Chip assisted lamination device

Abstract

The utility model discloses a chip auxiliary lamination device relates to semiconductor patch technical field for solving in the process of chip lamination, because the hand of operator shakes not voluntarily, will lead to the uncontrolled position deviation of chip when placing chip, influence patch precision. Chip auxiliary lamination device includes base and limit stop, and the base is used to place the substrate, and limit stop is detachably connected with the base, and the limit stop is opened with the positioning hole, and the positioning hole is used to correspond to the top of chip mounting area of the substrate, and the positioning hole is used to accommodate and limit the chip.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip mounting technology, and specifically to a chip-assisted stacking device. Background Technology

[0002] In the field of semiconductor chip mounting, existing technologies primarily rely on manual operation to stack chips. During this process, tweezers are used to manually place the chip at the target location on the substrate. After applying adhesive around the bottom chip, the top chip is then manually placed using tweezers. However, during chip stacking, involuntary hand tremors can cause uncontrollable positional shifts in the chips, affecting mounting accuracy. Utility Model Content

[0003] The purpose of this invention is to provide a chip-assisted stacking device that solves the problem of chip position misalignment during chip stacking and ensures the accuracy of chip placement.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A chip-assisted stacking device, comprising: The base is used to hold the substrate; The limiting plate is detachably connected to the base. The limiting plate has positioning holes, which are used to correspond to the chip mounting area of ​​the substrate and to accommodate and limit the chip.

[0005] Optionally, in the above-mentioned chip-assisted stacking device, the chip-assisted stacking device further includes a plurality of spacers, which are disposed between the base and the limiting plate for adjusting the distance between the base and the limiting plate.

[0006] Optionally, in the above-mentioned chip-assisted stacking device, a first positioning post is provided on the base, and a first through hole is provided on the gasket, and the gasket is connected to the first positioning post through the first through hole.

[0007] Optionally, in the above-mentioned chip-assisted stacking device, a second through hole is provided on the limiting plate, and the limiting plate is connected to the first positioning post through the second through hole.

[0008] Optionally, in the above-described chip-assisted stacking device, the limiting plate includes: The limiting frame has opposing inner and outer walls. The limiting frame is detachably connected to the base. The limiting frame is vertically movable above the base. The inner wall of the limiting frame is provided with an annular boss. Through holes are opened around the perimeter of the limiting frame, penetrating the inner and outer walls. The opening of the through holes is located above the annular boss. A movable plate is horizontally mounted on an annular boss. The movable plate has a positioning hole and a through hole for the adjustment component to extend into and push the movable plate horizontally on the annular boss.

[0009] Optionally, in the above-described chip-assisted stacking apparatus, the movable board includes: The movable plate body is horizontally movable and set on the annular boss, and the movable plate body has a third through hole; The transparent frame is a through prism structure. The transparent frame is embedded in the third through hole. The two opposite ends of the transparent frame are respectively provided with a first extension and a second extension. The first extension extends horizontally in a direction away from the axis of the transparent frame and covers the upper surface of the moving plate body. The second extension extends in a direction close to the axis of the transparent frame and forms a positioning hole.

[0010] Optionally, in the chip-assisted stacking device described above, the positioning hole is a rectangular through hole, and each side of the rectangular through hole is provided with a first groove recessed in a direction away from the center of the positioning hole.

[0011] Optionally, in the chip-assisted stacking device described above, the shape of the positioning hole matches the shape of the chip.

[0012] Optionally, in the chip-assisted stacking device described above, a second groove is provided on at least two opposite edges of the base, recessed toward the center side of the base, and the second groove extends through two opposite surfaces of the base.

[0013] Optionally, in the above-mentioned chip-assisted stacking device, a second positioning post is provided on the base, which is used to position and mount the substrate.

[0014] Compared with existing technologies, the chip-assisted stacking device provided in this application uses a base as a substrate support platform for placing the substrate. A limiting plate is detachably connected to the base and positioned above it. Positioning holes on the limiting plate are positioned above the chip mounting area of ​​the substrate, corresponding to the vertical direction of the chip. During operation: After placing the substrate on the base, the limiting plate is connected to the base, and the positioning holes are vertically aligned with the chip mounting area of ​​the substrate. At this time, the substrate is located between the base and the limiting plate. When the chip is placed into the chip mounting area on the substrate through the positioning holes, the inner wall of the positioning holes physically constrains the movement range of the chip. The chip can be vertically placed into the chip mounting area along the positioning holes to complete the chip installation on the substrate. Similarly, when stacking chips, the upper-layer chip is placed into the lower-layer chip along the positioning holes for stacking. This configuration limits the movement range of the chip during installation through the spatial constraint mechanism of the positioning holes, eliminating offset errors during manual placement, solving the problem of uncontrollable chip position offset caused by hand tremors in existing technologies, and improving the chip mounting accuracy and stacking consistency. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a top view schematic diagram of a limiting plate of a chip-assisted stacking device proposed in an embodiment of this utility model; Figure 2 This is a top view schematic diagram of the base of a chip-assisted stacking device proposed in an embodiment of this utility model; Figure 3 This is a top view schematic diagram of a gasket for a chip-assisted stacking device proposed in an embodiment of this utility model; Figure 4 This is a side view schematic diagram of a limiting plate of a chip-assisted stacking device proposed in an embodiment of this utility model; Figure 5 This is a side view schematic diagram of a gasket for a chip-assisted stacking device proposed in an embodiment of this utility model; Figure 6 This is a side view of the base of a chip-assisted stacking device proposed in an embodiment of the present invention.

