Micro light emitting diode device package module and display device

Abstract

The application provides a micro light emitting diode device packaging module and a display device. The substrate of the packaging module comprises a first surface and a second surface arranged oppositely along the thickness direction, and the second surface is provided with a first pad. The micro light emitting diode device is arranged on the first surface and electrically connected with the substrate. The driving board is arranged on the second surface and is provided with a second pad. The second pad is welded with the first pad and electrically connected with the first pad. The driving board is used for providing an electrical signal to the micro light emitting diode device through the second pad and the first pad. Based on this, the packaging module has better connection stability and electrical connection reliability, and the performance of the packaging module is more reliable.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, specifically to a micro light-emitting diode device packaging module and display device. Background Technology

[0002] Micro-LED (Micro-Light Emitting Diode) display technology miniaturizes and arrays the traditional LED (Light Emitting Diode) structure, and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to create the driving circuit, thereby achieving addressing control and individual driving of each pixel.

[0003] Micro-LEDs require encapsulation after fabrication. The encapsulation methods for Micro-LEDs in related technologies need improvement. Utility Model Content

[0004] The purpose of this application is to provide a miniature light-emitting diode (LED) device packaging module and a display device.

[0005] In a first aspect, this application provides a miniature light-emitting diode device packaging module, comprising:

[0006] The substrate includes a first surface and a second surface disposed opposite to each other along the thickness direction, and the second surface is provided with a first pad.

[0007] A miniature light-emitting diode device is disposed on the first surface and electrically connected to the substrate;

[0008] A driver board is disposed on the second side. The driver board has a second pad, which is soldered to the first pad and electrically connected to it. The driver board is used to provide electrical signals to the micro light-emitting diode device through the second pad and the first pad.

[0009] Optionally, the first pad includes a first sub-pad and a second sub-pad, and the second pad includes a third sub-pad and a fourth sub-pad;

[0010] The third sub-pad is electrically connected to the first sub-pad and is used to provide drive control signals to the micro light-emitting diode device;

[0011] The fourth sub-pad is electrically connected to the second sub-pad and is used to provide a power signal to the micro LED device.

[0012] Optionally, the first surface is provided with a third pad, which is electrically connected to the first pad and the micro LED device respectively. The driver board is used to provide electrical signals to the micro LED device through the second pad, the first pad, and the third pad.

[0013] Optionally, the micro light-emitting diode device includes a driver chip and a micro light-emitting diode chip sequentially stacked and electrically connected to each other on the first surface along the thickness direction, wherein the driver chip has a fourth pad; wherein,

[0014] The fourth pad is electrically connected to the third pad via a connecting line; or, the fourth pad is connected to the third pad and the two are electrically connected.

[0015] Optionally, the packaging module further includes:

[0016] An adhesive layer is disposed between the driver chip and the first surface along the thickness direction, and the driver chip is bonded to the first surface through the adhesive layer.

[0017] Optionally, the packaging module further includes:

[0018] A frame is disposed along the thickness direction on the side of the first surface opposite to the second surface. The frame is connected to the first surface, and the two together form an accommodating space. The micro light-emitting diode device is located within the accommodating space.

[0019] Optionally, the frame has a light-transmitting area, the projection of which along the thickness direction covers at least a portion of the micro LED chip.

[0020] Optionally, the substrate further includes a through-hole structure penetrating the first surface and the second surface; the packaging module further includes:

[0021] A heat-conducting structure is disposed within the through-hole structure. The heat-conducting structure is respectively bonded and connected to the micro light-emitting diode device and the driving board, and is used to transfer the heat generated by the micro light-emitting diode device to the driving board.

[0022] Optionally, the heat-conducting structure is also used to electrically connect to the driving board and the micro LED device respectively, and to transmit the electrical signal provided by the driving board to the micro LED device.

[0023] Optionally, the encapsulation module further includes at least one of a first thermally conductive colloid and a second thermally conductive colloid;

[0024] The first thermally conductive colloid is disposed between the first surface and the micro light-emitting diode device along the thickness direction, and at least covers the thermally conductive structure;

[0025] The second thermally conductive colloid is disposed between the second surface and the drive plate along the thickness direction, and at least covers the thermally conductive structure.

[0026] Optionally, at least one of the first thermally conductive colloid and the second thermally conductive colloid may further include a conductive structure.

[0027] Optionally, the driving board carries the substrate and the micro light-emitting diode device, and the projected area of ​​the driving board along the thickness direction is greater than or equal to the area of ​​the second surface.

[0028] Optionally, at least one of the substrate and the drive board includes a thermally conductive substrate.

[0029] Secondly, this application also provides a display device, which includes the packaging module described above.

