Fan bracket, fan assembly, heat dissipation structure for controller and controller

CN224734014UActive Publication Date: 2026-09-08BOSCH AUTOMOTIVE PRODUCTS (SUZHOU) CO LTD
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Patent Information

Application Number
CN202521971135.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-12
Publication Date
2026-09-08
Estimated Expiration
2035-09-12

AI Technical Summary

Technical Problem

[0004]而针对每一种芯片设计单独的散热系统又会造成浪费

Benefits of technology

[0024] The fan bracket described in this invention allows fans of various sizes to be locked onto the same bracket, thus enabling them to share the same heat dissipation structure housing. When the controller's main chip is a low-power, low-level intelligent driver chip, a small fan with relatively low airflow can be used to cool the controller. When the controller's main chip is a high-power, high-end intelligent driver chip, simply replacing the small fan with a large fan with higher airflow is sufficient to meet the high heat dissipation requirements. In this way, by simply replacing the fan, which is a standard component, rather than redesigning or adopting a new heat dissipation structure, the heat dissipation requirements of both high-platform and low-platform chips can be met simultaneously, achieving high compatibility at a lower cost.

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Abstract

The utility model discloses a fan support for controller, be equipped with ventilation opening (101) on the fan support, a plurality of support rib (102) extend setting in the radial direction of ventilation opening, be equipped with at least a plurality of first fan mounting hole (103) and a plurality of second fan mounting hole (104) on the fan support, the first distance between first fan mounting hole and the center of ventilation opening, the second distance between second fan mounting hole and the center of ventilation opening, the first distance is not equal to second distance.
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Description

Technical Field

[0001] This utility model relates to a heat dissipation mechanism, and more particularly to a controller having a heat dissipation mechanism. Background Technology

[0002] To address the heat dissipation problem of controllers, most controllers currently have cooling devices, one type of which uses a fan to blow air for cooling.

[0003] Furthermore, for controllers, the power consumption of the main chip varies significantly under different operating modes. Whether it's a low-power or medium-to-high-power chip, a stable and reliable cooling system is required to ensure that heat within the system is quickly dissipated to the outside within a limited space, avoiding localized overheating that could lead to chip frequency reduction or malfunction.

[0004] Designing a separate cooling system for each type of chip would be wasteful. Therefore, a solution that meets the diverse cooling requirements is desired. Utility Model Content

[0005] One of the objectives of this invention is to provide a fan bracket for a controller, which enables fans of various sizes to be locked onto the same fan bracket, thereby allowing fans of different power to share the same heat dissipation structure housing based on cooling requirements.

[0006] To achieve the above objectives, this utility model proposes a fan bracket for a controller, wherein:

[0007] The fan bracket is provided with a ventilation opening, and several support ribs are arranged extending radially in the ventilation opening;

[0008] The fan bracket is provided with at least a plurality of first fan mounting holes and a plurality of second fan mounting holes; there is a first distance between the first fan mounting hole and the center of the vent, and there is a second distance between the second fan mounting hole and the center of the vent; the first distance is not equal to the second distance.

[0009] Furthermore, in the fan bracket described in this utility model, the plurality of first fan mounting holes are arranged in a cocircular circle; and / or the plurality of second fan mounting holes are arranged in a cocircular circle.

[0010] Furthermore, in the fan bracket described in this utility model, the first fan mounting hole includes a threaded hole; and / or the second fan mounting hole includes a threaded hole.

[0011] Furthermore, in the fan bracket described in this utility model, one of the first fan mounting hole and the second fan mounting hole is provided on the support rib, and the other is provided on the fan bracket next to the vent.

[0012] Furthermore, in the fan bracket described in this utility model, the fan bracket has outwardly extending winglets, and the winglets are provided with fan bracket mounting holes and / or positioning holes.

[0013] Another objective of this invention is to provide a fan assembly that can accommodate fans of different sizes based on the different cooling requirements of the controller, thereby simplifying the structure and improving efficiency.

