Automatic silicon wafer edge removing device

Abstract

The utility model provides a kind of silicon wafer automatic edge removal equipment, including being installed in the loading unit of equipment base body, processing unit and the transfer unit for silicon wafer movement, loading unit includes loading tray, and loading tray includes the base, buffer portion and bearing portion connected in turn, and the base is connected with equipment base body, and processing unit includes the first processing groove body connected with equipment base body, and first processing groove body installs temperature adjusting mechanism, and transfer unit can transfer silicon wafer from bearing portion to first processing groove body to remove film.The utility model has the beneficial effects of reducing silicon wafer in the process of picking up piece dark crack or broken piece hidden danger, reducing manual operation or monitoring link, improving film removal operation efficiency, and ensuring film removal quality.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor fabrication equipment technology, and in particular relates to an automatic edge removal device for silicon wafers. Background Technology

[0002] In existing technologies, the edge chemical stripping process for semiconductor silicon wafers is a crucial step in semiconductor manufacturing. Traditional semi-automated edge stripping equipment relies on manual wafer transfer or monitoring of wafer slots and the work environment. However, manual feedback is often delayed, impacting efficiency and potentially leading to uneven stripping and other quality issues. While some improvements utilize robotic arms for wafer transfer, the rigid contact between the robotic arm and the wafer during pressing and removal can cause dark cracks or breakage, affecting subsequent product yield and quality. Therefore, the process suffers from multiple technical problems, including the impact of semi-automated edge stripping equipment, delayed manual operation or monitoring, and the risk of dark cracks and breakage due to improved robotic arm handling, all of which negatively affect efficiency and quality. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides an automatic edge removal device for silicon wafers, which is particularly suitable for reducing manual operation or monitoring links, improving operation efficiency and silicon wafer film removal quality.

[0004] The technical solution adopted by this utility model is: an automatic edge removal device for silicon wafers, including a feeding unit, a processing unit and a transfer unit for moving silicon wafers installed in the equipment base. The feeding unit includes a feeding tray, which includes a base, a buffer part and a support part connected in sequence. The base is connected to the equipment base. The processing unit includes a first processing tank connected to the equipment base. The first processing tank is equipped with a temperature adjustment mechanism. The transfer unit can transfer the silicon wafer from the support part to the first processing tank for film removal.

[0005] Furthermore, the loading tray also includes a limiting pin connected to the buffer section, and the bearing section has a limiting hole that cooperates with the limiting pin.

[0006] Furthermore, the support section has a positioning opening and an adsorption tank assembly, and the support section has an air passage that communicates with the adsorption tank assembly.

[0007] Furthermore, the adsorption tank assembly includes an arc-shaped groove, a connecting groove, and adsorption holes that are connected to the air passage. There are multiple arc-shaped grooves arranged concentrically. The connecting groove is used to connect adjacent arc-shaped grooves and divide the adjacent arc-shaped grooves into multiple regions. Adsorption holes are opened in at least some regions.

[0008] Furthermore, a spraying mechanism is provided inside the first treatment tank. The spraying mechanism includes a nozzle support and multiple nozzles connected to the nozzle support. The nozzle support is connected to the inside of the first treatment tank.

[0009] Furthermore, the spraying mechanism also includes an infusion tube connected to the spray head to introduce the defilming solution, and a flow sensor is installed on the outside of the infusion tube.

[0010] Furthermore, it also includes a feeding unit, which includes a first transmission section and a feeding basket with multiple slots. The first transmission section is rotatably connected to the equipment base. The transfer unit can place the silicon wafer in the first transmission section, and the first transmission section can be rotated to an inclined state so that the silicon wafer slides to the corresponding slot.

[0011] Furthermore, the unloading unit also includes a second transmission section that is inclinedly connected to the equipment base. The second transmission section is located between the first transmission section and the unloading basket. The unloading basket is movably connected to the equipment base to adjust the height of the slot. The silicon wafer can be slid sequentially from the first transmission section and the second transmission section to the corresponding slot.

[0012] Furthermore, the unloading unit also includes a transfer tank connected to the equipment base, and the unloading wafer basket is disposed in the transfer tank. The transfer tank is used to contain liquid to soak the silicon wafer placed in the unloading wafer basket.