[0030] Based on the above technical solution, the miniature light-emitting diode device and the driver board of the packaging module of this application are respectively disposed on opposite sides of the substrate, which can make reasonable use of the space on both sides of the substrate. The size of the packaging module is small, which can realize miniaturization design. At the same time, the driver board is soldered to the first pad on the substrate through the second pad and electrically connected. The connection and electrical connection between the driver board and the substrate are more robust, and the electrical connection between the driver board and the miniature light-emitting diode device through the second pad and the first pad is also more reliable. Therefore, the miniature light-emitting diode device packaging module of this application has better connection stability and better electrical connection reliability. The packaging module has better drop resistance, water vapor resistance, and corrosion resistance, and the overall performance of the packaging module is more reliable. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0032] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0033] Figure 1 This is a schematic diagram of a micro LED device packaging module provided in an embodiment of this application;

[0034] Figure 2 An exploded view of the packaging module provided in the embodiments of this application;

[0035] Figure 3A schematic diagram of a substrate provided in an embodiment of this application;

[0036] Figure 4 A schematic diagram of a driver board provided in an embodiment of this application;

[0037] Figure 5 A schematic diagram of another structure of the substrate provided in an embodiment of this application;

[0038] Figure 6 This is a schematic diagram of a micro light-emitting diode device provided in an embodiment of this application;

[0039] Figure 7 This is a schematic diagram of the structure of a miniature light-emitting diode chip provided in an embodiment of this application;

[0040] Figure 8 This is a partial schematic diagram of the packaging module provided in an embodiment of this application;

[0041] Figure 9 for Figure 8 An exploded view of the packaging module shown.

[0042] Figure 10 This is another schematic diagram of the packaging module provided in the embodiments of this application;

[0043] Figure 11 for Figure 10 An exploded view of the packaging module shown.

[0044] Figure 12 This is a schematic diagram of a display device provided in an embodiment of this application.

[0045] The reference numerals in the attached figures are as follows:

[0046] 10. Display device; 100. Packaging module; 200. Packaging structure; 110. Substrate; 120. Miniature light-emitting diode device; 130. Driver board; 140. Adhesive layer; 150. Frame; 160. Thermally conductive structure; 111. First surface; 112. Second surface; 113. First pad; 114. Third pad; 121. Miniature light-emitting diode chip; 122. Driver chip; 131. Second pad; 141. Groove structure; 151. Light-transmitting area; 1131. First sub-chip 1132, Second sub-pad; 1211, First substrate; 1212, Buffer layer; 1213, First semiconductor layer; 1214, Light-emitting layer; 1215, Second semiconductor layer; 1216, Current diffusion layer; 1217, First electrode layer; 1218, Second electrode layer; 1219, Solder joint structure; 1221, Fourth pad; 1222, Second substrate; 1223, Driving circuit; 1224, Driving pad; 1311, Third sub-pad; 1312, Fourth sub-pad. Detailed Implementation

[0047] The following will refer to the appendices in this application. Figure 1 To be continued Figure 12 The technical solutions in this application are clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0048] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0049] The following detailed description is based on specific embodiments. It should be noted that the embodiments of this application can be presented in various forms, and some examples will be described below.

[0050] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of a micro LED device packaging module 100 (hereinafter referred to as packaging module 100) provided in an embodiment of this application. Figure 2 This is an exploded structural diagram of the packaging module 100 provided in an embodiment of this application. Figure 3 This is a schematic diagram of a substrate 110 provided in an embodiment of this application. The packaging module 100 includes the substrate 110, a micro light-emitting diode device 120, and a driver board 130.

[0051] The substrate 110 includes a first surface 111 and a second surface 112 disposed opposite to each other along the thickness direction (hereinafter referred to as the thickness direction) of the packaging module 100. The second surface 112 is provided with a first pad 113. A miniature light-emitting diode device 120 is disposed on the first surface 111 and is electrically connected to the substrate 110. A driver board 130 is disposed on the second surface 112 and is provided with a second pad 131. The second pad 131 is soldered to the first pad 113 and the two are electrically connected. The driver board 130 is used to provide electrical signals to the miniature light-emitting diode device 120 through the second pad 131 and the first pad 113.

[0052] It is understood that the substrate 110 is used to support the micro-LED device 120. The micro-LED device 120 can be fixed to the substrate 110 by means of bonding, welding, snap-fitting, riveting, screwing, magnetic connection, etc. The substrate 110 and the micro-LED device 120 together form the package structure 200. In some examples, the substrate 110 includes a circuit board with a circuit structure that can perform signal control on the micro-LED device 120. In some examples, the substrate 110 is a thermally conductive substrate. The substrate 110 can be, but is not limited to, a ceramic substrate, an aluminum substrate, a copper substrate, or an Invar steel substrate, etc., which have a thermally conductive structure. In this case, the substrate 110 can better conduct the heat generated by the micro-LED device 120 during operation to the outside of the package module 100, thereby improving the heat dissipation performance of the package module 100.

[0053] It is understood that the driver board 130 is used to support the substrate 110 and the miniature light-emitting diode device 120, or in other words, the driver board 130 is used to support the package structure 200. In some examples, the projected area of ​​the driver board 130 along the thickness direction is greater than or equal to the area of ​​the second surface 112 of the substrate 110. Furthermore, the projected area of ​​the driver board 130 along the thickness direction is greater than or equal to the projected area of ​​the package structure 200 along the thickness direction. In this case, the driver board 130 can fully support the package structure 200, and the connection stability between the driver board 130 and the package structure 200 is better.