[0014] To achieve the above objectives, the present invention also provides a fan assembly, which includes at least a first fan, a second fan, and a fan bracket as described above, wherein in a first installation state, the first fan is mounted on the fan bracket through a first fan mounting hole; and in a second installation state, the second fan is mounted on the fan bracket through a second fan mounting hole.

[0015] Another objective of this invention is to provide a heat dissipation structure that is compatible with fans of different sizes based on the different cooling requirements of the controller, so that fans of various sizes can share the same heat dissipation structure housing, thereby simplifying the structural design while ensuring the heat dissipation effect.

[0016] To achieve the above objectives, the present invention also provides a heat dissipation structure, which includes a housing for accommodating a printed circuit board assembly, and a fan assembly as described above, the fan assembly being disposed on the outer surface of the housing.

[0017] Furthermore, in the heat dissipation structure described in this utility model, the outer surface of the outer shell has a plurality of vertically arranged heat dissipation fins, the plurality of heat dissipation fins surround a fan assembly accommodating space, the fan assembly is disposed within the fan assembly accommodating space, and the heat dissipation fins are arranged radially outward from the fan assembly.

[0018] Furthermore, in the heat dissipation structure described in this utility model, the fan assembly is disposed on the outer surface of the housing corresponding to the position of the main chip.

[0019] Furthermore, in the heat dissipation structure described in this utility model, the fan assembly is interference-fitted with the heat dissipation fins that form the accommodating space of the fan assembly.

[0020] Furthermore, in the heat dissipation structure described in this utility model, the fan assembly is disposed on the outer surface of the housing via supporting ribs disposed on the outer surface of the housing.

[0021] Furthermore, in the heat dissipation structure described in this utility model, the inner surface of the outer shell has a heat dissipation boss protruding from the inner surface of the outer shell, and the top surface of the heat dissipation boss has a heat-conducting element.

[0022] Another objective of this invention is to provide a controller that can meet the cooling requirements of main chips with different power levels.

[0023] To achieve the above objectives, the present invention also provides a controller, which includes a heat dissipation structure as described above, wherein a printed circuit board assembly is disposed within the housing of the heat dissipation structure.

[0024] The fan bracket described in this invention allows fans of various sizes to be locked onto the same bracket, thus enabling them to share the same heat dissipation structure housing. When the controller's main chip is a low-power, low-level intelligent driver chip, a small fan with relatively low airflow can be used to cool the controller. When the controller's main chip is a high-power, high-end intelligent driver chip, simply replacing the small fan with a large fan with higher airflow is sufficient to meet the high heat dissipation requirements. In this way, by simply replacing the fan, which is a standard component, rather than redesigning or adopting a new heat dissipation structure, the heat dissipation requirements of both high-platform and low-platform chips can be met simultaneously, achieving high compatibility at a lower cost. Attached Figure Description

[0025] Figure 1 This diagram shows a structural schematic of the fan bracket according to one embodiment of the present invention.

[0026] Figure 2 The diagram shows a top-down view of the fan bracket in one embodiment of the present invention.

[0027] Figure 3 The diagram shows a top-down view of the fan bracket of this invention in another embodiment.

[0028] Figure 4 This diagram shows a split structure of the fan assembly described in this invention in a first installation state according to one embodiment.

[0029] Figure 5 This diagram shows a split structure of the fan assembly described in this invention in a second installation state according to one embodiment.

[0030] Figure 6 The diagram shows a split structure of the heat dissipation structure described in this utility model in one embodiment.

[0031] Figure 7 This shows the state in one embodiment of the heat dissipation structure described in this utility model, in which a first fan is installed.

[0032] Figure 8 This illustration shows the state in one embodiment of the heat dissipation structure described in this utility model, in which a second fan is installed.

[0033] Figure 9 The diagram shows a top-down view of one embodiment of the heat dissipation structure described in this invention.

[0034] Figure 10 Showing Figure 9 Sectional view at point AA.

[0035] Figure 11 The diagram shows a top-down view of the outer casing of the heat dissipation structure described in this invention, in one embodiment.

