Air-cooled heat dissipation structure and testing device

Abstract

The utility model relates to chip testing technical field discloses a kind of air cooling heat dissipation structure and testing device, and the air cooling heat dissipation structure includes cold air pipe, connecting structure, heat conduction piece, heat spreader. Connecting structure is provided with air inlet channel, air inlet channel is communicated with cold air pipe, the lower end of connecting structure is provided with first recess, air inlet channel is communicated with first recess, one end of heat conduction piece is connected with the lower end of connecting structure, the other end of heat conduction piece is adapted to contact with chip, heat conduction piece and first recess form a cavity, air inlet channel is communicated with cavity, the side wall of cavity is provided with air outlet channel being communicated with external environment, heat spreader is set on heat conduction piece, and heat spreader is located in cavity. Chip overheating can be effectively prevented, and test data comprehensiveness and reliability are improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a wind-cooled heat dissipation structure and testing device. Background Technology

[0002] In the manufacturing process of integrated circuit boards, in-circuit testing is a crucial step in ensuring product quality. In-circuit testing uses specialized bed-of-nails fixtures to contact test points on the circuit board, performing electrical performance tests on the components to quickly locate manufacturing defects such as open circuits, short circuits, mis-assembly, and missing components. To ensure the comprehensiveness and reliability of the test, the testing system must power on and operate the core chips on the circuit board, especially high-performance chips using BGA (Ball Grid Array) packages, under high load during testing to simulate their real-world operating conditions. However, these BGA chips typically have high integration and high power density, generating a significant amount of heat in a short period during testing. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a wind-cooled heat dissipation structure, which can effectively prevent chip overheating and improve the comprehensiveness and reliability of test data.

[0004] This utility model also proposes a test device having the above-mentioned air-cooled heat dissipation structure.

[0005] A wind-cooled heat dissipation structure according to a first aspect embodiment of the present invention includes: Air conditioning pipes; The connecting structure has an air inlet slot that is connected to the air cooling pipe, and a first groove is provided at the lower end of the connecting structure, with the air inlet slot connected to the first groove. A heat-conducting component, one end of which is connected to the lower end of the connecting structure, and the other end of which is adapted to contact the chip. The heat-conducting component and the first groove form a cavity. The air inlet slot communicates with the cavity. An air outlet slot communicating with the external environment is provided on the side wall of the cavity. A heat spreader is disposed on the heat-conducting component and located within the cavity.

[0006] According to some embodiments of the present invention, the connecting structure includes a first connecting member and a second connecting member connected vertically, the air inlet groove passes through the first connecting member and the second connecting member, the first groove is formed on the second connecting member, and the maximum cross-section of the first connecting member in the horizontal direction is greater than the maximum cross-section of the second connecting member in the horizontal direction.

[0007] According to some embodiments of the present invention, the lower end of the connecting structure is further provided with a second groove, the upper end of the second groove is connected to the air inlet groove, and the lower end of the second groove is connected to the first groove.

[0008] According to some embodiments of the present invention, the inner diameter of the second groove is smaller than the inner diameter of the first groove.

[0009] According to some embodiments of the present invention, the heat-conducting component has an installation groove, the opening of the installation groove faces the connecting structure, one end of the heat-spreading plate is connected to the bottom of the installation groove, and the other end of the heat-spreading plate extends toward the connecting structure.

[0010] According to some embodiments of this utility model, four air outlet slots are provided and are evenly distributed along the circumference of the cavity.

[0011] According to some embodiments of the present invention, multiple heat spreaders are provided, and the multiple heat spreaders are arranged around the geometric center of the upper end surface of the heat-conducting component.

[0012] According to some embodiments of the present invention, the lower end of the air inlet slot faces the upper end surface of the heat spreader.

[0013] According to some embodiments of the present invention, the heat-conducting element is in contact with the chip through a heat-conducting medium.

[0014] The testing apparatus according to a second aspect of the present invention includes a wind-cooled heat dissipation structure according to the first aspect of the present invention described above.

[0015] The present invention has at least the following beneficial effects: cold air is introduced through the cold air pipe and guided to the heat-conducting component and the heat spreader through the connecting structure. The upper end of the heat spreader significantly increases the heat dissipation area of ​​the heat-conducting component, thereby simultaneously improving the heat receiving capacity and the cold air contact efficiency. The heat spreader is located in the cavity formed by the first groove and the heat-conducting component, which simplifies the size of the structure. The lower end of the heat spreader is in contact with the chip, which can quickly receive a large amount of heat generated by the chip during the test and conduct it into the cavity and dissipate it to the external environment through the air outlet slot. This effectively prevents the chip from overheating, ensures that the chip operates stably under high load during the test, improves the comprehensiveness and reliability of the test, and avoids test errors or equipment damage caused by temperature rise.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is an assembly structure diagram of the air-cooled heat dissipation structure according to an embodiment of the present utility model; Figure 2 yes Figure 1 Sectional view at point AA; Figure 3 This is an exploded view of the assembly structure of the air-cooled heat dissipation structure according to an embodiment of the present utility model; Figure 4 for Figure 3 The diagram shows the structure of the second connector of the air-cooled heat dissipation structure.

