. Figure 1 Along the first direction (e.g.) Figure 1 In the Z-direction, at least one first leg 12 and a corresponding second leg 22 are located between the first body 11 and the second body 21. By arranging the first leg 12 and the second leg 22 between the first body 11 and the second body 21, the influence of the first leg 12 and the second leg 22 on the dimensions of the electronic device in the direction perpendicular to the first direction can be reduced, facilitating the miniaturization design of the electronic device. In addition, the influence on the dimensions of the electronic device in the first direction can also be reduced, which contributes to the miniaturization design of the electronic device.

[0114] When there are multiple first legs 12, each first leg 12 and its corresponding second leg 22 can be located between the first body 11 and the second body 21, such as... Figure 1 As shown, there are four first legs 12 and four second legs 22, and the four first legs 12 and the four second legs 22 are located between the first body 11 and the second body 21.

[0115] Of course, in addition to all being located between the first body 11 and the second body 21, in some embodiments, a portion of the plurality of first legs 12 and their corresponding second legs 22 may be located between the first body 11 and the second body 21, while another portion and their corresponding second legs 22 may be located outside the gap between the first body 11 and the second body 21. Alternatively, in some embodiments, each first leg 12 and its corresponding second leg 22 is located outside the gap between the first body 11 and the second body 21. Alternatively, in some embodiments, at least a portion of at least one of at least one first leg 12 and its corresponding second leg 22 is located between the first body 11 and the second body 21, while the other is located outside the gap between the first body 11 and the second body 21.

[0116] For example, at least one first leg 12 is fixedly connected to the side wall of the first body 11, and its corresponding second leg 22 is fixedly connected to the side wall of the second body 21. The first leg 12 and its corresponding second leg 22 are both located outside the gap between the first body 11 and the second body 21.

[0117] See also some possible implementations. Figure 2 Along the first direction (e.g.) Figure 2 In the Z-direction, at least one end face of the first leg 12 away from the first body 11 is provided with a first groove 13, which is used to accommodate at least a portion of the second leg 22. By inserting the second leg 22 into the first groove 13, while ensuring a large heat exchange area between the first leg 12 and the second leg 22, the heat exchange area between the first leg 12 and the second leg 22 in the direction perpendicular to the first direction (e.g., in the Z-direction) can be reduced. Figure 2 The stacking dimensions in the X or Y direction can further reduce the influence of the first pin 12 and the second pin 22 on the dimensions of the electronic device in the direction perpendicular to the first direction, thereby further reducing the volume of the electronic device and further reducing the difficulty of miniaturizing the electronic device.

[0118] It is understood that the first groove 13 is used to accommodate the second foot 22 corresponding to the first foot 12. Therefore, when the first foot 12 corresponds to multiple second feet 22, at least a portion of each second foot 22 corresponding to the first foot 12 is inserted into the first groove 13.

[0119] The specific structure of the first groove 13 is not limited here. For example, the first groove 13 can be a rectangular groove, a circular groove, a triangular groove, or other groove structures.

[0120] When there are multiple first grooves 13, the structures of each first groove 13 may be the same or different, or a portion of the structures of multiple first grooves 13 may be the same and another portion may be different.

[0121] When there are multiple first legs 12, each first leg 12 can be provided with a first groove 13, for example, Figure 1 As shown, each of the four first legs 12 is provided with a first groove 13. Of course, in addition to each of the first legs 12 being provided with a first groove 13, in some embodiments, some of the multiple first legs 12 may have a first groove 13 while others do not.

[0122] In some embodiments, the depth of the first groove 13 may be greater than or equal to the height of the second foot 22, which can increase the heat exchange area between the first foot 12 and the second foot 22, thus helping to improve the heat dissipation performance of the electronic device. In addition, when the first foot 12 and the second foot 22 are located between the first body 11 and the second body 21, it helps to reduce the size of the heat dissipation device 100 in the first direction, thereby reducing the impact of the heat dissipation device 100 on the size of the electronic device in the first direction.

[0123] The height of the second leg 22 refers to the dimension of the second leg 22 along the depth direction of the first groove 13.

[0124] Of course, the depth of the first groove 13 can be greater than or equal to the height of the second leg 22, or it can be less than the height of the second leg 22.

[0125] When there are multiple first grooves 13, the depth of each first groove 13 may be the same or different, or a portion of the multiple first grooves 13 may have the same depth and another portion may have different depths.

[0126] In some possible implementations, at least a portion of the inner wall of at least one first groove 13 is spaced apart from the outer wall of the second leg 22; for example, a portion of the inner wall of the first groove 13 is spaced apart from the outer wall of the second leg 22. This arrangement, by creating a gap between the inner wall of the first groove 13 and the outer wall of the second leg 22, reduces the difficulty of inserting the second leg 22 into the first groove 13, thereby reducing the assembly difficulty of the first heat sink 10 and the second heat sink 20 and improving the assembly efficiency of the heat dissipation device 100.

[0127] Figure 3 Another schematic diagram of the heat dissipation device provided in this application embodiment. Figure 4 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application.

[0128] In some embodiments, see Figure 3 At least one inner wall of the first groove 13 is spaced apart from the outer wall of the second support 22. This further reduces the difficulty of inserting the second support 22 into the first groove 13, and helps to improve the assembly efficiency of the first heat sink 10 and the second heat sink 20.

[0129] The gas between the inner wall of the first groove 13 and the inner wall of the second leg 22 serves as the medium for heat exchange between the first leg 12 and the second leg 22. Additionally, as... Figure 3 As shown, the gap between the first groove 13 and the second leg 22 is designed to be small, which can also ensure that the first leg 12 can exchange heat with the second leg 22, and ensure that the first heat sink 10 and the second heat sink 20 conduct heat in synergy.

[0130] Of course, in some embodiments, besides being spaced apart from the outer wall of the second leg 22, the inner wall of the first groove 13 is also, for example... Figure 4 As shown, at least one portion of the inner wall of the first groove 13 is spaced apart from the outer wall of the second leg 22, and another portion is in direct contact with the outer wall of the second leg 22.

