Thermal interface structure for heat absorption and conduction

Abstract

The utility model discloses a heat interface structure for heat absorption and heat conduction relates to electronic component technical field. This heat interface structure for heat absorption and heat conduction, including bottom shell, the top of bottom shell is fixedly installed with top shell through bolt, the inside fixed mounting of bottom shell has source IC, the bottom of bottom shell inner surface is provided with main base plate, the upper surface of main base plate is fixedly connected with a plurality of fixed cylinder, the inside of fixed cylinder is equipped with movable plate, the lower surface of movable plate is fixedly connected with support spring, the upper surface of movable plate is fixedly connected with support rod, the top of support rod is fixedly connected with heat conduction board, the upper surface of heat conduction board is provided with contact surface coating, the lower surface of heat conduction board is fixedly connected with a plurality of radiating fins, the utility model discloses can ensure compact heat conduction contact through elastic support, and utilize the expansion radiating area to realize efficient heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, specifically to a thermal interface structure for heat absorption and conduction. Background Technology

[0002] Organic light-emitting diode (OLED) displays, as a next-generation display technology, have gained widespread application in consumer electronics due to their advantages such as self-illumination, wide viewing angle, high contrast, fast response speed, and flexible display capabilities. The core component of these devices is the OLED panel, which requires a driving integrated circuit (such as a source IC) to provide signals during operation. However, the driving IC generates a significant amount of heat during operation, causing its own temperature to rise rapidly. If this heat cannot be dissipated effectively and promptly, it will not only accelerate the aging of the IC itself and shorten its lifespan, but may also affect the performance stability of adjacent optical components, and even lead to display quality problems such as uneven brightness and color shift in the display panel, severely restricting the high-performance and long-life design of the device.

[0003] According to patent number CN200910172882.9, an organic electroluminescent display device and its manufacturing method are disclosed. An organic electroluminescent display device includes: an organic electroluminescent panel, comprising a viewing surface for displaying an image and a facing surface, and including a plurality of source pads located in a peripheral region of the organic electroluminescent panel; a bottom cover configured to face the facing surface of the organic electroluminescent panel; at least one source IC configured to output source signals corresponding to the source pads, and the at least one source IC is located between the bottom cover and the facing surface of the organic electroluminescent panel; and a heat-conducting unit configured to be located between the at least one source IC and the bottom cover, and in contact with the at least one source IC and the bottom cover.

[0004] While the aforementioned patents have established a heat conduction path to some extent, they still have significant limitations. The overall heat-conducting cover is difficult to adapt to the slight height differences that may exist between multiple source ICs, which can easily lead to poor contact of some ICs, local hot spots, uneven thermal resistance, and thus affect the overall heat dissipation performance. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a thermal interface structure for heat absorption and conduction, thereby solving the problems of poor contact and uneven thermal resistance caused by the existing integral thermal conductive cover plate, which is difficult to adapt to the height differences of multiple source ICs, as mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a heat interface structure for heat absorption and conduction, comprising a bottom shell, a top shell fixedly mounted on the top of the bottom shell by bolts, an active IC fixedly mounted inside the bottom shell, a main substrate disposed at the bottom of the inner surface of the bottom shell, multiple fixed cylinders fixedly connected to the upper surface of the main substrate, a movable plate sleeved inside the fixed cylinders, a support spring fixedly connected to the lower surface of the movable plate, a support rod fixedly connected to the upper surface of the movable plate, a heat-conducting plate fixedly connected to the top of the support rod, a contact surface coating disposed on the upper surface of the heat-conducting plate, and multiple heat dissipation fins fixedly connected to the lower surface of the heat-conducting plate.

[0007] Preferably, the bottom of the base shell has multiple positioning holes, and the lower surface of the main substrate is fixedly connected with multiple positioning screws.

[0008] Preferably, the outer surface of the positioning screw passes through the positioning hole, and a nut is threaded onto the outer surface of the positioning screw, with the nut positioned below the bottom shell.

[0009] Preferably, the bottom end of the support spring is fixedly connected to the bottom of the inner cavity of the fixed cylinder, and the outer surface of the support rod penetrates the top of the fixed cylinder.

[0010] Preferably, the upper surface of the contact surface coating is in contact with the lower surface of the source IC.

