Heat sink, circuit board assembly and energy storage device

Abstract

The application provides a heat sink, a circuit board assembly and an energy storage device. The heat sink comprises a bottom plate part, a side plate part and a support part. The side plate part is arranged on one side of the bottom plate part and perpendicular to the bottom plate part, and is configured to be attached to and dissipate heat from a first power module. The support part is arranged on the side of the bottom plate part away from the side plate part, and is configured to be arranged on a circuit board and form an accommodation space between the bottom plate part and the circuit board, the accommodation space being configured to accommodate a second power module, and the bottom plate part being configured to be attached to and dissipate heat from the second power module. The heat sink can dissipate heat from at least two power modules at the same time, improving the utilization rate of the heat sink, thereby reducing the number of heat sinks on the circuit board, reducing the occupied space and weight, and reducing the volume and weight of the energy storage device.

Description

Technical Field

[0001] This application relates to the field of circuit board heat dissipation, specifically a heat sink, circuit board assembly, and energy storage device. Background Technology

[0002] Currently, circuit boards in energy storage devices have multiple power modules to realize multiple functions of the energy storage device. Typically, each power module on the circuit board is equipped with a heat sink for heat dissipation. However, as the functions of energy storage devices gradually increase, the number of power modules on the circuit board also gradually increases. Therefore, more heat sinks need to be installed on the circuit board to meet the heat dissipation requirements of the circuit board.

[0003] In related technologies, due to the large size and weight of heat sinks, configuring one heat sink for each power module would result in a large number of heat sinks, low utilization rate of each heat sink, and a large number of heat sinks would occupy a large space and increase weight, thereby increasing the size and weight of the energy storage device. Utility Model Content

[0004] In view of this, this application provides a heat sink, circuit board assembly and energy storage device that can improve utilization.

[0005] One embodiment of this application provides a heat sink, including a base plate, a side plate, and a support. The side plate is disposed on one side of the base plate and perpendicular to the base plate, and is configured to accommodate a first power module and dissipate heat from the first power module. The support is disposed on the side of the base plate opposite to the side plate, and is configured to be mounted on a circuit board, forming a receiving space between the base plate and the circuit board. The receiving space is configured to accommodate a second power module, and the base plate is configured to accommodate the second power module and dissipate heat from the second power module.

[0006] When the heat sink provided in this application is used, it not only attaches to and dissipates heat from the first power module through the side plate, but also forms a receiving space between the base plate and the circuit board through the support portion to accommodate the second power module. This allows the base plate to attach to and dissipate heat from the second power module, thereby achieving the effect of simultaneously dissipating heat from the first and second power modules. Compared to the method of dissipating heat from each power module through a heat sink, the heat sink provided in this application can dissipate heat from at least two power modules at the same time, improving the utilization rate of the heat sink, thereby reducing the number of heat sinks on the circuit board, reducing the space occupied and weight, and further reducing the size and weight of the energy storage device.

[0007] In some embodiments, the support includes a plurality of ribs, the side of the ribs facing away from the base plate being configured to be disposed on the circuit board, the plurality of ribs being parallel and / or intersecting, and the accommodating space forming subspaces between two adjacent ribs and / or between intersecting ribs, each subspace being configured to accommodate a second power module.

[0008] In some embodiments, there are two ribs, which extend along two opposite edges of the base plate, and a receiving space is formed between the two ribs to form a subspace. The subspace forms an opening at the other two opposite edges of the base plate.

[0009] In some embodiments, the support portion includes a plurality of protrusions spaced apart on the base plate portion, and the side of each protrusion facing away from the base plate portion is configured to be disposed on a circuit board.

[0010] In some embodiments, the base plate portion has a heat-conducting element on one side of the receiving space, and the heat-conducting element is configured to fill between the base plate portion and the second power module.

[0011] In some embodiments, an insulating member is provided on the side of the support portion facing away from the base plate portion, and the insulating member is configured to be disposed between the circuit board and the support portion.