[0036] Figure 12 The diagram shows a split structure of the controller according to one embodiment of the present invention. Detailed Implementation

[0037] The fan bracket, fan assembly, heat dissipation structure, and controller of this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, this explanation and description do not constitute an undue limitation on the technical solution of this utility model.

[0038] The core components of the controller are the printed circuit board assembly housed within the casing, especially the main chip mounted on the PCB. The power consumption of the main chip often varies significantly depending on the operating mode requirements. However, both low-power and medium-to-high-power chips require a stable and reliable cooling system to ensure that heat inside the casing is quickly dissipated to the outside, preventing localized overheating that could lead to chip frequency reduction or malfunction. Designing a separate cooling system for each type of chip would be wasteful.

[0039] To address the aforementioned problems, this invention proposes a fan bracket in one embodiment that is compatible with fans of different sizes.

[0040] Figure 1 This diagram shows a structural schematic of the fan bracket according to one embodiment of the present invention.

[0041] Figure 2 The diagram shows a top-down view of the fan bracket in one embodiment of the present invention.

[0042] like Figure 1 and Figure 2 As shown, in one embodiment, the fan bracket 100 for the controller is provided with a vent 101, thereby forming a cooling air duct when the fan is mounted on the fan bracket. A plurality of support ribs 102 are provided extending radially in the vent 101, thereby forming a mounting surface for supporting or mounting the fan.

[0043] The fan bracket 100 is provided with at least a plurality of first fan mounting holes 103 and a plurality of second fan mounting holes 104; wherein the first distance between the first fan mounting hole 103 and the center O of the vent is not equal to the second distance between the second fan mounting hole 104 and the center O of the vent.

[0044] With this configuration, the aforementioned fan bracket can be compatible with fans of different sizes. For cooling low-power chips, a smaller fan can be mounted on the fan bracket through either the first or second fan mounting hole. For chips operating in medium to high power consumption modes, simply remove the smaller fan and replace it with a larger fan through the other fan mounting hole. This replacement process is simple, requires no changes to other structures, and greatly simplifies the design of the controller's heat dissipation structure.

[0045] In such Figure 1 and Figure 2 In the illustrated embodiment, the first distance between the first fan mounting hole 103 and the center O of the vent is greater than the second distance between the second fan mounting hole 104 and the center O of the vent. Of course, in other embodiments, the first distance between the first fan mounting hole and the center O of the vent can be less than the second distance between the second fan mounting hole and the center O of the vent. This means that the present invention does not limit the first fan mounting hole to necessarily being used for mounting a large-sized fan, nor does it limit the second fan mounting hole to necessarily being used for mounting a small-sized fan; swapping the two is also feasible.

[0046] Furthermore, it should be noted that this utility model does not limit the fan bracket to having only two different types of mounting holes: a first fan mounting hole and a second fan mounting hole. Rather, it aims to provide a technical solution where the fan bracket has mounting holes that can accommodate fans of different sizes. Therefore, in addition to having a first fan mounting hole and a second fan mounting hole, the fan bracket can also have a third fan mounting hole 105 with a third distance between it and the center O of the vent (e.g., ...). Figure 3 As shown), and the third distance is not equal to the first distance and the second distance, or further, it has a fourth fan mounting hole with a fourth distance between it and the center O of the vent, and the fourth distance is not equal to the first distance, the second distance and the third distance. By analogy, the fan bracket of this utility model may also have a fifth fan mounting hole or more fan mounting holes.

[0047] It should also be noted that, although in Figure 3In the illustrated embodiment, the third distance between the third fan mounting hole 105 and the center O of the vent is less than the first distance and greater than the second distance; however, this is merely an exemplary embodiment. In other embodiments, the third distance may be less than the second distance or greater than the first distance.

