An LED device and LED light panel

Abstract

The utility model relates to LED packaging technical field discloses a kind of LED device and LED lamp panel. LED device includes substrate, LED chip, light-transmitting spacer and encapsulation glue, the LED chip flip-chip is set on the substrate, the outside of the LED chip is set the light-transmitting spacer, the outside of the light-transmitting spacer is covered and is set the encapsulation glue, to isolate between the LED chip and the encapsulation glue. LED device provided by the utility model is completely isolated by setting light-transmitting spacer between flip-chip LED chip and encapsulation glue, to avoid the hot expansion force generated by encapsulation glue when the solder paste of flip-chip LED chip welding place is secondarily melted under high temperature, can make the solder paste of flip-chip LED chip welding place under high-temperature reflow can be smoothly remelted and connected with pad without chip false welding or off-welding dead lamp, finally realize the high reliability of LED device and lamp drive integrated display module.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to an LED device and an LED light board. Background Technology

[0002] With the rapid development of LCD technology in recent years, the trend towards larger screens, high dynamic range (HDR), and the demand driven by the "stay-at-home economy," Mini-LED display technology is gradually penetrating the application fields of medium and large-size displays, including TVs, commercial displays, and e-sports. Currently, the mainstream Mini-LED backlight products are integrated lamp boards, which include LED chips and ICs soldered together on a PCB. Specifically, this is achieved by packaging LED chips into individual SMD LED chips, and then packaging the LED chips and driver ICs together on the PCB. This is done using the commonly known POB (Package on Board) packaging technology, which is currently the most widely used packaging technology and is particularly prevalent in current Mini-LED display products.

[0003] Due to the high power, high integration, and high heat dissipation requirements of Mini-LED products, more and more LED chips are being packaged using flip-chip technology. LED chips are only one component of Mini-LED products. Generally, the LED chips are manufactured first and then packaged on a PCB together with components such as driver ICs. However, when the LED chips and driver ICs are packaged together on the PCB, the LED chips undergo a secondary reflow process, which causes the solder at the LED chip packaging solder joints to melt again. This results in poor soldering of the LED chips inside the LED chip, causing the chips to fail, affecting the quality of the LED chips, producing defective products, and even affecting the rework of the display module.

[0004] Therefore, in existing technologies, when LED chips are packaged together with other electronic components, internal LED chip soldering defects are common, leading to product defects. Utility Model Content

[0005] To address the aforementioned problems, the present invention aims to provide an LED device and an LED light board that can solve the problem in the prior art where internal LED chip soldering defects easily occur when LED devices are packaged together with other electronic components, leading to product defects.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0007] An LED device includes a substrate, an LED chip, a light-transmitting isolator, and an encapsulating adhesive. The LED chip is flip-chip mounted on the substrate. The light-transmitting isolator is disposed on the outer side of the LED chip. The encapsulating adhesive is disposed on the outer side of the light-transmitting isolator to isolate the LED chip from the encapsulating adhesive.

[0008] In one feasible embodiment, the light-transmitting isolator is an isolation cover that covers the substrate and surrounds the outside of the LED chip.

[0009] In one feasible embodiment, a mounting groove is provided on the substrate, and the bottom edge of the light-transmitting isolator is fixedly disposed in the mounting groove.

[0010] In one feasible embodiment, the LED device further includes a reflector cup disposed on the substrate and surrounding the outside of the light-transmitting isolator, wherein the encapsulating adhesive fills the reflector cup and is located outside the light-transmitting isolator.

[0011] In one feasible embodiment, the light-transmitting insulating element is one or a combination of several of the following: spherical shell, quasi-spherical shell, or square shell structure.

[0012] In one feasible embodiment, the light-transmitting isolator is an isolator sheet, the LED device further includes a reflector cup disposed on the substrate, the light-transmitting isolator is mounted on the inner wall of the reflector cup, the light-transmitting isolator and the reflector cup form an isolation space for isolating the LED chip, and the encapsulating adhesive is filled in the reflector cup and located outside the light-transmitting isolator.

