Power tube heat dissipation structure

Abstract

A power tube heat dissipation structure, including PCB board, at least one power tube, radiator and compression fixing device, the first side of the power tube is attached on the first side of the PCB board, and the first side of the PCB board faces the radiator, the second side of the power tube is attached on the heat dissipation surface of the radiator, and the heat dissipation surface of the radiator faces the PCB board, and the compression fixing device is installed on the second side of the PCB board away from the radiator to compress and fix the PCB board, the power tube and the radiator, in the utility model, the special fixing compression plate is replaced by the PCB board, the power tube can be compressed and fixed through the PCB board, the compression fixing device and the radiator, additional fixing compression plate installation space is not needed, therefore, the required installation space of overall structure is small, the manufacturing cost is low, and the miniaturization of power module is beneficial.

Description

Technical Field

[0001] This utility model relates to heat dissipation of power transistors, and more specifically, to a heat dissipation structure for power transistors. Background Technology

[0002] As power module power density increases, the number of power transistors used also increases, resulting in less space for their installation. Furthermore, power transistors need to meet heat dissipation requirements and must be designed as close to the heatsink as possible. Therefore, the current solution is to fix the power transistors to the heatsink using a specific mounting plate. This mounting plate design not only increases manufacturing costs but also occupies internal space within the power module, hindering miniaturization. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a power tube heat dissipation structure that eliminates the need for a fixing plate to fix the power tube, thereby requiring less installation space, reducing manufacturing costs, and facilitating the miniaturization of power modules.

[0004] The technical solution adopted by this utility model to solve its technical problem is as follows: a power transistor heat dissipation structure is constructed, including a PCB board, at least one power transistor, a heat sink, and a clamping and fixing device; the first side of the power transistor is attached to the first side of the PCB board, and the first side of the PCB board faces the heat sink; the second side of the power transistor is attached to the heat dissipation surface of the heat sink, and the heat dissipation surface of the heat sink faces the PCB board; the clamping and fixing device is installed on the second side of the PCB board facing away from the heat sink to clamp and fix the PCB board, the power transistor, and the heat sink.

[0005] In the power tube heat dissipation structure of this utility model, a mounting groove is formed on the heat dissipation surface of the heat sink, facing the power tube. A heat sink is installed in the mounting groove. The first side of the heat sink facing the mounting groove abuts against the bottom surface of the mounting groove, and the second side of the heat sink facing the power tube abuts against the second side of the power tube.

[0006] In the power tube heat dissipation structure of this utility model, thermally conductive silicone is provided between the second side of the heat sink and the second side of the power tube, and the bottom surface of the mounting groove is coated with thermally conductive silicone grease.

[0007] In the power tube heat dissipation structure of this utility model, the clamping and fixing device includes a plurality of first screw holes arranged around the mounting groove on the heat dissipation surface of the heat sink, a plurality of second screw holes arranged on the PCB board, and a plurality of fixing screws. The plurality of fixing screws, the plurality of first screw holes and the plurality of second screw holes correspond one-to-one, thereby clamping and fixing the PCB board, the power tube, the heat sink and the heat sink.

[0008] In the power transistor heat dissipation structure of this utility model, the at least one power transistor includes a first power transistor, a second power transistor, a third power transistor, and a fourth power transistor; the first power transistor, the second power transistor, the third power transistor, and the fourth power transistor are arranged in a rectangular pattern on the first side of the PCB board; The second sides of the first power transistor, the second power transistor, the third power transistor, and the fourth power transistor respectively abut against different areas on the second side of the heat sink.

[0009] In the power tube heat dissipation structure of this utility model, the plurality of second screw holes are arranged around the first power tube, the second power tube, the third power tube and the fourth power tube, and correspond one-to-one with the plurality of first screw holes, thereby pressing the PCB board, the first power tube, the second power tube, the third power tube and the fourth power tube, the heat sink and the heat radiator.

[0010] In the power tube heat dissipation structure of this utility model, a capacitor is further provided on the first side of the PCB board facing the heat sink; the side of the capacitor facing the heat sink abuts against the first area of ​​the heat dissipation surface of the heat sink; the first area is located outside the mounting slot.

[0011] In the power tube heat dissipation structure of this utility model, the heat sink is a rectangular aluminum nitride ceramic sheet, and the distance between the first region and the mounting groove is greater than 0.5mm.

[0012] In the power tube heat dissipation structure of this utility model, a resistor is further provided on the first side of the PCB board facing the heat sink; the side of the resistor facing the heat sink abuts against the second area of ​​the heat dissipation surface of the heat sink; the second area is located outside the mounting slot.