[0054] Understandably, in some examples, the second pad 131 of the driver board 130 is correspondingly disposed with the first pad 113 of the substrate 110, and their projections along the thickness direction coincide. In some examples, the driver board 130 may have multiple second pads 131, and the second surface 112 of the substrate 110 may have multiple first pads 113. The multiple first pads 113 and multiple second pads 131 are one-to-one corresponding and directly opposite each other, and their projections along the thickness direction coincide. The multiple second pads 131 of the driver board 130 can be soldered to the multiple first pads 113 to achieve electrical connection. The driver board 130 achieves fixed connection and electrical connection with the substrate 110 through the first pads 113 and second pads 131.

[0055] Understandably, in some examples, the driver board 130 is a circuit board. The driver board 130 can receive signals from an external control system (such as, but not limited to, a remote control, a command input device, a network control device, etc.) and provide corresponding electrical signals to the micro LED device 120 through the second pad 131 and the first pad 113 according to the signals. The electrical signals may include, but are not limited to, power signals and drive control signals. Thus, the driver board 130 can provide power signals and drive control signals to the micro LED device 120 through the second pad 131 and the first pad 113, thereby controlling the light emission of the micro LED device 120.

[0056] In this embodiment, the miniature light-emitting diode device 120 and the driver board 130 of the packaging module 100 are respectively disposed on opposite sides of the substrate 110, making reasonable use of the space on both sides of the substrate 110. The packaging module 100 is small in size and can achieve miniaturization design. At the same time, the driver board 130 is soldered to the first pad 113 on the substrate 110 through the second pad 131 and electrically connected. The connection and electrical connection between the driver board 130 and the substrate 110 are more robust, and the electrical connection between the driver board 130 and the miniature light-emitting diode device 120 through the second pad 131 and the first pad 113 is also more reliable. Therefore, the packaging module 100 of this application has better connection stability and better electrical connection reliability. The packaging module 100 has better drop resistance, water vapor resistance, and corrosion resistance, and the overall performance of the packaging module 100 is more reliable.

[0057] In some examples, please combine Figure 3 Please refer to Figure 4 , Figure 4 This is a schematic diagram of a drive board 130 provided in an embodiment of this application. The first pad 113 of the substrate 110 includes a first sub-pad 1131 and a second sub-pad 1132. The second pad 131 of the drive board 130 includes a third sub-pad 1311 and a fourth sub-pad 1312.

[0058] Understandably, the third sub-pad 1311 is electrically connected to the first sub-pad 1131 and is used to provide drive control signals to the miniature LED device 120. The fourth sub-pad 1312 is electrically connected to the second sub-pad 1132 and is used to provide power signals to the miniature LED device 120.

[0059] It is understandable that, such as Figure 3 and Figure 4 As shown, in some examples, the first surface 111 of the substrate 110 is provided with a plurality of first sub-pads 1131 and a plurality of second sub-pads 1132, and the driver board 130 is provided with a plurality of third sub-pads 1311 and fourth sub-pads 1312. In some examples, the third sub-pads 1311 and the first sub-pads 1131 may be, but are not limited to, small pad structures in the shape of circles or ellipses, which can be used to transmit drive control signals. In some examples, the fourth sub-pads 1312 and the second sub-pads 1132 may be, but are not limited to, rectangular solder structures, and, as... Figure 3 and Figure 4 As shown, the second sub-pad 1132 includes two small rectangular portions and one large rectangular portion. The two small rectangular portions can be electrically connected to the positive power supply, and the large rectangular portion can be electrically connected to the negative power supply. Similarly, the fourth sub-pad 1312 includes two small rectangular portions electrically connected to the positive power supply and one large rectangular portion electrically connected to the negative power supply. This embodiment transmits drive control signals through a smaller sub-pad structure and power signals through a larger sub-pad structure, which ensures the reliability of power signal transmission under high power while reducing the area occupied by the sub-pads for transmitting control signals.

[0060] Understandably, in some examples, the first sub-pad 1131 may, but is not limited to, be disposed on the edge regions of opposite sides of the substrate 110; the third sub-pad 1311 may, but is not limited to, be disposed on the edge regions of opposite sides of the driver board 130; the second sub-pad 1132 may, but is not limited to, be disposed in the middle region of the substrate 110; and the fourth sub-pad 1312 may, but is not limited to, be disposed in the middle region of the driver board 130. By placing the larger sub-pads in the middle region of the substrate 110 or driver board 130 and the smaller sub-pads in the edge regions of the substrate 110 or driver board 130, the space of the substrate 110 or driver board 130 can be utilized efficiently, the total space occupied by the sub-pads can be reduced, and the miniaturization design of the substrate 110 or driver board 130 can be achieved.

[0061] The substrate 110 and the driver board 130 of this application embodiment are respectively provided with sub-pads for transmitting drive control signals and sub-pads for transmitting power signals. The driver board 130 can supply power to the micro light-emitting diode device 120 and transmit control signals through the substrate 110. The driver board 130 has a high degree of integration and the structure of the packaging module 100 is relatively simple.

[0062] In some examples, please refer to Figure 5 , Figure 5 This is a schematic diagram of another direction of the substrate 110 provided in the embodiments of this application. The first surface 111 of the substrate 110 is provided with a third pad 114, which is electrically connected to the first pad 113 and the micro light-emitting diode device 120.