[0012] In some embodiments, the radiator further includes a plurality of fins, and the base plate has two spaced side plates, with the fins disposed on opposite sides of the two side plates or disposed on the base plate and located between the two side plates.

[0013] In one embodiment of this application, a circuit board assembly is also provided. The circuit board assembly includes a circuit board, a first power module, a second power module, and a heat sink as described in any of the above embodiments. A support portion is disposed on the circuit board, and the first power module and the second power module are disposed on the circuit board. The first power module is attached to the side plate portion, and the second power module is located in the accommodating space and is attached to the bottom plate portion.

[0014] In some embodiments, the circuit board assembly further includes a sub-board, one side of which is attached to a side panel portion, and the second power module is disposed on the other side of the sub-board.

[0015] In one embodiment of this application, an energy storage device is also provided. The energy storage device includes a battery pack, a housing, and a circuit board assembly as described in any of the above embodiments. The battery pack and the circuit board assembly are disposed inside the housing, and the circuit board assembly is electrically connected to the battery pack.

[0016] The circuit board assembly and energy storage device provided in this application, through the aforementioned heat sink, not only have the side plate portion attached to and dissipating heat from the first power module, but also form a receiving space between the base plate portion and the circuit board through the support portion to accommodate the second power module. This allows the base plate portion to attach to and dissipate heat from the second power module, thereby achieving the effect of the heat sink simultaneously dissipating heat from both the first and second power modules. Compared to the method of dissipating heat from each power module through a heat sink, the heat sink provided in this application can dissipate heat from at least two power modules simultaneously, improving the utilization rate of the heat sink, thereby reducing the number of heat sinks on the circuit board, reducing the space occupied and weight, and further reducing the size and weight of the energy storage device. Attached Figure Description

[0017] Figure 1 This is a perspective view of an energy storage device according to one embodiment of this application.

[0018] Figure 2 for Figure 1 An exploded view of the energy storage device.

[0019] Figure 3 This is a perspective view of a circuit board assembly in one embodiment of this application.

[0020] Figure 4 for Figure 3 An exploded view of the circuit board assembly.

[0021] Figure 5 for Figure 3 Side view of the circuit board assembly.

[0022] Figure 6 This is a perspective view of a heat sink in one embodiment of this application.

[0023] Figure 7 for Figure 6 A three-dimensional view of the bottom of the radiator.

[0024] Figure 8 This is a perspective view of the bottom of the heat sink in one embodiment of this application.

[0025] Figure 9 This is a perspective view of the bottom of the heat sink in one embodiment of this application.

[0026] Figure 10 This is a perspective view of a circuit board assembly in one embodiment of this application.

[0027] Explanation of key component symbols: 100. Heat sink; 200. Circuit board assembly; 201. Circuit board; 2011. Second through hole; 202. First power module; 2021. Fourth through hole; 203. Second power module; 204. Sub-board; 300. Energy storage device; 301. Battery pack; 302. Housing; 10. Base plate; 11. First through hole; 20. Side plate; 21. Third through hole; 30. Support; 31. Rib; 32. Protrusion; 40. Accommodation space; 41. Subspace; 42. Opening; 50. Insulator; 60. Fin; 70. Heat-conducting component; 400. Weld post; 500. Screw. Detailed Implementation

[0028] The technical solution of this application will now be described with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.

[0029] It should be noted that when an element is considered to be "connected to" or "located on" another element, it can be directly connected to the other element or may have an element centrally located. In this application, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "fixed," etc., should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. The terms "first," "second," etc., are only used to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary / secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified. The shape descriptions in the embodiments of this application are merely illustrative and should not constitute any absolute limitation on this application. The terms "vertical" and "parallel" are used to describe the ideal state between two components; in actual production or use, a state approximately vertical or parallel may exist.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. Where there is no conflict, the various embodiments in this application can be combined with each other.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms “comprising,” “having,” and “equipped with,” and any variations thereof, in the description, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion.