[0048] To further ensure the structural stability of the fan bracket and prevent the fan bracket structure from becoming unstable due to a large ventilation opening diameter, or to further ensure the protective function of the fan bracket and effectively prevent external objects from entering the fan and damaging the fan blades or causing unnecessary safety accidents, the number of support ribs 102 can be set to at least three, which can be evenly distributed in the circumferential direction of the ventilation opening.

[0049] For example, in such Figure 1 and Figure 2 In the illustrated embodiment, four support ribs 102 are exemplaryly provided within the area of ​​the ventilation opening 101. Of course, in other embodiments, the number of support ribs can be three, five, or other quantities. However, the number of support ribs should not be excessive to prevent occupying too much ventilation opening area and reducing the air-cooling effect.

[0050] Additionally, it should be noted that although in Figure 2 In the example shown, the number of first fan mounting holes 103 is the same as the number of second fan mounting holes 104. However, in other embodiments, the number of first fan mounting holes 103 and the number of second fan mounting holes 104 may be different.

[0051] In addition, although Figure 2 In the example shown, the number of first fan mounting holes 103 and the number of second fan mounting holes 104 are equal to the number of support ribs 102. However, it is known that the number of first fan mounting holes 103 and second fan mounting holes 104 does not necessarily correspond to the number of support ribs. That is, in some embodiments, the number of first fan mounting holes 103 and second fan mounting holes 104 may not be equal to the number of support ribs 102.

[0052] Additionally, it should be noted that although in Figure 1 and Figure 2 In the illustrated embodiment, the vent 101 is circular in shape to achieve maximum compatibility with the fan's air intake channel. However, in other embodiments, the vent may be other shapes, such as square, rectangle, regular pentagon, regular hexagon, or other shapes. Therefore, in this invention, the fact that several supporting ribs are arranged extending in the "radial direction" of the vent does not mean that the vent is necessarily circular, but rather that the supporting ribs extend from the edge of the vent towards the center O.

[0053] In some more specific embodiments, a plurality of first fan mounting holes are arranged on the same circle, that is, a plurality of first fan mounting holes are located on the same circumference, and the distance of each first fan mounting hole from the center of the vent is equal.

[0054] In some other, more specific embodiments, a number of second fan mounting holes are arranged on the same circle, that is, a number of second fan mounting holes are located on the same circumference, and the distance of each second fan mounting hole from the center of the vent is equal.

[0055] In some other, more specific embodiments, a plurality of first fan mounting holes are arranged in a cocircle, and a plurality of second fan mounting holes are also arranged in a cocircle.

[0056] It should be noted that the common-circle setting described in this utility model is a common-circle setting within the allowable error range, rather than an absolute common-circle setting. For example, the positional error of each first fan mounting hole or each second fan mounting hole in the common-circle setting can be within 0.5mm.

[0057] Of course, in some other alternative embodiments, the plurality of first fan mounting holes can also be arranged in a non-circular manner. Similarly, the plurality of first fan mounting holes can also be arranged in a non-circular manner. However, this arrangement may incur additional manufacturing costs, and the connection stability is inferior to the concentric arrangement.

[0058] In some specific embodiments, to simplify the installation process, the first fan mounting hole may include a threaded hole, so that the fan can be fastened to the fan bracket with a corresponding bolt through the first fan mounting hole.

[0059] Similarly, in some other specific embodiments, the second fan mounting hole may also include a threaded hole, so that the fan can be fastened to the fan bracket with a corresponding bolt through the second fan mounting hole.

[0060] In some other specific embodiments, both the first fan mounting hole and the second fan mounting hole may include threaded holes.

[0061] Of course, in other embodiments, the first fan mounting hole may also include a pin hole, which can cooperate with the connecting pin and the locating ring to achieve a secure connection between the fan and the fan bracket. Similarly, the second fan mounting hole may also include a pin hole.