[0063] It is understood that the substrate 110 can have multiple (two or more) first pads 113 and multiple third pads 114. In some examples, the multiple first pads 113 and multiple third pads 114 are arranged one-to-one and facing each other, with their projections along the thickness direction overlapping one-to-one. In other examples, the multiple first pads 113 and multiple third pads 114 are arranged one-to-one and staggered, with their projections along the thickness direction staggered one-to-one. Of course, in still other examples, the number of multiple first pads 113 is different from the number of multiple third pads 114, and the multiple first pads 113 are not arranged one-to-one with the multiple third pads 114.

[0064] Understandably, in some examples, the substrate 110 also includes an electrical connection structure through which the first pad 113 and the third pad 114 are electrically connected. For example, the substrate 110 has a via penetrating the first surface 111 and the second surface 112, through which the electrical connection structure passes and electrically connects the first pad 113 and the third pad 114. As another example, the electrical connection structure is laid along the first surface 111, the second surface 112, and the side surface of the substrate 110 to achieve electrical connection between the first pad 113 and the second pad 131. Of course, in other examples, one or both of the first pad 113 and the third pad 114 may also penetrate the substrate 110 to achieve electrical connection with the other pad.

[0065] It is understood that the third pad 114 can be electrically connected to the micro LED device 120 by means of soldering, wire connection, etc. In this case, the second pad 131, the first pad 113, the third pad 114, and the micro LED device 120 are electrically connected in sequence. The driver board 130 is used to provide electrical signals to the micro LED device 120 through the second pad 131, the first pad 113, and the third pad 114. The driver board 130 can provide power signals and drive control signals to the micro LED device 120.

[0066] In this embodiment, the substrate 110 is electrically connected to the second pad 131 of the driver board 130 via a first pad 113, and the substrate 110 is electrically connected to the micro light-emitting diode device 120 via a third pad 114. Compared with the method of electrically connecting the driving structure and the micro light-emitting diode device 120 via wires in related technologies, the pad electrical connection scheme between the substrate 110, the driver board 130, and the micro light-emitting diode device 120 in this application is significantly better than the wire connection scheme in terms of drop resistance and impact resistance. Therefore, the electrical and fixed connection between the substrate 110 and the driver board 130 and the micro light-emitting diode device 120 via pads in this application is more reliable, and the overall performance of the packaging module 100 is more reliable.

[0067] In some examples, please refer to Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of a micro light-emitting diode device 120 provided in an embodiment of this application. Figure 7 This is a schematic diagram of a micro LED chip 121 provided in an embodiment of this application. The micro LED device 120 includes a micro LED chip 121 and a driver chip 122.

[0068] It is understood that the driver chip 122 and the micro LED chip 121 can be sequentially stacked on the first surface 111 of the substrate 110 along the thickness direction. The projected area of ​​the driver chip 122 and the micro LED chip 121 along the thickness direction is smaller than the area of ​​the first surface 111, so that the substrate 110 can fully support the driver chip 122 and the micro LED chip 121.

[0069] It is understood that the driver chip 122 is electrically connected to the substrate 110 and receives electrical signals such as drive control signals and power signals transmitted from the driver board 130. The driver chip 122 is also electrically connected to the micro LED chip 121 and is used to control the micro LED chip 121 to emit light. The driver chip 122 is provided with a fourth pad 1221.

[0070] In some examples, the fourth pad 1221 can be electrically connected to the third pad 114 of the substrate 110 via a connecting wire. This connecting wire can be, but is not limited to, gold or aluminum wire. The connection between the driver chip 122 and the substrate 110 via connecting wires reduces the spacing between the connecting wires, enabling miniaturization and high-density integration of the driver chip 122 and the substrate 110. It also reduces signal transmission loss and interference, ensuring the display performance of the miniature LED device 120.

[0071] In other examples, the fourth pad 1221 can be directly connected to the third pad 114 of the substrate 110, and the two are electrically connected. For example, the fourth pad 1221 and the third pad 114 are arranged facing each other along the thickness direction, and are connected together by welding to achieve electrical connection. In this application, the fourth pad 1221 and the third pad 114 are welded together, making the connection and electrical connection between the driver chip 122 and the substrate 110 more robust, improving the connection stability and electrical connection reliability, and making the overall performance of the package module 100 more reliable.

[0072] Understandably, in some examples, the miniature LED chip 121 may be bonded to the driver chip 122. For example, as... Figure 7 As shown, the miniature light-emitting diode chip 121 includes a first substrate 1211, and a buffer layer 1212, a first semiconductor layer 1213, a light-emitting layer 1214, a second semiconductor layer 1215, a current diffusion layer 1216, a first electrode layer 1217, a second electrode layer 1218, and multiple solder joint structures 1219 formed on the first substrate 1211. Figure 6 As shown, the driver chip 122 includes a second substrate 1222, a driver circuit 1223 formed on the second substrate 1222, and a plurality of driver pads 1224. These driver pads 1224 can be correspondingly configured and bonded to a plurality of solder joint structures 1219, enabling the micro-LED chip 121 and the driver chip 122 to be bonded together. After bonding, the first substrate 1211 can be peeled off. Alternatively, in other examples, the driver chip 122 and the micro-LED chip 121 can be fabricated on the same substrate 110 using a process and electrically connected via wires or other connectors.