[0013] In one feasible embodiment, the inner wall of the reflective cup is provided with a support structure for fixing and supporting the edge of the light-transmitting insulating element.

[0014] In one feasible embodiment, the light-transmitting isolator protrudes from the side closer to the LED chip toward the side closer to the encapsulating adhesive.

[0015] This utility model also provides an LED light board, including a circuit board, a driver chip and the LED device. The circuit board has a pre-set circuit route, and the driver chip and the LED device are disposed on the circuit board and electrically connected through the circuit route.

[0016] In one feasible embodiment, the LED chip is flip-chip mounted on the substrate using a first solder, and the driver chip is mounted on the circuit board using a second solder, wherein the melting point of the second solder is higher than that of the first solder.

[0017] By adopting the above technical solution, this utility model has at least the following beneficial effects:

[0018] The LED device provided by this utility model completely isolates the flip-chip LED from the encapsulating adhesive by setting a light-transmitting isolator. This avoids the thermal expansion force generated by the encapsulating adhesive pulling the solder paste at the solder joint of the flip-chip LED at high temperature when it melts again. This allows the solder paste at the solder joint of the flip-chip LED to melt back and connect to the pad smoothly under high-temperature reflow without chip cold solder joints or desoldering and dead LEDs. This also allows the subsequent assembly of the integrated lamp driver display module to select a compatible temperature for tinning and soldering of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED device and the integrated lamp driver display module. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the first structure of the LED device provided in this embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the second structure of the LED device provided in this embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the third structure of the LED device provided in this embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the fourth structure of the LED device provided in this embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the fifth structure of the LED device provided in this embodiment of the present invention;

[0024] Figure 6 This is a schematic diagram of the sixth structure of the LED device provided in this embodiment of the utility model;

[0025] Figure 7 This is a schematic diagram of the seventh structure of the LED device provided in this embodiment of the utility model;

[0026] Figure 8 This is a schematic diagram of the eighth structure of the LED device provided in this embodiment of the utility model;

[0027] Figure 9 This is a schematic diagram of the structure of the LED light board provided in this embodiment of the utility model.

[0028] In the attached diagram, 1 is the substrate; 11 is the mounting groove; 2 is the LED chip; 3 is the light-transmitting insulating component; 4 is the encapsulating adhesive; 5 is the reflector cup; 51 is the support structure; 10 is the circuit board; 20 is the driver chip; and 30 is the LED device. Detailed Implementation

[0029] The technical solution of this utility model patent will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0030] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] Example 1

[0033] See Figure 1 , Figure 1 This is a schematic diagram of the first structure of the LED device provided in this embodiment. The LED device provided in this embodiment includes a substrate 1, an LED chip 2, a light-transmitting isolator 3, and an encapsulant 4. The LED chip 2 is flip-chip mounted on the substrate 1. The light-transmitting isolator 3 is disposed on the outside of the LED chip 2. The encapsulant 4 is covered on the outside of the light-transmitting isolator 3 to isolate the LED chip 2 and the encapsulant 4.

[0034] It is understood that the substrate 1 in this embodiment is mainly used for mounting the LED chip 2. The LED chip 2 and the substrate 1 can be fixedly connected by solder paste. The specific implementation of the flip-chip LED 2 is a mature technology in the field and will not be described further here. The substrate 1 is generally a PCB board or carrier board in the field, and generally includes a substrate body. The shape of the substrate body is not strictly limited and can be square, round or irregular. The substrate body can be made of rigid material, such as, but not limited to, phenolic paper laminate, epoxy paper laminate, polyester glass mat laminate, epoxy glass cloth laminate, BT resin board, or glass plate; the substrate body can also be made of flexible material, such as, but not limited to, polyester film, polyimide film, or fluorinated ethylene propylene film. In some examples, the substrate body can be integrated with corresponding circuits according to application requirements. These circuits may include, but are not limited to, circuits connected to the LED chip 2 and driving circuits. Alternatively, a conductive layer can be used to extend pads through the substrate 1 on both sides of the substrate 1 to facilitate the connection of the flip-chip LED chip 2 on one side. The pads on the other side can then be electrically connected to the PCB or other components, allowing the LED chip 2 to be connected to other display modules. Further details are not described here.

