A crosstalk prevention ceramic housing and electronic component
Patent Information
- Application Number
- CN202521983389.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-16
- Publication Date
- 2026-09-08
- Estimated Expiration
- 2035-09-16
AI Technical Summary
[0004]本实用新型实施例提供一种防串扰陶瓷外壳及电子元器件，旨在解决现有采用陶瓷外壳的电器元器件收发端集成在一个外壳上串扰问题严重的技术问题
[0015] Secondly, this utility model embodiment also provides an electronic component, including the aforementioned anti-crosstalk ceramic housing.
Smart Images
Figure CN224734034U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic packaging technology, specifically relating to an anti-crosstalk ceramic shell and electronic components. Background Technology
[0002] Ceramic packaging is an electronic packaging technology that uses ceramic materials as the core carrier. It achieves physical protection, environmental isolation, signal transmission and heat management for electronic components such as chips, sensors and radio frequency modules through ceramic shells or substrates. It is a key packaging form for high-end electronic devices (especially in high reliability, high frequency and high temperature scenarios).
[0003] Driven by the trends of miniaturization, high-density cabling, and low cost, a structural design that integrates the transmitting and receiving ends into a single housing is commonly adopted. The transmitting end typically outputs a high-power signal, while the receiving end needs to receive a weak signal. The high-frequency components of the strong signal can directly intrude into the weak signal link of the receiving end. Furthermore, high-density cabling often makes it difficult to achieve a strict "signal shielding cavity," further strengthening the coupling between strong and weak signals. Moreover, the housing material is mostly ceramic, which is an insulator and cannot block spatial radiation coupling between the transmitting and receiving ends, resulting in severe crosstalk of existing electronic components. Utility Model Content
[0004] This utility model provides an anti-crosstalk ceramic housing and electronic components, aiming to solve the serious crosstalk problem in existing electrical components with ceramic housings where the transceiver terminals are integrated on a single housing.
[0005] In a first aspect, embodiments of the present invention provide an anti-crosstalk ceramic housing, comprising: The outer casing has two independent mounting slots, one of which is used to mount the receiving end and the other is used to mount the transmitting end. A metal frame is fixed to the top outer periphery of one of the mounting slots; A metal cover plate is fixed to the top of the metal frame; The mounting groove, the metal frame, and the metal cover plate together form a closed shielded space.
[0006] Compared with the prior art, the solution shown in this application utilizes the electromagnetic shielding properties of metal by setting a metal frame and a metal cover plate on the top of one of the mounting slots. During operation, the metal frame can reflect or absorb external electromagnetic waves, preventing them from entering the shielded space and preventing signal interference. Furthermore, the signal located in the shielded space can also be prevented from leaking out, solving the signal crosstalk problem between the receiving end and the transmitting end. This ensures the integrity of the signal waveform and maintains the communication rate and detection accuracy.
[0007] In conjunction with the first aspect, in one possible implementation, the outer casing has a wall located in front of the two mounting slots, the wall has two spaced grooves, the metal frame has a U-shaped cross-section, the front ends of the metal frame are respectively matched with the two grooves, the metal frame is flush with the top surface of the wall, and the metal cover plate is placed on the top of the wall.
[0008] In conjunction with the first aspect, in one possible implementation, the sidewall of the groove is provided with a first metal layer, which is welded to the metal frame.
[0009] In conjunction with the first aspect, in one possible implementation, a second metal layer is provided on the outer peripheral top surface of one of the mounting slots, and the second metal layer is welded to the metal frame.
[0010] In conjunction with the first aspect, in one possible implementation, the outer casing body is provided with a blind hole located below the second metal layer.
[0011] In conjunction with the first aspect, in one possible implementation, the blind vias are uniformly arranged along the extension path of the second metal layer.
[0012] In conjunction with the first aspect, in one possible implementation, the welding is performed using gold-tin solder or silver-copper solder.
[0013] In conjunction with the first aspect, in one possible implementation, the metal cover plate is bonded to the top surface of the metal frame.
[0014] In conjunction with the first aspect, in one possible implementation, the metal cover plate and the metal frame are bonded together with silver adhesive.