[0131] Among them, such as Figure 4 As shown, a portion of the outer wall of the second leg 22 can directly contact the side wall of the first groove 13, and another portion can be spaced apart from the bottom of the first groove 13; or, a portion of the outer wall of the second leg 22 can be spaced apart from the side wall of the first groove 13, and another portion can directly contact the bottom of the first groove 13; or, a portion of the outer wall of the second leg 22 can be spaced apart from a portion of the side wall and bottom of the first groove 13, and another portion can directly contact another portion of the bottom of the first groove 13; or, a portion of the outer wall of the second leg 22 can be directly contact a portion of the side wall and bottom of the first groove 13, and another portion can be spaced apart from another portion of the bottom of the first groove 13.

[0132] When there are multiple first grooves 13, the inner wall of each first groove 13 can be spaced apart from the outer wall of the second leg 22. Alternatively, a portion of the inner wall of one of the multiple first grooves 13 can be spaced apart from the outer wall of the second leg 22, and a portion of the inner wall of another portion can be spaced apart from the outer wall of the second leg 22. Alternatively, a portion of the inner wall of each first groove 13 can be spaced apart from the outer wall of the second leg 22, and another portion can be in direct contact with the outer wall of the second leg 22.

[0133] In some possible implementations, such as Figure 1As shown, the heat dissipation device 100 further includes at least one first thermally conductive medium 30. At least a portion of the first thermally conductive medium 30 is disposed between the groove sidewall of at least one first groove 13 and the sidewall of the second support 22. The first thermally conductive medium 30 is in contact with at least one of the first support 12 and the second support 22, for example, as... Figure 1 As shown, the first thermally conductive medium 30 is in contact with the first leg 12 and the second leg 22. By providing the first thermally conductive medium 30 between the sidewall of the first groove 13 and the sidewall of the second leg 22, the efficiency of heat exchange between the first leg 12 and the second leg 22 can be improved, which helps to improve the heat dissipation performance of electronic devices.

[0134] The first heat-conducting medium 30 can completely or partially fill the annular gap between the sidewall of the first groove 13 and the outer wall of the second support 22. Furthermore, the first heat-conducting medium 30 is a non-gaseous medium.

[0135] In some embodiments, the first thermally conductive medium 30 can be a liquid thermally conductive medium, such as a thermally conductive gel. Because the liquid thermally conductive medium is fluid, it can completely fill the gap between the sidewall of the first groove 13 and the sidewall of the second leg 22, which helps to improve the heat exchange efficiency of the first leg 12 and the second leg 22.

[0136] Of course, liquid thermal conductive media can be other types of thermal conductive media besides thermal conductive gel, such as thermal conductive grease, thermal conductive putty, and thermal conductive adhesive.

[0137] In addition to being a liquid thermal conductive medium, the first thermal conductive medium 30 can also be a solid thermal conductive medium, such as a thermal conductive pad or a graphene thermal conductive coating.

[0138] When there are multiple first grooves 13, each first groove 13 is provided with a first heat-conducting medium 30 inside, or a portion of the multiple first grooves 13 may be provided with a first heat-conducting medium 30 inside, while another portion may not be provided with a first heat-conducting medium 30 inside.

[0139] In some possible implementations, such as Figure 1 As shown, at least one portion of the first thermally conductive medium 30 is located between the sidewall of the first groove 13 and the sidewall of the second leg 22, and another portion is located between the bottom of the first groove 13 and the end face of the second leg 22 away from the second body 21. In this way, the inner wall of the first groove 13 can exchange heat with the second leg 22 through the first thermally conductive medium 30, which can improve the heat exchange efficiency between the first leg 12 and the second leg 22 and help improve the heat dissipation performance of the electronic device.

[0140] In some embodiments, the first thermally conductive medium 30 may be an integral structure. In this case, a portion of the first thermally conductive medium 30 is located between the sidewall of the first groove 13 and the sidewall of the second leg 22, and another portion is located between the bottom of the first groove 13 and the end face of the second leg 22 away from the second body 21.

[0141] Alternatively, in some embodiments, the first heat-conducting medium 30 may include a first part and a second part. The first part is located between the groove sidewall of the first groove 13 and the sidewall of the second support 22, and the second part is located between the groove bottom of the first groove 13 and the end face of the second support 22 away from the second body 21. The first part and the second part may be in contact or not in contact. The first part may fill at least a portion of the gap between the groove sidewall of the first groove 13 and the outer wall of the second support 22, and the second part may fill at least a portion of the gap between the groove bottom of the first groove 13 and the end face of the second support 22.

[0142] When there are multiple first heat-conducting media 30, each first heat-conducting media 30 can be disposed between the side wall of the first groove 13 and the side wall of the second support 22. Alternatively, a portion of each first heat-conducting media 30 can be disposed between the side wall of the first groove 13 and the outer wall of the second support 22, and another portion can be disposed between the bottom of the first groove 13 and the end face of the second support 22. Alternatively, a portion of the multiple first heat-conducting media 30 can be disposed between the side wall of the first groove 13 and the outer wall of the second support 22, and a portion of each of the other portions of the multiple first heat-conducting media 30 can be disposed between the side wall of the first groove 13 and the outer wall of the second support 22, and another portion can be disposed between the bottom of the first groove 13 and the end face of the second support 22.

[0143] Figure 5 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application. Figure 6 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application.

[0144] See also some possible implementations. Figure 5 At least one first thermally conductive medium 30 is located between the sidewall of the first groove 13 and the sidewall of the second leg 22, with the bottom of the first groove 13 in contact with the end face of the second leg 22 away from the second body 21. This arrangement increases the heat exchange area between the first leg 12 and the second leg 22 while keeping the height of the second leg 22 and the depth of the first groove 13 constant, thereby improving the heat exchange efficiency of the first leg 12 and the second leg 22 and enhancing the heat dissipation performance of the electronic device. Furthermore, when the first leg 12 and the second leg 22 are located between the first body 11 and the second body 21, it helps to reduce the size of the heat dissipation device 100 in the first direction.