[0032] Currently, circuit boards in energy storage devices have multiple power modules to realize multiple functions of the energy storage device. Typically, each power module on the circuit board is equipped with a heat sink for heat dissipation. However, as the functions of energy storage devices gradually increase, the number of power modules on the circuit board also gradually increases. Therefore, more heat sinks need to be installed on the circuit board to meet the heat dissipation requirements of the circuit board.

[0033] In related technologies, due to the large size and weight of heat sinks, configuring one heat sink for each power module would result in a large number of heat sinks, low utilization rate of each heat sink, and a large number of heat sinks would occupy a large space and increase weight, thereby increasing the size and weight of the energy storage device.

[0034] In view of this, this application provides a heat sink, circuit board assembly, and energy storage device that can improve utilization. The heat sink includes a base plate, a side plate, and a support. The side plate is disposed on one side of the base plate and perpendicular to the base plate, and is configured to allow a first power module to be attached and to dissipate heat from the first power module. The support is disposed on the side of the base plate opposite to the side plate, and is configured to be mounted on the circuit board, forming a receiving space between the base plate and the circuit board. The receiving space is configured to accommodate a second power module, and the base plate is configured to allow the second power module to be attached and to dissipate heat from the second power module.

[0035] When the heat sink provided in this application is used, it not only attaches to and dissipates heat from the first power module through the side plate, but also forms a receiving space between the base plate and the circuit board through the support portion to accommodate the second power module. This allows the base plate to attach to and dissipate heat from the second power module, thereby achieving the effect of simultaneously dissipating heat from the first and second power modules. Compared to the method of dissipating heat from each power module through a heat sink, the heat sink provided in this application can dissipate heat from at least two power modules at the same time, improving the utilization rate of the heat sink, thereby reducing the number of heat sinks on the circuit board, reducing the space occupied and weight, and further reducing the size and weight of the energy storage device.

[0036] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0037] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment of the application provides a heat sink 100, a circuit board assembly 200, and an energy storage device 300. The energy storage device 300 includes a battery pack 301, a housing 302, and the circuit board assembly 200. The battery pack 301 and the circuit board assembly 200 are disposed within the housing 302. The circuit board assembly 200 is electrically connected to the battery pack 301. The circuit board assembly 200 can serve as an inverter module to control the charging and discharging of the battery pack 301, thereby enabling the energy storage device 300 to supply power to external devices or to charge the energy storage device 300 from external devices. Alternatively, the circuit board assembly 200 can serve as a BMS (BATTERY MANAGEMENT SYSTEM) component of the battery pack 301 to manage the battery cells in the battery pack 301. Exemplarily, the energy storage device 300 can be a portable power source for outdoor scenarios or a home energy storage system for home energy storage, etc. The external devices can be electrical appliances, solar panels, or home power supply devices, etc.

[0038] like Figure 3 , Figure 4 and Figure 5 As shown, the circuit board assembly 200 includes a circuit board 201, a first power module 202, a second power module 203, and a heat sink 100. The heat sink 100, the first power module 202, and the second power module 203 are disposed on the circuit board 201. The heat sink 100 includes a base plate portion 10, a side plate portion 20, and a support portion 30. The side plate portion 20 is disposed on one side of the base plate portion 10 and perpendicular to the base plate portion 10. The side plate portion 20 is used for mounting the first power module 202 and for heat dissipation of the first power module 202. The support portion 30 is disposed on the side of the base plate portion 10 opposite to the side plate portion 200. The support portion 30 is disposed on the circuit board 201, and a receiving space 40 is formed between the base plate portion 10 and the circuit board 201. The receiving space 40 is used to accommodate the second power module 203. The base plate portion 10 is used for mounting the second power module 203 and for heat dissipation of the second power module 203.

[0039] When in use, the heat sink 100 not only adheres to the first power module 202 and dissipates heat from it through the side plate portion 20, but also forms a receiving space 40 between the base plate portion 10 and the circuit board 201 through the support portion 30 to accommodate the second power module 203. This allows the base plate portion 10 to adhere to the second power module 203 and dissipate heat from it. Thus, the heat sink 100 simultaneously dissipates heat from both the first power module 202 and the second power module 203. Compared to the method where each power module is dissipated by a single heat sink, the heat sink 100 provided in this application can dissipate heat from at least two power modules simultaneously, improving the utilization rate of the heat sink 100. This reduces the number of heat sinks on the circuit board 201, reduces the space occupied and weight, and consequently reduces the volume and weight of the energy storage device 300.

