Light emitting diode for display screen

Abstract

The utility model relates to a display screen field's a display screen uses emitting diode, including heat dissipation base, the top center of heat dissipation base is installed with LED chip, the top of LED chip is added with the package shell, the both sides of heat dissipation base's bottom end all are installed with pin. The outside of heat dissipation base all is set up microchannel radiating groove around, and the positive back and both sides of heat dissipation base all are installed with positioning boss;The upper surface of LED chip is added with fluorescent powder layer, and the upper surface of fluorescent powder layer is connected with the antireflection film;The both sides of package shell's lower surface all are installed with wave elastic arm, and the both sides of heat dissipation base's top all are set up positioning hole, and wave elastic arm is connected with the plug -in between positioning hole, and the inner wall of positioning hole all is installed with elastic protruding evenly, and elastic protruding and the outer surface of wave elastic arm are closely combined, and microchannel radiating groove can increase the heat dissipation area, reduce the thermal resistance and promote the heat dissipation efficiency, avoid the LED chip junction temperature to rise, delay the light decay, guarantee the work stability.

Description

Technical Field

[0001] This utility model relates to the field of display screens, and specifically to a light-emitting diode for display screens. Background Technology

[0002] As the core light-emitting element of a display module, the performance of light-emitting diodes (LEDs) directly affects the display quality, operational stability, and overall lifespan of the display screen. They are widely used in various civilian, commercial, and industrial display devices and are a key component for realizing image display and information transmission on the display screen.

[0003] Existing LEDs used in displays suffer from deficiencies in their heat dissipation design. They struggle to effectively increase the heat dissipation area, resulting in high thermal resistance between the heat dissipation substrate and the external environment. This leads to low heat dissipation efficiency, hindering the rapid dissipation of heat generated during LED chip operation. Consequently, the junction temperature of the LED chip rises during prolonged operation, accelerating light decay, affecting its operational stability, and shortening its lifespan. Furthermore, existing LEDs lack optimized light propagation design. The light emitted by the LED chip is not properly spectrally adjusted, and the absence of effective anti-reflection structures during propagation results in significant light reflection loss and low light utilization. This leads to insufficient brightness in displays, impacting the display effect. Additionally, the lack of reliable positioning structures during module installation makes precise positioning difficult, increasing installation complexity and reducing module assembly efficiency. Utility Model Content

[0004] The purpose of this invention is to address the above-mentioned deficiencies and provide a light-emitting diode for a display screen. The microchannel heat dissipation grooves opened around the outer side of the heat dissipation substrate can effectively increase the heat dissipation area, significantly reduce the thermal resistance between the heat dissipation substrate and the external environment, and significantly improve the overall heat dissipation efficiency. It can promptly dissipate the heat generated by the LED chip during operation, solving the technical problem that the existing technology is unable to effectively increase the heat dissipation area, resulting in a large thermal resistance between the heat dissipation substrate and the external environment, low heat dissipation efficiency, and inability to quickly dissipate the heat generated by the LED chip during operation.

[0005] The objective of this utility model is achieved through the following means:

[0006] A light-emitting diode for a display screen includes a heat-dissipating substrate, an LED chip mounted at the center of the top of the heat-dissipating substrate, an encapsulation shell above the LED chip, pins mounted on both sides of the bottom of the heat-dissipating substrate, microchannel heat dissipation grooves formed around the outer side of the heat-dissipating substrate, positioning protrusions mounted on the front, back and sides of the heat-dissipating substrate, a phosphor layer applied to the upper surface of the LED chip, an anti-reflection film connected to the upper surface of the phosphor layer, corrugated elastic arms mounted on both sides of the lower surface of the encapsulation shell, positioning holes formed on both sides of the top of the heat-dissipating substrate, the corrugated elastic arms being inserted into the positioning holes, and elastic protrusions uniformly mounted on the inner wall of the positioning holes, the elastic protrusions being tightly fitted to the outer surface of the corrugated elastic arms.