[0018] Figure label: 100mm air conditioning pipe Connection structure 200, air inlet channel 210, first groove 220, second groove 221, first connector 230, second connector 240. Heat-conducting component 300, air outlet channel 310, mounting channel 320, heat-conducting medium 330 Cavity 400 Heat spreader 500. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] In the description of this utility model, it should be understood that the terms "center," "upper," "lower," "vertical," "horizontal," "circumferential," "bottom," and "inner," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this utility model, unless otherwise explicitly defined, the terms "setting", "installing", "connecting", "linking", etc. should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in combination with the specific content of the technical solution.

[0022] The following is as follows Figures 1 to 4 This invention describes a wind-cooled heat dissipation structure according to an embodiment of the present invention.

[0023] like Figure 1 and Figure 2 As shown, a wind-cooled heat dissipation structure according to an embodiment of the present invention includes a cooling pipe 100, a connecting structure 200, a heat-conducting component 300, and a heat spreader 500. The connecting structure 200 has an air inlet groove 210, which communicates with the cooling pipe 100. A first groove 220 is formed at the lower end of the connecting structure 200, and the air inlet groove 210 communicates with the first groove 220. One end of the heat-conducting component 300 is connected to the lower end of the connecting structure 200, and the other end of the heat-conducting component 300 is adapted to contact a chip. The heat-conducting component 300 and the first groove 220 form a cavity 400. The air inlet groove 210 communicates with the cavity 400. An air outlet groove 310 communicating with the external environment is formed on the side wall of the cavity 400. The heat spreader 500 is disposed on the heat-conducting component 300 and is located inside the cavity 400.

[0024] When the air-cooled heat dissipation structure is working, cold air enters through the cold air duct 100, is introduced into the cavity 400 through the air inlet slot 210, and can quickly cool the temperature of the heat-conducting component 300 and the heat spreader 500 and dissipate to the external environment through the air outlet slot 310. The lower end of the heat-conducting component 300 can be in close contact with the chip. According to the thermodynamic principle of heat transfer from high temperature area to low temperature area, the heat generated by the chip during the test is continuously conducted to the heat-conducting component 300. The upper end of the heat-conducting component 300 is provided with a heat spreader 500. One end of the heat spreader 500 is set on the heat-conducting component 300, and the other end extends into the first groove 220. The setting of the heat spreader 500 not only enhances the overall heat receiving capacity, but also increases the contact area with the cold air, thereby effectively improving the cooling efficiency, realizing the rapid cooling of the heat-conducting component 300 and the heat spreader 500, and further cooling the chip.

[0025] It is understandable that the air outlet duct 310 can be provided only on the heat-conducting component 300 or the connecting structure 200, or it can be provided on both the heat-conducting component 300 and the connecting structure 200. It is also understandable that the horizontal position of the air outlet duct 310 should be as close as possible to the connection between the heat-conducting component 300 and the heat spreader 500.

[0026] It is understandable that the structure of the heat-conducting component 300 at the chip contact end is adapted to the chip surface.

[0027] In some specific embodiments of this utility model, the connecting structure 200 includes a first connecting member 230 and a second connecting member 240 connected vertically, an air inlet groove 210 passing through the first connecting member 230 and the second connecting member 240, a first groove 220 being formed on the second connecting member 240, and the maximum cross-section of the first connecting member 230 in the horizontal direction being greater than the maximum cross-section of the second connecting member 240 in the horizontal direction.

[0028] like Figure 3 As shown, in this embodiment, the first connector 230 and the second connector 240 are set separately, which can easily form a structure in which the maximum cross-section of the first connector 230 in the horizontal direction is larger than the maximum cross-section of the second connector 240 in the horizontal direction. Furthermore, the upper end face of the first connector 230 facilitates the installation of the overall structure. The smaller cross-section of the second connector 240 can reduce unnecessary material waste and space occupation.

[0029] In some specific embodiments of this utility model, the lower end of the connecting structure 200 is further provided with a second groove 221, the upper end of the second groove 221 is connected to the air inlet groove 210, and the lower end of the second groove 221 is connected to the first groove 220.