[0145] Of course, when the first heat-conducting medium 30 is located between the sidewall of the first groove 13 and the sidewall of the second support 22, the bottom of the first groove 13, in addition to contacting the end face of the second support 22, in some embodiments, see [reference needed]. Figure 6 The bottom of the first groove 13 can also be spaced apart from the end face of the second support 22, that is, the bottom of the first groove 13 and the end face of the second support 22 are not in contact.

[0146] When multiple first heat-conducting media 30 are disposed between the sidewall of the first groove 13 and the sidewall of the second support 22, the bottom of the multiple first grooves 13 can all contact the end face of the second support 22, or, a portion of the bottom of the multiple first grooves 13 can contact the end face of the second support 22, and another portion can be spaced apart from the end face of the second support 22.

[0147] Of course, in addition to the arrangement described above, in some possible implementations, at least one first heat-conducting medium 30 may also be disposed between the bottom of the first groove 13 and the end face of the second leg 22.

[0148] Figure 7 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application.

[0149] See also some possible implementations. Figure 7 At least one sidewall of the first groove 13 is in direct contact with the sidewall of the second leg 22. Therefore, the direct contact between the first leg 12 and the second leg 22 can also improve the heat exchange efficiency between the first leg 12 and the second leg 22.

[0150] In some embodiments, see continue to see Figure 7 At least one bottom of the first groove 13 is in direct contact with the end face of the second leg 22 away from the second body 21. This arrangement increases the heat exchange area between the first leg 12 and the second leg 22 while keeping the height of the second leg 22 and the depth of the first groove 13 constant, thereby improving the heat exchange efficiency and enhancing the heat dissipation performance of the electronic device. Furthermore, when the first leg 12 and the second leg 22 are located between the first body 11 and the second body 21, it helps to reduce the size of the heat dissipation device 100 in the first direction.

[0151] Of course, in some embodiments, besides directly contacting the end face of the second leg 22, the bottom of the first groove 13 may also... Figure 4 As shown, the sidewall of the first groove 13 is in direct contact with the sidewall of the second leg 22, while the bottom of the first groove 13 is spaced apart from the end face of the second leg 22.

[0152] In some possible implementations, at least one of the first leg 12 and the second leg 22 that are in direct contact is elastic; for example, both the first leg 12 and the second leg 22 are elastic. This arrangement reduces the difficulty of direct contact between the sidewall or bottom of the first groove 13 and the outer wall of the second leg 22.

[0153] The first leg 12 can be made of an elastic material, giving it elasticity. Alternatively, the first leg 12 can also be made elastic through a well-designed structure.

[0154] Similarly, the second leg 22 can be made of an elastic material, making it elastic. Alternatively, the second leg 22 can also be made elastic through a reasonable design of its structure.

[0155] Understandably, when the first leg 12 is elastic, the sidewall and / or bottom of the first groove 13 of the elastic first leg 12 can directly contact the second leg 22. Similarly, when the second leg 22 is elastic, the outer wall of the second leg 22 can directly contact the sidewall and / or bottom of the first groove 13.

[0156] In some embodiments, when the first leg 12 is elastic, the second leg 22 corresponding to the elastic first leg 12 may also be elastic. Alternatively, in some embodiments, when the first leg 12 is elastic, the second leg 22 corresponding to the elastic first leg 12 may not be elastic. Alternatively, in some embodiments, the second leg 22 corresponding to the non-elastic first leg 12 may be elastic.

[0157] It should be noted that when multiple first legs 12 are in direct contact with second legs 22, at least one of the multiple first legs 12 in direct contact with second legs 22 may be elastic. Similarly, when multiple second legs 22 are in direct contact with first legs 12, at least one of the multiple second legs 22 in direct contact with first legs 12 may be elastic.

[0158] Figure 8 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application. Figure 9 for Figure 8 A three-dimensional structural diagram of the first and second heat sink components.

[0159] In some possible implementations, such as Figure 9 As shown, along the first direction (such as...) Figure 9 In the Z-direction, at least one end face of the second leg 22, away from the second body 21, is provided with a second groove 23 that accommodates at least a portion of the corresponding first leg 12. Figure 8 As shown, by inserting the first leg 12 into the second groove 23, while ensuring a large heat exchange area between the second leg 22 and the first leg 12, the stacking size of the second leg 22 and the first leg 12 in the direction perpendicular to the first direction can be reduced. This can further reduce the influence of the second leg 22 and the first leg 12 on the size of the electronic device in the direction perpendicular to the first direction, further reduce the volume of the electronic device, and further reduce the difficulty of miniaturizing the electronic device.

[0160] The specific structure of the second groove 23 is not limited here. For example, the second groove 23 can be a rectangular groove, a circular groove, a triangular groove, or other groove structures.

[0161] When there are multiple second grooves 23, the structures of each second groove 23 may be the same or different, or, some of the multiple second grooves 23 may have the same structure and others may have different structures.

[0162] When there are multiple second legs 22, each second leg 22 can be provided with a second groove 23. For example, all four second legs 22 can be provided with a second groove 23. Of course, in addition to each second leg 22 being provided with a second groove 23, in some embodiments, some of the multiple second legs 22 can have a second groove 23 while others do not.

[0163] In some embodiments, the depth of the second groove 23 may be greater than or equal to the height of the first leg 12, which can increase the heat exchange area between the second leg 22 and the first leg 12, thus helping to improve the heat dissipation performance of the electronic device. In addition, when the second leg 22 and the first leg 12 are located between the first body 11 and the second body 21, it helps to reduce the size of the heat dissipation device 100 in the first direction, thereby reducing the impact of the heat dissipation device 100 on the size of the electronic device in the first direction.