[0007] Microchannel heat dissipation grooves are evenly opened around the outer side of the heat dissipation substrate, and positioning bosses are installed on the front, back and sides of the heat dissipation substrate to complete the basic structure preparation of the heat dissipation substrate.

[0008] Eutectic bonding technology is used to precisely mount the LED chip at the top center of the heat dissipation substrate, ensuring a stable physical and thermal connection between the LED chip and the heat dissipation substrate;

[0009] A phosphor layer is uniformly applied to the upper surface of the LED chip. After the phosphor layer is cured, an anti-reflection film is tightly connected to the upper surface of the phosphor layer to form a light conversion and anti-reflection structure above the LED chip.

[0010] The encapsulation housing is placed on the outside of the LED chip, phosphor layer and antireflection film respectively. The wave elastic arms on both sides of the lower surface of the encapsulation housing are aligned with the positioning holes on both sides of the top of the heat dissipation substrate. The wave elastic arms are inserted into the positioning holes until the elastic protrusions on the inner wall of the positioning holes are tightly fitted with the outer surface of the wave elastic arms, thus completing the fixed assembly of the encapsulation housing and the heat dissipation substrate.

[0011] Pins are installed on both sides of the bottom of the heat dissipation substrate to ensure a firm connection between the pins and the heat dissipation substrate, thus forming a complete LED structure for the display screen. In practical applications, the LED is connected to the external circuit through the pins so that the LED chip can work normally after being powered on.

[0012] Furthermore, a hemispherical microlens array is mounted on the upper surface of the antireflective film, the hemispherical microlens array consisting of five to twenty groups of hemispherical microlenses.

[0013] Hemispherical microlens arrays can effectively improve the utilization rate of light and reduce the scattering loss of light during transmission. When combined with antireflective coatings, they can further reduce light reflection, making light transmission more uniform and efficient, significantly optimizing the optical performance of related optical equipment, and ensuring more stable imaging or light-gathering effects.

[0014] Furthermore, a biomimetic micron protrusion array is mounted on the top of the heat dissipation substrate, the biomimetic micron protrusion array consisting of five to sixty groups of biomimetic micron protrusions.

[0015] The biomimetic micron-sized protrusion array significantly increases the heat dissipation area of ​​the heat dissipation substrate, improves heat dissipation efficiency, and can quickly remove the heat absorbed by the substrate, preventing the heat dissipation substrate and surrounding components from being affected by local overheating, extending the service life of related equipment, and ensuring long-term stable operation of the equipment.

[0016] Furthermore, a porous copper-nickel alloy nanoframework is installed at the front end of the inner cavity of each microchannel heat dissipation groove, and a heat-conducting block is added to the inner cavity of the porous copper-nickel alloy nanoframework.

[0017] The porous copper-nickel alloy nanoframework has excellent thermal conductivity. When paired with a heat-conducting block, it can quickly absorb and disperse heat, preventing heat accumulation at the front end of the microchannel heat sink cavity, improving the overall heat dissipation speed, ensuring continuous and efficient heat dissipation of the heat sink, and providing a stable temperature environment for the core components of the equipment.

[0018] Furthermore, a hollow cavity is formed at the center of the upper surface of the positioning boss, and a neodymium iron boron micro magnet is installed in the center of the inner cavity of the hollow cavity.

[0019] Neodymium iron boron micromagnets provide a stable magnetic field, which can improve the positioning accuracy of the positioning boss for related components, reduce deviations during assembly, make the components more stable, reduce the risk of structural loosening due to improper assembly, and ensure the overall assembly quality and structural stability of the equipment.

[0020] Furthermore, a thermally conductive insulating layer is provided between the lower surface of the LED chip and the upper surface of the heat dissipation substrate.

[0021] The thermally conductive insulation layer not only ensures efficient heat conduction between the LED chip and the heat dissipation substrate, but also achieves electrical insulation between the two, avoiding the risk of short circuits caused by electrical connections, ensuring that the LED chip operates in a stable temperature and electrical environment, and improving chip lifespan and operational reliability.