[0040] In some embodiments, the base plate portion 10 is parallel to the circuit board 201, the side plate portion 20 is perpendicular to the circuit board 201, the first power module 202 is a vertical transistor erected on the circuit board 201, and the second power module 203 is a horizontal transistor attached to the circuit board 201.

[0041] In some embodiments, such as Figure 4 , Figure 6 and Figure 7 As shown, the support portion 30 includes multiple ribs 31. The side of each rib 31 facing away from the base plate portion 10 is disposed on the circuit board 201. The multiple ribs 31 are parallel and / or intersecting. The accommodating space 40 forms sub-spaces 41 between adjacent ribs 31 and / or between intersecting ribs 31. Each sub-space 41 can selectively accommodate at least one second power module 203. The multiple ribs 31 are used to support the base plate portion 10 on the circuit board 201, forming not only the accommodating space 40 but also the sub-spaces 41, to achieve heat dissipation for the second power modules 203 at various locations on the circuit board 201. This not only improves the stability of the heat sink 100 on the circuit board 201 but also ensures that the second power modules 203 can fit snugly against the base plate portion 10, thereby guaranteeing the heat dissipation efficiency of the second power modules 203.

[0042] In some embodiments, there are two ribs 31, which extend parallel to each other along the two opposite edges of the base plate 10. The two ribs 31 support the base plate 10 on the circuit board 201. The accommodating space 40 forms a subspace 41 between the two ribs 31. The accommodating space 40 is the subspace 41, which maximizes the volume of the subspace 41. All the second power modules 203 are located in the subspace 41 to accommodate more second power modules 203. In addition, the heat sink 100 is simplified by the two ribs 31 extending parallel to each other along the two opposite edges of the base plate 10, which makes the structure of the heat sink 100 easier to manufacture. At the same time, the subspace 41 forms an opening 42 on the other two opposite edges of the base plate 10. The opening 42 allows the subspace 41 to communicate with the outside atmosphere, so as to facilitate heat exchange between the subspace 41 and the outside, thereby improving the heat dissipation efficiency of the second power modules 203.

[0043] In other embodiments, such as Figure 4 and Figure 8 As shown, the ribs 31 have two or more intersecting ribs, for example, three ribs 31, two of which are parallel and the third rib is perpendicular to the two parallel ribs 31, so that the accommodating space 40 is divided into six sub-spaces 41, each sub-space 41 selectively accommodating the second power module 203. The heat sink 100, through the three intersecting ribs 31, can not only more evenly support the base plate 10 to improve the stability of the base plate 10 on the circuit board 201, but also form multiple spaced sub-spaces 41 to accommodate second power modules 203 in different positions or of different types. Simultaneously, each sub-space 41 is connected to the outside atmosphere at the edge of the base plate 10, so that each sub-space 41 can exchange heat with the outside, improving the heat dissipation efficiency of the second power module 203.

[0044] In some embodiments, such as Figure 4 and Figure 9As shown, the support portion 30 includes multiple protrusions 32, which are spaced apart on the base plate portion 10. Each protrusion 32 is located on the circuit board 201 on the side facing away from the base plate portion 10 to support the base plate portion 10, thereby forming a receiving space 40. The multiple protrusions 32 can be distributed at various positions on the base plate portion 10, which not only provides more uniform support to the base plate portion 10, but also allows the multiple protrusions 32 to be adaptively arranged according to the distribution of the multiple second power modules 203. That is, the multiple protrusions 32 can be placed in the gaps between the multiple second power modules 203 without interfering with the second power modules 203, thus improving the adaptability of the heat sink 100. In addition, since the multiple protrusions 32 are spaced apart, gaps can be formed between adjacent two protrusions 32. Therefore, compared with multiple ribs 31, the multiple protrusions 32 can make the receiving space 40 more freely connected to the outside atmosphere, thereby allowing the receiving space 40 to exchange heat with the outside more smoothly and improving the heat dissipation efficiency of the second power modules 203.