[0062] In some specific embodiments, to further simplify the structural design, while considering the structural strength and stability of the fan bracket, and to maximize the utilization of the load-bearing components of the fan bracket, one of the first fan mounting hole 103 and the second fan mounting hole 104 can be located on the support rib 102, and the other can be located on the fan bracket next to the vent. For example, as Figure 1 and Figure 2 As shown, the first fan mounting hole 103 is located on the fan bracket next to the vent, and the second fan mounting hole 104 is located on the support rib 102. Compared to placing both the first and second fan mounting holes on the support rib, this arrangement is more conducive to ensuring the structural stability of the fan bracket.

[0063] like Figure 1 and Figure 2 As shown, in some specific embodiments, the fan bracket may also have outwardly extending fins 106. The fins may have fan bracket mounting holes 107, or positioning holes 108, or both mounting holes 107 and positioning holes 108. The positioning holes 108 are used to initially position the fan bracket 100 on the outer shell of the heat dissipation structure, and the mounting holes 107 are used to securely mount the fan bracket 100 to the outer shell of the heat dissipation structure. Providing fins 106 with mounting holes and / or positioning holes can further reduce the weight of the fan bracket while achieving the mounting structure. Furthermore, by adjusting the position of the fins, the fan bracket can be adapted to various installation conditions or positions.

[0064] Therefore, the fan bracket described in this utility model enables fans of various sizes to be installed on the same fan bracket, thus allowing them to share the same heat dissipation structure housing.

[0065] In some other embodiments, this invention also provides a fan assembly.

[0066] Figure 4 This diagram shows a split structure of the fan assembly described in this invention in a first installation state according to one embodiment.

[0067] Figure 5 This diagram shows a split structure of the fan assembly described in this invention in a second installation state according to one embodiment.

[0068] like Figure 4 and Figure 5 As shown, in some embodiments, the fan assembly includes at least a first fan 200, a second fan 300, and a fan bracket 100 as described above.

[0069] Among them, such as Figure 4As shown, in the first installation state, the first fan 200 is mounted on the fan bracket 100 through the first fan mounting hole 103 and the first connector 400 adapted thereto.

[0070] like Figure 5 As shown, in the second installation state, the second fan 300 is mounted on the fan bracket 100 through the second fan mounting hole 104 and the second connector 500 adapted thereto.

[0071] As mentioned above, this utility model does not limit the fan assembly to having only two different sizes of fans, namely the first fan and the second fan. Rather, it aims to provide a technical solution where the same fan bracket can accommodate different sized fans based on varying heat dissipation requirements. Therefore, in addition to having at least the first fan 200 and the second fan 300, the fan bracket can further be compatible with mounting the third fan in the mounting hole 105 (e.g., ...). Figure 3 The third fan corresponds to the one shown. Similarly, the fan assembly of this invention may also have a fourth fan, a fifth fan, or more fans of different sizes.

[0072] In some specific embodiments, when the first fan mounting hole 103 is a screw hole, the first connector 400 can be a corresponding bolt. Similarly, when the second fan mounting hole 104 is a screw hole, the second connector 500 can be a corresponding bolt.

[0073] In some other embodiments, this invention also provides a heat dissipation structure.

[0074] Figure 6 The diagram shows a split structure of the heat dissipation structure described in this utility model in one embodiment.

[0075] like Figure 6 As shown, in some embodiments, the heat dissipation structure includes a housing 600 for accommodating a printed circuit board assembly, and a fan assembly 1 as described above, wherein the fan assembly 1 is disposed on the outer surface of the housing 600.

[0076] In some specific implementation methods, such as Figure 6 As shown, the housing 600 includes an upper cover 601 and a lower cover 602 connected to the upper cover by a third connector 603 (e.g., bolts).

[0077] When the controller has high heat dissipation requirements, such as Figure 7 As shown, the fan assembly in its first mounting state is mounted on the housing 600, particularly the top cover 601. That is, the larger first fan 200 is mounted on the housing 600.

[0078] When the controller's heat dissipation requirements are low, such as Figure 8As shown, the fan assembly in the second mounting state is mounted on the housing 600, particularly the top cover 601. That is, a smaller second fan 300 is mounted on the housing 600.