[0073] It should be noted that the above-described structure of the micro LED chip 121 and the above-described structure of the driver chip 122 can be found in the description of related technologies, and will not be repeated in the embodiments of this application.

[0074] In this embodiment, the fourth pad 1221 of the driver chip 122 is connected to the third pad 114 of the substrate 110 via a connecting line. The spacing between the multiple connecting lines is small, enabling miniaturization and high-density integration of the driver chip 122 and the substrate 110, thus realizing the miniaturized design of the packaging module 100. At the same time, the substrate 110 transmits electrical signals to the driver chip 122 via the connecting lines, which can reduce signal transmission loss and interference, and ensure the display performance of the miniature light-emitting diode device 120.

[0075] Please refer to the following: Figure 8 and Figure 9 , Figure 8 This is a partial schematic diagram of the packaging module 100 provided in an embodiment of this application. Figure 9 for Figure 8The diagram shows an exploded view of the packaging module 100. In some examples, the packaging module 100 further includes an adhesive layer 140, which is disposed along the thickness direction between the driver chip 122 and the first surface 111 of the substrate 110, wherein the driver chip 122 is bonded to the first surface 111 of the substrate 110 through the adhesive layer 140.

[0076] Understandably, in some examples, the projected area of ​​the adhesive layer 140 along the thickness direction is equal to or slightly larger than the projected area of ​​the driver chip 122 along the thickness direction, resulting in a larger bonding area between the driver chip 122 and the adhesive layer 140, and a stronger bond between them. Of course, in other examples, the projected area of ​​the adhesive layer 140 along the thickness direction is smaller than the projected area of ​​the driver chip 122 along the thickness direction.

[0077] Understandably, in some examples, the adhesive layer 140 is provided with a groove structure 141, and at least a portion of the driver chip 122 is disposed within the groove structure 141. The sidewalls of the groove structure 141 can cover all or part of the sidewalls of the driver chip 122. On the one hand, the sidewalls of the groove structure 141 of the adhesive layer 140 can block more moisture and other foreign objects, improving the packaging reliability of the packaging module 100. On the other hand, the groove structure 141 can also limit the driver chip 122, improving the connection stability of the packaging module 100.

[0078] It is understood that the adhesive layer 140 can be, but is not limited to, a die-bonding adhesive layer, and the die-bonding adhesive material can be, but is not limited to, epoxy resin, silicone, acrylic adhesive, mixed adhesive, etc. The die-bonding adhesive layer can prevent moisture from entering between the driver chip 122 and the substrate 110, thereby improving the packaging reliability of the packaging module 100. Of course, the adhesive layer 140 can also be, but is not limited to, an adhesive strip.

[0079] In this embodiment, the driver chip 122 is bonded to the substrate 110 via the adhesive layer 140, making the connection between the driver chip 122 and the substrate 110 more stable. At the same time, the die bond adhesive layer 140 can also improve the waterproof performance of the packaging module 100 and improve the packaging reliability of the packaging module 100.

[0080] In some examples, please refer to [the relevant documentation / reference]. Figure 8 and Figure 9 The encapsulation module 100 also includes a frame 150. The frame 150 is disposed along the thickness direction on the side of the first surface 111 of the substrate 110 away from the second surface 112. The frame 150 is connected to the first surface 111 of the substrate 110 and the two together form an accommodating space, in which the micro light-emitting diode device 120 is located.

[0081] It is understood that the frame 150 includes a bottom wall and a side wall. The side wall is connected to the periphery of the bottom wall and extends in a direction away from the bottom wall, and surrounds the periphery of the bottom wall. The bottom wall and the side wall together form a groove structure. The side wall of the frame 150 is connected to the first surface 111 of the substrate 110, and the bottom wall is disposed away from the first surface 111. Thus, the frame 150 and the substrate 110 together form an accommodating space, and the frame 150 covers the micro light-emitting diode device 120 within the accommodating space.

[0082] It is understood that the material of the frame 150 may include, but is not limited to, silicone, epoxy resin, etc., and the frame 150 may include, but is not limited to, damming adhesive, filler adhesive, etc.

[0083] Understandably, the frame 150 has a light-transmitting area 151, the projection of which along its thickness covers at least a portion of the micro LED chip 121, and the light emitted by the micro LED chip 121 exits through this light-transmitting area 151. In some examples, the light-transmitting area 151 may be a through-hole penetrating the bottom wall of the frame 150. In this case, the light emitted by the micro LED chip 121 directly passes through to the outside of the encapsulation module 100, resulting in better display performance of the micro LED chip 121. Of course, in other examples, the light-transmitting area 151 may be a light-transmitting adhesive area, where the light emitted by the micro LED chip 121 passes through the light-transmitting adhesive area before exiting to the outside of the encapsulation module 100.