[0035] It is understandable that the light-transmitting isolator 3 in this embodiment is mainly used to form an isolation between the LED chip 2 and the encapsulating adhesive 4, so as to prevent the encapsulating adhesive 4 from being stretched by thermal expansion when the LED device and other components in this embodiment are packaged together on the circuit board for reflow soldering. In addition to playing an isolation role, it is also necessary to ensure that the most basic light-emitting function of the LED device itself is not affected. Therefore, the isolator in this embodiment is selected to ensure both light transmission and isolation. Specifically, the light-transmitting isolator 3 can be a quartz-like material with high transparency, high temperature resistance, and high light radiation resistance, such as quartz glass, high borosilicate glass, transparent ceramic microcrystalline glass, etc.

[0036] It is understood that the encapsulating adhesive 4 is a conventional material in the field, mainly used to protect the LED chip 2 and to transmit light. The type of encapsulating adhesive 4 can be selected according to actual needs. For example, the LED device in this embodiment can be made of fluorescent adhesive or various resin materials, etc., which will not be described in further detail here.

[0037] It is understood that in this embodiment, isolating the LED chip 2 and the encapsulating adhesive 4 by the light-transmitting isolator 3 mainly means that the encapsulating adhesive 4 cannot enter the inner side of the light-transmitting isolator 3, that is, it cannot contact the LED chip 2. In addition, it should be noted that in this embodiment, the outer side of the light-transmitting isolator 3 mainly refers to the side away from the LED chip 2, and the inner side mainly refers to the side facing the LED chip 2.

[0038] like Figure 1 As shown, in this embodiment, the light-transmitting isolation element 3 is an isolation cover, which is disposed on the substrate 1 and surrounds the outside of the LED chip 2.

[0039] It is understandable that the isolation cover means that it can cover the LED chip 2, so that the LED chip 2 is isolated from the encapsulating adhesive 4 that is subsequently packaged. The advantage of using the isolation cover is that it can be directly covered on the substrate 1 without the aid of the reflective cup 5 or other support structure 51 to isolate the encapsulating adhesive 4 and the LED chip 2, thus improving the flexibility of use.

[0040] like Figure 2 The diagram shows a second structural schematic of the LED device provided in this embodiment. In this embodiment, a mounting groove 11 is provided on the substrate 1, and the bottom edge of the light-transmitting isolator 3 is fixedly disposed in the mounting groove 11. It is understood that the shape of the mounting groove 11 is consistent with the shape of the bottom edge of the light-transmitting isolator 3. For example, if the light-transmitting isolator 3 is spherical, then the mounting groove 11 is an annular groove surrounding the LED chip 2 on the substrate 1. More specific shapes will not be further described here. The mounting groove 11 enables rapid positioning and installation of the light-transmitting isolator 3. After fixing, the mounting groove 11 can constrain the light-transmitting isolator 3, preventing it from loosening or shifting relative to the substrate 1.

[0041] In addition, it is understood that the light-transmitting isolator 3 in this embodiment can be fixed to the substrate 1 by high-temperature curing with silicone adhesive, or other conventional adhesives, such as inorganic high-temperature adhesives or high-temperature resistant glass adhesives, can also be used. The main purpose is to fix the light-transmitting glass component and ensure that it can withstand high temperatures and prevent the light-transmitting isolator 3 from loosening when the LED device is encapsulated into the display module for reflow soldering.

[0042] like Figure 3 The diagram shown illustrates a third structural design of the LED device provided in this embodiment. In this embodiment, the LED device further includes a reflector cup 5, which is disposed on the substrate 1 and surrounds the outside of the light-transmitting isolator 3. The encapsulating adhesive 4 fills the reflector cup 5 and is located outside the light-transmitting isolator 3. It is understood that the specific shape of the reflector cup 5 is not limited in this embodiment, and it is mainly used to reflect and adjust the light emitted by the LED chip 2.

