Horizontal heat sink assembly

Abstract

The horizontal heat dissipation assembly comprises a heat radiator, a heat radiator shell, a heat dissipation fin and a heat generating device; the heat radiator shell is installed on a horizontal installation surface of the heat radiator; the heat dissipation fin and the heat generating device are sequentially arranged in a sealed inner cavity, and the sealed inner cavity is filled with potting glue, wherein the sealed inner cavity is an inner cavity surrounded by the horizontal installation surface and the heat radiator shell. The horizontal heat dissipation assembly has the advantages that the heat dissipation fin and the heat generating device are sequentially arranged in the inner cavity surrounded by the horizontal installation surface and the heat radiator shell, so that the heat dissipation fin and the heat generating device are horizontally installed, the stacking space is effectively utilized, the planar space is reduced, the required installation space is small, and the inner cavity is filled with the potting glue, so that the heat generating device is cooled by the potting glue, and the heat dissipation efficiency is higher than that of conventional air cooling.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in power modules, and more specifically, to a horizontal heat dissipation component. Background Technology

[0002] Metal-oxide-semiconductor field-effect transistors (MOSFETs) are one of the main heat-generating components in power modules. The current conventional heat dissipation design involves mounting a ceramic plate on a vertical heatsink, then securing the MOSFET to the ceramic plate, and finally dissipating heat through the cool air blown out by the heatsink. However, this method has drawbacks: vertical heatsinks require significant installation space, and air cooling efficiency is relatively low. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a horizontal heat dissipation component that requires little installation space and has high heat dissipation efficiency, in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by this utility model to solve its technical problem is: to construct a horizontal heat dissipation component, including: a radiator, a radiator housing, heat sinks, and a heating element; the radiator housing is mounted on the horizontal mounting surface of the radiator; the heat sinks and the heating element are arranged horizontally in sequence in a sealed inner cavity, the sealed inner cavity contains potting compound, wherein the sealed inner cavity is an inner cavity surrounded by the horizontal mounting surface and the radiator housing.

[0005] In the horizontal heat dissipation assembly of this utility model, the heat sink housing includes a mounting frame and a cover; the mounting frame is fixed on the horizontal mounting surface, the first side of the heat sink is in contact with the horizontal mounting surface, and the second side of the heat sink is in contact with the heat-generating device.

[0006] In the horizontal heat dissipation assembly of this utility model, a mounting frame is provided on the side of the mounting frame facing the horizontal mounting surface; the heat sink is mounted in the mounting frame; a mounting square hole is further provided in the mounting frame, and the first side of the heat-generating device passes through the mounting square hole and fits against the second side of the heat sink.

[0007] In the horizontal heat dissipation assembly of this utility model, the mounting frame is a rectangular mounting frame, and two mounting frames are horizontally arranged in the rectangular mounting frame, with one heat sink installed in each mounting frame; each mounting frame is provided with two mounting square holes, and each mounting square hole corresponds to one heat-generating device.

[0008] In the horizontal heat dissipation assembly of this utility model, the four corners of the rectangular mounting frame are respectively provided with L-shaped limiting parts for limiting the heat sink.

[0009] In the horizontal heat dissipation assembly of this utility model, bolts are installed on the cover, a first mounting screw hole is provided on each heat-generating device, a second mounting screw hole is provided on each heat sink, and a third mounting screw hole is provided on the horizontal mounting surface; the mounting bolts, the first mounting screw hole, the second mounting screw hole, and the third mounting screw hole correspond one-to-one with each other; the cover and each of the heat-generating devices are fixed to the horizontal mounting surface by the mounting bolts, the first mounting screw hole, the second mounting screw hole, and the third mounting screw hole.

[0010] In the horizontal heat dissipation assembly described in this utility model, the cover is provided with multiple pin holes corresponding to the pin positions of each heat-generating device.

[0011] In the horizontal heat dissipation assembly described in this utility model, the heat sink housing is a plastic insulating housing, the heat-generating device includes a power transistor, a square inductor or a square resistor; and the heat sink is a rectangular ceramic heat sink.

[0012] In the horizontal heat dissipation assembly of this utility model, a plurality of heat dissipation fins are provided on the side of the heat sink facing away from the horizontal mounting surface; an adhesive filling port is provided in the center of the heat dissipation fins.