[0079] like Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, in order to further improve the heat dissipation capacity of the heat dissipation structure, the outer surface of the housing 600 has a number of vertically arranged heat dissipation fins 604. These heat dissipation fins 604 surround the fan assembly receiving space P, so that the fan assembly can be installed in the fan assembly receiving space P. These heat dissipation fins are arranged radially outward from the fan assembly.

[0080] Following this setup method, such as Figure 10 As shown, when the fan is running, a large amount of external air Q enters from the top of the fan. Because the fan bracket has vents 101, the air intake side of the fan is almost unobstructed, allowing sufficient cool air to be drawn into the fan and then blown onto the numerous heat dissipation fins 604 on the housing 600. The large number of heat dissipation fins 604 significantly increases the surface area of ​​the housing 600, thereby greatly improving the heat dissipation effect. Furthermore, the radially arranged heat dissipation fins also create airflow between two adjacent fins, quickly guiding the hot air exhausted by the fan out, further enhancing the heat dissipation effect.

[0081] In some specific implementations, the fan assembly 1 is positioned on the housing 600 above the main chip of the controller, thereby providing targeted heat dissipation for the chip that generates the most heat in the entire controller.

[0082] In some specific embodiments, the fan assembly 1 is interference-fitted with the heat sink fins forming the fan assembly receiving space P, that is, the external dimensions of the fan assembly are slightly larger than the dimensions of the fan assembly receiving space P, so that the fan assembly can be locked in the fan assembly receiving space P, thereby further ensuring the stable installation of the fan assembly and preventing noise from vibration during loading and use.

[0083] like Figure 10 and Figure 11 As shown, the fan assembly 1 is mounted on the outer surface of the housing 600 via support ribs 605. The housing 600 also has connection holes 606 corresponding to the mounting holes 107 of the fan assembly, for securely mounting the fan assembly 1 onto the housing via connectors 607 (e.g., bolts).

[0084] In some specific embodiments, a positioning post 608 may also be provided on the housing 600, which is used to cooperate with the positioning hole 108 of the fan assembly to achieve the initial positioning of the fan assembly during installation.

[0085] In some more specific embodiments, the support ribs 605 may include ribs extending in the width direction and ribs extending in the length direction, which are arranged in a cross shape, so as to provide stable support for the fan assembly without affecting the heat dissipation effect.

[0086] like Figure 6 As shown, in some more specific embodiments, to further improve heat dissipation, the inner surface of the housing has at least one heat dissipation protrusion 609 protruding from the inner surface of the housing, and the top surface of the heat dissipation protrusion 609 has a thermally conductive element 610. The heat dissipation protrusion 609 is used for thermal exchange connection with at least one electronic device on the printed circuit board assembly of the controller. With this arrangement, the various electronic devices on the printed circuit board assembly can be cooled in a targeted manner almost simultaneously, which improves cooling efficiency and ensures cooling uniformity.

[0087] Therefore, the heat-conducting element 610 is disposed between the heat dissipation protrusion 609 and the corresponding electronic device to further improve the heat dissipation effect.

[0088] In some more specific embodiments, the thermally conductive element may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive grease, the more beneficial it is for heat dissipation. Of course, in other more specific embodiments, the thermally conductive layer may also include thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet, or similar thermally conductive elements.

[0089] In some embodiments, this utility model also provides a controller.

[0090] Figure 12 The diagram shows a split structure of the controller according to one embodiment of the present invention.

[0091] like Figure 12 As shown, the controller includes a housing 600, a fan assembly 1 mounted on the outer surface of the housing, and a printed circuit board assembly 700 disposed inside the housing.

[0092] When the controller has high heat dissipation requirements, or when the controller's main chip is a high-power, high-end intelligent driver chip, such as Figure 7 As shown, the fan assembly in its first mounting state is mounted on the housing 600, particularly the top cover 601. That is, the larger first fan 200 is mounted on the housing 600.