[0043] like Figure 1 and Figure 4 As shown, Figure 4This is a schematic diagram of the fourth structure of the LED device provided in this embodiment. The light-transmitting isolator 3 is one or a combination of several of the following: spherical shell, near-spherical shell, or square shell structure. It can be understood that in this embodiment, the light-transmitting isolator 3 is mainly used to cover the outside of the LED chip 2, and its inner side only needs to have a cavity to accommodate the LED chip 2. The external shape can be selected and adjusted according to actual needs, for example... Figure 4 Choosing a spherical or near-spherical shape can reduce stress concentration and allow the light emitted by the LED chip 2 to exit perpendicularly to the spherical surface, avoiding refraction. More specific details can be understood and implemented by those skilled in the art in conjunction with the above description, and will not be further described here.

[0044] It is understandable that, such as Figure 5 As shown, Figure 5 This is a schematic diagram of the fifth structure of the LED device provided in this embodiment. In this embodiment, when the light-transmitting isolation component 3 is selected as an isolation cover, the light-transmitting isolation component 3 can be set close to the LED chip 2, so that there is enough space on the outside of the light-transmitting isolation component 3 to facilitate the dispensing of the encapsulating adhesive 4 and ensure the encapsulation effect of the encapsulating adhesive 4.

[0045] In this embodiment, the LED device completely isolates the flip-chip LED 2 from the encapsulating adhesive 4 by setting a light-transmitting isolator 3. This prevents the solder paste at the solder joint of the flip-chip LED 2 from being pulled by the thermal expansion force generated by the encapsulating adhesive 4 when it melts again at high temperature. This allows the solder paste at the solder joint of the flip-chip LED 2 to melt back smoothly and connect with the pads without chip soldering failure or desoldering. This also allows the subsequent assembly of the integrated lamp driver display module to select a temperature compatible with the tin plating of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED device and the integrated lamp driver display module.

[0046] Example 2

[0047] See Figure 6 , Figure 6 This is a schematic diagram of the sixth structure of the LED device provided in this embodiment. The LED device provided in this embodiment includes a substrate 1, an LED chip 2, a light-transmitting isolator 3, and an encapsulant 4. The LED chip 2 is flip-chip mounted on the substrate 1. The light-transmitting isolator 3 is disposed on the outside of the LED chip 2. The encapsulant 4 is covered on the outside of the light-transmitting isolator 3 to isolate the LED chip 2 and the encapsulant 4.

[0048] like Figure 6As shown, unlike Embodiment 1, in this embodiment, the light-transmitting isolator 3 is an isolator sheet, and the LED device also includes a reflector cup 5. The reflector cup 5 is disposed on the substrate 1, and the light-transmitting isolator 3 is mounted on the inner wall of the reflector cup 5. The light-transmitting isolator 3 and the reflector cup 5 form an isolation space that isolates the LED chip 2. The encapsulating adhesive 4 is filled in the reflector cup 5 and located outside the light-transmitting isolator 3.

[0049] It is understood that in this embodiment, the light-transmitting isolator 3 is mainly a sheet-like structure. Although it cannot be independently mounted on the substrate 1 to isolate the LED chip 2, its structure is simpler. By forming an isolation space on the inner wall of the reflector cup 5, the LED chip 2 is isolated inside. This also prevents the encapsulating adhesive 4 from pulling on the LED chip 2 due to thermal expansion when the LED device and other components are packaged together on the circuit board for reflow soldering. Similarly, the material and fixing method of the sheet-like light-transmitting isolator 3 can be understood and implemented with reference to the aforementioned embodiments, and will not be further described here.

[0050] It is understandable that the light-transmitting isolator 3 can be directly bonded and fixed to the inclined inner wall of the reflector cup 5 using adhesive or silicone, or a corresponding structural design can be made on the inner wall of the reflector cup 5. For example... Figure 7 As shown, Figure 7 This is a schematic diagram of the seventh structure of the LED device provided in this embodiment. In this embodiment, the inner wall of the reflector cup 5 is provided with a support structure 51, which is used to fix and support the edge of the light-transmitting insulating member 3.