[0084] It is understandable that the areas of the frame 150 other than the light-transmitting area 151 can be, but are not limited to, light-shielding areas. These light-shielding areas block light from escaping, ensuring that the light emitted by the micro LED chip 121 can only exit through the light-transmitting area 151. This reduces stray light generated by the micro LED chip 121 and improves its display performance. Of course, in other examples, other areas of the frame 150 can also be light-transmitting areas 151.

[0085] In this embodiment, the frame 150 and the substrate 110 together form an accommodating space. The frame 150 can prevent foreign objects such as moisture from affecting the micro light-emitting diode device 120, thereby improving the packaging reliability of the micro light-emitting diode device 120.

[0086] Based on the above description, the micro light-emitting diode device 120 of this application embodiment is bonded to the first surface 111 of the substrate 110 through the adhesive layer 140. Then, the fourth pad 1221 of the driver chip 122 is electrically connected to the third pad 114 of the substrate 110 by wire bonding. Next, a material with a damming base protection function is applied to the area surrounding the micro light-emitting diode device 120 on the first surface 111 of the substrate 110 to form a damming adhesive. At the same time, protective adhesive (or filler adhesive) is filled in the area where the fourth pad 1221 and the third pad 114 are located to protect and fix the third pad 114, the fourth pad 1221 and the connection line between them. The damming adhesive or the damming adhesive and the filler adhesive form an adhesive frame 150. The substrate 110, adhesive layer 140, micro light-emitting diode device 120 and frame 150 can jointly form a package structure 200. After the package structure 200 is assembled, the first pad 113 of the substrate 110 is soldered to the second pad 131 of the driver board 130 and electrically connected. The package structure 200 is soldered to the driver board 130 to form a package module 100. The solution of this application can achieve both miniaturization of the package module 100 and ensure the reliability of the package module 100.

[0087] In some examples, please refer to Figure 10 and Figure 11 , Figure 10 This is another structural schematic diagram of the packaging module 100 provided in the embodiments of this application. Figure 11 for Figure 10 The diagram shows an exploded view of the packaging module 100. The substrate 110 also includes a through-hole structure penetrating the first surface 111 and the second surface 112. The packaging module 100 also includes a heat-conducting structure 160, which is disposed within the through-hole structure. The heat-conducting structure 160 is bonded and connected to the micro-LED device 120 and the driving board 130, respectively, and is used to transfer the heat generated by the micro-LED device 120 to the driving board 130, and then transfer the heat to the air outside the packaging module 100 through the driving board 130 to achieve heat dissipation of the packaging module 100.

[0088] Understandably, in some examples, the thermally conductive structure 160 can fill the entire through-hole structure, so that the edge of the thermally conductive structure 160 is connected to the hole wall of the through-hole structure. In this case, the entire substrate 110 is a single structure, which improves the structural strength performance of the substrate 110.

[0089] Understandably, in some examples, the thermally conductive structure 160 may, but is not limited to, be disposed in the central region of the substrate 110. In the thickness direction, the thermally conductive structure 160 may be disposed directly opposite to the micro-LED device 120, and after the thermally conductive structure 160 is attached to the micro-LED device 120, it can better conduct the heat generated by the micro-LED device 120 during operation.

[0090] It is understood that the thermally conductive structure 160 can be, but is not limited to, a metal thermally conductive structure, an alloy thermally conductive structure, a ceramic thermally conductive structure, etc.

[0091] Understandably, in some examples, at least one of the substrate 110 and the driver board 130 includes a thermally conductive substrate. At least one of the substrate 110 and the driver board 130 may be, but is not limited to, a substrate structure with good thermal conductivity, such as a ceramic substrate, an aluminum substrate, a copper substrate, or an Invar steel substrate. In this case, the substrate 110 and the driver board 130 can better conduct the heat generated by the micro-LED device 120 during operation to the outside of the packaging module 100, thereby improving the heat dissipation performance of the packaging module 100.

[0092] In this embodiment, a heat-conducting structure 160 is provided in the through-hole structure of the substrate 110, which is respectively attached to the micro light-emitting diode device 120 and the driver board 130, greatly improving the heat dissipation performance of the packaging module 100.

[0093] In some examples, the encapsulation module 100 further includes one or both of a first thermally conductive colloid and a second thermally conductive colloid. The first thermally conductive colloid is disposed along the thickness direction between the first surface 111 and the micro-light-emitting diode device 120, and at least covers the thermally conductive structure 160. The second thermally conductive colloid is disposed along the thickness direction between the second surface 112 and the driver board 130, and at least covers the thermally conductive structure 160.

[0094] It is understood that the first thermally conductive colloid and the second thermally conductive colloid can be, but are not limited to, silicone-based thermally conductive colloids, epoxy resin-based thermally conductive colloids, polyurethane-based thermally conductive colloids, acrylic-based thermally conductive colloids, etc. The first thermally conductive colloid and the second thermally conductive colloid can be colloid structures of the same or different materials.