[0013] In the power tube heat dissipation structure of this utility model, the heat sink is a rectangular aluminum nitride ceramic sheet, and the distance between the second region and the mounting groove is greater than 0.5mm.

[0014] This utility model discloses a power transistor heat dissipation structure, including a PCB board, at least one power transistor, a heat sink, and a clamping and fixing device. A first side of the power transistor is attached to the first side of the PCB board facing the heat sink, and a second side of the power transistor is attached to the heat dissipation surface of the heat sink facing the PCB board. The clamping and fixing device is installed on the second side of the PCB board facing away from the heat sink to clamp and fix the PCB board, the power transistor, and the heat sink. Therefore, in this utility model, a PCB board replaces a dedicated fixing plate. The power transistor can be clamped and fixed using the PCB board, the clamping and fixing device, and the heat sink, eliminating the need for additional fixing plate installation space. Thus, the overall structure requires less installation space, has lower manufacturing costs, and is beneficial for the miniaturization of power modules. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a first-angle exploded view of a preferred embodiment of the power tube heat dissipation structure of this utility model; Figure 2 This is a second-angle exploded view of a preferred embodiment of the power tube heat dissipation structure of this utility model; Figure 3 This is a third-angle exploded view of a preferred embodiment of the power tube heat dissipation structure of this utility model; Figure 4 This is a front view of a preferred embodiment of the power tube heat dissipation structure of this utility model. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0017] Figure 1 This is a first-angle exploded view of a preferred embodiment of the power tube heat dissipation structure of this utility model. Figure 2 This is a second-angle exploded view of a preferred embodiment of the power tube heat dissipation structure of this utility model. Figure 3 This is a third-angle exploded view of a preferred embodiment of the power tube heat dissipation structure of this utility model. Figure 4 This is a front view of a preferred embodiment of the power tube heat dissipation structure of this utility model, wherein the internal perspective structure is shown at point A.

[0018] like Figure 1-4As shown, the power transistor heat dissipation structure of this utility model includes a PCB board 100, at least one power transistor, a heat sink 300, and a clamping and fixing device 400. The first side of the power transistor is attached to the first side 110 of the printed circuit board (PCB board) 100, and the first side 110 of the PCB board 100 faces the heat sink 300. The second side of the power transistor is attached to the heat dissipation surface 310 of the heat sink 300, and the heat dissipation surface 310 of the heat sink 300 faces the PCB board 100. The clamping and fixing device 400 is installed on the second side of the PCB board 100 facing away from the heat sink 300 to clamp and fix the PCB board 100, the power transistor, and the heat sink 300.

[0019] This utility model discloses a power transistor heat dissipation structure, including a PCB board, at least one power transistor, a heat sink, and a clamping and fixing device. A first side of the power transistor is attached to the first side of the PCB board facing the heat sink, and a second side of the power transistor is attached to the heat dissipation surface of the heat sink facing the PCB board. The clamping and fixing device is installed on the second side of the PCB board facing away from the heat sink to clamp and fix the PCB board, the power transistor, and the heat sink. Therefore, in this utility model, a PCB board replaces a dedicated fixing plate. The power transistor can be clamped and fixed using the PCB board, the clamping and fixing device, and the heat sink, eliminating the need for additional fixing plate installation space. Thus, the overall structure requires less installation space, has lower manufacturing costs, and is beneficial for the miniaturization of power modules.

[0020] In a preferred embodiment of this invention, a mounting groove is formed on the heat dissipation surface 310 of the heat sink 300, opposite the position of the power transistor. A heat sink is installed in the mounting groove, with a first side of the heat sink facing the mounting groove abutting against the bottom surface of the mounting groove, and a second side of the heat sink facing the power transistor abutting against the second side of the power transistor. Thermally conductive silicone is disposed between the second side of the heat sink and the second side of the power transistor, and thermally conductive silicone grease is coated on the bottom surface of the mounting groove. In a preferred embodiment of this invention, the clamping and fixing device 400 includes a plurality of first screw holes disposed on the heat dissipation surface 310 of the heat sink 300 around the mounting groove, a plurality of second screw holes disposed on the PCB board 100, and a plurality of fixing screws. The plurality of fixing screws, the plurality of first screw holes, and the plurality of second screw holes correspond one-to-one, thereby clamping and fixing the PCB board 100, the power transistor, the heat sink, and the heat sink 300.