[0015] Secondly, this utility model embodiment also provides an electronic component, including the aforementioned anti-crosstalk ceramic housing.
[0016] Compared with the prior art, the solution shown in this application uses the above-mentioned anti-crosstalk ceramic shell and sets up a shielding space inside it. In multi-channel sensors or radio frequency modules, it can prevent signals from adjacent channels from interfering with each other through spatial radiation or conduction, thus ensuring signal integrity. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the main structure of the anti-crosstalk ceramic shell provided in an embodiment of the present utility model; Figure 2 For along Figure 1 Schematic diagram of the cross-sectional structure along line AA; Figure 3 This is a schematic diagram of the main structure of the outer shell body used in an embodiment of this utility model.
[0018] Explanation of reference numerals in the attached figures: 10-Outer shell; 11-Mounting slot; 12-Wall; 13-Recess; 14-Blind hole; 20 - Metal frame; 30 - Metal cover plate. Detailed Implementation
[0019] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. The following description of at least one exemplary embodiment is actually illustrative only and is in no way intended to limit this application or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0021] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0022] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
[0023] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.
[0024] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, and the spatial relative descriptions used herein will be interpreted accordingly.
[0025] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.
[0026] Please refer to the following: Figures 1 to 3 The crosstalk-proof ceramic housing provided by this utility model will now be described. The crosstalk-proof ceramic housing includes a housing body 10, a metal frame 20, and a metal cover plate 30. The housing body 10 has two independent mounting slots 11, one of which is used to install a receiving end, and the other is used to install a transmitting end. The metal frame 20 is fixed to the top outer periphery of one of the mounting slots 11. The metal cover plate 30 is fixed to the top of the metal frame 20. The mounting slots 11, the metal frame 20, and the metal cover plate 30 enclose a closed shielding space.
[0027] It should be noted that the outer casing 10 also includes an installation space located above the two mounting slots 11, and the aforementioned metal frame 20 and metal cover plate 30 are both located within this installation space, that is, the top surface of the metal cover plate 30 does not extend beyond the top surface of the outer casing 10.
[0028] With the metal frame 20 and metal cover 30 installed on one of the mounting slots 11, the module in the other mounting slot 11 can be installed normally. The problem of signal crosstalk between the receiving and transmitting ends can be solved simply by closing one mounting slot 11.
[0029] Compared with the prior art, the anti-crosstalk ceramic housing provided in this embodiment utilizes the electromagnetic shielding properties of metal by setting a metal frame 20 and a metal cover plate 30 on the top of one of the mounting slots 11. During operation, the metal frame 20 can reflect or absorb external electromagnetic waves, preventing them from entering the shielded space and preventing signal interference. Furthermore, the signal located in the shielded space can also be prevented from leaking out, thus solving the signal crosstalk problem between the receiving end and the transmitting end. This ensures the integrity of the signal waveform and maintains the communication rate and detection accuracy.
[0030] In some embodiments, an improved implementation of the above-described housing may employ, as follows: Figure 3 The structure shown. See also Figure 3 The outer casing 10 has a wall 12 located in front of the two mounting slots 11. The wall 12 has two spaced grooves 13. The metal frame 20 has a U-shaped cross section. The two front ends of the metal frame 20 are respectively matched with the two grooves 13. The metal frame 20 is flush with the top surface of the wall 12. The metal cover plate 30 is placed on the top of the wall 12.
[0031] By setting the groove 13, it is convenient to position the metal frame 20 when arranging it. After the front end of the metal frame 20 is inserted into the groove 13, the metal frame 20 can be initially fixed. This makes it easier to operate when welding the metal frame 20 and the outer shell body 10, and avoids the metal frame 20 shifting and affecting the welding quality.
[0032] pass Figure 3 As can be seen, the two mounting slots 11 are distributed on the left and right. Therefore, by using the wall 12 of the outer shell 10 to shield the front of the metal frame 20, signal shielding is formed between the left and right distributed receiving and transmitting ends, while also reducing the material used in the metal frame 20 and reducing manufacturing costs.