[0164] The height of the first leg 12 refers to the dimension of the first leg 12 along the depth direction of the second groove 23.

[0165] Of course, the depth of the second groove 23 can be greater than or equal to the height of the first leg 12, or it can be less than the height of the first leg 12.

[0166] When there are multiple second grooves 23, the depths of the various second grooves 23 may be the same or different; or, a portion of the multiple second grooves 23 may have the same depth, while another portion may have different depths.

[0167] In some possible implementations, at least a portion of the inner wall of at least one second groove 23 is spaced apart from the outer wall of the first leg 12. For example, the inner wall of the second groove 23 is partially spaced apart from the outer wall of the first leg 12. By providing a gap between the inner wall of the second groove 23 and the outer wall of the first leg 12, the difficulty of inserting the first leg 12 into the second groove 23 can be reduced, which helps to reduce the assembly difficulty of the first heat sink 10 and the second heat sink 20 and improve the assembly efficiency of the heat dissipation device 100.

[0168] In some embodiments, the inner wall of at least one second groove 23 is spaced apart from the outer wall of the first support 12. This further reduces the difficulty of inserting the first support 12 into the second groove 23, and helps to improve the assembly efficiency of the first heat sink 10 and the second heat sink 20.

[0169] The gas between the inner wall of the second groove 23 and the inner wall of the first leg 12 serves as the medium for heat exchange between the second leg 22 and the first leg 12. Furthermore, the small gap between the second groove 23 and the first leg 12 ensures that the second leg 22 can exchange heat with the first leg 12, thus ensuring coordinated heat conduction between the first heat sink 10 and the second heat sink 20.

[0170] Of course, in some embodiments, in addition to being spaced apart from the outer wall of the first leg 12, the inner wall of at least one second groove 23 is spaced apart from the outer wall of the first leg 12, and another part is in direct contact with the outer wall of the first leg 12.

[0171] Specifically, a portion of the outer wall of the first support leg 12 can directly contact the side wall of the second groove 23, while another portion can be spaced apart from the bottom of the second groove 23; alternatively, a portion of the outer wall of the first support leg 12 can be spaced apart from the side wall of the second groove 23, while another portion can directly contact the bottom of the second groove 23; alternatively, a portion of the outer wall of the first support leg 12 can be spaced apart from a portion of the side wall and bottom of the second groove 23, while another portion can directly contact another portion of the bottom of the second groove 23; alternatively, a portion of the outer wall of the first support leg 12 can be directly contact a portion of the side wall and bottom of the second groove 23, while another portion can be spaced apart from another portion of the bottom of the second groove 23.

[0172] When there are multiple second grooves 23, the inner wall of each second groove 23 can be spaced apart from the outer wall of the first leg 12. Alternatively, a portion of the inner wall of one of the multiple second grooves 23 can be spaced apart from the outer wall of the first leg 12, and a portion of the inner wall of another portion can be spaced apart from the outer wall of the first leg 12. Or, a portion of the inner wall of each second groove 23 can be spaced apart from the outer wall of the first leg 12, and another portion can be in direct contact with the outer wall of the first leg 12.

[0173] In some possible implementations, such as Figure 8 As shown, the heat dissipation device 100 further includes at least one second heat-conducting medium 40. At least a portion of the second heat-conducting medium 40 is disposed between the groove sidewall of at least one second groove 23 and the sidewall of the first leg 12, and the second heat-conducting medium 40 is in contact with at least one of the first leg 12 and the second leg 22. By distributing the second heat-conducting medium 40 between the groove sidewall of the second groove 23 and the sidewall of the first leg 12, the efficiency of heat exchange between the second leg 22 and the first leg 12 can be improved, which helps to improve the heat dissipation performance of the electronic device.

[0174] The second heat-conducting medium 40 can completely or partially fill the annular gap between the sidewall of the second groove 23 and the outer wall of the first support 12. Furthermore, the second heat-conducting medium 40 is a non-gaseous medium.

[0175] In some embodiments, the second thermally conductive medium 40 can be a liquid thermally conductive medium, such as a thermally conductive gel. Because the liquid thermally conductive medium is fluid, it can completely fill the gap between the sidewall of the second groove 23 and the sidewall of the first leg 12, which helps to improve the heat exchange efficiency between the second leg 22 and the first leg 12.

[0176] Of course, liquid thermal conductive media can be other types of thermal conductive media besides thermal conductive gel, such as thermal conductive grease, thermal conductive putty, and thermal conductive adhesive.

[0177] The second thermal conductive medium 40 can be a liquid thermal conductive medium or a solid thermal conductive medium, such as a thermal conductive pad or a graphene thermal conductive coating.

[0178] When there are multiple second grooves 23, each second groove 23 is provided with a second heat-conducting medium 40 inside, or a portion of the multiple second grooves 23 may be provided with a second heat-conducting medium 40 inside, while another portion may not be provided with a second heat-conducting medium 40 inside.

[0179] In some possible implementations, at least one portion of the second heat-conducting medium 40 is located between the sidewall of the second groove 23 and the sidewall of the first leg 12, and another portion is located between the bottom of the second groove 23 and the end face of the first leg 12 away from the first body 11. In this way, the inner wall of the second groove 23 can exchange heat with the first leg 12 through the second heat-conducting medium 40, which can improve the heat exchange efficiency between the second leg 22 and the first leg 12 and help improve the heat dissipation performance of the electronic device.

[0180] In some embodiments, the second heat-conducting medium 40 may be an integral structure. In this case, a portion of the second heat-conducting medium 40 is located between the sidewall of the second groove 23 and the sidewall of the first leg 12, and another portion is located between the bottom of the second groove 23 and the end face of the first leg 12 away from the second body 21.