[0045] Optionally, multiple protrusions 32 are distributed on two opposite edges of the base plate 10. In this case, the accommodating space 40 is the subspace 41, which maximizes the volume of the subspace 41. All the second power modules 203 are located in the subspace 41 to accommodate more second power modules 203.

[0046] In some embodiments, such as Figure 4 and Figure 5 As shown, an insulating member 50 is provided on the side of the support portion 30 facing away from the base plate portion 10. The insulating member 50 is configured to be disposed between the circuit board 201 and the support portion 30. For example, the insulating member 50 is disposed at the bottom of the rib 31 and / or the protrusion 32. The insulating member 50 is used to insulate the heat sink 100 from the circuit board 201, thereby improving the safety of the circuit board 201 and reducing the risk of short circuits in the circuit board 201. Optionally, the insulating member 50 is an insulating pad or insulating adhesive, etc.

[0047] In some embodiments, such as Figure 4 and Figure 5 As shown, the radiator 100 also includes a plurality of fins 60. The base plate portion 10 is provided with two spaced side plate portions 20. The fins 60 are provided on the opposite side of the two side plate portions 20, or provided on the base plate portion 10 and located between the two side plate portions 20. The plurality of fins 60 are used to assist the base plate portion 10 and the side plate portions 20 in heat dissipation, so as to improve heat dissipation efficiency.

[0048] In some embodiments, such as Figure 4 and Figure 5As shown, the base plate 10 has a heat-conducting element 70 on one side of the accommodating space 40. The heat-conducting element 70 is configured to fill the space between the base plate 10 and the second power module 203. The heat-conducting element 70 is used to make more sufficient contact between the second power module 203 and the base plate 10, thereby transferring the heat of the second power module 203 to the base plate 10 more efficiently, thus improving the heat dissipation efficiency of the second power module 203. Optionally, the heat-conducting element 70 is a flexible thermal pad or thermal adhesive, etc.

[0049] In some embodiments, such as Figure 3 , Figure 4 and Figure 5 As shown, the heat sink 100 has a first through hole 11 on the base plate 10, and the circuit board 201 has a second through hole 2011. The first through hole 11 and the second through hole 2011 are aligned with each other. The solder post 400 passes through the first through hole 11 and the second through hole 2011, allowing the heat sink 100 and the circuit board 201 to be soldered using a wave soldering process. One end of the solder post 400 is soldered to the heat sink 100, and the other end is soldered to the circuit board 201. After soldering, the solder post 400 fixes the heat sink 100 to the circuit board 201. When the circuit board 201 needs to be soldered with electronic components using a wave soldering process, the solder post 400 can be soldered simultaneously with the electronic components to fix the heat sink 100 and the circuit board 201, thereby improving soldering efficiency.

[0050] Optionally, the heat sink 100 has a first through hole 11 at each end of the base plate 10 along the length direction, and the circuit board 201 has two corresponding second through holes 2011. Each first through hole 11 is aligned with a corresponding second through hole 2011 and a solder post 400 is inserted therein, so that both ends of the heat sink 100 are fixed to the circuit board 201, thereby improving the stability of the heat sink 100 on the circuit board 201.

[0051] In other embodiments, the heat sink 100 has a first through hole 11 in the base plate 10, and the circuit board 201 has a second through hole 2011, such as Figure 3 , Figure 4 and Figure 5 As shown, the first through hole 11 and the second through hole 2011 are aligned with each other, and the screw 500 passes through the first through hole 11 and the second through hole 2011, so that the heat sink 100 is fixed to the circuit board 201. When the circuit board 201 does not require wave soldering of electronic components, the heat sink 100 can be fixed to the circuit board 201 by means of screw 500 and nut, which can reduce costs.