[0021] The mounting slots allow for better securing of the power transistors, while the heatsinks and thermally conductive silicone provide improved heat dissipation. The screw-and-hole clamping mechanism is not only simple and easy to implement, but also requires minimal installation space, further reducing the overall installation space needed and manufacturing costs, thus contributing to the miniaturization of the power module.

[0022] like Figures 1-4 As shown, in a further preferred embodiment of this utility model, the at least one power transistor includes a first power transistor 210, a second power transistor 220, a third power transistor 230, and a fourth power transistor 240. The first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 are surface mount technology (SMT) chip capacitors. The first side of the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 are mounted on the first side 110 of the PCB board 100 facing the heat sink 300, and are arranged in a rectangular pattern on the first side 110 of the PCB board 100. The heat dissipation surface 310 of the heat sink 300 has mounting grooves 320 opposite to the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240. Heat sink fins 800 are installed in the mounting grooves 320. The first side of the heat sink 800 facing the mounting groove 320 abuts against the bottom surface of the mounting groove 320. The second sides of the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 abut against different areas of the second side of the heat sink 800 facing these power transistors. That is, four power transistors are correspondingly arranged on the second side of one heat sink 800. Of course, in other preferred embodiments of this invention, one heat sink can correspond to one power transistor. The former obviously saves installation space, simplifies the installation process, and reduces costs. Thermally conductive silicone 500 is disposed between the second side of the heat sink 800 and the second side of the second power transistor 220, the third power transistor 230 and the fourth power transistor 240, and thermally conductive silicone grease is coated on the bottom surface 321 of the mounting groove 320.

[0023] Further as Figures 1-4As shown, the clamping and fixing device 400 includes a plurality of first screw holes disposed on the heat dissipation surface 310 of the heat sink 300 surrounding the mounting groove 320, a plurality of second screw holes disposed on the PCB board 100, and a plurality of fixing screws 410. The plurality of fixing screws 410, the plurality of first screw holes, and the plurality of second screw holes correspond one-to-one, thereby clamping and fixing the PCB board 100, the power transistor, the heat sink 800, and the heat sink 300. The plurality of first screw holes and the plurality of second screw holes can be disposed in any suitable position surrounding the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 and the mounting groove 310, as long as they can satisfy the clamping and fixing requirements.

[0024] The first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 can be arranged in any suitable shape on the first side 110 of the PCB board 100, as long as the second sides of the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 respectively abut against different areas on the second side of the heat sink 800. The heat sink 800 and the mounting slot 320 can also adopt any suitable shape, as long as they match. Each heat sink can correspond to a different number of power transistors, as long as the safety distance and electrical clearance requirements are met.

[0025] Further as Figures 1-4 As shown, a capacitor 610 is further disposed on the first side 110 of the PCB board 100 facing the heat sink 300; the side of the capacitor 610 facing the heat sink 300 abuts against a first area of ​​the heat dissipation surface 310 of the heat sink 300; the first area is located outside the mounting slot 320. Preferably, the capacitor 610 is a surface mount capacitor, which is disposed adjacent to any power transistor, but its side facing the heat sink 300 does not contact the heat sink 800 located in the mounting slot 320. Preferably, the heat sink 800 is a rectangular aluminum nitride ceramic sheet, and the distance between the first area and the mounting slot 320 is greater than 0.5 mm.

[0026] Similarly, such as Figures 1-4As shown, a resistor 620 is further disposed on the first side 110 of the PCB board 100 facing the heat sink 300; the side of the resistor 620 facing the heat sink 300 abuts against a second region of the heat dissipation surface 310 of the heat sink 300; the second region is located outside the mounting slot 320. Preferably, the resistor 620 is a surface mount resistor, which is disposed adjacent to any power transistor, but its side facing the heat sink 300 does not contact the heat sink 800 located in the mounting slot 320. Preferably, the heat sink 800 is a rectangular aluminum nitride ceramic sheet, and the distance between the first region and the mounting slot 320 is greater than 0.5 mm.