[0022] The beneficial effects of this utility model are: the microchannel heat dissipation grooves opened around the outer side of the heat dissipation substrate can effectively increase the heat dissipation area, significantly reduce the thermal resistance between the heat dissipation substrate and the external environment, significantly improve the overall heat dissipation efficiency, and can timely dissipate the heat generated by the LED chip during operation, avoid the junction temperature of the LED chip from rising due to long-term operation, thereby slowing down the light decay rate of the LED chip, ensuring the working stability of the LED chip, and extending its service life.

[0023] The phosphor layer added to the surface of the LED chip can reasonably adjust the spectrum of the light emitted by the LED chip. The anti-reflection film connected to the surface of the phosphor layer can reduce the reflection loss of light during propagation, improve the light utilization rate, and thus effectively improve the display brightness of the LED used in the display screen and optimize the display effect.

[0024] The positioning bosses installed on the front, back and sides of the heat dissipation base can provide precise positioning for the light-emitting diodes of the display during the module installation process, which facilitates the quick and efficient completion of module assembly and reduces the installation difficulty. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of a light-emitting diode for a display screen according to the present invention;

[0026] Figure 2 This is a cross-sectional view of the positioning boss of a light-emitting diode for a display screen according to the present invention.

[0027] Figure 3 This is a cross-sectional view of the packaging housing of a light-emitting diode for a display screen according to the present invention.

[0028] Figure 4 This is a schematic diagram of the packaging housing and connection structure of a light-emitting diode for a display screen according to the present invention;

[0029] Figure 5 This is a cross-sectional view of the heat dissipation substrate for a light-emitting diode used in a display screen according to the present invention.

[0030] Figure 6 This utility model relates to an accessory for a light-emitting diode used in a display screen. Figure 5 Enlarged structural diagram at point A in the middle;

[0031] In the diagram, 1. Heat dissipation substrate; 2. LED chip; 3. Phosphor layer; 4. Antireflective coating; 5. Hemispherical microlens array; 6. Encapsulation shell; 7. Wave-shaped elastic arm; 8. Positioning hole; 9. Elastic protrusion; 10. Bionic micron protrusion array; 11. Porous copper-nickel alloy nanoframework; 12. Microchannel heat dissipation groove; 13. Positioning boss; 14. Hollow cavity; 15. Neodymium iron boron micromagnet; 16. Pin. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0033] In this embodiment, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6A specific embodiment of the LED for display screen includes a heat dissipation substrate 1, an LED chip 2 mounted at the top center of the heat dissipation substrate 1, an encapsulation shell 6 above the LED chip 2, pins 16 mounted on both sides of the bottom of the heat dissipation substrate 1, microchannel heat dissipation grooves 12 formed around the outer side of the heat dissipation substrate 1, positioning protrusions 13 mounted on the front, back and sides of the heat dissipation substrate 1, a phosphor layer 3 mounted on the upper surface of the LED chip 2, an antireflection film 4 connected to the upper surface of the phosphor layer 3, wave elastic arms 7 mounted on both sides of the lower surface of the encapsulation shell 6, positioning holes 8 formed on both sides of the top of the heat dissipation substrate 1, the wave elastic arms 7 being inserted and connected to the positioning holes 8, and elastic protrusions 9 uniformly mounted on the inner wall of the positioning holes 8, the elastic protrusions 9 being tightly fitted to the outer surface of the wave elastic arms 7.

[0034] Microchannel heat dissipation grooves 12 are evenly opened around the outer side of the heat dissipation substrate 1, and positioning bosses 13 are installed on the front, back and sides of the heat dissipation substrate 1 respectively, thus completing the basic structure preparation of the heat dissipation substrate 1.

[0035] Using eutectic bonding technology, the LED chip 2 is precisely installed at the top center of the heat dissipation substrate 1, ensuring a stable physical and thermal connection between the LED chip 2 and the heat dissipation substrate 1.