[0013] The technical solution adopted by this utility model to solve its technical problem is as follows: A horizontal heat dissipation assembly is constructed, comprising: a radiator, a radiator housing, a first heat sink, a second heat sink, a first heating element, a second heating element, a third heating element, and a fourth heating element; the radiator housing includes a mounting frame and a cover; the cover and the mounting frame are fixed together on the horizontal mounting surface; the mounting frame includes a first mounting frame and a second mounting frame; the first heat sink is mounted on the first mounting frame, and the second radiator is mounted on the second mounting frame; the first mounting frame is provided with a first mounting square hole and a second mounting square hole; the second mounting frame is provided with a third mounting square hole and a fourth mounting square hole; the first side surface of the first heat sink and the first side surface of the second heat sink are both aligned with the horizontal mounting surface. Surface bonding; the first side of the first heating element passes through the first mounting square hole and is bonded to the second side of the first heat sink, the first side of the second heating element passes through the second mounting square hole and is bonded to the second side of the first heat sink; the first side of the third heating element passes through the third mounting square hole and is bonded to the second side of the second heat sink, the first side of the fourth heating element passes through the fourth mounting square hole and is bonded to the second side of the second heat sink; the first heat sink, the second heat sink, the first heating element, the second heating element, the third heating element and the fourth heating element are all housed in a sealed inner cavity, the sealed inner cavity contains potting compound, and the sealed inner cavity is an inner cavity surrounded by the horizontal mounting surface, the mounting frame and the cover.

[0014] The horizontal heat dissipation assembly of this utility model has heat sinks and heating elements arranged sequentially on the horizontal mounting surface of the heat sink and in the inner cavity enclosed by the heat sink shell. Therefore, the heat sinks and heating elements are installed horizontally, which can effectively utilize the stacked space, thereby reducing the planar space and requiring less installation space. At the same time, the inner cavity is filled with potting compound, so the heating elements dissipate heat through the potting compound, which is more efficient than conventional air cooling. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is an exploded structural diagram of the horizontal heat dissipation component of this utility model. Figure 2 This is a schematic diagram of the combined structure of the horizontal heat dissipation component of this utility model; Figure 3 yes Figure 2 A schematic diagram of the horizontal heat dissipation assembly from another angle; Figure 4 yes Figure 2 A schematic diagram of the horizontal heat dissipation assembly from another angle; Figure 5 yes Figure 2 The diagram shows another angle of the horizontal heat dissipation assembly. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0017] Figure 1 This is an exploded structural diagram of the horizontal heat dissipation component of this utility model. Figure 2 This is a schematic diagram of the combined structure of the horizontal heat dissipation component of this utility model; Figure 3 yes Figure 2 A schematic diagram of the horizontal heat dissipation assembly from another angle; Figure 4 yes Figure 2 A schematic diagram of the horizontal heat dissipation assembly from another angle; Figure 5 yes Figure 2 The diagram shows another angle of the horizontal heat dissipation assembly.

[0018] like Figures 1-5 As shown, the horizontal heat dissipation assembly of this utility model includes: a radiator 100, a radiator housing 200, heat sink 300, and a heat-generating device 400; the radiator housing 200 is mounted on the horizontal mounting surface 110 of the radiator 100; the heat sink 300 and the heat-generating device 400 are arranged horizontally in sequence within a sealed inner cavity. In this preferred embodiment, the sealed inner cavity is the cavity formed by the horizontal mounting surface 110 and the radiator housing 200, and the inner cavity is filled with potting compound.

[0019] In the horizontal heat dissipation assembly of this utility model, the heat sink 300 and the heat-generating device 400 are arranged horizontally in sequence in the inner cavity formed by the horizontal mounting surface 110 and the heat sink housing 200. Therefore, the heat sink 300 and the heat-generating device 400 are installed horizontally, which can effectively utilize the stacked space, that is, reduce the planar space and thus require less installation space. At the same time, the inner cavity is filled with potting compound, so the heat-generating device dissipates heat through the potting compound, which is more efficient than conventional air cooling.

[0020] It should be further noted that, in this application, "horizontal" means that the heat sink 300 and the heating element 400 are horizontally disposed on the horizontal mounting surface 110 of the radiator 100, which is the opposite of "vertical" installation. "Vertical" installation, on the other hand, means that the heat sink and the heating element are disposed on the vertical mounting surface of the radiator, that is, on two surfaces perpendicular to the horizontal mounting surface 110.

[0021] In a preferred embodiment of this invention, the heat sink 100 can be any heat sink known in the art, preferably rectangular in shape with a large horizontal mounting surface 110, and multiple heat dissipation fins 120 are provided on the side facing away from the horizontal mounting surface 110. A potting port 140 is provided at the center of each heat dissipation fin 120 to facilitate the pouring of potting compound. Of course, potting ports can also be provided at other locations, as long as potting compound can be poured in.

