Light emitting device

Abstract

The application relates to a light-emitting device. The light-emitting device comprises a substrate, a light-emitting chip, a light-transmitting structure, an encapsulating adhesive layer and a cutoff ring. The substrate has a recess, the light-emitting chip is arranged in the recess, and the light-transmitting structure is arranged on the light-emitting chip. The encapsulating adhesive layer is arranged in the recess, covers at least part of the side surface of the light-transmitting structure and part of the side wall of the recess, and is lightproof. The cutoff ring is light-absorbing and arranged on the substrate to form a cavity together with the substrate, the encapsulating adhesive layer and the light-transmitting structure. The cutoff ring is provided with a light-emitting hole, the light-emitting hole is communicated with the cavity, corresponds to the light-emitting chip and is used for emitting part of the light emitted by the light-emitting chip. The light-emitting device is provided with the lightproof encapsulating adhesive layer and the light-absorbing cutoff ring, so that the light emitted by the light-emitting chip can only be directly emitted from the light-emitting hole. The light-emitting hole finally defines the edge of the projected light spot, the edge of the light spot is clear, there is no light and shade transition phenomenon, the cutoff property of the light spot is improved, and the quality of the light spot is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to a light-emitting device. Background Technology

[0002] Traditional light-emitting devices typically consist of an LED chip and a light-transmitting adhesive layer that encapsulates the LED chip. Because the light emission of the LED chip follows a Lambertian distribution, its luminous intensity decreases as the emission angle increases. This results in poor cutoff of the light spot projected by traditional light-emitting devices, unclear edge of the light spot, and a transition between light and dark areas, thus the quality of the light spot needs to be improved. Summary of the Invention

[0003] Therefore, it is necessary to provide a light-emitting device that addresses the problem of poor cutoff of the light spot projected by traditional light-emitting devices.

[0004] A light-emitting device, the light-emitting device comprising:

[0005] A substrate having a groove;

[0006] A light-emitting chip, wherein the light-emitting chip is disposed within the groove;

[0007] A light-transmitting structure is disposed on the light-emitting chip;

[0008] An encapsulating adhesive layer, wherein the encapsulating adhesive layer is disposed within the groove, covering at least a portion of the side surface of the light-transmitting structure and a portion of the sidewall of the groove, and is provided to be opaque; and

[0009] A cutoff element is provided, which is light-absorbing and disposed on the substrate, and together with the substrate, the encapsulating adhesive layer and the light-transmitting structure, forms a cavity. The cutoff element has a light-emitting hole that communicates with the cavity and is disposed corresponding to the light-emitting chip, and is used to emit part of the light emitted by the light-emitting chip.

[0010] In one embodiment, the back side of the stop member includes an mounting area and a stop area, the mounting area being disposed around the stop area and bonded to the front side of the substrate, and the stop area being disposed corresponding to the groove.

[0011] In one embodiment, the light-emitting device further includes an adhesive layer bonded between the back side of the stop member and the front side of the substrate, and bonded between the back side of the stop member and the remaining sidewalls of the groove.

[0012] In one embodiment, the stop element is made of silicone, silicone resin, or epoxy resin filled with light-absorbing particles.

[0013] In one embodiment, the light-emitting aperture is gradually widened in the direction away from the light-emitting chip; the light-emitting aperture is gradually narrowed in the direction away from the light-emitting chip; or the light-emitting aperture is cylindrical in the direction away from the light-emitting chip.

[0014] In one embodiment, the light-emitting aperture includes an open section and a connecting section, the connecting section connecting the open section and the cavity; the open section is gradually widening in the direction away from the light-emitting chip, and the light-emitting opening of the light-emitting aperture is formed at the outer end of the open section; the connecting section is cylindrical or gradually narrowing in the direction away from the light-emitting chip.

[0015] In one embodiment, the light-emitting aperture has a minimum light-passing aperture and a maximum light-passing aperture. The projected area of ​​the minimum light-passing aperture is larger than the front area of ​​the light-emitting chip and smaller than the projected area of ​​the maximum light-passing aperture.

[0016] In one embodiment, the light-emitting aperture has a minimum light-passing aperture and a maximum light-passing aperture. The minimum light-passing aperture, the maximum light-passing aperture, and the front surface of the light-emitting chip are all rectangular. The short side of the minimum light-passing aperture is greater than the short side of the front surface of the light-emitting chip and smaller than the short side of the maximum light-passing aperture.

[0017] In one embodiment, the light-emitting aperture has a light-emitting opening that is parallelogram-shaped, elliptical, circular, triangular, or hexagonal; or the light-emitting aperture has a minimum light-passing opening located between the light-emitting opening and the light-inlet opening of the light-emitting aperture, and the minimum light-passing opening is parallelogram-shaped, elliptical, circular, triangular, or hexagonal.

[0018] In one embodiment, the light-transmitting structure is a wavelength conversion layer or a light-transmitting adhesive layer.

[0019] In one embodiment, the light-emitting device further includes a light-transmitting protective layer that covers the front and the remaining sides of the light-transmitting structure.