[0181] Alternatively, in some embodiments, the second heat-conducting medium 40 may include a first part and a second part. The first part is located between the groove sidewall of the second groove 23 and the sidewall of the first leg 12, and the second part is located between the bottom of the second groove 23 and the end face of the first leg 12 away from the second body 21. The first part and the second part may be in contact or not in contact. The first part may fill at least a portion of the gap between the groove sidewall of the second groove 23 and the outer wall of the first leg 12, and the second part may fill at least a portion of the gap between the bottom of the second groove 23 and the end face of the first leg 12.

[0182] When there are multiple second heat-conducting media 40, each second heat-conducting media 40 can be disposed between the side wall of the second groove 23 and the side wall of the first support 12. Alternatively, a portion of each second heat-conducting media 40 can be disposed between the side wall of the second groove 23 and the outer wall of the first support 12, and another portion can be disposed between the bottom of the second groove 23 and the end face of the first support 12. Alternatively, a portion of the multiple second heat-conducting media 40 can be disposed between the side wall of the second groove 23 and the outer wall of the first support 12, and a portion of each of the other portions of the multiple second heat-conducting media 40 can be disposed between the side wall of the second groove 23 and the outer wall of the first support 12, and another portion can be disposed between the bottom of the second groove 23 and the end face of the first support 12.

[0183] In some possible implementations, at least one second heat-conducting medium 40 is located between the sidewall of the second groove 23 and the sidewall of the first leg 12, with the bottom of the second groove 23 contacting the end face of the first leg 12 away from the first body 11. This arrangement, while keeping the height of the first leg 12 and the depth of the second groove 23 constant, increases the heat exchange area between the second leg 22 and the first leg 12, thereby improving the heat exchange efficiency and enhancing the heat dissipation performance of the electronic device. Furthermore, when the second leg 22 and the first leg 12 are located between the first body 11 and the second body 21, it helps to reduce the size of the heat dissipation device 100 in the first direction.

[0184] Of course, when the second heat-conducting medium 40 is located between the side wall of the second groove 23 and the side wall of the first support 12, in addition to contacting the end face of the first support 12, in some embodiments the bottom of the second groove 23 may also be spaced apart from the end face of the first support 12, that is, the bottom of the second groove 23 and the end face of the first support 12 are not in contact.

[0185] When multiple second heat-conducting media 40 are disposed between the sidewall of the second groove 23 and the sidewall of the first support 12, the bottom of the multiple second grooves 23 can all contact the end face of the first support 12, or, a portion of the bottom of the multiple second grooves 23 can contact the end face of the first support 12, and another portion can be spaced apart from the end face of the first support 12.

[0186] Of course, in addition to the arrangement described above, in some possible implementations, at least one second heat-conducting medium 40 may also be disposed between the bottom of the second groove 23 and the end face of the first leg 12.

[0187] In some possible implementations, at least one sidewall of the second groove 23 is in direct contact with the sidewall of the first leg 12. Therefore, direct contact between the second leg 22 and the first leg 12 can also improve the heat exchange efficiency between the second leg 22 and the first leg 12.

[0188] In some embodiments, the bottom of at least one second groove 23 directly contacts the end face of the first leg 12 away from the first body 11. This configuration, while keeping the height of the first leg 12 and the depth of the second groove 23 constant, increases the heat exchange area between the second leg 22 and the first leg 12, thereby improving the heat exchange efficiency and enhancing the heat dissipation performance of the electronic device. Furthermore, when the second leg 22 and the first leg 12 are located between the first body 11 and the second body 21, it helps to reduce the size of the heat dissipation device 100 in the first direction.

[0189] Of course, in addition to directly contacting the end face of the first leg 12, in some embodiments, the bottom of the second groove 23 is also spaced apart from the end face of the first leg 12 while the side wall of the second groove 23 is directly contacting the side wall of the first leg 12.

[0190] In some possible implementations, at least one of the directly contacting second leg 22 and first leg 12 is elastic; for example, both second leg 22 and first leg 12 are elastic. This arrangement reduces the difficulty of direct contact between the sidewall or bottom of the second groove 23 and the outer wall of the first leg 12.

[0191] The first leg 12 can be made of an elastic material, giving it elasticity. Alternatively, the first leg 12 can also be made elastic through a well-designed structure.

[0192] Similarly, the second leg 22 can be made of an elastic material, making it elastic. Alternatively, the second leg 22 can also be made elastic through a reasonable design of its structure.

[0193] Understandably, when the first leg 12 is elastic, the outer wall of the first leg 12 can directly contact the side wall and / or bottom of the second groove 23. Similarly, when the second leg 22 is elastic, the side wall and / or bottom of the second groove 23 of the elastic second leg 22 can directly contact the first leg 12.

[0194] In some embodiments, when the second leg 22 is elastic, the first leg 12 corresponding to the elastic second leg 22 may also be elastic. Alternatively, in some embodiments, when the second leg 22 is elastic, the first leg 12 corresponding to the elastic second leg 22 may not be elastic. Alternatively, in some embodiments, the first leg 12 corresponding to the non-elastic second leg 22 may be elastic.

[0195] It should be noted that when multiple second legs 22 are in direct contact with the first leg 12, at least one of the multiple second legs 22 in direct contact with the first leg 12 may be elastic. Similarly, when multiple first legs 12 are in direct contact with the second legs 22, at least one of the multiple first legs 12 in direct contact with the second legs 22 may be elastic.

[0196] In summary, the relative relationship between the second groove 23 and the first support 12 is basically the same as the relative relationship between the first groove 13 and the second support 22. Therefore, the relative relationship between the second groove 23 and the first support 12 can be determined by referring to... Figures 1 to 7 The relative relationship between the first groove 13 and the second leg 22 is shown.

[0197] Figure 10 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application.

[0198] See also some possible implementations. Figure 10 Along a direction perpendicular to the first direction (e.g.) Figure 10In the Y direction, at least one first leg 12 and a corresponding second leg 22 are arranged side by side. With this arrangement, the sidewall portion of the first leg 12 and the sidewall portion of the second leg 22 are positioned opposite each other in a direction perpendicular to the first direction, which can also realize heat exchange between the first leg 12 and the second leg 22, and achieve heat conduction synergy between the first heat sink 10 and the second heat sink 20.