[0095] It is understood that the first thermally conductive colloid can be laid on a portion of the first surface 111 of the substrate 110 and cover the thermally conductive structure 160, or it can be laid on the entire first surface 111. In this embodiment, the first thermally conductive colloid can both bond the micro-LED device 120 and the substrate 110, and it can also improve the heat conduction efficiency between the micro-LED device 120 and the thermally conductive structure 160. It is understood that in this embodiment, the encapsulation module 100 may not have an adhesive layer 140, and the first thermally conductive colloid can be reused as the adhesive layer 140. Of course, the encapsulation module 100 may also include both the adhesive layer 140 and the first thermally conductive colloid.

[0096] It is understood that the second thermally conductive colloid can be applied to a portion of the second surface 112 of the substrate 110 and cover the thermally conductive structure 160, or it can be applied to the entire second surface 112. In this embodiment, the second thermally conductive colloid can also bond the substrate 110 to the drive plate 130, and the first thermally conductive colloid can also improve the heat conduction efficiency between the thermally conductive structure 160 and the drive plate 130.

[0097] In this embodiment, a first thermally conductive colloid is disposed between the substrate 110 and the micro-LED device 120, and a second thermally conductive colloid is disposed between the substrate 110 and the driver board 130. The first and second thermally conductive colloids greatly improve the connection between the substrate 110 and the micro-LED device 120 and the driver board 130, and also greatly improve the heat conduction efficiency between the micro-LED device 120, the thermally conductive structure 160 and the driver board 130, resulting in better heat dissipation performance of the encapsulation module 100.

[0098] In some examples, the thermally conductive structure 160 is also used to electrically connect to the driver board 130 and the micro LED device 120 respectively, and to transmit the electrical signal provided by the driver board 130 to the micro LED device 120. In this case, the thermally conductive structure 160 has both the function of conducting heat and the function of transmitting electrical signals, and the thermally conductive structure 160 is multiplexed.

[0099] Understandably, in some examples, the thermally conductive structure 160 may be a copper structure, aluminum structure, or other structure that can conduct both heat and electricity.

[0100] Understandably, in some examples, such as Figure 10 and Figure 11 As shown, the heat-conducting structure 160 can be the first pad 113 in the aforementioned embodiment. The third pad 114 provided on the first surface 111 of the substrate 110 can be provided along the edge of the heat-conducting structure 160. For example, the third pad 114 is provided around the heat-conducting structure 160 and surrounds the heat-conducting structure 160. The heat-conducting structure 160 can be electrically connected to the third pad 114 through circuit structures, circuit networks, etc. on or inside the surface of the substrate 110. In some examples, the fourth pad 1221 of the micro LED device 120 corresponds one-to-one with the third pad 114, and its projection along the thickness direction can also be provided around the heat-conducting structure 160 and surround the heat-conducting structure 160. The fourth pad 1221 and the third pad 114 are connected by welding or other means and are electrically connected. The driver board 130 provides electrical signals to the micro LED device 120 through the second pad 131, the first pad 113, the third pad 114, and the fourth pad 1221.

[0101] Understandably, in some examples, at least one of the first thermally conductive colloid and the second thermally conductive colloid also includes a conductive structure. For example, at least one of the first thermally conductive colloid and the second thermally conductive colloid includes a thermally conductive silver paste structure, a conductive metal nanoparticle (copper, aluminum, nickel) colloidal structure, a graphene colloidal structure, a carbon nanotube colloidal structure, etc. In this case, the first thermally conductive colloid and the second thermally conductive colloid have electrical conductivity. The first thermally conductive colloid can transmit electrical signals between the thermally conductive structure 160 or the first pad 113 and the micro light-emitting diode device 120, and the second thermally conductive colloid can transmit electrical signals between the thermally conductive structure 160 or the first pad 113 and the driver board 130.

[0102] The thermally conductive structure 160 in this embodiment has both thermal and electrical conductivity functions. The reuse of the thermally conductive structure 160 simplifies the structure of the packaging module 100, enabling miniaturization and thinning of the packaging module 100. Simultaneously, at least one of the first and second thermally conductive colloids has electrical conductivity. The first and second thermally conductive colloids ensure both the robust connection and reliable electrical connection between the substrate 110 and the micro-LED device 120 and the driver board 130, while also possessing high thermal conductivity. Therefore, the overall performance of the packaging module 100 in this embodiment is more reliable.

[0103] Based on the above description, this application also provides a display device 10, please refer to... Figure 12 , Figure 12 This is a schematic diagram of a display device 10 provided in an embodiment of this application. The display device 10 can be applied to electronic devices to realize extended reality (XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). In implementation, the display device 10 can be the projection part of an electronic device, such as a projector or head-up display (HUD); or, for example, the display device 10 can be the display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen; or, for example, the display device 10 can be the lighting part of an electronic device, such as a vehicle or streetlight, or any device with lighting components.

[0104] It is understood that the packaging module 100 and display device 10 of this application embodiment can be applied to, but are not limited to, automotive headlights. With the development of automotive intelligence, headlights are shifting from traditional lighting tools and functional safety components to electronic and intelligent systems, and are likely to become one of the main pathways in the future automotive interaction field. The application of intelligent control systems gives headlights higher value and the impetus for continuous upgrades. The packaging module 100 and display device 10 of this application embodiment can be an automotive MicroLED structure. This application provides a highly reliable MicroLED module and display device 10 that can be applied to automotive headlights.