[0020] In one embodiment, the light-transmitting structure is a lens, the side of the lens is gradually widened in the direction away from the light-emitting chip, and the front of the lens is a convex curved surface.

[0021] In one embodiment, the number of light-emitting chips is at least two, wherein any two light-emitting chips emit the same or different colors.

[0022] In one embodiment, the substrate includes a metal structure and a plastic structure, the plastic structure being disposed on the metal structure to enclose and form the groove; wherein at least one of the adhesive layer, the plastic structure, and the encapsulating adhesive layer is black or dark-colored.

[0023] The aforementioned light-emitting device, by filling the groove of the substrate with an encapsulating adhesive layer, which covers at least part of the side surface of the light-transmitting structure and part of the sidewall of the groove, ensures that the light emitted by the light-emitting chip cannot pass through the encapsulating adhesive layer and is reflected by the sidewall of the groove. This significantly reduces disordered stray light and diffused light, allowing the light emitted by the light-emitting chip to be emitted primarily from the uncovered surface of the light-transmitting structure. The emitted light directly enters the cavity, with some of it entering the light-emitting aperture. Due to the light-absorbing design of the cut-off element, the light illuminating the aperture wall is essentially absorbed, and the light can only pass directly through the light-emitting aperture and be emitted, with virtually no reflection. Therefore, there is virtually no reflected light or stray light emanating from the light-emitting aperture. The light emitted directly from the light-emitting aperture forms a light spot, and the light-emitting aperture ultimately defines the edge of the projected light spot. The edge of the light spot is clear, with no transition between light and dark, improving the cut-off performance of the light spot and thus enhancing its quality. Moreover, compared to traditional lighting devices with an external light-blocking structure above the light source, the light-emitting device integrates a cut-off component. When applied to lighting devices, the lighting device does not need to have a light-blocking structure, which greatly simplifies the structure, reduces the size, and significantly reduces the cost.

[0024] Furthermore, the mounting area on the back of the stop component is fixed to the front of the substrate by an adhesive layer. The stop area is located above the groove and absorbs large-angle lateral light rays incident upon it, further reducing stray and diffused light within the groove. Simultaneously, the stop component's thickness is extremely large in the lateral direction of light, making it impossible for lateral light to penetrate. Therefore, the stop component has excellent light absorption effect on lateral light rays incident upon the stop area, resulting in a purer light spot projected from the light outlet, with virtually no stray light spots outside the edge of the light spot. Moreover, the back of the stop component has a reserved area not bonded to the substrate, avoiding an excessively large bonding area that could lead to excessive shrinkage stress during adhesive layer curing, causing poor adhesion, stop component displacement, or even detachment. Therefore, this design helps release the shrinkage stress of the adhesive layer, improving the installation stability of the stop component.

[0025] Furthermore, the adhesive layer is bonded between the back of the stop and the remaining sidewalls of the groove, thereby increasing the bonding area and making the stop more securely mounted on the substrate. Attached Figure Description

[0026] Figure 1 This is a cross-sectional view of the light-emitting device in the first embodiment of this application.

[0027] Figure 2 for Figure 1A top view of the light-emitting device.

[0028] Figure 3 for Figure 1 A simulation diagram of the light spot projected by the light-emitting device.

[0029] Figure 4 This is a simulation diagram of the light spot projected when a traditional light-emitting device is combined with a conventional light-blocking structure.

[0030] Figure 5 This is a cross-sectional view of the light-emitting device in the second embodiment of this application.

[0031] Figure 6 This is a cross-sectional view of the light-emitting device in the third embodiment of this application.

[0032] Figure 7 This is a cross-sectional view of the light-emitting device in the fourth embodiment of this application.

[0033] Figure 8 This is a cross-sectional view of the light-emitting device in the fifth embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100 - Light-emitting device; 110 - Substrate; 111 - Groove; 112 - Metal structure; 113 - Plastic structure; 114 - First metal part; 115 - Second metal part; 120 - Light-emitting chip; 130 - Light-transmitting structure; 140 - Encapsulating adhesive layer; 150 - Cut-off component; 151 - Light-emitting hole; 152 - Mounting area; 153 - Cut-off area; 154 - Minimum light-passing aperture; 155 - Maximum light-passing aperture; 156 - Open section; 157 - Connecting section; 160 - Cavity; 170 - Adhesive layer; 180 - Light-transmitting protective layer. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0042] Please see Figure 1 and Figure 2 , Figure 1 A cross-sectional view of the light-emitting device in the first embodiment of this application is shown. Figure 2 The figure shows a top view of the light-emitting device. The first embodiment of this application provides a light-emitting device 100, including a substrate 110, a light-emitting chip 120, a light-transmitting structure 130, an encapsulating layer 140, and a cutoff element 150. The substrate 110 has a groove 111, the light-emitting chip 120 is disposed within the groove 111, and the light-transmitting structure 130 is disposed on the light-emitting chip 120. The encapsulating layer 140 is disposed within the groove 111, covering at least a portion of the side surface of the light-transmitting structure 130 and a portion of the sidewall of the groove 111, and is opaque. The cutoff element 150 is light-absorbing and disposed on the substrate 110, forming a cavity 160 with the substrate 110, the encapsulating layer 140, and the light-transmitting structure 130. The cutoff element 150 has a light-emitting hole 151, which communicates with the cavity 160 and is disposed corresponding to the light-emitting chip 120, for emitting partial light from the light-emitting chip 120.