[0033] As an alternative implementation, without the groove 13, the cross-section of the metal frame 20 is rectangular, and the bottom surface of the metal frame 20 is fixed by welding or bonding to the outer periphery top surface of the corresponding mounting groove 11.
[0034] In some embodiments, an improved implementation of the groove 13 can have the following structure: the sidewall of the groove 13 is provided with a first metal layer, and the first metal layer is welded to the metal frame 20. The first metal layer is formed by metallizing the sidewall of the groove 13, and the first metal layer and the metal frame 20 are easily welded together.
[0035] It should be noted that the first metal layer on the sidewall of the groove 13 is obtained by metallizing the sidewall of the groove 13. Metallization is the process of firmly adhering a metal film to the ceramic surface. Metallization is a conventional technique in this field and will not be described in detail here.
[0036] As a variation of the implementation, the sidewall of the groove 13 and the metal frame 20 can also be connected by adhesive bonding, which can save the metallization operation.
[0037] In some embodiments, an improved implementation of the outer casing 10 may employ the following structure, wherein a second metal layer is provided on the outer periphery of a mounting groove 11, and the second metal layer is welded to the metal frame 20. This mounting groove 11 forms a shielding space, and by providing a second metal layer on its outer periphery, it can be easily welded to the bottom surface of the metal frame 20.
[0038] The second metal layer is obtained by metallizing the surface, just like the first metal layer.
[0039] It should be noted that when the front end of the metal frame 20 is fitted with the groove 13, the bottom surface of the metal frame 20 and the outer peripheral top surface of the corresponding mounting groove 11 can be welded or bonded. The metal frame 20 and the side wall of the groove 13 can also be welded or bonded. These two different parts of the metal frame 20 can use the same connection method (e.g., both are welded) or different connection methods.
[0040] In some embodiments, an improved implementation of the outer casing 10 may employ, as follows: Figures 2 to 3 The structure shown. See also Figures 2 to 3 The outer casing 10 has a blind hole 14 located below the second metal layer. The outer casing 10 includes a main body and a chassis located below the main body. The mounting groove 11 is located inside the main body. The blind hole 14 penetrates the main body and is covered by the chassis. By setting the blind hole 14 at the bottom of the second metal layer, signal reflection, crosstalk and attenuation can be reduced.
[0041] In this application, the welding operation mentioned above uses gold-tin solder or silver-copper solder.
[0042] In actual welding operations, the bottom surface of the metal frame 20 uses gold-tin solder (because RF wiring is required here), while the sidewalls of the groove 13 can use silver-copper solder. Gold is a chemically inert metal, and the oxidation rate of the solder joint surface formed after gold-tin soldering is much lower than that of silver-copper solder. In harsh environments such as humid, high-temperature, or sulfur-containing environments, gold-tin solder joints are less prone to oxidation failure, while silver-copper solder joints may experience increased contact resistance or embrittlement due to oxidation. When operating in a high-temperature environment for a long time, the copper in silver-copper solder will diffuse with the substrate (such as copper lead frame) to form brittle intermetallic compounds, leading to a decrease in solder joint strength. Gold-tin solder, on the other hand, has better compatibility with common plating layers such as gold and nickel, and the intermetallic compounds grow slowly and have a stable structure, which can maintain the mechanical properties of the solder joint for a long time.
[0043] In some embodiments, a specific connection method between the metal cover plate 30 and the metal frame 20 can be as follows: the metal cover plate 30 and the metal frame 20 are bonded together with silver paste. The curing temperature of silver paste is typically low, avoiding performance degradation caused by high temperatures. Furthermore, silver paste can directly bond to non-metallic or metallic surfaces, eliminating the need for complex metallization steps. The amount of silver paste can be precisely controlled through dispensing, printing, etc., and it can uniformly fill minute gaps. The high silver content in the silver paste forms a conductive path, enabling electrical connection between the metal frame 20 and the metal cover plate 30.
[0044] Based on the same inventive concept, this application also provides an electronic component, including the aforementioned anti-crosstalk ceramic housing.