[0036] A phosphor layer 3 is uniformly applied to the upper surface of the LED chip 2. After the phosphor layer 3 is cured, an anti-reflection film 4 is tightly connected to the upper surface of the phosphor layer 3 to form a light conversion and anti-reflection structure above the LED chip 2.

[0037] The encapsulation housing 6 is placed on the outside of the LED chip 2, phosphor layer 3 and antireflection film 4 respectively, so that the wave elastic arms 7 on both sides of the lower surface of the encapsulation housing 6 are aligned with the positioning holes 8 on both sides of the top of the heat dissipation substrate 1, and the wave elastic arms 7 are inserted into the positioning holes 8 until the elastic protrusion 9 on the inner wall of the positioning hole 8 is tightly attached to the outer surface of the wave elastic arms 7, thus completing the fixed assembly of the encapsulation housing 6 and the heat dissipation substrate 1.

[0038] Pins 16 are installed on both sides of the bottom end of the heat dissipation substrate 1 to ensure that the pins 16 are firmly connected to the heat dissipation substrate 1, thus forming a complete LED structure for the display screen. In practical applications, the LED is connected to the external circuit through pins 16 so that the LED chip 2 can work normally after being powered on.

[0039] The heat dissipation substrate 1 is made of copper-aluminum composite material. The microchannel heat dissipation grooves 12 on its outer side can significantly reduce thermal resistance and accelerate heat dissipation. At the same time, the LED chip 2 is connected to the heat dissipation substrate 1 through eutectic bonding technology, which further enhances the heat conduction efficiency. The heat generated by the LED chip 2 during operation can be transferred to the heat dissipation substrate 1 in a timely manner and quickly discharged through the microchannel heat dissipation grooves 12. This effectively avoids the junction temperature rise of the LED chip 2 due to long-term high-power operation, thereby slowing down the light decay rate and preventing color drift problems, ensuring the working stability of the LED chip 2, and extending the service life of the entire light-emitting diode.

[0040] The phosphor layer 3 on the upper surface of the LED chip 2 can convert the wavelength of the light emitted by the LED chip 2 to meet the spectrum required for display. The anti-reflection film 4 connected to the upper surface of the phosphor layer 3 can reduce the reflection loss of light during propagation. At the same time, the encapsulation shell 6 is made of high-transmittance silicone material, which can reduce the attenuation of light in the encapsulation structure. The three work together to significantly improve the light utilization rate and effectively improve the brightness output of the light-emitting diode to meet the high brightness display requirements.

[0041] The encapsulation housing 6 is connected to the positioning hole 8 of the heat dissipation substrate 1 through the wave elastic arm 7. The tight fit between the elastic protrusion 9 on the inner wall of the positioning hole 8 and the wave elastic arm 7 enhances the connection strength between the encapsulation housing 6 and the heat dissipation substrate 1. The positioning protrusions 13 on the front, back and sides of the heat dissipation substrate 1 facilitate the precise installation and positioning of the light-emitting diode and the display module. In addition, the pins 16 are stably installed on both sides of the bottom end of the heat dissipation substrate 1. The overall structure can effectively avoid failures such as poor contact in a vibration environment, reduce the maintenance frequency and cost of the display, and is suitable for long-term stable operation of high-brightness displays.

[0042] like Figure 3 and Figure 5 As shown, a hemispherical microlens array 5 is mounted on the upper surface of the antireflective coating 4. The hemispherical microlens array 5 consists of five to twenty groups of hemispherical microlenses.

[0043] First, the upper surface of the antireflective coating 4 is cleaned and positioned. Then, a hemispherical microlens array 5, composed of multiple hemispherical microlenses, is precisely installed on this surface. When light shines on it, the hemispherical microlens array 5 first converges and homogenizes the light. The processed light then continues to be transmitted through the antireflective coating 4, completing the optimized light transmission process. The hemispherical microlens array 5 can effectively improve the utilization rate of light and reduce the scattering loss of light during transmission. Combined with the antireflective coating 4, it can further reduce light reflection, making the light transmission more uniform and efficient, significantly optimizing the optical performance of related optical equipment, and ensuring more stable imaging or light-gathering effects of the equipment.