[0043] By filling the groove 111 of the substrate 110 with an encapsulating adhesive layer 140, which covers at least a portion of the sidewalls of the light-transmitting structure 130 and a portion of the sidewalls of the groove 111, the light emitted by the light-emitting chip 120 cannot pass through the encapsulating adhesive layer 140 and is reflected by the sidewalls of the groove 111. This significantly reduces disordered stray light and diffused light, ensuring that the light emitted by the light-emitting chip 120 can only be emitted from the uncovered surface of the light-transmitting structure 130, and the emitted light directly enters the cavity 160. A portion of the light enters the light-emitting aperture 151. Due to the light-absorbing setting of the cut-off element 150, the light that shines on the aperture wall of the light-emitting aperture 151 is basically absorbed. The light can only pass directly through the light-emitting aperture 151 and be emitted, with virtually no reflection. Therefore, there is virtually no reflected light or stray light emitted from the light-emitting aperture 151. The light emitted directly from the light-emitting aperture 151 forms a light spot. The light-emitting aperture 151 ultimately defines the edge of the projected light spot. The edge of the light spot is clear, with no transition between light and dark, which improves the cut-off of the light spot and enhances the quality of the light spot.

[0044] Moreover, compared to traditional lighting devices with an external light-blocking structure above the light source, the light-emitting device 100 integrates a cut-off element 150. When applied to a lighting device, the lighting device does not need to have a light-blocking structure, which greatly simplifies the structure, reduces the size, and significantly reduces the cost.

[0045] It should be noted that the aforementioned "opaque setting" refers to the opacity of the corresponding structure. "Opaqueness" means that a material completely prevents light from passing through; incident light is absorbed or reflected by the object and cannot be transmitted, making the other side invisible. In terms of transmittance, the transmittance of opaque objects is usually less than 10%. The encapsulating adhesive layer 140 only covers part of the sidewall of the groove 111, and the remaining space is reserved in the groove 111. Therefore, the cavity 160 can be formed solely by the remaining space of the groove 111, or it can be formed by a combination of the remaining space of the groove 111 and the space opened on the back side of the stop member 150. The side of the light-emitting chip 120 is covered by the opaque encapsulating adhesive layer 140, so there is no need for it to emit light. Therefore, the light-emitting surface of the light-emitting chip 120 is its front side, while the front side of other components is relative to the front side of the light-emitting chip 120. The surface of other components facing away from the front side of the light-emitting chip 120 is the front side, and the surface of other components facing the front side of the light-emitting chip 120 is the back side.

[0046] The substrate 110 is a support or bowl / cup, comprising a metal structure 112 and a plastic structure 113 disposed on the metal structure 112. The plastic structure 113 can be injection molded onto the metal structure 112, forming a groove 111 with the metal structure 112. The light-emitting chip 120 is disposed on the metal structure 112. The metal structure 112 includes a first metal portion 114 and a second metal portion 115 spaced apart. When the plastic structure 113 is injection molded, it fills the space between the first metal portion 114 and the second metal portion 115, thus isolating them. In other embodiments, the substrate 110 may include a substrate and a support structure or dam disposed on the substrate. The support structure or dam forms a groove 111 with the substrate. The substrate has pads for electrical connection with the light-emitting chip 120.

[0047] Furthermore, the plastic structure 113 may be made of, but is not limited to, polyphthalamide (PPA), making the plastic structure 113 white, with the sidewalls of its grooves 111 capable of reflecting light. In an alternative embodiment, the plastic structure 113 may be black or dark-colored, capable of absorbing light incident upon it.

[0048] The light-emitting chip 120 can be, but is not limited to, an LED chip. At least one LED chip is disposed within the groove 111. The LED chip can be a vertical chip, a horizontal chip, or a flip chip. In this embodiment, one LED chip is disposed within the groove 111. This LED chip is a vertical chip, with its back electrode fixed to the first metal portion 114, and its front electrode connected to the second metal portion 115 via bonding wires (not labeled). In an alternative embodiment, the number of light-emitting chips 120 is at least two, wherein any two light-emitting chips 120 emit the same or different colors. For example, two LED chips can be disposed within the groove 111, and the two LED chips emit the same color, both emitting red, blue, or green light; or three LED chips can be disposed within the groove 111, and the three LED chips emit the same or different colors. When the three LED chips emit different colors, any one of the three LED chips can be controlled to emit light to achieve monochromatic light emission. Moreover, the LED chip can be a flip chip, with its positive and negative electrodes fixed to the first metal portion 114 and the second metal portion 115, respectively, without the need for bonding wires.

