High airtightness LED package bracket structure

Abstract

The utility model discloses a high airtightness LED package support structure, including fixed crystal area and a plurality of pins, the surface of fixed crystal area and a plurality of pins all is equipped with plating, and is located fixed crystal area and a plurality of pins between, the pin and the pin between all are equipped with slit, is located fixed crystal area and a plurality of pins on top and forms cup body, the cup body integrative forming has fixed part, the fixed part inserts the slit and passes out, the end of fixed part is equipped with boss, the boss is higher than plating, and transversely extends to the pin and fixed crystal area surface and forms first zigzag airtight structure, through the boss pressure in fixed crystal area and a plurality of pin surfaces, first zigzag airtight structure refers to the fixed part and the boss combination pin and the lateral surface of fixed crystal area and has the "7" letter type of sticking surface, and the sticking surface has corner, through the corner in this structure and the path of extension, then plays the barrier effect to gas invasion, improves airtightness.

Description

Technical Field

[0001] This utility model belongs to the field of LED packaging brackets, specifically a high-airtightness LED packaging bracket structure. Background Technology

[0002] With the rapid development of indoor and outdoor LED display application technology, the lifespan requirements for LED displays in high-end outdoor applications are increasing year by year. In harsh outdoor environments, insufficient airtightness of LEDs will allow outdoor moisture and pollutants to seep in, damaging the internal chips and circuit structures of the LEDs, thereby reducing the lifespan of the display and failing to meet the needs of high-end customers.

[0003] Since the opening of the cup is the light-emitting part, the current focus is mainly on the sealing structure of the cup itself. However, the narrow gap between the cup and the substrate is overlooked, which could allow gas to enter and affect the lifespan of the cup. Utility Model Content

[0004] The purpose of this invention is to provide a high-airtightness LED packaging bracket structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A high-airtightness LED packaging bracket structure includes a die-bonding area and a plurality of pins. The surfaces of the die-bonding area and the plurality of pins are all coated, and slits are provided between the die-bonding area and the plurality of pins and between the pins. A cup body is formed on the die bonding area and several pins. The cup body is integrally formed with a fixing part, which is embedded in the slit and protrudes out. The end of the fixing part is provided with a boss, which is higher than the plating layer and extends laterally to the surface of the pins and the die bonding area to form a first tortuous airtight structure.

[0006] In a further technical solution, the die-bonding area and the edge surface of the pin near the boss are left blank. The surface of the blank area is not coated. The boss is in close contact with the surface of the blank area and the side of the coating to form a second tortuous airtight structure.

[0007] In a further technical solution, the slit is convex in shape, and the fixing part is adapted to it.

[0008] In a further technical solution, the die-bonding area is located in the middle, and three pins are respectively provided on both sides of the die-bonding area. The back of the die-bonding area and several pins are coated.

[0009] In a further technical solution, several of the pins have the same shape and are arranged symmetrically on the left and right.

[0010] The beneficial effects of this utility model are: This invention uses a boss pressed against the die-bonding area and several pin surfaces. The first zigzag airtight structure refers to the fixing part and the boss forming a "7"-shaped contact surface on the side of the pin and the die-bonding area. This contact surface has corners. Assuming that there are cracks at the contact surface due to process reasons, which may cause gas intrusion, the corners in this structure and the extended path mean that gas needs to follow the "7"-shaped path to enter the cup, thereby blocking gas intrusion and improving airtightness.

[0011] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0012] Figure 1 Top view of this utility model.

[0013] Figure 2 : Cross-sectional structural diagram of this utility model.

[0014] Reference numerals: 11-Die bonding area, 12-Pin, 13-Platinum layer, 14-Blank area, 41-Cup body, 42-Fixing part, 43-Boss, 51-First zigzag airtight structure, 52-Second zigzag airtight structure. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0016] Please refer to Figure 1 and Figure 2 ; This utility model aims to provide a high-airtightness LED packaging bracket. During airtightness testing, colored ink is used to simulate gas flow, allowing the flow trajectory to be observed. During the test, it was discovered that the ink seeps into the cup body 41 from the bottom through the joint gap. This reveals a technical problem in this application. Besides manufacturing reasons, the area where the ink is essentially joined to the cup body 41 lacks obstruction and is essentially a straight line, making it very easy for gas to pass through. The technical solution adopted in this application is as follows: Specifically, it includes a die-bonding region 11 and several pins 12. The surfaces of both the die-bonding region 11 and the pins 12 are coated with a layer 13, and slits are provided between the die-bonding region 11 and the pins 12, and between the pins 12 themselves. More specifically, it is formed by stamping a metal substrate, on which several positions are arranged corresponding to the formation of several pins 12 and the die-bonding region 11. Then, electroplating is performed, typically silver plating. The blank areas are removed by stamping before electroplating to reduce the use of silver. The removed blank areas are the slits. The pins 12 and the die-bonding area 11 are independent of each other. Therefore, the pins 12 and the die-bonding area 11 are fixed to the substrate respectively. Then, the cup body 41 is formed by injection molding. The cup body 41 is located on the die-bonding area 11 and several pins 12. Several pins 12 and the die-bonding area 11 are exposed at the bottom of the cup mouth of the cup body 41. The cup body 41 is integrally formed with a fixing part 42. The fixing part 42 is embedded in the slit and protrudes. The end of the fixing part 42 is provided with a boss 43. The boss 43 is higher than the plating layer 13 and extends laterally to the surface of the pins 12 and the die-bonding area 11 to form a first tortuous airtight structure 51. In this embodiment, the boss 43 presses against the die-bonding area 11 and the surface of several pins 12. The first tortuous airtight structure 51 refers to the fixing part 42 and the boss 43 forming a "7"-shaped contact surface with the side of the pins 12 and the die-bonding area 11. This contact surface has corners. Assuming that there are cracks at the contact surface due to process reasons, which may cause gas intrusion, the corners in this structure and the extended path mean that gas needs to follow the "7"-shaped path to enter the cup 41, thereby blocking gas intrusion and improving airtightness.