[0044] A biomimetic micron bump array 10 is mounted on the top of the heat dissipation substrate 1. The biomimetic micron bump array 10 consists of five to sixty groups of biomimetic micron bumps.

[0045] After marking and positioning the top surface of the heat dissipation substrate 1 according to the preset layout, the biomimetic micron protrusion array 10, composed of multiple sets of biomimetic micron protrusions, is firmly installed. When the heat dissipation substrate 1 receives heat, the heat will be transferred to the biomimetic micron protrusion array 10. The protrusion structure increases the contact area with the air, accelerating the dissipation of heat to the outside. The biomimetic micron protrusion array 10 significantly increases the heat dissipation area of ​​the heat dissipation substrate 1, improves the heat dissipation efficiency, and can quickly remove the heat absorbed by the substrate, preventing the heat dissipation substrate 1 and surrounding components from being affected by local overheating, extending the service life of related equipment, and ensuring the long-term stable operation of the equipment.

[0046] The front end of the inner cavity of the microchannel heat dissipation slot 12 is equipped with a porous copper-nickel alloy nanoframework 11, and a heat-conducting block is added to the inner cavity of the porous copper-nickel alloy nanoframework 11.

[0047] First, a perforated copper-nickel alloy nanoframework 11 is installed at the front end of the inner cavity of the microchannel heat sink 12, adapted to the structure of the sink. After the frame is securely installed, a heat-conducting block is precisely added inside the inner cavity of the perforated copper-nickel alloy nanoframework 11. When heat is transferred to the microchannel heat sink 12, it is first absorbed by the heat-conducting block, then conducted to the perforated copper-nickel alloy nanoframework 11, and finally dispersed by the frame into the medium inside the heat sink for discharge. The perforated copper-nickel alloy nanoframework 11 has good thermal conductivity, and when combined with the heat-conducting block, it can quickly absorb and disperse heat, avoid heat accumulation at the front end of the inner cavity of the microchannel heat sink 12, improve the overall heat dissipation speed, ensure continuous and efficient heat dissipation of the heat sink, and provide a stable temperature environment for the core components of the equipment.

[0048] like Figure 6 As shown, a hollow cavity 14 is provided at the center of the upper surface of the positioning boss 13, and a neodymium iron boron micro magnet 15 is installed in the center of the inner cavity of the hollow cavity 14.

[0049] A hollow cavity 14 is precisely machined at the center of the upper surface of the positioning boss 13. After cleaning the inside of the cavity, a neodymium iron boron micro magnet 15 is accurately installed in the center of the inner cavity of the hollow cavity 14. During component assembly, the neodymium iron boron micro magnet 15 uses a magnetic field to attract and position the matching component, assisting in the assembly process. The neodymium iron boron micro magnet 15 provides a stable magnetic field, which can improve the positioning accuracy of the positioning boss 13 for related components, reduce deviations during the assembly process, make the component installation more stable, reduce the risk of structural loosening due to improper assembly, and ensure the overall assembly quality and structural stability of the equipment.

[0050] A thermally conductive insulating layer is provided between the lower surface of the LED chip 2 and the upper surface of the heat dissipation substrate 1.

[0051] A thermally conductive insulating layer is evenly laid on the upper surface of the heat dissipation substrate 1, ensuring that the coverage area of ​​the insulating layer matches the lower surface of the LED chip 2. Then, the lower surface of the LED chip 2 is tightly attached to the thermally conductive insulating layer. The heat generated by the LED chip 2 during operation is transferred to the heat dissipation substrate 1 through the thermally conductive insulating layer, and then dissipated by the substrate. The thermally conductive insulating layer not only ensures efficient heat conduction between the LED chip 2 and the heat dissipation substrate 1, but also achieves electrical insulation between the two, avoiding the risk of short circuit due to electrical connection, ensuring that the LED chip 2 works in a stable temperature and electrical environment, and improving the chip's lifespan and operational reliability.

