A novel VC structure

CN224734022UActive Publication Date: 2026-09-08KUNSHAN YINGFAN PRECISION METAL
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Patent Information

Application Number
CN202522159967.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-13
Publication Date
2026-09-08
Estimated Expiration
2035-10-13

AI Technical Summary

Technical Problem

1.单网结构:毛细力一般,功率受限;

Benefits of technology

增加液体回流速度,毛细力强,测试功率高;

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a novel VC structure, including upper cover and lower cover, upper cover and lower cover sealed connection and inside form cavity, the lower cover inner wall is established with microchannel, the lower cover inner wall surface bonds with capillary net structure. The microchannel is the groove formed with chemical etching or laser scanning. The utility model discloses technical effect and advantage: increase liquid backflow speed, capillary force is strong, and test power is high, and the work quality backflow speed is fast in the lower cover cavity inside, and the heat exchange efficiency is more optimal, and the test power is 10-20W higher than single net structure, and there is no bulge phenomenon in cold and hot impact test.
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Description

Technical Field

[0001] This utility model relates to the field of thin VC capillary structure design, and more specifically to a novel VC structure. Background Technology

[0002] Thin VCs currently commonly use the following two structures: 1. Single-network structure: capillary force is generally low, and power is limited; 2. Mesh + wire structure: bulging is prone to occur during thermal shock testing. Utility Model Content

[0003] In order to overcome the above-mentioned defects of the prior art, this utility model provides a novel VC structure.

[0004] The technical solution of this utility model is as follows: A novel VC structure includes an upper cover and a lower cover, which are sealed together and form a cavity inside. The inner wall of the lower cover has microchannels and a capillary mesh structure is bonded to the inner wall surface of the lower cover.

[0005] The microchannels are trenches formed by chemical etching or laser scanning.

[0006] The capillary mesh structure is a copper mesh structure, a stainless steel structure, or a foamed copper structure.

[0007] The upper and lower covers are welded together by diffusion welding or brazing to form a sealed structure.

[0008] The technical effects and advantages of this utility model are as follows: Increased liquid reflux rate, strong capillary force, and high test power; The working fluid inside the lower cover cavity flows back quickly, resulting in better heat exchange efficiency. The test power was 10-20W higher than that of a single-network structure; No bulging was observed during the thermal shock test. Attached Figure Description

[0009] Figure 1 This is an exploded structural diagram of the present invention; Figure 2 This is a schematic diagram of the overall structure of this utility model. Detailed Implementation

[0010] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. Example

[0011] like Figure 1 and Figure 2 The novel VC structure shown includes an upper cover 1 and a lower cover 2, which are sealed together and form a cavity inside. The inner wall of the lower cover 2 is provided with microchannels 21, and the inner wall surface of the lower cover 2 is bonded with a capillary mesh structure 22.

[0012] Furthermore, the microchannels are trenches formed by chemical etching or laser scanning.

[0013] Furthermore, the capillary mesh structure is a copper mesh structure, a stainless steel structure, or a foamed copper structure.

[0014] Furthermore, the upper and lower covers are welded together by diffusion welding or brazing to form a sealed structure. Example

[0015] 1. The internal cavity of the lower cover material (including but not limited to alloy copper, stainless steel, and Cu1020) is formed with microchannels by chemical etching or laser scanning. 2. Place the mesh (including but not limited to copper mesh, stainless steel, and foamed copper) into the lower cover cavity and sinter it under high temperature and fixed pressure to bond the mesh to the lower cover cavity; 3. The upper cover and the lower cover with the welded mesh are welded together by diffusion welding or brazing to form a sealed structure.

[0016] This patent uses VC lower cover cavity surface treatment and microchannel formation before post-processing to increase liquid reflux speed, strong capillary force, and high testing power.

[0017] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel VC structure, characterized in that: It includes an upper cover and a lower cover, which are sealed together and form a cavity inside. The inner wall of the lower cover has microchannels as grooves, which are formed by chemical etching or laser scanning. The inner wall surface of the lower cover has a capillary structure sintered by high temperature and fixed pressure.

2. The novel VC structure according to claim 1, characterized in that: The capillary mesh structure is a copper mesh structure, a stainless steel structure, or a foamed copper structure.

3. The novel VC structure according to claim 1, characterized in that: The upper and lower covers are welded together by diffusion welding or brazing to form a sealed structure.