[0017] The metal substrate is a copper plate, while the silver plating layer itself has a smooth surface and high inertness, resulting in naturally weak adhesion to plastic. This can easily lead to "delamination" or "detachment," affecting the bonding effect of the cup body 41. Copper, on the other hand, can bond better with plastic. Therefore, a blank area 14 is left on the edge surface of the die bonding area 11 and the pin 12 near the boss 43. The blank area 14 does not have the plating layer 13, thus retaining the surface of the copper plate. After injection molding, the boss 43 extends laterally, with its bottom surface adhering to the surface of the blank area 14 and its side surface adhering to the plating layer 13. At the same time, an upward adhering surface is formed between the side surface of the boss 43 and the plating layer 13. This adhering surface has a corner with the first zigzag airtight structure 51, together forming the second zigzag airtight structure 52. Gas must cross the corner and pass through the upward adhering surface to enter the cup body 41, thus extending the gas path length and further blocking the gas.

[0018] In this embodiment of the utility model, the slit is convex, and the fixing part 42 is adapted to it. The fixing part 42 is also convex, and together with the boss 43, it can clamp the edge of the die bonding area 11 and the edge of the pin 12. This not only makes the cup body 41 more firmly attached, but also prevents the edges of the pin 12 and the die bonding area 11 from lifting.

[0019] In this embodiment of the present invention, the die bonding area 11 is located in the middle, and three pins 12 are respectively provided on both sides of the die bonding area 11. The back of the die bonding area 11 and the pins 12 are coated with a layer 13. According to this technical solution, it is a six-pin 12 LED bracket, in which the six pins 12 are independent. When in use, the LEDs are bonded to the die bonding area 11. Assuming there are three LEDs, the die bonding area 11 only provides a fixing function. The positive and negative leads of the LEDs are connected to the pins 12 on both sides respectively. Another way of using it is that the die bonding area 11 is used as a common terminal, and each pin 12 is an independent control terminal. That is, a maximum of six LEDs can be bonded in the die bonding area 11. The common terminal of the LEDs is connected to the die bonding area 11, and the control terminal is connected to the corresponding pin 12.

[0020] In this embodiment of the invention, several pins 12 have the same shape and are arranged symmetrically from left to right. This structural shape is more conducive to mold design and simplifies the overall structure.

[0021] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0022] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-airtightness LED packaging bracket structure, characterized in that: It includes a die-bonding area (11) and a plurality of pins (12). The surfaces of the die-bonding area (11) and the plurality of pins (12) are all provided with a plating layer (13), and slits are provided between the die-bonding area (11) and the plurality of pins (12) and between the pins (12). A cup body (41) is formed on the die bonding area (11) and a number of pins (12). The cup body (41) is integrally formed with a fixing part (42). The fixing part (42) is embedded in the slit and protrudes out. The end of the fixing part (42) is provided with a boss (43). The boss (43) is higher than the plating layer (13) and extends laterally to the surface of the pins (12) and the die bonding area (11) to form a first tortuous airtight structure (51).

2. The high-airtightness LED packaging bracket structure according to claim 1, characterized in that: The die-bonding area (11) and the pin (12) are near the edge surface of the boss (43) with a blank area (14). The blank area (14) has no plating (13) on its surface. The boss (43) is in close contact with the surface of the blank area (14) and the side of the plating (13) to form a second tortuous airtight structure (52).

3. The high-airtightness LED packaging bracket structure according to claim 1, characterized in that: The slit is convex in shape, and the fixing part (42) is adapted to it.

4. The high-airtightness LED packaging bracket structure according to claim 1, characterized in that: The die-bonding area (11) is located in the middle, and three pins (12) are respectively provided on both sides of the die-bonding area (11). The back of the die-bonding area (11) and the pins (12) are all coated (13).

5. The high-airtightness LED packaging bracket structure according to claim 1, characterized in that: Several of the pins (12) have the same shape and are arranged symmetrically on the left and right.

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