[0105] It is understood that the display device 10 of this application embodiment includes the packaging module 100 of any of the foregoing embodiments. Therefore, the display device 10 of this application can achieve a miniaturized design and has superior packaging reliability.

[0106] It is understood that in some examples, the display device 10 may include, but is not limited to, a control module, a power module, an interface module, and an input module, in addition to the packaging module 100. The control module is electrically connected to the driver board 130, which receives control commands through the control module to drive the micro LED device 120. The power module is electrically connected to the driver board 130 to provide power signals to drive the packaging module 100. The interface module can connect to external devices to transmit various signals. The input module can receive user control commands to the display device 10. It should be noted that the above are merely examples, and the display device 10 may also include other structures.

[0107] It should be noted that the packaging module 100 and the display device 10 in the embodiments of this application are different subjects under the same inventive concept, and features not described in detail in each embodiment can be referred to the descriptions in other embodiments.

[0108] It should be noted that the term "multiple" in this application generally refers to two or more. Furthermore, the directional terms used in the embodiments of this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. In the various drawings, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Additionally, some related parts may not be shown in the drawings.

[0109] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0110] It is understood that those skilled in the art, guided by the above embodiments, can combine various implementation methods in the above embodiments to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0111] The foregoing has provided a detailed description of the miniature light-emitting diode (LED) device packaging module and display device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of aiding understanding this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there may be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A miniature light-emitting diode (LED) device packaging module, characterized in that, include: The substrate includes a first surface and a second surface disposed opposite to each other along the thickness direction, and the second surface is provided with a first pad. A miniature light-emitting diode device is disposed on the first surface and electrically connected to the substrate; A driver board is disposed on the second side. The driver board has a second pad, which is soldered to the first pad and electrically connected to it. The driver board is used to provide electrical signals to the micro light-emitting diode device through the second pad and the first pad.

2. The packaging module according to claim 1, characterized in that, The first pad includes a first sub-pad and a second sub-pad, and the second pad includes a third sub-pad and a fourth sub-pad; The third sub-pad is electrically connected to the first sub-pad and is used to provide drive control signals to the micro light-emitting diode device; The fourth sub-pad is electrically connected to the second sub-pad and is used to provide a power signal to the micro LED device.

3. The packaging module according to claim 1, characterized in that, The first surface is provided with a third pad, which is electrically connected to the first pad and the micro light-emitting diode device respectively. The driver board is used to provide electrical signals to the micro light-emitting diode device through the second pad, the first pad, and the third pad.

4. The packaging module according to claim 3, characterized in that, The micro LED device includes a driver chip and a micro LED chip sequentially stacked and electrically connected on the first surface along the thickness direction, wherein the driver chip has a fourth pad; wherein... The fourth pad is electrically connected to the third pad via a connecting line; or, the fourth pad is connected to the third pad and the two are electrically connected.

5. The packaging module according to claim 4, characterized in that, The packaging module also includes: An adhesive layer is disposed between the driver chip and the first surface along the thickness direction, and the driver chip is bonded to the first surface through the adhesive layer.

6. The packaging module according to claim 4, characterized in that, The packaging module also includes: A frame is disposed along the thickness direction on the side of the first surface opposite to the second surface. The frame is connected to the first surface, and the two together form an accommodating space. The micro light-emitting diode device is located within the accommodating space.

7. The packaging module according to claim 6, characterized in that, The frame has a light-transmitting area, and the projection of the light-transmitting area along the thickness direction covers at least a portion of the micro LED chip.

8. The packaging module according to claim 1, characterized in that, The substrate also has a through-hole structure penetrating the first surface and the second surface; the packaging module further includes: A heat-conducting structure is disposed within the through-hole structure. The heat-conducting structure is respectively bonded and connected to the micro light-emitting diode device and the driving board, and is used to transfer the heat generated by the micro light-emitting diode device to the driving board.

9. The packaging module according to claim 8, characterized in that, The heat-conducting structure is also used to electrically connect to the driving board and the micro LED device respectively, and to transmit the electrical signal provided by the driving board to the micro LED device.

10. The packaging module according to claim 8, characterized in that, The encapsulation module further includes at least one of a first thermally conductive colloid and a second thermally conductive colloid; The first thermally conductive colloid is disposed between the first surface and the micro light-emitting diode device along the thickness direction, and at least covers the thermally conductive structure; The second thermally conductive colloid is disposed between the second surface and the drive plate along the thickness direction, and at least covers the thermally conductive structure.

11. The packaging module according to claim 10, characterized in that, At least one of the first thermally conductive colloid and the second thermally conductive colloid further includes a conductive structure.

12. The packaging module according to any one of claims 1 to 11, characterized in that, The driving board carries the substrate and the micro light-emitting diode device, and the projected area of ​​the driving board along the thickness direction is greater than or equal to the area of ​​the second surface.

13. The packaging module according to any one of claims 1 to 11, characterized in that, At least one of the substrate and the drive board includes a thermally conductive substrate.

14. A display device, characterized in that, The display device includes the encapsulation module as described in any one of claims 1 to 13.

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