[0199] When there are multiple first legs 12, each first leg 12 and its corresponding second leg 22 can be arranged side by side, or a portion of the multiple first legs 12 and its corresponding second leg 22 can be arranged side by side, and each of the other portions can have a first groove 13 or each corresponding second leg 22 has a second groove 23.

[0200] When the first leg 12 and the second leg 22 are arranged side by side in a direction perpendicular to the first direction, the orthographic projections of the first leg 12 and the corresponding second leg 22 on the projection plane do not coincide, or the orthographic projections of the first leg 12 and the corresponding second leg 22 on the projection plane may partially coincide.

[0201] When the first leg 12 and the corresponding second leg 22 are arranged side by side, in some embodiments, such as Figure 10 As shown, at least one sidewall of the first leg 12 is in direct contact with at least one corresponding sidewall of the second leg 22. This direct contact between the sidewalls of the first leg 12 and the second leg 22 improves the heat transfer efficiency of both legs, thus enhancing the heat dissipation performance of the electronic device.

[0202] When multiple first legs 12 and corresponding second legs 22 are arranged side by side in a direction perpendicular to the first direction, the sidewall of each first leg 12 can directly contact the sidewall of the corresponding second leg 22, or a portion of the sidewall of the multiple first legs 12 can directly contact the sidewall of the corresponding second leg 22.

[0203] In some embodiments, at least one of the first leg 12 and the second leg 22 that are in direct contact is elastic, which can reduce the difficulty of direct contact between the sidewalls of the first leg 12 and the sidewalls of the second leg 22, allowing the sidewalls of the first leg 12 and the second leg 22 to be in close contact. Additionally, deformation of the first leg 12 and / or the second leg 22 can facilitate assembly of the first leg 12 and the corresponding second leg 22, reducing the difficulty of assembly.

[0204] The details of how to make the first leg 12 and / or the second leg 22 elastic have been described in detail above, so they will not be elaborated on here.

[0205] Figure 11This is another schematic diagram of the heat dissipation device provided in the embodiments of this application.

[0206] When the first leg 12 and the corresponding second leg 22 are arranged side by side, in some embodiments, see [link to relevant documentation]. Figure 11 At least one sidewall of the first leg 12 is spaced apart from the sidewall of the corresponding at least one second leg 22. Heat exchange between the first leg 12 and the second leg 22 is achieved through the gas between their sidewalls, enabling coordinated heat conduction of the first heat sink 10 and the second heat sink 20. This fully utilizes the heat dissipation capabilities of the first heat sink 10 and the second heat sink 20, improving the heat dissipation performance of the electronic device.

[0207] The sidewalls of the first leg 12 and the second leg 22 are spaced apart in a direction perpendicular to the first direction, which can reduce the difficulty of assembling the first leg 12 and the second leg 22 and improve the assembly efficiency of the first heat sink 10 and the second heat sink 20.

[0208] When the first leg 12 corresponds to multiple second legs 22, the side wall of the first leg 12 can be spaced apart from the side walls of the corresponding second legs 22, or the side wall of the first leg 12 can be spaced apart from a portion of the side walls of the multiple second legs 22 and directly contact the other portion of the side walls.

[0209] In some embodiments, see Figure 11 The outer wall of at least one first leg 12 is spaced apart from the outer wall of at least one corresponding second leg 22. Therefore, the outer walls of the first leg 12 and the second leg 22 do not directly contact each other, which further reduces the assembly difficulty of the first leg 12 and the second leg 22.

[0210] When the first leg 12 corresponds to multiple second legs 22, the outer wall of the first leg 12 can be spaced apart from the outer walls of the corresponding second legs 22, or the outer wall of the first leg 12 can be spaced apart from a portion of the outer walls of the multiple second legs 22 and spaced apart from a portion of the side wall of another portion.

[0211] When the outer wall of the first leg 12 is partially spaced from the outer wall of the second leg 22, the end face of the first leg 12 away from the first body 11 along the first direction can directly contact the outer wall of the second leg 22. Alternatively, a portion of the side wall of the first leg 12 is spaced from the outer wall of the second leg 22, while another portion directly contacts the outer wall of the second leg 22.

[0212] Figure 12 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application.

[0213] See also some possible implementations. Figure 12 The heat dissipation device 100 further includes a third heat-conducting medium 50. The third heat-conducting medium 50 is disposed between the sidewall of at least one first leg 12 and the sidewall of at least one corresponding second leg 22, and is in contact with at least one of the first leg 12 and the second leg 22. By distributing the third heat-conducting medium 50 between the sidewalls of the first leg 12 and the second leg 22, the efficiency of heat exchange between the first leg 12 and the second leg 22 can be improved, thereby fully utilizing the heat dissipation capacity of the first heat sink 10 and the second heat sink 20, and contributing to improved heat dissipation performance of the electronic device.

[0214] The third heat-conducting medium 50 is a non-gas contact medium. Furthermore, the third heat-conducting medium 50 can completely or partially fill the gap between the sidewalls of the first leg 12 and the second leg 22.

[0215] In some embodiments, the third thermally conductive medium 50 can be a liquid thermally conductive medium, such as a thermally conductive gel. Because the liquid thermally conductive medium is fluid, it can completely fill the gap between the sidewall of the first groove 13 and the sidewall of the second leg 22, which helps to improve the heat exchange efficiency of the first leg 12 and the second leg 22.

[0216] Of course, liquid thermal conductive media can be other types of thermal conductive media besides thermal conductive gel, such as thermal conductive grease, thermal conductive putty, and thermal conductive adhesive.

[0217] The third thermal conductive medium 50 can be a liquid thermal conductive medium or a solid thermal conductive medium, such as a thermal conductive pad or a graphene thermal conductive coating.