[0049] The light-transmitting structure 130 is a light-transmitting adhesive layer that only covers the front side of the light-emitting chip 120. The adhesive layer is made of a light-transmitting resin, such as silicone or epoxy resin, and is not filled with particles. The adhesive layer not only reduces Fresnel loss in the light emission of the light-emitting chip 120 but also seals the chip, forming a semi-open light-emitting device 100, whose light-emitting aperture 151 connects the inside and outside of the device. In other embodiments, the adhesive layer can simultaneously cover the side of the light-emitting chip 120, and the opaque encapsulating adhesive layer 140 correspondingly covers the side of the adhesive layer. When multiple light-emitting chips 120 are provided in the groove 111, a light-transmitting adhesive layer is provided on the front side of each chip 120, and the adhesive layer only covers the front side of the chip 120, while the side of each chip 120 is covered by the encapsulating adhesive layer 140; or, the adhesive layer simultaneously covers both the front and side of all the light-emitting chips 120.

[0050] The encapsulating adhesive layer 140 covers at least a portion of the side surface of the light-transmitting structure 130. Since the light-transmitting structure 130 is located on the front side of the light-emitting chip 120, the encapsulating adhesive layer 140 necessarily covers the side surface of the light-emitting chip 120, and also covers a portion of the sidewall of the groove 111. To prevent the bonding wires between the light-emitting chip 120 and the second metal part 115 from being exposed, the encapsulating adhesive layer 140 also necessarily covers the bonding wires. Because the encapsulating adhesive layer 140 is made of an opaque material, when the light emitted by the light-emitting chip 120 shines on the encapsulating adhesive layer 140, it cannot penetrate the encapsulating adhesive layer 140, and the sidewall of the groove 111 covered by the encapsulating adhesive layer 140 cannot reflect light. Therefore, stray light and diffused light in the groove 111 are greatly reduced, which is beneficial for purifying the emitted light.

[0051] Furthermore, the encapsulating adhesive layer 140 completely covers the side of the light-transmitting structure 130, so that light can only be emitted from the front of the light-transmitting structure 130, while transferring the light-emitting surface of the light-emitting chip 120 to the front of the light-transmitting structure 130.

[0052] The encapsulating adhesive layer 140 may be made of, but is not limited to, PPA, and is white, capable of reflecting incident light, and thus opaque. In alternative embodiments, the encapsulating adhesive layer 140 may be black or dark-colored, serving to absorb light and also being opaque.

[0053] It should be noted that the arrangement of the various parts within the groove 111 is as follows: First, a light-emitting chip 120 is placed at the bottom of the groove 111. Then, a light-transmitting structure 130 is placed on the front side of the light-emitting chip 120. Finally, encapsulating adhesive is added into the groove 111, covering the sides of the light-emitting chip 120, the bonding wires, and the sides of the light-transmitting structure 130, until the encapsulating adhesive cures into an encapsulating layer 140. The above arrangement is exemplary and not restrictive; other reasonable methods can be used instead.

[0054] The light-emitting device 100 also includes an adhesive layer 170, which is bonded between the back side of the stop member 150 and the front side of the substrate 110, and also between the back side of the stop member 150 and the remaining sidewalls of the groove 111, thereby increasing the bonding area and making the stop member 150 more securely mounted on the substrate 110. In other embodiments, the stop member 150 can be fixed to the substrate 110 by a snap-fit ​​structure. For example, the back or side of the stop member 150 is provided with a snap-fit, and the substrate 110 is provided with a slot, into which the snap-fit ​​is inserted to achieve snap-fit ​​assembly.

[0055] The adhesive layer 170 covers the front side of the substrate 110 and the remaining sidewalls of the groove 111, and is black or dark in color to absorb light, further reducing the exposed sidewalls of the groove 111 and thus reducing the reflected light from the sidewalls of the groove 111. In other embodiments, the adhesive layer 170 is white, serving to reflect and block light.

[0056] The back of the cutoff element 150 has a mounting area 152 and a cutoff area 153. The mounting area 152 is arranged around the cutoff area 153 and is bonded to the front of the substrate 110. The cutoff area 153 is arranged corresponding to the groove 111. The mounting area 152 is fixed to the front of the substrate 110 by an adhesive layer 170. The cutoff area 153 is located above the groove 111 and absorbs large-angle side light that shines on it, further reducing stray light and scattered light in the groove 111. At the same time, the thickness of the cutoff element 150 is extremely large in the side direction of light, and side light cannot penetrate the cutoff element 150. Therefore, the cutoff element 150 has a good light absorption effect on the side light that shines on the cutoff area 153, and the light spot projected by the light outlet 151 is purer, with no stray light spots outside the edge of the light spot.

[0057] Furthermore, the back of the stop part 150 has a reserved area that is not bonded to the substrate 110, thus avoiding an excessively large bonding area, which would cause excessive shrinkage stress when the adhesive layer 170 is cured, resulting in poor bonding, displacement of the stop part 150, or even detachment. Therefore, this feature helps to release the shrinkage stress of the adhesive layer 170 and improves the installation stability of the stop part 150.