[0016] Reference numerals: 100 is the base, 110 is the first positioning post, 120 is the second groove, 130 is the second positioning post, 200 is the limiting plate, 210 is the positioning hole, 2101 is the first groove, 220 is the second through hole, 230 is the limiting frame, 2301 is the annular boss, 2302 is the through hole, 240 is the moving plate, 2401 is the main body of the moving plate, 2402 is the transparent frame, 24021 is the first extension, 24022 is the second extension, 300 is the gasket, and 310 is the first through hole. Detailed Implementation

[0017] To make the technical problems, solutions, and beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0018] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0020] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] Please see Figure 1 The chip-assisted stacking device provided in this embodiment of the utility model includes a base 100 and a limiting plate 200; wherein, the base 100 is used to place the substrate, the limiting plate 200 is detachably connected to the base 100, the limiting plate 200 is provided with a positioning hole 210, the positioning hole 210 is used to correspond to the chip mounting area above the substrate, and the positioning hole 210 is used to accommodate and limit the chip.

[0023] For specific implementation details, please refer to: Figure 1In the chip-assisted stacking apparatus provided in this application, the base 100 serves as a substrate support platform for placing the substrate; the limiting plate 200 is detachably connected to the base 100 and positioned above the base 100. The positioning hole 210 on the limiting plate 200 is positioned above the chip mounting area of ​​the substrate, corresponding to the vertical direction of the chip. During operation: after placing the substrate on the base 100, the limiting plate 200 is connected to the base 100, and the positioning hole 210 is vertically aligned with the chip mounting area of ​​the substrate. At this time, the substrate is located between the base 100 and the limiting plate 200. When the chip is placed into the chip mounting area on the substrate through the positioning hole 210, the inner wall of the positioning hole 210 physically constrains the movement range of the chip during placement. The chip mounting on the substrate can be completed simply by vertically placing the chip into the chip mounting area along the positioning hole 210. Similarly, when stacking chips, the upper layer chip is placed into the lower layer chip along the positioning hole 210 for stacking. This configuration limits the chip's range of motion during installation by using the spatial constraint mechanism of the positioning hole 210, eliminating offset errors during manual placement, solving the problem of uncontrollable chip position offset caused by hand tremors in the prior art, and improving the chip placement accuracy and stacking consistency.

[0024] It should be noted that the positioning hole 210 on the limiting plate 200 passes through two opposite surfaces of the limiting plate 200. Therefore, the positioning hole 210 has a certain thickness. When the thickness of the positioning hole 210 is greater than the thickness of a chip, the limiting plate 200 can stack a certain number of chips by relying on the thickness of the positioning hole 210 itself. The total thickness of the certain number of chips is less than or equal to the thickness of the positioning hole 210.

[0025] As one possible implementation, such as Figure 3As shown, the chip-assisted stacking device also includes multiple spacers 300, which are disposed between the base 100 and the limiting plate 200 to adjust the distance between them. Multiple spacers 300 are stacked between the contact surfaces of the base 100 and the limiting plate 200. Each spacer 300 has a frame structure, placed at the outer edge of the base 100 and in contact with the limiting plate 200. During operation, when chips of different thicknesses need to be stacked, the appropriate number of spacers 300 can be selected and stacked on the base 100 according to the required height, vertically aligning the positioning holes 210 of the limiting plate 200 with the lower layer chip. The multiple layers of spacers 300 increase the vertical distance between the base 100 and the limiting plate 200 through their own thickness, raising the limiting plate 200 to a predetermined height, thus adapting to chip stacking operations with different numbers of layers. When the total thickness of the stacked chips exceeds the thickness of the positioning hole 210 itself, the topmost chip exceeds the thickness of the positioning hole 210 provided by the thickness of the limiting plate 200 itself when it contacts the base 100. At this time, the topmost chip to be stacked protrudes beyond the limiting plate 200, and the limiting and positioning effect of the positioning hole 210 fails. At this time, by setting the multi-layer pads 300, the height of the limiting plate 200 is adjusted, realizing the flexible and controllable distance between the substrate and the limiting plate 200, ensuring that the positioning hole 210 is always accurately located above the chip to be stacked when different layers of chips are stacked. This structure improves the versatility of the device while ensuring the chip mounting accuracy.