[0218] When multiple first legs 12 and corresponding second legs 22 are arranged side by side in a direction perpendicular to the first direction, a third heat-conducting medium 50 can be provided between the side wall of each first leg 12 and the side wall of the corresponding second leg 22, or a third heat-conducting medium 50 can be provided between a portion of the side wall of the multiple first legs 12 and the side wall of the corresponding second leg 22.

[0219] In summary, the arrangement of the first leg 12 and the second leg 22 can include, but is not limited to, the following three: 1. The first leg 12 has a first groove 13, which accommodates at least a portion of the second leg 22. 2. The second leg 22 has a second groove 23, which accommodates at least a portion of the first leg 12. 3. The first leg 12 and the second leg 22 are arranged side by side along a direction perpendicular to the first direction.

[0220] When there are multiple first legs 12, the arrangement of each first leg 12 and its corresponding second leg 22 can be any one of the three schemes mentioned above, or the arrangement of multiple first legs 12 and their corresponding second legs 22 can adopt two of the three schemes mentioned above, or the arrangement of the first part of multiple first legs 12 and their corresponding second legs 22 can adopt the first of the three schemes mentioned above, the arrangement of the second part and their corresponding second legs 22 can adopt the second of the three schemes mentioned above, and the arrangement of the third part and their corresponding second legs 22 can adopt the third of the three schemes mentioned above.

[0221] In some possible implementations, at least one of the first heat sink 10 and the second heat sink 20 is a metal heat sink; for example, both the first heat sink 10 and the second heat sink 20 can be metal heat sinks. This configuration helps to improve the heat dissipation capacity of the first heat sink 10 and / or the second heat sink 20, thereby further improving the heat dissipation capacity of the heat dissipation device 100.

[0222] Of course, besides being a metal heat sink, the first heat sink 10 can also be a non-metal heat sink, for example, the material of the first heat sink 10 can be ceramic material, thermally conductive plastic, etc. Similarly, besides being a metal heat sink, the second heat sink 20 can also be a non-metal heat sink, for example, the material of the second heat sink 20 can be ceramic material, thermally conductive plastic, etc.

[0223] In some embodiments, both the first heat sink 10 and the second heat sink 20 can be metal heat sinks. Alternatively, in some embodiments, one of the first heat sink 10 and the second heat sink 20 can be a metal heat sink.

[0224] In some possible implementations, at least one of the first heat sink 10 and the second heat sink 20 is a heat sink; for example, both the first heat sink 10 and the second heat sink 20 can be heat sinks. In this way, the first heat sink 10 and / or the second heat sink 20 have a large heat dissipation area, resulting in better heat dissipation capabilities.

[0225] There are no restrictions on the specific structure of the heat sink. For example, the heat sink may include a body and multiple heat dissipation fins.

[0226] Figure 13 This is another structural schematic diagram of the electronic device provided in the embodiments of this application.

[0227] See also some possible implementations. Figure 13In this configuration, one of the first heat sink 10 and the second heat sink 20 (e.g., the second heat sink 20) ​​is a heat sink, and the other (e.g., the first heat sink 10) is part of the electronic device's casing. The casing is the external component of the electronic device that is visible to the user when the device is in its complete state. Both the heat sink and the device to be cooled 200 are located inside the casing. By using a part of the external component as the first heat sink 10 and / or the second heat sink 20, the number of parts in the electronic device can be reduced while improving its heat dissipation performance.

[0228] The outer casing may include a bottom shell and a top shell, which are fixedly connected and form a cavity to accommodate the device to be cooled 200 and other devices such as heat sinks. One of the top shell and the bottom shell serves as either the first heat sink 10 or the second heat sink 20. For example, see [link to relevant documentation]. Figure 13 The bottom shell serves as the first heat dissipation component 10.

[0229] When the bottom shell serves as the first heat sink 10 or the second heat sink 20, the material of the bottom shell can be a metallic material or a non-metallic material. Similarly, when the top shell serves as the first heat sink 10 or the second heat sink 20, the material of the top shell can also be a metallic material or a non-metallic material.

[0230] In some possible implementations, the first heat sink 10 or the second heat sink 20, which is part of the housing, is a metal heat sink. For example, when the bottom shell of the housing serves as the first heat sink 10 or the second heat sink 20, the bottom shell is a metal heat sink. This configuration can improve the heat dissipation performance of the electronic device.

[0231] Of course, in addition to using a portion of the electronic device's casing as the first heat sink 10 and the second heat sink 20, in some possible implementations, the electronic device also includes a casing, with the heat sink 100 and the device to be cooled 200 both located inside the casing. In this case, the casing and the first heat sink 10 and the second heat sink 20 are two independent parts.

[0232] In some possible implementations, the electronic device further includes a fourth thermally conductive medium 60. Along the first direction, the fourth thermally conductive medium 60 is disposed on both sides of the device to be cooled 200. The fourth thermally conductive medium 60 is disposed between the first body 11 and the device to be cooled 200, and between the second body 21 and the device to be cooled 200. The first body 11 exchanges heat with the device to be cooled 200 through the fourth thermally conductive medium 60, and the second body 21 exchanges heat with the device to be cooled 200 through the fourth thermally conductive medium 60. This arrangement allows the heat generated by the device to be cooled 200 to be transferred to the first heat sink 10 and the second heat sink 20 in a timely manner, ensuring that the temperature of the device to be cooled 200 remains within a reasonable range.

[0233] The fourth thermal conductive medium 60 can be a thermal pad, or it can be other structures, such as a graphene thermal conductive sheet.

[0234] Of course, in addition to providing the fourth heat-conducting medium 60 on both sides of the heat-dissipating device 200, in some embodiments, the fourth heat-conducting medium 60 can also be provided on one side of the heat-dissipating device 200 in the first direction, for example, the fourth heat-conducting medium 60 can be provided on the side of the heat-dissipating device 200 close to the first body 11.