[0058] The light-emitting hole 151 of the stop member 150 is provided corresponding to the light-emitting chip 120, that is, the center line of the light-emitting hole 151 coincides with the optical axis of the light-emitting chip 120. In other embodiments, when multiple light-emitting chips 120 are provided in the groove 111, the center line passing through the geometric center of the multiple light-emitting chips 120 coincides with the center line of the light-emitting hole 151.

[0059] The light-emitting aperture 151 of the cutoff element 150 is gradually widened in the direction away from the light-emitting chip 120, adopting a single-segment design and being open in shape. The light spot projected through the open-shaped light-emitting aperture 151 has better cutoff performance. The light-emitting aperture 151 has a minimum light-passing opening 154 and a maximum light-passing opening 155. The minimum light-passing opening 154 is the light-inlet, and the maximum light-passing opening 155 is the light-outlet. In an alternative embodiment, the open-shaped light-emitting aperture 151 can be composed of multiple segments spliced ​​together.

[0060] Please combine Figure 2 The projected area of ​​the smallest light-passing aperture 154 is larger than the frontal area of ​​the light-emitting chip 120, but smaller than the projected area of ​​the largest light-passing aperture 155. This allows the normal emission and small-angle emission of the light-emitting chip 120 to pass through the smallest light-passing aperture 154 and be emitted directly, preserving the high-intensity emission of the light-emitting chip 120 and thus improving the overall brightness of the projected light spot. In other embodiments, the projected area of ​​the smallest light-passing aperture 154 is set to be larger than the frontal area of ​​multiple light-emitting chips 120.

[0061] It should be noted that, in the alternative embodiment, the front of the minimum light-passing port 154, the maximum light-passing port 155, and the light-emitting chip 120 are all rectangular. The short side of the minimum light-passing port 154 is larger than the short side of the front of the light-emitting chip 120, but smaller than the short side of the maximum light-passing port 155. That is, the light-inlet port is only set for a portion of the front area of ​​the light-emitting chip 120, and the remaining area of ​​the front of the light-emitting chip 120 is set for the back of the cut-off member 150.

[0062] The light exit port of the light exit aperture 151 is arranged in a parallelogram shape, that is, the maximum light passage 155 is arranged in a parallelogram shape. Consequently, the light spot projected by the light exit aperture 151 is arranged in a parallelogram shape. Therefore, the shape of the light spot can be adjusted by controlling the shape of the light exit port of the light exit aperture 151. Correspondingly, the shape of the light entrance port of the light exit aperture 151 is adapted to the shape of the light exit port. In an alternative embodiment, the light exit port of the light exit aperture 151 may be elliptical, circular, triangular, hexagonal, or other polygonal, and the light entrance port of the light exit aperture 151 is adapted accordingly.

[0063] Furthermore, the light-emitting aperture 151 has a square-shaped light-emitting port, and the light spot it projects is square. Its light-inlet port is also square accordingly. In other embodiments, the light-emitting aperture 151 can be rectangular, rhomboid, or other parallelogram-shaped, and its light-inlet port is also set accordingly.

[0064] The cutoff element 150 is made of silicone filled with light-absorbing particles. Silicone has good light transmittance; when light shines on the cutoff element 150, the light can pass through the silicone and be absorbed by the light-absorbing particles. Compared to traditional PPA filled with light-absorbing particles, where PPA reflects the light, when some light passes through PPA, the light-absorbing particles inside absorb the light. Therefore, the cutoff element 150 made of silicone filled with light-absorbing particles has a better light absorption effect and basically does not reflect light. The light shining on the wall of the light-emitting hole 151 is basically not reflected, thus cutting off disordered reflected light. Consequently, the light spot is formed by the beam of light directly passing through the light-emitting hole 151, resulting in a clearer edge, a significant cutoff line between light and dark, and no transition zone. The light-absorbing particles are known materials. In alternative embodiments, the cutoff element 150 can also be made of epoxy resin or silicone resin filled with light-absorbing particles.

[0065] Furthermore, the light-absorbing particles can be, but are not limited to, carbon black, which has good light absorption properties. In other embodiments, the light-absorbing particles can also be metal microparticles, black dye particles, or black silicon carbide particles, wherein the metal microparticles are also known materials and can be, but are not limited to, aluminum powder or copper powder.

[0066] Please see Figure 3 and Figure 4 , Figure 3 This image shows a simulation of the light spot projected by the light-emitting device in this embodiment. Figure 4 A simulation diagram of the light spot projected when a traditional light-emitting device is combined with a conventional light-blocking structure is shown. Figure 3 The edge of the light spot is completely cut off, the cutoff line between light and dark is clear, the entire light spot is uniform and pure, and there are no stray light spots around it. Figure 4 The central light spot is a black area surrounded by numerous light spots. This central spot is brighter than the surrounding area, exhibiting a clear transition between light and dark. Furthermore, the edge of the light spot is not completely cut off, resulting in an unclear cutoff line. Therefore, in this embodiment, the light spot projected by the light-emitting device has a clear edge, without any transition between light and dark, significantly improving the cutoff of the light spot. It is virtually free of stray light spots, resulting in a pure light spot and a substantial improvement in light spot quality.