[0013] Furthermore, the transfer unit includes a slide rail, a first drive unit, a second drive unit, and a gripping suction cup. The slide rail is connected to the device base, the first drive unit is slidably disposed on the slide rail, the second drive unit is slidably connected to the first drive unit for vertical movement, and the gripping suction cup is connected to the second drive unit.

[0014] The advantages and positive effects of this utility model are: by adopting the above technical solution, the risk of dark cracks or breakage of silicon wafers during wafer removal can be reduced, and manual operation or monitoring links can be reduced; it has the advantages of improving the efficiency of film removal operation and ensuring the quality of film removal. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of one embodiment of the present utility model;

[0016] Figure 2 This is a top view schematic diagram of the load-bearing structure of one embodiment of the present invention;

[0017] Figure 3 This is a top view of the internal structure of the first processing tank according to an embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of the cover structure of one embodiment of the present utility model;

[0019] In the picture:

[0020] 1. Equipment base; 2. Base; 3. Buffer section

[0021] 4. Supporting unit; 5. First processing tank; 6. Second processing tank

[0022] 7. Cover body; 8. Loading robot; 9. Edge finding device

[0023] 10. Feeding basket; 11. Discharging basket; 31. Limit pin

[0024] 41. Air passage; 42. Arc-shaped groove; 43. Connecting groove

[0025] 44. Adsorption hole; 45. Trachea; 46. Positioning opening

[0026] 51. Nozzle support; 52. Nozzle; 53. Infusion tubing

[0027] 54. Flow sensor 55. Temperature sensor 56. Temperature regulator

[0028] 61. Gas tumbling mechanism; 81. First transmission section; 82. Second transmission section

[0029] 83. Transfer trough; 91. Slide rail; 92. First drive unit

[0030] 93. Second drive unit; 94. Grasping suction cup Detailed Implementation

[0031] The embodiments of the present invention will be described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present invention, and not all embodiments.

[0032] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar units or units having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0033] In the description of this utility model, it should be understood that terms such as "installation", "connection", and "fixation" should be interpreted broadly, and can refer to direct connection, installation or fixation, or indirect connection, installation or fixation. This utility model does not limit this.

[0034] like Figures 1 to 4 As shown in the schematic diagram of an embodiment of the automatic edge removal equipment for silicon wafers of this utility model, it includes a feeding unit, a processing unit, and a transfer unit for moving silicon wafers, all installed in the equipment base 1. The feeding unit includes a feeding tray, which includes a base 2, a buffer part 3, and a support part 4 connected in sequence. The base 2 is connected to the equipment base 1. The processing unit includes a first processing tank 5 connected to the equipment base 1. The first processing tank 5 is equipped with a temperature regulating mechanism. The transfer unit can transfer the silicon wafer from the support part 4 to the first processing tank 5 for film removal.

[0035] Due to differences in silicon wafer thickness, traditional gripping suction cups 94, which make rigid contact with the silicon wafers for adsorption, are prone to causing dark cracks or breakage of the wafers. The buffer section 3 provides cushioning during the gripping and pressing of the silicon wafers, reducing damage during the adsorption process. Preferably, the buffer section 3 can be made of a buffer silicone pad. Hydrofluoric acid is used to remove the film from the silicon wafers in the first processing tank 5. However, the reaction rate of hydrofluoric acid is significantly affected by environmental fluctuations. In one application scenario, when the workshop temperature deviates from the standard temperature by more than 5°C, the film thickness deviation in the silicon wafer edge removal process reaches more than 20%. In this embodiment, real-time temperature compensation can be achieved through a temperature regulation mechanism to avoid lag in manual monitoring feedback and ensure the quality of film removal. Preferably, the temperature regulation mechanism includes a temperature sensor 55 and a temperature regulator 56 connected to the first processing tank 5. The temperature regulator 56 integrates a cooling module and a thin-film heating module. The cooling module is a thermoelectric semiconductor cooling chip assembly and is combined with a thin-film heating module made of a micro heating film to form the temperature regulator 56 for temperature control. Based on the concentration of the decoction solution (such as hydrofluoric acid) and the silicon wafer material, a temperature compensation curve is generated using a PID algorithm. The temperature sensor 55 collects temperature data in the first processing tank 5 in real time. The PLC compares this data with a preset process curve. The temperature compensation curve generated by the PID algorithm is used to adjust the output of the temperature regulator 56 to control the temperature. The temperature regulation mechanism can reduce the decoction thickness deviation to within 3%, thus improving the edge removal quality. Preferably, the processing unit also includes a second processing tank 6 connected to the equipment base 1. The second processing tank 6 is used to contain cleaning liquid. A gas tumbling mechanism 61 is provided inside the second processing tank 6 to input gas and cause the cleaning liquid to tumble, improving the silicon wafer cleaning effect. The gas tumbling mechanism 61 can be made using existing mechanisms, and this invention is not limited thereto.