[0022] In a preferred embodiment of this utility model, the heat sink housing 200 is a plastic insulating housing, the heating device 400 includes a power transistor, a square inductor, or a square resistor; and the heat sink 300 is a rectangular ceramic heat sink 300. Using a plastic heat sink housing further enhances insulation protection.

[0023] Further as Figure 1 As shown, the radiator housing 200 includes a mounting frame 210 and a cover 220; the mounting frame 210 is fixed on the horizontal mounting surface 110, the first side 310 of the heat sink 300 is in contact with the horizontal mounting surface 110, and the second side 320 of the heat sink 300 is in contact with the heat-generating device 400.

[0024] Further as Figure 1 As shown, a mounting frame 211 is provided on the side of the mounting frame 210 facing the horizontal mounting surface 110; the heat sink 300 is installed in the mounting frame 211; a mounting square hole 212 is further provided in the mounting frame 211, and the first side 410 of the heating device 400 passes through the mounting square hole 212 and fits against the second side 320 of the heat sink 300.

[0025] exist Figure 1 In the preferred embodiment shown, the mounting frame 210 is a rectangular mounting frame, with two horizontally arranged mounting frames 211 within it. Each mounting frame 211 houses one heat sink 300. Each mounting frame 211 has two mounting square holes 212, each corresponding to a heat-generating device 400. That is, as... Figure 1As shown, the mounting frame 210 includes a first mounting frame 211 and a second mounting frame 211. The heat sink includes a first heat sink 300 and a second heat sink 300. The heating device includes a first heating device 400, a second heating device 400, a third heating device 400, and a fourth heating device 400. The first heat sink 300 is mounted in the first mounting frame 211, and the second heat sink 100 is mounted in the second mounting frame 211. The first mounting frame 211 has a first mounting square hole 212 and a second mounting square hole 212. The second mounting frame 211 has a third mounting square hole 212 and a fourth mounting square hole 212. The first side of the first heat sink 300 and the second side of the second heat sink 300 are both in contact with the horizontal mounting surface 110. The first side of the first heating device 400 passes through the first mounting square hole 212 and is in contact with the second side of the first heat sink 300. The first side of the second heating device 400 passes through the first mounting square hole 212 and is in contact with the second side of the first heat sink 300. The second mounting square hole 212 is fitted to the second side of the first heat sink 300; the first side of the third heating element 400 passes through the third mounting square hole 212 and is fitted to the second side of the second heat sink 300; the first side of the fourth heating element 400 passes through the fourth mounting square hole 212 and is fitted to the second side of the second heat sink 300; the first heat sink 300, the second heat sink 300, the first heating element 400, the second heating element 400, the third heating element 400, and the fourth heating element 400 are all housed within the cavity formed by the horizontal mounting surface 110, the mounting frame 210, and the cover 220. Here, the shapes of the mounting frame 210, the cover 220, and the horizontal mounting surface 110 can be matched to each other. Figure 1 As shown, they are preferably all rectangular. Furthermore, although this invention employs a scheme of two heat sinks to dissipate heat from four heat-generating devices, those skilled in the art will understand that each heat-generating device can be assigned to one heat sink, or multiple heat-generating devices can correspond to one heat sink, or multiple heat sinks can correspond to one heat-generating device. Furthermore, depending on the size of the horizontal mounting surface 110 of the heat sink, the number of heat-generating devices installed can be adjusted according to actual needs, and all of these fall within the protection scope of this invention.

[0026] Further as Figure 1 As shown, the four corners of the rectangular mounting frame 210 are respectively provided with L-shaped limiting parts 213 for limiting the installation of the heat sink 300 therein.

[0027] Further as Figure 1As shown, four bolts 221 are installed on the cover 220, each heating element 400 is provided with a first mounting screw hole 430, each heat sink 300 is provided with a second mounting screw hole 330, and a third mounting screw hole is provided on the horizontal mounting surface 110; the mounting bolts 430, the first mounting screw holes, the second mounting screw holes 330, and the third mounting screw holes correspond one-to-one with each other; the cover 220 and each of the heating elements 400 are fixed to the horizontal mounting surface 110 by the mounting bolts 221, the first mounting screw holes 430, the second mounting screw holes 330, and the third mounting screw holes. Of course, it should be noted that in other preferred embodiments of this utility model, any known fixing method can also be used to fix the cover 220, the mounting frame 210, the heat sink 100, the heat sink housing 200, the heat sink 300, and the heating elements 400 together, and any fixing method falls within the protection scope of this utility model. Further as... Figure 1 As shown, the cover 220 is provided with multiple pin holes 222 corresponding to the pin positions 440 of each heating device 400.