[0030] like Figure 2 and Figure 4 As shown, in this embodiment, the second groove 221 is located at the bottom of the first groove 220, and the lower end of the air inlet groove 210 is located at the bottom of the second groove 221. It can be understood that the second groove 221 forms a pressure-stabilizing layer. When high-speed cold air enters the cavity 400, it can quickly decelerate and mix in the second groove 221, converting dynamic pressure into uniform static pressure. This ensures that the cold air can enter the first groove 220 evenly and smoothly, ultimately covering the heat-conducting component 300 and the heat spreader 500 to the maximum extent with a uniform airflow speed, eliminating cooling dead zones and improving cooling efficiency and effect.

[0031] In some specific embodiments of this utility model, the inner diameter of the second groove 221 is smaller than the inner diameter of the first groove 220. For example... Figure 2 As shown, in this embodiment, the setting that the inner diameter of the second groove 221 is smaller than the inner diameter of the first groove 220 can ensure that gas does not accumulate in the second groove 221 while realizing the pressure stabilizing layer, thereby preventing a decrease in cooling efficiency.

[0032] In some specific embodiments of this utility model, the heat-conducting component 300 has an installation groove 320, the opening of the installation groove 320 faces the connecting structure 200, one end of the heat-spreading plate 500 is connected to the bottom of the installation groove 320, and the other end of the heat-spreading plate 500 extends toward the connecting structure 200.

[0033] like Figure 2 and Figure 3 As shown, in this embodiment, the cavity 400 includes a mounting groove 320. One end of the heat spreader 500 is disposed at the bottom of the mounting groove 320, and the other end of the heat spreader 500 extends toward the connecting structure 200. The air inlet vent 210 can deliver cold air into the mounting groove 320 to contact the heat-conducting component 300 and the heat spreader 500. After the cold air contacts the heat-conducting component 300 and the heat spreader 500 in the mounting groove 320, it can also be discharged from the air outlet vent 310.

[0034] It is understood that the cavity 400 can be formed by the first groove 220 and the upper end face of the heat-conducting element 300, or by the mounting groove 320 and the lower end face of the connecting structure 200, or by a combination of the mounting groove 320 and the first groove 220.

[0035] In some specific embodiments of this utility model, four air outlet slots 310 are provided and are evenly distributed along the circumference of the cavity 400.

[0036] like Figure 1 and Figure 3 As shown, in this embodiment, the connecting structure 200 and the heat-conducting component 300 form a columnar structure with four sides. The air outlet groove 310 is provided with four evenly distributed grooves, which ensures that the gas in the cavity 400 can flow out in multiple directions evenly without obstruction, thereby ensuring smooth airflow and optimizing the cooling effect.

[0037] In some specific embodiments of this utility model, multiple heat spreaders 500 are provided, and the multiple heat spreaders 500 are arranged around the geometric center of the upper end face of the heat conductor 300.

[0038] like Figure 3 As shown, in this embodiment, fifty heat spreaders 500 are arranged in three layers around the geometric center of the upper surface of the heat conductor 300 in numbers of six, twenty-two, and twenty-two.

[0039] It is understandable that the heat spreader 500 is preferably a flat and long columnar structure. This multi-layered, surrounding arrangement naturally forms a gas flow channel between each adjacent heat spreader 500, which facilitates the rapid discharge of cold air through the exhaust vent 310 after the cold air has fully contacted and exchanged heat with the heat spreader 500, thereby improving the airflow circulation efficiency.

[0040] Understandably, the purpose of the heat spreader 500 is to increase the heat-bearing capacity of the heat-conducting component 300 and its contact area with the cooling air, thereby achieving rapid cooling of the chip. Therefore, its specific number and arrangement can be adaptively adjusted according to the actual area available for installation on the heat-conducting component 300 and the size of the heat spreader 500. For example, the number can be thirty, forty, or one hundred, and the arrangement can be parallel, disordered, etc.

[0041] In some specific embodiments of this utility model, the lower end of the air inlet slot 210 faces the upper end surface of the heat spreader 500.

[0042] like Figure 2 and Figure 3 As shown, in this embodiment, the air inlet duct 210 is arranged vertically, and the opening of the air inlet duct 210 faces the upper surface of the heat exchange plate 500. This layout allows the cold air to cover and cool the heat exchange plate 500 to the greatest extent possible from top to bottom.