[0045] Compared with the prior art, the electronic components provided in this embodiment adopt the above-mentioned anti-crosstalk ceramic shell and set a shielding space inside it. In multi-channel sensors or radio frequency modules, the signals of adjacent channels can avoid mutual interference through spatial radiation or conduction, thus ensuring signal integrity.
[0046] A specific processing procedure for electronic components including anti-crosstalk ceramic housings in this application embodiment is as follows: (1) Casting: After mixing ceramic alumina powder, single-sheet casting is carried out to form a sheet for subsequent processing.
[0047] (2) Punching and filling: The sheet is punched and filled with metallizing paste to achieve vertical conduction. At the same time, the blind hole 14 of the ceramic part is completed in this step to shield the signal crosstalk of the receiving and transmitting ends passing through the ceramic.
[0048] (3) Printing: Used for printing metallization paste to achieve horizontal conduction. Metallization of the sidewall of groove 13 is completed in this step for welding with the metal frame 20.
[0049] (4) Lamination + Cutting + Sintering: The printed products are laminated together in the design order, then cut and sintered to obtain the main body. The preparation for welding is completed after the nickel plating process.
[0050] (5) Brazing + gold plating: The chassis, ceramic, wall and other components are welded together to form the outer shell body 10, and then nickel gold is plated to prepare for gold-tin welding of the metal frame 20.
[0051] (6) Welding the frame: Weld the metal frame 20 onto the outer shell body 10, or glue the metal frame 20 onto the outer shell body 10.
[0052] (7) Surface mount + wire bonding: The chip is pasted inside the mounting slot 11 and wire bonded to the ceramic pad to achieve conductivity.
[0053] (8) Welding the cover plate: Weld the metal cover plate 30 onto the metal frame 20. This achieves signal isolation between the receiving and transmitting ends, avoiding crosstalk between them.
[0054] (9) Covering: Cover the outer shell 10 to obtain a device that integrates the receiving and transmitting ends to prevent crosstalk.
[0055] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A crosstalk-resistant ceramic housing, characterized in that, include: The outer casing (10) has two independent mounting slots (11), one of which is used to mount the receiving end and the other is used to mount the transmitting end; A metal frame (20) is fixed to the top outer periphery of one of the mounting slots (11); A metal cover plate (30) is fixed to the top of the metal frame (20); The mounting groove (11), the metal frame (20), and the metal cover plate (30) together form a closed shielding space.
2. The anti-crosstalk ceramic housing as described in claim 1, characterized in that, The outer shell body (10) has a wall (12) located in front of the two mounting slots (11). The wall (12) has two spaced grooves (13). The metal frame (20) has a U-shaped cross section. The two front ends of the metal frame (20) are respectively matched with the two grooves (13). The metal frame (20) is flush with the top surface of the wall (12). The metal cover plate (30) is placed on the top of the wall (12).
3. The anti-crosstalk ceramic housing as described in claim 2, characterized in that, The sidewall of the groove (13) is provided with a first metal layer, which is welded to the metal frame (20).
4. The anti-crosstalk ceramic housing as described in claim 1, characterized in that, One of the mounting slots (11) has a second metal layer on its outer periphery top surface, and the second metal layer is welded to the metal frame (20).
5. The anti-crosstalk ceramic housing as described in claim 4, characterized in that, The outer shell body (10) is provided with a blind hole (14) located below the second metal layer.
6. The anti-crosstalk ceramic housing as described in claim 5, characterized in that, The blind holes (14) are uniformly arranged along the extension path of the second metal layer.
7. The anti-crosstalk ceramic housing as described in claim 3 or 4, characterized in that, The welding is performed using gold-tin solder or silver-copper solder.
8. The anti-crosstalk ceramic housing as described in claim 1, characterized in that, The metal cover plate (30) is bonded to the top surface of the metal frame (20).
9. The anti-crosstalk ceramic housing as described in claim 8, characterized in that, The metal cover plate (30) and the metal frame (20) are bonded together with silver glue.
10. An electronic component, characterized in that, Including the anti-crosstalk ceramic housing as described in any one of claims 1-9.