[0027] In this invention, the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 are surface mount technology (SMT) chip capacitors, which are mounted on the first side 110 of the PCB board 100 facing the heat sink 300. Mounting slots 320 are formed on the heat dissipation surface 310 of the heat sink 300, directly opposite the positions of the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240. The bottom surface 321 of the mounting groove 320 is coated with thermally conductive silicone grease. A heat sink 800 is installed in the mounting groove 320. The first side of the heat sink 800 facing the mounting groove 320 abuts against the bottom surface of the mounting groove 320. Thermally conductive silicone is installed on the second side of the heat sink 800 facing the power transistors. Then, the second sides of the first power transistor 210, the second power transistor 220, the third power transistor 230, and the fourth power transistor 240 respectively abut against different areas of the second side of the heat sink 800 facing the power transistors. That is, the second side of one heat sink 800 contacts four power transistors through the thermally conductive silicone. When assembling the printed circuit board assembly, the PCB board 100, the power transistors, the heat sink, and the heat radiator 300 are pressed and fixed by multiple fixing screws, multiple first screw holes, and multiple second screw holes. The power transistors can have sufficient contact with the thermally conductive silicone, resulting in better heat conduction. Aluminum nitride heat sinks are preferably used because they have a high thermal conductivity (greater than 170 W / mK) and are also insulating. As long as the distance between it and capacitor 610 and resistor 620 is greater than 0.5mm, interference between them can be prevented. Therefore, the aluminum nitride heat sink can be made larger, resulting in a larger heat dissipation area and better thermal conductivity.

[0028] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.

[0029] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A power transistor heat dissipation structure, characterized in that, The device includes a PCB board, at least one power transistor, a heat sink, and a clamping and fixing device. The first side of the power transistor is attached to the first side of the PCB board, and the first side of the PCB board faces the heat sink. The second side of the power transistor is attached to the heat dissipation surface of the heat sink, and the heat dissipation surface of the heat sink faces the PCB board. The clamping and fixing device is installed on the second side of the PCB board facing away from the heat sink to clamp and fix the PCB board, the power transistor, and the heat sink.

2. The power transistor heat dissipation structure according to claim 1, characterized in that, A mounting groove is formed on the heat dissipation surface of the heat sink, opposite the position of the power transistor. A heat sink fin is installed in the mounting groove. The first side of the heat sink facing the mounting groove abuts against the bottom surface of the mounting groove, and the second side of the heat sink facing the power transistor abuts against the second side of the power transistor.

3. The power transistor heat dissipation structure according to claim 2, characterized in that, Thermally conductive silicone is disposed between the second side of the heat sink and the second side of the power transistor, and thermally conductive silicone grease is coated on the bottom surface of the mounting groove.

4. The power transistor heat dissipation structure according to claim 3, characterized in that, The clamping and fixing device includes a plurality of first screw holes arranged around the mounting groove on the heat dissipation surface of the heat sink, a plurality of second screw holes arranged on the PCB board, and a plurality of fixing screws. The plurality of fixing screws, the plurality of first screw holes and the plurality of second screw holes correspond one-to-one, thereby clamping and fixing the PCB board, the power transistor, the heat sink and the heat sink.

5. The power transistor heat dissipation structure according to claim 4, characterized in that, The at least one power transistor includes a first power transistor, a second power transistor, a third power transistor, and a fourth power transistor; the first power transistor, the second power transistor, the third power transistor, and the fourth power transistor are arranged in a rectangular pattern on the first side of the PCB board; The second sides of the first power transistor, the second power transistor, the third power transistor, and the fourth power transistor respectively abut against different areas on the second side of the heat sink.

6. The power transistor heat dissipation structure according to claim 5, characterized in that, The plurality of second screw holes are arranged around the first power transistor, the second power transistor, the third power transistor and the fourth power transistor, and correspond one-to-one with the plurality of first screw holes, thereby pressing the PCB board, the first power transistor, the second power transistor, the third power transistor and the fourth power transistor, the heat sink and the heat radiator.

7. The power transistor heat dissipation structure according to claim 6, characterized in that, A capacitor is further disposed on the first side of the PCB board facing the heat sink; the side of the capacitor facing the heat sink abuts against a first area of ​​the heat dissipation surface of the heat sink; the first area is located outside the mounting slot.

8. The power transistor heat dissipation structure according to claim 7, characterized in that, The heat sink is a rectangular aluminum nitride ceramic sheet, and the distance between the first region and the mounting groove is greater than 0.5 mm.

9. The power transistor heat dissipation structure according to claim 6, characterized in that, A resistor is further provided on the first side of the PCB board facing the heat sink; the side of the resistor facing the heat sink abuts against a second area of ​​the heat dissipation surface of the heat sink; the second area is located outside the mounting slot.

10. The power transistor heat dissipation structure according to claim 9, characterized in that, The heat sink is a rectangular aluminum nitride ceramic sheet, and the distance between the second region and the mounting groove is greater than 0.5 mm.

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