[0043] Understandably, the heat-conducting component 300 absorbs heat from the chip through contact heat transfer. In actual production, the geometric center of the chip is usually the area with the highest heat flux density. Correspondingly, the highest temperature point of the assembly of the heat-conducting component 300 and the heat spreader 500 is also located near this geometric center. By precisely aligning the opening of the air inlet slot 210 with this high-temperature central area, and allowing the cool air to radiate outwards from the cavity 400 through the evenly distributed circumferential air outlet slots 310, a forced convection path from the central high-temperature area to the surrounding areas can be constructed. This "central air inlet, surrounding air outlet" airflow design enables precise cooling of the core heat-generating area, thereby significantly improving the system's heat dissipation efficiency.

[0044] In some specific embodiments of this utility model, the heat-conducting element 300 contacts the chip through a heat-conducting medium 330. For example... Figure 3 As shown, in this embodiment, the thermal conductive medium 330 helps the thermal conductive component 300 to better receive heat from the chip.

[0045] This utility model embodiment also discloses a testing device, including the above-described air-cooled heat dissipation structure.

[0046] When the air-cooled heat dissipation structure is working, cold air enters through the cold air duct 100, is introduced into the cavity 400 through the air inlet slot 210, and can quickly cool the temperature of the heat-conducting component 300 and the heat spreader 500 and dissipate to the external environment through the air outlet slot 310. The heat-conducting component 300 is in close contact with the chip through the heat-conducting medium 330. According to the thermodynamic principle of heat transfer from high temperature area to low temperature area, the heat generated by the chip during the test is continuously conducted to the heat-conducting component 300. The heat-conducting component 300 is also provided with a heat spreader 500. One end of the heat spreader 500 is set on the heat-conducting component 300, and the other end extends into the first groove 220. The setting of the heat spreader 500 not only enhances the overall heat receiving capacity, but also increases the contact area with the cold air, thereby effectively improving the cooling efficiency, realizing the rapid cooling of the heat-conducting component 300 and the heat spreader 500, and further cooling the chip.

[0047] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An air-cooled heat dissipation structure, characterized by comprising: The application relates to a wind-cooled heat dissipation structure. The wind-cooled heat dissipation structure comprises a cold air pipe (100), a connecting structure (200) provided with an air inlet channel (210) which is communicated with the cold air pipe (100), a first recess (220) formed in the lower end of the connecting structure (200), a heat conducting member (300) having one end connected with the lower end of the connecting structure (200) and the other end adapted to contact a chip, a cavity (400) formed by the heat conducting member (300) and the first recess (220), an air outlet channel (310) formed in the side wall of the cavity (400) and communicated with the outside environment, and a vapor chamber (500) arranged on the heat conducting member (300) and located in the cavity (400). The connecting structure (200) comprises a first connecting member (230) and a second connecting member (240) connected in sequence, the air inlet channel (210) penetrates through the first connecting member (230) and the second connecting member (240), the first recess (220) is formed in the second connecting member (240), and the maximum cross section of the first connecting member (230) in the horizontal direction is larger than that of the second connecting member (240). The lower end of the connecting structure (200) is further provided with a second recess (221), the upper end of the second recess (221) is communicated with the air inlet channel (210), and the lower end of the second recess (221) is communicated with the first recess (220). The inner diameter of the second recess (221) is smaller than that of the first recess (220).

2. The air-cooled heat dissipation structure according to claim 1, characterized in that, The heat conducting member (300) is provided with a mounting groove (320), the groove opening of the mounting groove (320) faces the connecting structure (200), one end of the vapor chamber (500) is connected to the groove bottom of the mounting groove (320), and the other end of the vapor chamber (500) extends towards the connecting structure (200).

3. The air-cooled heat dissipation structure according to claim 1, characterized in that, The air outlet channel (310) is provided with four air outlet channels which are uniformly distributed along the circumference of the cavity (400).

4. The air-cooled heat dissipation structure according to claim 3, characterized in that, The vapor chamber (500) is provided with a plurality of vapor chambers which are arranged around the geometric center of the upper end surface of the heat conducting member (300).

5. The air-cooled heat dissipation structure according to claim 1, characterized in that, The lower end groove opening of the air inlet channel (210) faces the upper end surface of the vapor chamber (500).

6. The air-cooled heat dissipation structure according to claim 1, characterized in that, The heat conducting member (300) contacts the chip through a heat conducting medium (330).

7. The air-cooled heat dissipation structure according to claim 1, characterized in that, The application further discloses a wind-cooled heat dissipation structure comprising the wind-cooled heat dissipation structure.

8. The air-cooled heat dissipation structure according to claim 1, characterized in that, ​ 9. The air-cooled heat dissipation structure according to claim 1, characterized in that, ​ 10. A test device, characterized by ​

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