[0067] Please see Figure 5 , Figure 5 A cross-sectional view of the light-emitting device in the second embodiment of this application is shown. Compared with the light-emitting device 100 in the first embodiment, the light-transmitting structure 130 of the light-emitting device 100 in this embodiment is a wavelength conversion layer, which converts the color of the light emitted by the light-emitting chip 120.

[0068] Furthermore, the wavelength conversion layer may be, but is not limited to, a phosphor layer, and the light-emitting chip 120 may be, but is not limited to, a blue LED chip. The phosphor layer converts the blue light emitted by the blue LED chip into white light.

[0069] To protect the wavelength conversion layer, the light-emitting device 100 also includes a light-transmitting protective layer 180, which covers the front and other sides of the light-transmitting structure 130, thus preventing the light-transmitting structure 130 from being exposed. This helps to improve the service life of the wavelength conversion layer and reduces the impact of the external environment on the wavelength conversion layer.

[0070] The thickness of the light-transmitting protective layer 180 is less than that of the wavelength conversion layer, resulting in a shorter light path through the interior of the light-transmitting protective layer 180. This helps reduce stray light and scattering, and also saves material. Simultaneously, the front surface of the light-transmitting protective layer 180 is essentially equal to the front surface of the wavelength conversion layer, making the front surface of the light-transmitting protective layer 180 relatively small. Consequently, the light-emitting surface of the light-transmitting protective layer 180 is smaller, preventing excessive light diffusion and improving the brightness of the final emitted light spot. In other embodiments, the encapsulating adhesive layer 140 can completely cover the sides of the light-transmitting structure 130, while the light-transmitting protective layer 180 only covers the front surface of the light-transmitting structure 130. Thus, the light-emitting surface of the light-transmitting protective layer 180 is even smaller.

[0071] The encapsulating adhesive layer 140 is black or dark in color, which can absorb the lateral light emitted onto it. At the same time, stray light and diffused light in the groove 111 are also absorbed when they shine on the front side of the encapsulating adhesive layer 140, thus greatly reducing the stray light and diffused light in the groove 111.

[0072] Furthermore, the encapsulating layer 140 can be made of silicone filled with black heat-dissipating particles, making the entire encapsulating layer 140 black. The black heat-dissipating particles not only absorb light but also have good thermal conductivity, thus better conducting the heat generated by the light-emitting chip 120. In other embodiments, the silicone can be replaced by PPA, epoxy resin, or silicone resin.

[0073] The black heat dissipation particles can be, but are not limited to, silicon carbide particles. Silicon carbide has high light absorption rates in the ultraviolet, visible, and infrared bands, especially in the ultraviolet band, where its light absorption rate can reach over 95%. Simultaneously, silicon carbide exhibits excellent thermal conductivity. In alternative embodiments, the black heat dissipation particles can also be nanoscale carbon black particles with a particle size of 20nm~30nm.

[0074] It should be noted that when setting the multi-layer structure within the groove 111, a light-transmitting protective layer 180 can be provided on the light-transmitting structure 130, based on the first embodiment described above. The light-transmitting protective layer 180 can be formed by coating, spraying, dispensing, or molding. In an alternative embodiment, the light-transmitting structure 130 and the light-transmitting protective layer 180 can be sequentially provided on the light-emitting chip 120, and then an encapsulating adhesive layer 140 can be provided within the groove 111. The encapsulating adhesive layer 140 covers at least a portion of the side surface of the light-emitting chip 120, the side surface of the light-transmitting structure 130, and the side surface of the light-transmitting protective layer 180.

[0075] The light-emitting aperture 151 of the cutoff member 150 includes an open section 156 and a connecting section 157, with the connecting section 157 connecting between the cavity 160 and the open section 156. The open section 156 is gradually widened in the direction away from the light-emitting chip 120, and the light-emitting opening of the light-emitting aperture 151 is formed at the outer end of the open section 156, resulting in better cutoff performance for the light spot projected through the open section 156.

[0076] Furthermore, the connecting segment 157 is tapered away from the light-emitting chip 120, and its aperture wall is funnel-shaped towards the light-emitting chip 120, which can absorb more light emitted from the light-emitting chip 120 and significantly reduce stray light and diffuse light entering the connecting segment 157, resulting in a purer projected light spot. In other embodiments, the connecting segment 157 may be cylindrical.

[0077] The light inlet of the light-emitting aperture 151 is formed at the end of the connecting section 157 away from the open section 156, while the minimum light-passing aperture 154 of the light-emitting aperture 151 is located between the light inlet and the light-emitting aperture. The minimum light-passing aperture 154 defines the final light transmission amount; it is parallelogram-shaped and defines the shape of the projected light spot. The size of the light inlet of the light-emitting aperture 151 is equal to the size of the light-emitting aperture and larger than the size of the minimum light-passing aperture 154. In other embodiments, the minimum light-passing aperture 154 may also be elliptical, circular, triangular, hexagonal, or other polygonal.