[0011] Preferably, the bottom of the bottom shell has multiple perforations, the outer surface of the heat dissipation fins is fitted inside the perforations, and the heat dissipation fins pass through the perforations and extend to the bottom of the bottom shell. Beneficial effects

[0012] This invention provides a thermal interface structure for heat absorption and conduction. It has the following beneficial effects: 1. This heat interface structure for heat absorption and conduction, through the setting of an elastic top support mechanism consisting of a fixed cylinder, a movable plate, a support spring, and a support rod, can provide continuous and uniform elastic pressure to the heat conduction plate, ensuring that the contact surface coating on it always maintains a large-area close contact with the lower surface of the heat source (source IC). This effectively overcomes the contact gap problem caused by installation tolerances or thermal expansion and contraction, significantly reduces the interface contact thermal resistance, and thus achieves efficient and stable heat conduction from the heat source to the heat conduction plate.

[0013] 2. The heat interface structure used for heat absorption and conduction, by directly fixing the heat dissipation fins to the heat conduction plate and extending downward through the perforations in the bottom shell, exposes the core part of the heat dissipation fins to the outside air of the device. This design greatly increases the effective heat dissipation surface area without significantly increasing the overall thickness of the device, making full use of convection heat transfer, and quickly dissipating the heat accumulated on the heat conduction plate to the surrounding environment, thereby significantly improving the heat dissipation efficiency in the final stage and effectively controlling the operating temperature of the heat source. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional view of the overall structure of this utility model; Figure 3 This is a schematic diagram of the structure of the heat-conducting plate of this utility model.

[0015] In the diagram: 1. Bottom shell; 2. Top shell; 3. Source IC; 4. Main substrate; 5. Positioning screw; 6. Positioning hole; 7. Nut; 8. Fixing cylinder; 9. Movable plate; 10. Support spring; 11. Support rod; 12. Heat-conducting plate; 13. Contact surface coating; 14. Heat dissipation fins; 15. Perforation. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] like Figures 1-3 As shown, this utility model provides a thermal interface structure for heat absorption and conduction, including a bottom shell 1, a top shell 2 fixedly installed on the top of the bottom shell 1 by bolts, an active IC 3 fixedly installed inside the bottom shell 1, a main substrate 4 provided at the bottom of the inner surface of the bottom shell 1, a plurality of fixed cylinders 8 fixedly connected to the upper surface of the main substrate 4, a movable plate 9 sleeved inside the fixed cylinders 8, a support spring 10 fixedly connected to the lower surface of the movable plate 9, a support rod 11 fixedly connected to the upper surface of the movable plate 9, a heat-conducting plate 12 fixedly connected to the top of the support rod 11, a contact surface coating 13 provided on the upper surface of the heat-conducting plate 12, and a plurality of heat dissipation fins 14 fixedly connected to the lower surface of the heat-conducting plate 12.

[0018] Specifically, the bottom of the bottom shell 1 has multiple positioning holes 6, and the lower surface of the main substrate 4 is fixedly connected with multiple positioning screws 5. The positioning holes 6 and the positioning screws 5 cooperate with each other to realize the precise positioning and pre-installation of the main substrate 4 in the bottom shell 1, ensuring the alignment accuracy of the entire heat conduction structure.

[0019] Specifically, the outer surface of the positioning screw 5 passes through the positioning hole 6, and the outer surface of the positioning screw 5 is threaded with a nut 7. The nut 7 is located below the bottom shell 1. The nut 7 locks the positioning screw 5 through the threaded connection, thereby firmly fixing the main base plate 4 to the bottom shell 1 and preventing it from shifting due to vibration or thermal stress during equipment use.

[0020] Specifically, the bottom end of the support spring 10 is fixedly connected to the bottom of the inner cavity of the fixed cylinder 8, and the outer surface of the support rod 11 penetrates the top of the fixed cylinder 8. The support spring 10 continuously provides an upward elastic force, which pushes the heat-conducting plate 12 to fit tightly against the source IC3 through the support rod 11, forming an elastic heat-conducting contact interface, effectively compensating for assembly tolerances and thermal expansion and contraction.

[0021] Specifically, the upper surface of the contact coating 13 is in contact with the lower surface of the source IC3. The contact coating 13 is made of a high thermal conductivity material. Its function is to fill the microscopic unevenness between the source IC3 and the heat-conducting plate 12, minimize the contact thermal resistance, and improve the initial heat conduction efficiency.