[0235] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0236] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation device (100), characterized in that, The heat dissipation device (100) is used to dissipate heat from the device to be cooled (200), and the heat dissipation device (100) includes: The first heat sink (10) includes a first body (11) and at least one first leg (12); The second heat sink (20) includes a second body (21) and at least one second leg (22). The first body (11) and the second body (21) are spaced apart. The gap between the first body (11) and the second body (21) is used to accommodate at least a portion of the heat sink (200). Each first leg (12) and at least one second leg (22) that can exchange heat with it are corresponding. Along a direction perpendicular to the first direction, the projection of each first leg (12) on the projection plane at least partially coincides with the projection of the corresponding second leg (22) on the projection plane. The projection plane is a plane that passes through the first body (11) and the second body (21). The projection plane is parallel to the first direction, which is the arrangement direction of the first body (11) and the second body (21).

2. The heat dissipation device (100) according to claim 1, characterized in that, Along the first direction, at least one of the first legs (12) has a first groove (13) on one end face away from the first body (11), the first groove (13) being used to accommodate at least a portion of the second leg (22).

3. The heat dissipation device (100) according to claim 2, characterized in that, At least a portion of the inner wall of at least one of the first grooves (13) is spaced apart from the outer wall of the second leg (22).

4. The heat dissipation device (100) according to claim 3, characterized in that, The heat dissipation device (100) further includes at least one first thermally conductive medium (30), at least a portion of the first thermally conductive medium (30) is disposed between the groove sidewall of at least one of the first groove (13) and the sidewall of the second support (22), and the first thermally conductive medium (30) is in contact with at least one of the first support (12) and the second support (22).

5. The heat dissipation device (100) according to claim 4, characterized in that, The first heat-conducting medium (30) is a liquid heat-conducting medium.

6. The heat dissipation device (100) according to claim 4, characterized in that, At least one portion of the first thermally conductive medium (30) is located between the sidewall of the first groove (13) and the sidewall of the second support (22), and another portion is located between the bottom of the first groove (13) and the end face of the second support (22) away from the second body (21); or, At least one of the first thermally conductive media (30) is located between the sidewall of the first groove (13) and the sidewall of the second leg (22), and the bottom of the first groove (13) is in contact with the end face of the second leg (22) away from the second body (21).

7. The heat dissipation device (100) according to claim 3, characterized in that, At least one of the inner walls of the first groove (13) is spaced apart from the outer wall of the second leg (22).

8. The heat dissipation device (100) according to claim 2, characterized in that, At least one of the groove sidewalls of the first groove (13) is in direct contact with the sidewall of the second leg (22).

9. The heat dissipation device (100) according to claim 8, characterized in that, At least one of the bottoms of the first groove (13) is in direct contact with the end face of the second leg (22) away from the second body (21).

10. The heat dissipation device (100) according to claim 8 or 9, characterized in that, At least one of the first leg (12) and the second leg (22) that are in direct contact is elastic.

11. The heat dissipation device (100) according to any one of claims 1-9, characterized in that, Along the first direction, at least one of the second legs (22) has a second groove (23) on one end face away from the second body (21) that accommodates at least a portion of the corresponding first leg (12).

12. The heat dissipation device (100) according to any one of claims 1-9, characterized in that, Along a direction perpendicular to the first direction, at least one of the first legs (12) and the corresponding second leg (22) are arranged side by side.

13. The heat dissipation device (100) according to claim 12, characterized in that, At least one sidewall of the first leg (12) is in direct contact with at least one corresponding sidewall of the second leg (22).

14. The heat dissipation device (100) according to claim 13, characterized in that, At least one of the first leg (12) and the second leg (22) that are in direct contact is elastic.

15. The heat dissipation device (100) according to claim 12, characterized in that, The sidewall of at least one of the first legs (12) is spaced apart from the sidewall of the corresponding at least one of the second legs (22).

16. The heat dissipation device (100) according to claim 15, characterized in that, The outer wall of at least one of the first legs (12) is spaced apart from the outer wall of at least one of the corresponding second legs (22).

17. The heat dissipation device (100) according to claim 15, characterized in that, The heat dissipation device (100) further includes a third thermal conductive medium (50), at least a portion of which is disposed between the sidewall of at least one of the first legs (12) and the sidewall of at least one corresponding second leg (22), and the third thermal conductive medium (50) is in contact with at least one of the first legs (12) and the second legs (22).

18. The heat dissipation device (100) according to any one of claims 1-9, characterized in that, Along the first direction, at least one first leg (12) and the corresponding second leg (22) are located between the first body (11) and the second body (21).

19. The heat dissipation device (100) according to any one of claims 1-9, characterized in that, At least one of the first heat sink (10) and the second heat sink (20) is a metal heat sink.

20. The heat dissipation device (100) according to any one of claims 1-9, characterized in that, At least one of the first heat sink (10) and the second heat sink (20) is a heat sink.

21. An electronic device, characterized in that, It includes the heat dissipation device (200) and the heat dissipation device (100) as described in any one of claims 1-20; At least a portion of the heat-dissipating device (200) is located between the first body (11) and the second body (21).

22. The electronic device according to claim 21, characterized in that, The heat dissipation device (200) includes a circuit board (210) and electronic devices (220) disposed on the circuit board (210).

23. The electronic device according to claim 21, characterized in that, One of the first heat sink (10) and the second heat sink (20) is a heat sink, and the other is part of the housing of the electronic device. The housing is the appearance part of the electronic device that is visible to the user when the device is in its complete state. The heat sink and the device to be cooled (200) are both located inside the housing.

24. The electronic device according to claim 23, characterized in that, The first heat sink (10) or the second heat sink (20), which is part of the housing, is a metal heat sink.

25. The electronic device according to claim 21, characterized in that, The electronic device also includes a housing, and the heat dissipation device (100) and the device to be cooled (200) are both located inside the housing.

26. The electronic device according to claim 21, characterized in that, The electronic device is one of the following products: a panel, a router, or a switch.

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