[0028] Combination Figures 1-5This utility model further discloses a horizontal heat dissipation assembly, including: a radiator 100, a radiator housing 200, a first heat sink 300, a second heat sink 300, a first heating element 400, a second heating element 400, a third heating element 400, and a fourth heating element 400; the radiator housing 200 includes a mounting frame 210 and a cover 220; the cover 220 and the mounting frame 210 are fixed together on the horizontal mounting surface 110; the mounting frame 210 includes a first mounting frame 211 and a second mounting frame 211, the first heat sink 300 is mounted in the first mounting frame 211, and the second radiator 100 is mounted in the second mounting frame 211; the first mounting frame 211 is provided with a first mounting square hole and a second mounting square hole; the second mounting frame 211 is provided with a third mounting square hole and a fourth mounting square hole; the first side of the first heat sink 300 and the second heat sink 300... The second side surfaces are all in contact with the horizontal mounting surface 110; the first side surface of the first heating element 400 passes through the first mounting square hole and is in contact with the second side surface of the first heat sink 300, the first side surface of the second heating element 400 passes through the second mounting square hole and is in contact with the second side surface of the first heat sink 300; the first side surface of the third heating element 400 passes through the third mounting square hole and is in contact with the second side surface of the second heat sink 300, the first side surface of the fourth heating element 400 passes through the fourth mounting square hole and is in contact with the second side surface of the second heat sink 300; the first heat sink 300, the second heat sink 300, the first heating element 400, the second heating element 400, the third heating element 400 and the fourth heating element 400 are all housed in the cavity formed by the horizontal mounting surface 110, the mounting frame 210 and the cover 220, and the cavity is filled with potting compound.

[0029] In a preferred embodiment of this invention, the heat sink 100 can be any heat sink known in the art, preferably rectangular in shape with a large horizontal mounting surface 110, and multiple heat dissipation fins 120 are provided on the side facing away from the horizontal mounting surface 110. A potting port 140 is provided at the center of each heat dissipation fin 120 to facilitate the pouring of potting compound. Of course, potting ports can also be provided at other locations, as long as potting compound can be poured in.

[0030] In a preferred embodiment of this utility model, the heat sink housing 200 is a plastic insulating housing, the heating device 400 includes a power transistor, a square inductor, or a square resistor; and the heat sink 300 is a rectangular ceramic heat sink 300. Using a plastic heat sink housing further enhances insulation protection.

[0031] In a preferred embodiment of the present invention, the four corners of the rectangular mounting frame 210 are respectively provided with L-shaped limiting portions 213 for limiting the installation of the heat sink 300 therein.

[0032] In a preferred embodiment of this utility model, four bolts 221 are installed on the cover 220, a first mounting screw hole 430 is provided on each heating element 400, a second mounting screw hole 330 is provided on each heat sink 300, and a third mounting screw hole is provided on the horizontal mounting surface 110; the mounting bolts 430, the first mounting screw hole, the second mounting screw hole 330, and the third mounting screw hole correspond one-to-one with each other; the cover 220 and each of the heating elements 400 are fixed to the horizontal mounting surface 110 by the mounting bolts 221, the first mounting screw hole 430, the second mounting screw hole 330, and the third mounting screw hole. Of course, it should be noted that in other preferred embodiments of this utility model, any known fixing method can be used to fix the cover 220, the mounting frame 210, the heat sink 100, the heat sink housing 200, the heat sink 300, and the heating elements 400 together, and any fixing method falls within the protection scope of this utility model. Further as... Figure 1 As shown, the cover 220 is provided with a plurality of pin holes 222 corresponding to the pin positions 440 of each heat-generating device 400; the cover 220 is further provided with fixing screws 223 so that the cover 220 and the mounting frame 210 are fixed to the heat sink 100 through the fixing screw holes provided on the mounting frame 210 and the heat sink 100.

[0033] The following describes the installation process using a MOSFET as the heat-generating device 400. First, bend the pins of the MOSFET to the required size using a bending jig. Install the heat sink ceramic plate into the mounting frame 210. Place the heat sink 100 on the front of the mounting frame 210 (i.e., the side facing the horizontal mounting surface 110). Secure the heat sink 100 and the mounting frame 210 together using plastic screws. Fix the four MOSFETs to the heat sink 100 and cover it with the cap 220. Then, install the heat dissipation assembly onto the PCB board and solder it using a solder pot. Finally, pour potting compound (e.g., AB silicone) into the potting port of the heat sink 100.