[0078] Furthermore, the minimum aperture 154 is square, which allows it to project a suitable light spot shape. In other embodiments, the minimum aperture 154 may also be rectangular, rhomboid, or other parallelogram-shaped.

[0079] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the first embodiment above. The specific contents can be referred to the description of the above embodiments, and will not be repeated here.

[0080] Please see Figure 6 , Figure 6 A cross-sectional view of the light-emitting device in the third embodiment of this application is shown. Compared with the light-emitting device 100 in the first embodiment, the light-transmitting structure 130 of the light-emitting device 100 in this embodiment is a lens. Since the lens covers the front of the light-emitting chip 120, it protects the light-emitting chip 120 and reduces the Fresnel loss of the light emitted by the light-emitting chip 120. The side of the lens is gradually widened in the direction away from the light-emitting chip 120, and reflects the large-angle lateral light from the light-emitting chip 120 towards the light-emitting aperture 151. The front of the lens is convex and curved, which acts as a light-focusing surface, making the light emitted by the light-emitting chip 120 more concentrated and focused, greatly improving the light extraction rate and significantly increasing the brightness of the light spot, with a clearer cutoff line.

[0081] When forming the lens, adhesive is first applied to the light-emitting chip 120, and then the shape of the lens is formed using a mold until the adhesive cures and the mold is removed. In other embodiments, multiple light-emitting chips 120 are provided in the groove 111, and a lens can be provided on each light-emitting chip 120 or multiple light-emitting chips 120 can share a single lens.

[0082] The encapsulating adhesive layer 140 completely covers the side of the lens, and reflects the light emitted from the side of the lens, which helps to reduce stray light and astigmatism.

[0083] The light-emitting aperture 151 is arranged in a straight cylindrical shape in the direction away from the light-emitting chip 120, and its light-emitting port and light-in port are the same size. In particular, by controlling the size of the light-emitting aperture 151, the area of ​​the cutoff region 153 is made larger than the area of ​​the mounting region 152. The larger area of ​​the cutoff region 153 allows it to absorb more light emitted onto the cutoff region 153.

[0084] Furthermore, the plastic structure 113 and the encapsulating adhesive layer 140 are both black, and the adhesive layer 170 is also black. Thus, the light emitted by the light-emitting chip 120 is absorbed by the black structure, and the remaining light emitted can basically only be emitted through the light hole 151.

[0085] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the above embodiments. The specific contents can be referred to the description of the above embodiments, and will not be repeated here.

[0086] Please see Figure 7 , Figure 7 A cross-sectional view of the light-emitting device in the fourth embodiment of this application is shown. Compared with the light-emitting device 100 in the first embodiment, the light-emitting hole 151 of the cut-off member 150 of the light-emitting device 100 in this embodiment is gradually narrowed in the direction away from the light-emitting chip 120. That is, the entire light-emitting hole 151 is narrowed in the direction away from the light-emitting chip 120, and the entire hole wall faces the light-emitting chip 120 to absorb the lateral light irradiated onto it. At the same time, the light-emitting port of the light-emitting hole 151 is smaller, so that the projected light spot is smaller. The normal light emission and small-angle light emission of the light-emitting chip 120 can be emitted through the light-emitting port. The light intensity of this part of the light emission is greater, so that the overall brightness of the light spot is higher and the cut-off of the light spot is better.

[0087] The black adhesive layer 170 covers at least the remaining sidewalls of the groove 111 to prevent light reflection from this portion of the sidewalls, further reducing stray light and scattering.

[0088] Furthermore, the adhesive layer 170 is extended to the edge of the front side of the encapsulating adhesive layer 140, thereby increasing the connection area and coverage area of ​​the adhesive layer 170, which is beneficial to improving the connection stability.

[0089] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the first embodiment above. The specific details can be referred to the description of the first embodiment above, and will not be repeated here.

[0090] Please see Figure 8 , Figure 8 A cross-sectional view of the light-emitting device in the fifth embodiment of this application is shown. Compared with the light-emitting device 100 in the second embodiment described above, the connecting section 157 of the light-emitting hole 151 of the light-emitting device 100 in this embodiment is arranged in a straight cylindrical shape, and the outer end of the connecting section 157 is larger than the inner end of the open section 156. The size of the connecting section 157 is basically the same as the opening size of the groove 111, so that the back of the stop member 150 only has the mounting area 152 and no stop area 153, and the light-absorbing surface of the connecting section 157 is larger, thus absorbing more light.

[0091] The light-transmitting protective layer 180 covers the remaining sidewalls of the groove 111. The adhesive layer 170 is bonded between the base 110 and the mounting area 152, and also bonded between the outer end face of the connecting section 157 and the light-transmitting protective layer 180. When the stop member 150 is bonded, the adhesive layer 170 is squeezed and overflows, climbing along the hole wall of the connecting section 157 to the outer end face of the connecting section 157, while extending to the front side of the light-transmitting protective layer 180, thus connecting the outer end face of the connecting section 157 and the light-transmitting protective layer 180, thereby improving the bonding stability and sealing performance.