[0052] The usage process of a light-emitting diode for a display screen in this embodiment is as follows: During operation, the heat generated by the LED chip 2 is sequentially transferred to the heat dissipation substrate 1 through the thermally conductive insulating layer. Part of the heat is transferred to the biomimetic micron bump array 10 through the heat dissipation substrate 1. The bump structure of the biomimetic micron bump array 10 increases the contact area with air and accelerates the dissipation. Another part of the heat is transferred to the microchannel heat dissipation tank 12. It is first absorbed by the heat-conducting block in the cavity of the porous copper-nickel alloy nanoframework 11, and then conducted to the porous copper-nickel alloy nanoframework 11. The porous copper-nickel alloy nanoframework 11 disperses the heat into the medium in the microchannel heat dissipation tank 12 and discharges it, thus avoiding the junction temperature of the LED chip 2 from rising.

[0053] The light emitted by LED chip 2 first undergoes wavelength conversion through phosphor layer 3, then is focused and homogenized through hemispherical microlens array 5, then passes through antireflection film 4 to reduce reflection loss, and finally passes through encapsulation housing 6 to transmit outward, improving light utilization and brightness output.

[0054] The neodymium iron boron micro magnet 15 on the positioning boss 13 assists in the precise installation and positioning of the light-emitting diode and the display module through the magnetic field. The insertion and cooperation of the wave elastic arm 7 and the positioning hole 8 and the tight fit of the elastic protrusion 9 enhance the connection strength between the package shell 6 and the heat dissipation base 1. The stable installation of the pin 16 prevents poor contact of the overall structure in the vibration environment and ensures the long-term stable operation of the entire light-emitting diode.

[0055] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A light-emitting diode for a display screen, comprising a heat-dissipating substrate, an LED chip mounted at the center of the top of the heat-dissipating substrate, an encapsulation shell above the LED chip, and pins mounted on both sides of the bottom of the heat-dissipating substrate, characterized in that: Microchannel heat dissipation grooves are formed around the outer side of the heat dissipation substrate. Positioning protrusions are installed on the front, back and sides of the heat dissipation substrate. A phosphor layer is added to the upper surface of the LED chip. An anti-reflection film is connected to the upper surface of the phosphor layer. Wave elastic arms are installed on both sides of the lower surface of the encapsulation shell. Positioning holes are formed on both sides of the top of the heat dissipation substrate. The wave elastic arms are inserted and connected to the positioning holes. Elastic protrusions are uniformly installed on the inner wall of the positioning holes. The elastic protrusions are tightly fitted to the outer surface of the wave elastic arms.

2. The light-emitting diode for a display screen according to claim 1, characterized in that: The upper surface of the antireflective film is equipped with a hemispherical microlens array, which consists of five to twenty groups of hemispherical microlenses.

3. The light-emitting diode for a display screen according to claim 1, characterized in that: The top of the heat dissipation substrate is equipped with a biomimetic micron protrusion array, which consists of five to sixty groups of biomimetic micron protrusions.

4. The light-emitting diode for a display screen according to claim 1, characterized in that: The inner front end of the microchannel heat dissipation groove is equipped with a porous copper-nickel alloy nanoframework, and a heat-conducting block is added to the inner cavity of the porous copper-nickel alloy nanoframework.

5. A light-emitting diode for a display screen according to claim 1, characterized in that: The upper surface of each positioning boss has a hollow cavity at its center, and a neodymium iron boron micro magnet is installed in the center of the hollow cavity.

6. The light-emitting diode for a display screen according to claim 1, characterized in that: A thermally conductive insulating layer is provided between the lower surface of the LED chip and the upper surface of the heat dissipation substrate.

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