[0051] In this embodiment, as Figure 7 As shown, taking the support structure 51 as an example, it can be understood that since the reflector cup 5 is a dam structure surrounding the LED chip 2, the support structure 51 is also arranged around the LED chip 2 to facilitate the fixed arrangement of the light-transmitting isolator 3 and prevent the encapsulating adhesive 4 from leaking into the inner isolation space of the light-transmitting isolator 3. In addition, the support structure 51 can also be a simple variation of other structures such as protrusions or grooves, which will not be further listed here. Those skilled in the art can easily adjust it according to actual needs.

[0052] like Figure 8 As shown, Figure 8This is the eighth structural schematic diagram of the LED device provided in this embodiment. In this embodiment, the light-transmitting isolator 3 protrudes from the side near the LED chip 2 to the side near the encapsulating adhesive 4. The protrusion can be formed into an arc shape, a sphere, a near-sphere shape, or other curved surface shapes, which can make the light emitted by the LED chip 2 perpendicular to the light-transmitting isolator 3, reducing light refraction. More specific situations can be understood and implemented by those skilled in the art in conjunction with the above description, and will not be further described here.

[0053] In this embodiment, the LED device completely isolates the flip-chip LED 2 from the encapsulating adhesive 4 by setting a light-transmitting isolator 3. This prevents the solder paste at the solder joint of the flip-chip LED 2 from being pulled by the thermal expansion force generated by the encapsulating adhesive 4 when it melts again at high temperature. This allows the solder paste at the solder joint of the flip-chip LED 2 to melt back smoothly and connect with the pads without chip soldering failure or desoldering. This also allows the subsequent assembly of the integrated lamp driver display module to select a temperature compatible with the tin plating of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED device and the integrated lamp driver display module.

[0054] Example 3

[0055] See Figure 9 This is a schematic diagram of the structure of an LED light board provided in this embodiment. The LED light board provided in this embodiment includes a circuit board 10, a driver chip 20, and an LED device 30 as described in this utility model. The circuit board 10 has a pre-set circuit route (not shown). The driver chip 20 and the LED device 30 are disposed on the circuit board 10 and are electrically connected through the circuit route.

[0056] It is understandable that the number of driver chips 20 and LED devices 30 on the LED light board can be adjusted according to actual needs; only a simple illustration is provided here.

[0057] In this embodiment, the LED chip is flip-chip mounted on the substrate using a first solder, and the driver chip is mounted on the circuit board using a second solder, wherein the melting point of the second solder is higher than that of the first solder.

[0058] Specifically, in this embodiment, the first solder can be conventional low-melting-point solder paste such as tin paste, gold-based solder paste, or silver-based solder paste. The corresponding second solder can be composed of tin, silver, or other solders with relatively higher melting points. Those skilled in the art can select and set the solder according to actual needs. Generally speaking, due to the difference in packaging processes between LED chips and electronic components, the melting point of the first solder used to package LED chips will be lower than the melting point of the second solder used to package components such as LED beads and driver chips. The specific selection of solder will not be further described here.

[0059] For example, in one specific embodiment, solder paste is used for soldering the flip-chip LED inside the LED device, while tin plating is used when packaging the LED device and other components such as the driver IC together on the PCB. However, the melting point of solder paste is lower than that of tin plating. For instance, the melting point of the solder paste used for packaging the LED chip inside the LED device is generally 227°C, while the melting point of tin plating for components such as the driver IC is above 230°C. When packaging the LED device and other components together on the circuit board, to ensure good soldering between the LED device and the driver IC, the furnace temperature needs to exceed 230°C. This can cause the solder paste at the LED chip packaging solder joint inside the LED device to melt again. At the same time, due to the high temperature, the encapsulation adhesive on the outside of the LED chip inside the LED device will have a thermal expansion effect due to the heat, which will exert an upward pulling force on the LED chip, causing poor soldering at the junction of the LED chip and the solder paste, resulting in dead LEDs. The quality of the LED device is affected, resulting in defective products and affecting the rework of the LED light board. Furthermore, even if the LED chip packaging and other component packaging of an LED device use the same solder, there can still be a situation where, when the LED device and other components are packaged together on a circuit board, the solder at the LED chip solder joint inside the LED device undergoes secondary melting and is stretched and pulled by the encapsulating glue.