[0092] Furthermore, the adhesive layer 170 is black or dark in color, which can absorb the light shining on it and reduce the reflection of light.

[0093] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the second embodiment above. The specific details can be referred to the description of the second embodiment above, and will not be repeated here.

[0094] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A light-emitting device, characterized in that, The light-emitting device (100) includes: A substrate (110) having a groove (111). A light-emitting chip (120) is disposed in the groove (111); A light-transmitting structure (130) is disposed on the light-emitting chip (120); An encapsulating adhesive layer (140) is disposed within the groove (111), covering at least a portion of the side surface of the light-transmitting structure (130) and a portion of the sidewall of the groove (111), and is provided to be opaque; and A cut-off element (150) is provided for light absorption and is disposed on the substrate (110). It forms a cavity (160) with the substrate (110), the encapsulating adhesive layer (140), and the light-transmitting structure (130). A light-emitting hole (151) is provided on the cut-off element (150). The light-emitting hole (151) communicates with the cavity (160) and is disposed corresponding to the light-emitting chip (120) for emitting part of the light emitted by the light-emitting chip (120).

2. The light-emitting device according to claim 1, characterized in that, The back side of the stop member (150) includes an installation area (152) and a stop area (153). The installation area (152) is arranged around the stop area (153) and is bonded to the front side of the base (110). The stop area (153) is arranged corresponding to the groove (111).

3. The light-emitting device according to claim 1, characterized in that, The light-emitting device (100) further includes: An adhesive layer (170) is bonded between the back side of the stop (150) and the front side of the substrate (110), and between the back side of the stop (150) and the remaining sidewalls of the groove (111).

4. The light-emitting device according to claim 1, characterized in that, The material of the stop element (150) is silicone, silicone resin or epoxy resin filled with light-absorbing particles.

5. The light-emitting device according to any one of claims 1 to 4, characterized in that, The light-emitting aperture (151) is gradually widened in the direction away from the light-emitting chip (120); The light-emitting aperture (151) is tapered in the direction away from the light-emitting chip (120); or The light-emitting aperture (151) is arranged in a cylindrical shape in the direction away from the light-emitting chip (120).

6. The light-emitting device according to any one of claims 1 to 4, characterized in that, The light outlet (151) includes an open section (156) and a connecting section (157), wherein the connecting section (157) connects the open section (156) and the cavity (160); The open section (156) is gradually widened in the direction away from the light-emitting chip (120), and the light-emitting port (151) is formed at the outer end of the open section (156). The connecting segment (157) is cylindrical or tapered in the direction away from the light-emitting chip (120).

7. The light-emitting device according to any one of claims 1 to 4, characterized in that, The light-emitting aperture (151) has a minimum light-passing port (154) and a maximum light-passing port (155). The projected area of ​​the minimum light-passing port (154) is larger than the front area of ​​the light-emitting chip (120) and smaller than the projected area of ​​the maximum light-passing port (155).

8. The light-emitting device according to any one of claims 1 to 4, characterized in that, The light-emitting aperture (151) has a minimum light-passing port (154) and a maximum light-passing port (155). The front sides of the minimum light-passing port (154), the maximum light-passing port (155), and the light-emitting chip (120) are all rectangular. The short side of the minimum light-passing port (154) is larger than the short side of the front side of the light-emitting chip (120) and smaller than the short side of the maximum light-passing port (155).

9. The light-emitting device according to any one of claims 1 to 4, characterized in that, The light-emitting aperture (151) has a light-emitting opening that is parallelogram-shaped, elliptical, circular, triangular, or hexagonal; or The light-emitting aperture (151) has a minimum light-passing opening (154), which is located between the light-emitting port and the light-inlet port of the light-emitting aperture (151). The minimum light-passing opening (154) is parallelogram, ellipse, circle, triangle or hexagon.

10. The light-emitting device according to any one of claims 1 to 4, characterized in that, The light-transmitting structure (130) is a wavelength conversion layer or a light-transmitting adhesive layer.

11. The light-emitting device according to claim 10, characterized in that, The light-emitting device (100) also includes a light-transmitting protective layer (180) that covers the front and other sides of the light-transmitting structure (130).

12. The light-emitting device according to any one of claims 1 to 4, characterized in that, The light-transmitting structure (130) is a lens, the side of the lens is gradually widened in the direction away from the light-emitting chip (120), and the front of the lens is a convex curved surface.

13. The light-emitting device according to any one of claims 1 to 4, characterized in that, The number of light-emitting chips (120) is at least two, wherein any two light-emitting chips (120) emit the same or different colors.

14. The light-emitting device according to claim 3, characterized in that, The substrate (110) includes a metal structure (112) and a plastic structure (113), wherein the plastic structure (113) is disposed on the metal structure (112) and surrounds to form the groove (111). Wherein, at least one of the adhesive layer (170), the plastic structure (113), and the encapsulating adhesive layer (140) is black or dark-colored.

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