[0036] In this embodiment, the loading tray also includes a limiting pin 31 connected to the buffer part 3, and the bearing part 4 has a limiting hole that cooperates with the limiting pin 31. This embodiment can ensure the stability of the connection between the buffer part 3 and the bearing part 4, and facilitate assembly and alignment.

[0037] In this embodiment, the support part 4 has a positioning opening 46 and an adsorption groove group, and the support part 4 has an air channel 41 communicating with the adsorption groove group. Preferably, a buffer silicone pad is installed on the base 2, and multiple limiting pins 31 are embedded in the buffer silicone pad. The bottom of the support part 4 has a limiting hole that cooperates with the limiting pins 31 to achieve alignment and assembly, ensuring the stability of the connection between the buffer part 3 and the support part 4 when subjected to external force impact, and ensuring the stability of the silicon wafer grasping and adsorption process. In this embodiment, the feeding unit also includes a feeding basket 10, a feeding robot 8, and an edge finding device 9. The feeding basket 10, the feeding robot 8, the edge finding device 9, and the base 2 of the feeding tray are installed on the same platform of the equipment base 1. The feeding robot 8 can take the silicon wafer out of the feeding basket 10 and place it in the edge finding device 9 for edge finding and positioning. After edge finding, the silicon wafer is transferred by the feeding robot 8 to the support part 4. The positioning opening 46 is used for the feeding robot 8 to insert and place the silicon wafer on the surface of the support part 4. The air pump is connected to the air passage 41 through the air pipe 45 and adsorbs the silicon wafer through the adsorption tank group, ensuring the stability of the silicon wafer fixed on the surface of the support part 4.

[0038] In this embodiment, the adsorption tank assembly includes an arc-shaped groove 42 connected to the air passage 41, a connecting groove 43, and adsorption holes 44. Multiple arc-shaped grooves 42 are arranged concentrically, with their centers corresponding to the center of the support portion 4. The connecting groove 43 connects adjacent arc-shaped grooves 42 and divides them into multiple regions, with adsorption holes 44 formed in at least some of these regions. This embodiment employs interconnected multi-point adsorption, reducing localized stress, ensuring the adsorption effect of the support portion 4 on the silicon wafer, reducing silicon wafer loading offset, and guaranteeing the gripping and positioning of the silicon wafer by the transfer unit.

[0039] In this embodiment, a spraying mechanism is provided inside the first processing tank 5. The spraying mechanism includes a nozzle support 51 and multiple nozzles 52 connected to the nozzle support 51. The nozzle support 51 is connected to the interior of the first processing tank 5. Preferably, the multiple nozzles 52 disposed on the same nozzle support 51 are evenly arranged in a ring. The spraying mechanism includes multiple vertically spaced nozzle supports 51 to form a first spray group and a second spray group. The first spray group is disposed above the second spray group. The nozzles 52 disposed in the first spray group spray downwards at an angle, and the nozzles 52 disposed in the second spray group spray upwards at an angle. When the silicon wafer is placed in the first processing tank 5 for film removal, the silicon wafer is located between the first spray group and the second spray group. This embodiment achieves film removal without dead angles at the edges of the silicon wafer through counter-spraying. The nozzle support 51 has a hollow center. In this embodiment, the nozzle support 51 is ring-shaped. The uniform ring-shaped distribution of nozzles 52 ensures the uniformity of silicon wafer removal. The nozzle support 51 not only provides support for the arrangement of nozzles 52, but its central hollow also facilitates the vertical movement of the silicon wafer.