[0022] Specifically, the bottom of the bottom shell 1 has multiple perforations 15. The outer surface of the heat dissipation fins 14 is fitted inside the perforations 15. The heat dissipation fins 14 pass through the perforations 15 and extend to the bottom of the bottom shell 1. The perforations 15 provide a channel for the heat dissipation fins 14 to pass through the bottom shell 1, so that the effective heat dissipation part of the heat dissipation fins 14 is exposed to the outside air of the device, which greatly increases the heat dissipation area and improves the final heat dissipation capacity to the environment.

[0023] The working principle of the above embodiments: During operation, heat is generated from the source IC3 and conducted to its lower surface. Since the contact surface coating 13 on the upper surface of the heat-conducting plate 12 is in direct contact with the lower surface of the source IC3, the heat is first efficiently absorbed through the contact surface coating 13 and transferred to the heat-conducting plate 12. The heat-conducting plate 12 is connected to the movable plate 9 via the support rod 11. The movable plate 9 is provided with continuous upward elastic pressure by the support spring 10 inside the fixed cylinder 8, thereby ensuring that the heat-conducting plate 12 is always in close contact with the source IC3, effectively reducing contact thermal resistance and avoiding poor contact caused by installation gaps or thermal expansion and contraction. The heat is then conducted from the heat-conducting plate 12 to the fixed lower surface. Multiple heat dissipation fins 14 are connected, passing through perforations 15 on the bottom shell 1 and extending to the outside of the bottom shell 1. Through direct contact with the outside air and convection, heat is quickly dissipated to the surrounding environment. During the entire heat dissipation process, the main substrate 4 is engaged with the positioning hole 6 at the bottom of the bottom shell 1 by the positioning screw 5 and locked by the nut 7, thus providing a stable mounting base for the entire heat conduction and heat dissipation structure. This structure achieves efficient heat conduction and heat dissipation from the heat source to the outside by combining elastic support with multi-fin extended heat dissipation, effectively reducing the operating temperature of the source IC and improving the reliability of the device.

[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. Thermal interface structure for heat absorption and heat conduction, comprising a base housing (1), characterized in that: The top of the bottom shell (1) is fixedly installed with a top shell (2) by bolts. The active IC (3) is fixedly installed inside the bottom shell (1). The bottom of the inner surface of the bottom shell (1) is provided with a main substrate (4). Multiple fixed cylinders (8) are fixedly connected to the upper surface of the main substrate (4). A movable plate (9) is sleeved inside the fixed cylinder (8). A support spring (10) is fixedly connected to the lower surface of the movable plate (9). A support rod (11) is fixedly connected to the upper surface of the movable plate (9). A heat-conducting plate (12) is fixedly connected to the top of the support rod (11). A contact surface coating (13) is provided on the upper surface of the heat-conducting plate (12). Multiple heat dissipation fins (14) are fixedly connected to the lower surface of the heat-conducting plate (12).

2. The thermal interface structure for heat absorption and conduction according to claim 1, characterized in that: The bottom of the bottom shell (1) is provided with multiple positioning holes (6), and multiple positioning screws (5) are fixedly connected to the lower surface of the main base plate (4).

3. The thermal interface structure for heat absorption and conduction according to claim 2, characterized in that: The outer surface of the positioning screw (5) passes through the positioning hole (6), and the outer surface of the positioning screw (5) is threaded with a nut (7), which is located below the bottom shell (1).

4. The thermal interface structure for heat absorption and conduction according to claim 1, characterized in that: The bottom end of the support spring (10) is fixedly connected to the bottom of the inner cavity of the fixed cylinder (8), and the outer surface of the support rod (11) penetrates the top of the fixed cylinder (8).

5. The heat-interfacing structure for heat-dissipating heat-conducting of claim 1, wherein: The upper surface of the contact surface coating (13) is in contact with the lower surface of the source IC (3).

6. The heat-interfacing structure for heat-dissipating heat-conducting of claim 1, wherein: The bottom of the bottom shell (1) has multiple perforations (15), the outer surface of the heat dissipation fins (14) is fitted inside the perforations (15), and the heat dissipation fins (14) pass through the perforations (15) and extend to the bottom of the bottom shell (1).

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