[0093] When the controller's heat dissipation requirements are low, or when the controller's main chip is a low-power, low-level intelligent driver chip, such as Figure 8 As shown, the fan assembly in the second mounting state is mounted on the housing 600, particularly the top cover 601. That is, a smaller second fan 300 is mounted on the housing 600.

[0094] With this configuration, for different cooling or heat dissipation needs, this utility model only needs to replace the fan, which is usually a standard part, instead of redesigning or adopting a new heat dissipation structure, to meet different heat dissipation requirements at the same time, achieving high compatibility at a lower cost.

[0095] It should also be noted that, although Figure 12 The example shown includes a printed circuit board assembly 700, but the present invention does not limit the number of printed circuit board assemblies. In other embodiments, the number of printed circuit board assemblies may be set to multiple, such as two or three or other numbers, as needed.

[0096] Since this utility model does not involve improvements to other components of the controller, the other components of the controller and their working process will not be described in detail.

[0097] It should be noted that the controller described in this utility model can include various types, such as vehicle controllers or other types of controllers, like smart home controllers. Furthermore, the vehicle controller can be a domain controller, an MCU (Microcontroller Unit), or an ECU (Electronic Control Unit).

[0098] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.

[0099] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0100] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.

Claims

1. A fan bracket for a controller, characterized in that: The fan bracket is provided with a vent (101), and a number of support ribs (102) are provided extending in the radial direction of the vent; The fan bracket is provided with at least a plurality of first fan mounting holes (103) and a plurality of second fan mounting holes (104); there is a first distance between the first fan mounting hole and the center of the vent, and there is a second distance between the second fan mounting hole and the center of the vent; the first distance is not equal to the second distance.

2. The fan bracket as described in claim 1, characterized in that, The plurality of first fan mounting holes are arranged in a common circle; and / or the plurality of second fan mounting holes are arranged in a common circle.

3. The fan bracket as described in claim 1, characterized in that, The first fan mounting hole includes a threaded hole; and / or the second fan mounting hole includes a threaded hole.

4. The fan bracket as described in claim 1, characterized in that, One of the first fan mounting hole and the second fan mounting hole is located on the support rib, and the other is located on the fan bracket next to the vent.

5. The fan bracket as described in claim 1, characterized in that, The fan bracket has outwardly extending fins (106), and the fins are provided with fan bracket mounting holes (107) and / or positioning holes (108).

6. A fan assembly, characterized in that, It includes at least a first fan, a second fan, and a fan bracket (100) as described in any one of claims 1-5, wherein in a first installation state, the first fan (200) is mounted on the fan bracket through a first fan mounting hole (103); and in a second installation state, the second fan (300) is mounted on the fan bracket through a second fan mounting hole (104).

7. A heat dissipation structure comprising a housing (600) for accommodating a printed circuit board assembly, characterized in that, It also includes the fan assembly (1) as described in claim 6, the fan assembly being disposed on the outer surface of the housing.

8. The heat dissipation structure as described in claim 7, characterized in that, The outer surface of the housing has a plurality of vertically arranged heat dissipation fins (604), which surround a fan assembly receiving space (P). The fan assembly is disposed within the fan assembly receiving space, and the heat dissipation fins are arranged radially outward from the fan assembly.

9. The heat dissipation structure as described in claim 7, characterized in that, The fan assembly is positioned on the outer surface of the casing, corresponding to the location of the main chip.

10. The heat dissipation structure as described in claim 7, characterized in that, The fan assembly is mounted on the outer surface of the housing via a support rib (605) disposed on the outer surface of the housing.

11. The heat dissipation structure as described in claim 7, characterized in that, The fan assembly is interference-fitted with the heat sink fins that form the space for housing the fan assembly.

12. The heat dissipation structure as described in claim 7, characterized in that, The inner surface of the housing has a heat dissipation boss (609) protruding from the inner surface of the housing, and the top surface of the heat dissipation boss has a heat-conducting element (610).

13. A controller, characterized in that, It includes a heat dissipation structure as described in any one of claims 7-12, wherein a printed circuit board assembly is provided inside the housing of the heat dissipation structure.