[0040] In this embodiment, the spraying mechanism also includes an infusion pipe 53 connected to the nozzle 52 to introduce the decoction solution, and a flow sensor 54 is installed on the outside of the infusion pipe 53. The decoction solution includes hydrofluoric acid. Preferably, the infusion pipe 53 is a corrosion-resistant PTFE-lined flexible tube connected to the nozzle 52. This embodiment can reduce the risk of leakage caused by the infusion pipe 53 being corroded by hydrofluoric acid and other corrosive liquids. The flow sensor 54 is communicatively connected to the equipment control system. When the flow deviation exceeds a preset value, an alarm can be triggered. This not only allows for timely monitoring of the decoction solution supply, but also prevents abnormal supply of the decoction solution due to leakage or other reasons, ensuring the quality of silicon wafer decoction.

[0041] In this embodiment, a feeding unit is also included. The feeding unit includes a first transmission section 81 and a feeding basket 11 with multiple slots. The first transmission section 81 is rotatably connected to the equipment base 1. The transfer unit can place the silicon wafers after film removal into the first transmission section 81, and the first transmission section 81 can be rotated to an inclined state so that the silicon wafers slide to the corresponding slots. The first transmission section 81 can carry the silicon wafers transferred by the transfer unit. By rotating the first transmission section 81 to an inclined state, the silicon wafers are changed from a horizontal state to an inclined state, and the silicon wafers slide into the corresponding slots of the feeding basket 11 by gravity.

[0042] In this embodiment, the unloading unit further includes a second transmission section 82 inclinedly connected to the equipment base 1. The second transmission section 82 is disposed between the first transmission section 81 and the unloading wafer basket 11. The unloading wafer basket 11 is movably connected to the equipment base 1 to adjust the height of the slot. The movable connection method can be flexibly selected based on the common technical knowledge of those skilled in the art, and this utility model is not limited thereto. The silicon wafer can be slid sequentially to the corresponding slot by the first transmission section 81 and the second transmission section 82. In this embodiment, the first transmission section 81 and the second transmission section 82 achieve graded transmission. The first transmission section 81 can turn the silicon wafer into a sliding state, and the second transmission section 82 can act as an intermediate buffer to prevent the silicon wafer from impacting the wafer basket at high speed. The fixed tilt angle of the second transmission section 82 can form a fixed silicon wafer landing point. The unloading wafer basket 11 only needs to be slightly adjusted to align the slot to be placed with the silicon wafer landing point formed by the tail end of the second transmission section 82, simplifying the alignment and correction process and ensuring accurate wafer placement.

[0043] In this embodiment, the unloading unit further includes a transfer tank 83 connected to the equipment base 1. The unloading wafer basket 11 is disposed within the transfer tank 83, which contains liquid to immerse the silicon wafers placed in the unloading wafer basket 11. In this embodiment, before the unloading wafer basket 11 is removed from the transfer tank 83, all silicon wafers placed in the unloading wafer basket 11 can be immersed in a protective liquid, better preventing oxidation or contamination of the silicon wafers during the transfer waiting process, avoiding the impact of manual operation delays on semiconductor manufacturing quality, and ensuring the effectiveness of automated operation. In this embodiment, the rotational connection between the first transmission unit 81 and the equipment base 1, and the connection between the second transmission unit 82 and the equipment base, are existing technologies and can be achieved through mechanical connections such as brackets; this utility model does not limit these methods.

[0044] In this embodiment, the transfer unit includes a slide rail 91, a first drive unit 92, a second drive unit 93, and a gripping suction cup 94. The slide rail 91 is connected to the device base 1. The first drive unit 92 is slidably disposed on the slide rail 91. The second drive unit 93 is slidably connected to the first drive unit 92 for vertical movement. The gripping suction cup 94 is connected to the second drive unit 93. Preferably, the area of ​​the gripping suction cup 94 is smaller than the area of ​​the silicon wafer to expose the edge of the silicon wafer where the film needs to be removed. The area of ​​the silicon wafer is not larger than the top area of ​​the bearing portion 4 of the loading tray. The extension path of the slide rail 91 is configured to pass through the corresponding positions of the loading unit, the processing unit, and the unloading unit, so that the first drive unit 92 can drive the gripping suction cup 94 to move along the slide rail 91 and precisely align with each unit in sequence.

[0045] At least one of the first processing tank 5 and the second processing tank 6 has an openable cover 7 rotatably mounted on its top. The cover 7 has a clearance hole that is adapted to the second drive unit 93 to ensure that the cover 7 can remain covered during the silicon wafer removal or cleaning process. This not only prevents liquid splashing in the tank, but also shields and protects the liquid in the tank, ensuring the quality of removal or cleaning, and improving the safety of the operation process.