[0060] Therefore, the LED devices included in the LED light board provided in this embodiment completely isolate the flip-chip LEDs from the encapsulating adhesive by setting a light-transmitting isolator. This avoids the thermal expansion force generated by the encapsulating adhesive pulling the solder paste at the solder joint of the flip-chip LEDs when it melts again at high temperature. This allows the solder paste at the solder joint of the flip-chip LEDs to melt back and connect to the pads smoothly under high-temperature reflow without chip soldering failure or desoldering. This also allows the light board to select a temperature compatible with the tinning and soldering of components such as driver chips and connectors during reflow soldering, ultimately achieving high reliability of the LED light board.

[0061] It is understood that soldering the driver chip 20 and the LED device 30 together onto the circuit board 10 is a conventional SMT (Surface Mount Technology) process in the art, and will not be elaborated here. The main point is that, by using the LED device 30 in this embodiment, the display module can completely isolate the flip-chip LED from the encapsulant during reflow soldering of the display module during surface mount packaging. This avoids the thermal expansion force generated by the encapsulant pulling the solder paste at the solder joint of the flip-chip LED at high temperature from being pulled. This allows the solder paste at the solder joint of the flip-chip LED to melt back smoothly and connect with the pads without chip soldering defects or desoldering. This also allows the display module to use a temperature compatible with the tinning of the driver chip, connectors and other components during reflow soldering, ultimately achieving high reliability of the integrated lamp driver display module.

[0062] For any content not elaborated in detail in this embodiment, those skilled in the art can refer to the foregoing embodiments for understanding and implementation, and will not be further described here.

[0063] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. An LED device, characterized by, The device includes a substrate, an LED chip, a light-transmitting isolator, and encapsulating adhesive. The LED chip is flip-chip mounted on the substrate. The light-transmitting isolator is disposed on the outer side of the LED chip, and the encapsulating adhesive is disposed on the outer side of the light-transmitting isolator to isolate the LED chip and the encapsulating adhesive. The light-transmitting isolator is a spacer sheet made of a quartz-like glass material. The LED device also includes a reflector cup disposed on the substrate. The light-transmitting isolator is mounted on the inner wall of the reflector cup. The light-transmitting isolator and the reflector cup form an isolation space that isolates the LED chip and the solder joint between the LED chip and the substrate. The encapsulating adhesive fills the reflector cup and is located on the outer side of the light-transmitting isolator.

2. The LED device of claim 1, wherein, The light-transmitting isolation element is an isolation cover, which is placed on the substrate and surrounds the outside of the LED chip.

3. The LED device of claim 2, wherein, The substrate is provided with a mounting groove, and the bottom edge of the light-transmitting isolation component is fixedly disposed in the mounting groove.

4. The LED device of claim 2, wherein, The light-transmitting insulating element is one or a combination of several of the following: spherical shell, near-spherical shell, or square shell structure.

5. The LED device of claim 1, wherein, The inner wall of the reflective cup is provided with a support structure, which is used to fix and support the edge of the light-transmitting insulating element.

6. The LED device of claim 1, wherein, The light-transmitting insulating element protrudes from the side closer to the LED chip towards the side closer to the encapsulating adhesive.

7. An LED light panel, characterized in that, The device includes a circuit board, a driver chip, and an LED device as described in any one of claims 1 to 6. The circuit board has a pre-set circuit path, and the driver chip and the LED device are disposed on the circuit board and electrically connected through the circuit path.

8. The LED lamp panel of claim 7, wherein, The LED chip is flip-chip mounted on the substrate using a first solder, and the driver chip is mounted on the circuit board using a second solder, wherein the melting point of the second solder is higher than that of the first solder.

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