[0052] Optionally, the nut that matches the screw 500 can be soldered to the side of the circuit board 201 facing the heat sink 100. When installing the heat sink 100, the first through hole 11 can be aligned with the nut to install the screw 500, so as to fix the heat sink 100 to the circuit board 201, which can improve the installation efficiency.

[0053] In some embodiments, such as Figure 3 , Figure 4 and Figure 5 As shown, the heat sink 100 has a third through hole 21 on the side plate 20 and the first power module 202 has a fourth through hole 2021. The third through hole 21 and the fourth through hole are aligned so that the screw 500 can pass through, so that the first power module 202 is fixed to the side plate 20 by the screw 500, thereby making the first power module 202 close to the side plate 20 to improve heat dissipation efficiency.

[0054] In some embodiments, such as Figure 10 As shown, the circuit board assembly 200 also includes a sub-board 204, which is perpendicular to the circuit board 201. One side of the sub-board 204 is attached to the side plate portion 20, and the first power module 202 is disposed on the other side of the sub-board 204. The heat of the first power module 202 is transferred to the side plate portion 20 through the sub-board 204, so that the heat sink 100 dissipates heat from the first power module 202. Optionally, the first power module 202 disposed on the sub-board 204 is a surface-mount transistor, and the sub-board 204 is attached to the side plate portion 20 with thermally conductive adhesive.

[0055] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A radiator, characterized in that, include: Base plate; A side plate portion is disposed on one side of the bottom plate portion and perpendicular to the bottom plate portion, and the side plate portion is configured to allow the first power module to be attached and to dissipate heat from the first power module; and A support portion is provided on the side of the base plate facing away from the side plate. The support portion is configured to be disposed on the circuit board and to form a receiving space between the base plate and the circuit board. The receiving space is configured to accommodate a second power module. The base plate is configured to allow the second power module to be attached and to dissipate heat from the second power module.

2. The radiator as described in claim 1, characterized in that: The support portion includes a plurality of ribs, the side of which facing away from the base plate is configured to be disposed on the circuit board. The plurality of ribs are parallel and / or intersecting. The accommodating space forms subspaces between two adjacent ribs and / or between the intersecting ribs. Each subspace is configured to accommodate the second power module.

3. The radiator as described in claim 2, characterized in that: The ribs are two in number, and the two ribs extend along two opposite edges of the base plate. The receiving space forms a subspace between the two ribs, and the subspace forms an opening at each of the other two opposite edges of the base plate.

4. The radiator as described in claim 1, characterized in that: The support portion includes a plurality of protrusions, which are spaced apart on the base plate portion, and the side of each protrusion facing away from the base plate portion is configured to be disposed on the circuit board.

5. The radiator as described in any one of claims 1 to 4, characterized in that: The base plate is provided with a heat-conducting element on one side of the accommodating space, and the heat-conducting element is configured to fill the space between the base plate and the second power module.

6. The radiator as described in any one of claims 1 to 4, characterized in that: An insulating member is provided on the side of the support portion facing away from the base plate portion, and the insulating member is configured to be disposed between the circuit board and the support portion.

7. The radiator as described in any one of claims 1 to 4, characterized in that: The radiator also includes multiple fins, and the base plate has two spaced-apart side plates. The fins are located on opposite sides of the two side plates or on the base plate and between the two side plates.

8. A circuit board assembly, characterized in that: The circuit board assembly includes a circuit board, a first power module, a second power module, and a heat sink as described in any one of claims 1 to 7. The support portion is disposed on the circuit board, the first power module and the second power module are disposed on the circuit board, the first power module is attached to the side plate portion, and the second power module is located in the receiving space and attached to the bottom plate portion.

9. The circuit board assembly as claimed in claim 8, characterized in that: The circuit board assembly also includes a sub-board, one side of which is attached to the side panel portion, and the first power module is disposed on the other side of the sub-board.

10. An energy storage device, characterized in that: The energy storage device includes a battery pack, a housing, and a circuit board assembly as described in any one of claims 8 or 9, wherein the battery pack and the circuit board assembly are disposed within the housing, and the circuit board assembly is electrically connected to the battery pack.

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