[0046] This embodiment enables automated edge stripping of semiconductor silicon wafers. Based on dynamic temperature compensation and adaptive wafer picking, it reduces manual operation steps and avoids affecting stripping quality or work efficiency due to manual operation or untimely monitoring. It can also reduce the risk of dark cracks or breakage of silicon wafers during automated operation, and can significantly improve the efficiency and quality of edge stripping of silicon wafers.

[0047] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made in accordance with the claims of this utility model should still fall within the patent coverage of this utility model.

Claims

1. An automatic edge-removing device for silicon wafers, comprising a feeding unit, a processing unit, and a transfer unit for moving silicon wafers, all mounted within a device substrate, characterized in that: The feeding unit includes a feeding tray, which includes a base, a buffer section, and a support section connected in sequence. The base is connected to the equipment base. The processing unit includes a first processing tank connected to the equipment base. The first processing tank is equipped with a temperature regulating mechanism. The transfer unit can transfer the silicon wafer from the support section to the first processing tank for film removal.

2. The automatic edge trimming equipment for silicon wafers according to claim 1, characterized in that: The loading tray also includes a limiting pin connected to the buffer section, and the bearing section has a limiting hole that cooperates with the limiting pin.

3. The automatic edge trimming equipment for silicon wafers according to claim 1 or 2, characterized in that: The support portion has a positioning opening and an adsorption groove assembly, and the support portion has an air passage communicating with the adsorption groove assembly.

4. The automatic edge trimming equipment for silicon wafers according to claim 3, characterized in that: The adsorption tank assembly includes an arc-shaped groove, a connecting groove, and adsorption holes that are connected to the air passage. There are multiple arc-shaped grooves arranged concentrically. The connecting groove is used to connect adjacent arc-shaped grooves and divide the adjacent arc-shaped grooves into multiple regions. Adsorption holes are opened in at least some of the regions.

5. The automatic edge trimming equipment for silicon wafers according to claim 1, 2, or 4, characterized in that: The first processing tank is equipped with a spraying mechanism, which includes a nozzle support and a plurality of nozzles connected to the nozzle support. The nozzle support is connected to the interior of the first processing tank.

6. The automatic edge trimming equipment for silicon wafers according to claim 5, characterized in that: The spraying mechanism also includes an infusion tube connected to the nozzle to introduce the defilm removal solution, and a flow sensor is installed on the outside of the infusion tube.

7. The automatic edge trimming equipment for silicon wafers according to claim 1, 2, 4, or 6, characterized in that: It also includes a feeding unit, which includes a first transmission section and a feeding basket with multiple slots. The first transmission section is rotatably connected to the equipment base. The transfer unit can place the silicon wafer in the first transmission section, and the first transmission section can be rotated to an inclined state so that the silicon wafer slides to the corresponding slot.

8. The automatic edge trimming equipment for silicon wafers according to claim 7, characterized in that: The unloading unit further includes a second transmission section that is inclinedly connected to the equipment base. The second transmission section is disposed between the first transmission section and the unloading tray. The unloading tray is movably connected to the equipment base to adjust the height of the slot. The silicon wafer can be slid sequentially from the first transmission section and the second transmission section to the corresponding slot.

9. The automatic edge trimming equipment for silicon wafers according to claim 7, characterized in that: The unloading unit also includes a transfer tank connected to the equipment base, and the unloading wafer basket is disposed in the transfer tank. The transfer tank is used to contain liquid to soak the silicon wafer placed in the unloading wafer basket.

10. The automatic edge trimming equipment for silicon wafers according to claim 8, characterized in that: The unloading unit also includes a transfer tank connected to the equipment base, and the unloading wafer basket is disposed in the transfer tank. The transfer tank is used to contain liquid to soak the silicon wafer placed in the unloading wafer basket.

11. The automatic edge trimming equipment for silicon wafers according to claim 1, 2, 4, 6, or 8, characterized in that: The transfer unit includes a slide rail, a first drive unit, a second drive unit, and a gripping suction cup. The slide rail is connected to the device base. The first drive unit is slidably disposed on the slide rail. The second drive unit is slidably connected to the first drive unit for vertical movement. The gripping suction cup is connected to the second drive unit.

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