[0034] In the horizontal heat dissipation assembly of this utility model, the heat sink 300 and the heat-generating device 400 are arranged horizontally in sequence in the inner cavity formed by the horizontal mounting surface 110 and the heat sink housing 200. Therefore, the heat sink 300 and the heat-generating device 400 are installed horizontally, which can effectively utilize the stacked space, that is, reduce the planar space and thus require less installation space. At the same time, the inner cavity is filled with potting compound, so the heat-generating device dissipates heat through the potting compound, which is more efficient than conventional air cooling.

[0035] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.

[0036] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A horizontal heat dissipation assembly, characterized in that, include: A radiator, a radiator housing, heat sink fins, and a heat-generating device; the radiator housing is mounted on a horizontal mounting surface of the radiator; the heat sink fins and the heat-generating device are arranged horizontally in sequence in a sealed inner cavity, the sealed inner cavity containing potting compound, wherein the sealed inner cavity is an inner cavity enclosed by the horizontal mounting surface and the radiator housing.

2. The horizontal heat dissipation assembly according to claim 1, characterized in that, The radiator housing includes a mounting frame and a cover; the mounting frame is fixed to the horizontal mounting surface, the first side of the heat sink is in contact with the horizontal mounting surface, and the second side of the heat sink is in contact with the heat-generating device.

3. The horizontal heat dissipation assembly according to claim 2, characterized in that, A mounting frame is provided on the side of the mounting frame facing the horizontal mounting surface; the heat sink is mounted in the mounting frame; a mounting square hole is further provided in the mounting frame, and the first side of the heating device passes through the mounting square hole and fits against the second side of the heat sink.

4. The horizontal heat dissipation assembly according to claim 3, characterized in that, The mounting frame is a rectangular mounting frame, in which two mounting frames are horizontally arranged, and one heat sink is installed in each mounting frame; each mounting frame is provided with two mounting square holes, and each mounting square hole corresponds to one heating device.

5. The horizontal heat dissipation assembly according to claim 4, characterized in that, The four corners of the rectangular mounting frame are respectively provided with L-shaped limiting parts for limiting the heat sink.

6. The horizontal heat dissipation assembly according to claim 4, characterized in that, Bolts are installed on the cover, a first mounting screw hole is provided on each heating element, a second mounting screw hole is provided on each heat sink, and a third mounting screw hole is provided on the horizontal mounting surface; the bolts, the first mounting screw hole, the second mounting screw hole and the third mounting screw hole correspond one-to-one with each other; the cover and each heating element are fixed to the horizontal mounting surface by the bolts, the first mounting screw hole, the second mounting screw hole and the third mounting screw hole.

7. The horizontal heat dissipation assembly according to claim 6, characterized in that, The cover has multiple pin holes corresponding to the pin positions of each heating element.

8. The horizontal heat dissipation assembly according to any one of claims 1 to 7, characterized in that, The heat sink housing is a plastic insulating housing, and the heat-generating device includes a power transistor, a square inductor, or a square resistor; the heat sink is a rectangular ceramic heat sink.

9. The horizontal heat dissipation assembly according to claim 8, characterized in that, The radiator has multiple heat dissipation fins on the side facing away from the horizontal mounting surface; an adhesive filling port is provided in the center of each heat dissipation fin.

10. A horizontal heat dissipation assembly, characterized in that, include: A radiator, a radiator housing, a first heat sink, a second heat sink, a first heating element, a second heating element, a third heating element, and a fourth heating element; the radiator housing includes a mounting frame and a cover; the cover and the mounting frame are fixed together on the horizontal mounting surface of the radiator, the mounting frame includes a first mounting frame and a second mounting frame, the first heat sink is mounted in the first mounting frame, and the second heat sink is mounted in the second mounting frame; The first mounting frame is provided with a first mounting square hole and a second mounting square hole; the second mounting frame is provided with a third mounting square hole and a fourth mounting square hole; the first side of the first heat sink and the first side of the second heat sink are both in contact with the horizontal mounting surface; the first side of the first heating element passes through the first mounting square hole and is in contact with the second side of the first heat sink, the first side of the second heating element passes through the second mounting square hole and is in contact with the second side of the first heat sink; the first side of the third heating element passes through the third mounting square hole and is in contact with the second side of the second heat sink, the first side of the fourth heating element passes through the fourth mounting square hole and is in contact with the second side of the second heat sink; the first heat sink, the second heat sink, the first heating element, the second heating element, the third heating element and the fourth heating element are all housed in a sealed inner cavity, the sealed inner cavity contains potting compound, and the sealed inner cavity is an inner cavity surrounded by the horizontal mounting surface, the mounting frame and the cover.

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