[0026] As one possible implementation, such as Figure 6 As shown, a first positioning post 110 is provided on the base 100, and a first through hole 310 is provided on the gasket 300. The gasket 300 is connected to the first positioning post 110 through the first through hole 310. The first positioning post 110 is vertically fixed to the surface of the base 100, and the gasket 300 is sleeved on the first positioning post 110 of the base 100 through the first through hole 310 thereon. Multiple gaskets 300 can be stacked along the axial direction of the positioning post, and the first through hole 310 of each gasket 300 is coaxially sleeved with the positioning post. During operation, the appropriate number of gaskets 300 can be selected according to the required height, and the first through holes 310 of the gaskets 300 are inserted one by one into the first positioning post 110 of the base 100, so that the gaskets 300 are stacked on the surface of the base 100. This configuration ensures the verticality of multiple gaskets 300 when stacked through the insertion and engagement mechanism of the first positioning post 110 and the first through hole 310. At the same time, the structure of the post and hole engagement prevents the gaskets 300 from shaking and maintains the stability of the device.

[0027] Furthermore, such as Figure 4As shown, the limiting plate 200 has a second through hole 220, through which the limiting plate 200 is connected to the first positioning post 110. When the limiting plate 200 covers the base 100, the first positioning post 110 vertically penetrates the second through hole 220 of the limiting plate 200 to form an axial constraint. During operation, the substrate is first placed on the base 100, and then the second through hole 220 of the limiting plate 200 is aligned with the first positioning post 110 of the base 100 and pressed down vertically, so that the first positioning post 110 completely passes through the second through hole 220; at this time, the limiting plate 200 achieves precise horizontal positioning through the gap fit between the second through hole 220 and the first positioning post 110, avoiding planar position deviation caused by manual placement. With this configuration, the mechanical structure of the column hole insertion and engagement enables the quick alignment of the limiting plate 200 and the base 100. At the same time, the through-type column connection ensures that the limiting plate 200 does not tilt when moving vertically, maintaining a stable correspondence between the positioning hole 210 and the substrate mounting area.

[0028] In some embodiments, such as Figure 1 As shown, the limiting plate 200 is a rectangular plate, and the four corners of the gasket 300 are respectively provided with a first through hole 310. The base 100 is provided with four first positioning posts 110 corresponding to their positions, which further reduces the possibility of device shaking when multiple gaskets 300 are stacked.

[0029] As one possible implementation, such as Figure 4As shown, the limiting plate 200 includes a limiting frame 230 and a movable plate 240. The limiting frame 230 has opposing inner and outer walls. The limiting frame 230 is detachably connected to the base 100. The limiting frame 230 is vertically movable above the base 100. The inner wall of the limiting frame 230 is provided with an annular boss 2301. Through holes 2302 penetrating the inner and outer walls are opened around the limiting frame 230. The opening of the through holes 2302 is located above the annular boss 2301. The movable plate 240 is horizontally movable on the annular boss 2301. The movable plate 240 is provided with a positioning hole 210. The through hole 2302 is used for an adjusting component to extend into and push the movable plate 240 to move horizontally on the annular boss 2301. The limiting frame 230 and the base 100 are detachably connected, facilitating overall assembly and disassembly. An annular boss 2301 is provided in the middle of the inner wall of the limiting frame 230 as a horizontal support platform. The movable plate 240 rests flat on the support surface of the annular boss 2301. A positioning hole 210 is provided in the middle of the movable plate 240 for chip positioning. A through hole 2302 on the side wall of the limiting frame 230 extends above the annular boss 2301, forming an operating channel. During operation: an adjusting rod can be inserted through the through hole 2302 to contact the side of the movable plate 240, pushing the movable plate 240 to slide horizontally on the plane of the annular boss 2301, allowing the positioning hole 210 to accurately align with the substrate mounting area. When the chip is placed through the positioning hole 210, the movable plate 240 can be independently moved and its position finely adjusted to ensure positioning accuracy. With this configuration, precise two-dimensional positioning is achieved through the sliding cooperation between the bearing surface of the annular boss 2301 and the moving plate 240. The through hole 2302 provides a closed operating channel to avoid external disturbances. At the same time, the limit frame 230 undertakes the overall lifting function, realizing coordinated control of vertical and horizontal adjustment, improving positioning accuracy and operational error tolerance.

[0030] As one possible implementation, such as Figure 4 As shown, the movable plate 240 includes a movable plate body 2401 and a transparent frame 2402. The movable plate body 2401 is horizontally movably mounted on the annular boss 2301, and the movable plate body 2401 has a third through hole. The transparent frame 2402 is a through prism structure and is embedded in the third through hole. The opposite two ends of the transparent frame 2402 are respectively provided with a first extension 24021 and a second extension 24022. The first extension 24021 extends horizontally in a direction away from the axis of the transparent frame 2402 and covers the upper surface of the movable plate body 2401. The second extension 24022 extends in a direction close to the axis of the transparent frame 2402 and forms a positioning hole 210.

[0031] The transparent frame 2402 is embedded in the third through hole using a through-prism structure. The upper and lower edges of the transparent frame 2402 are respectively provided with a first extension 24021 and a second extension 24022. The first extension 24021 extends horizontally outward to cover the upper surface of the movable board body 2401 for fixation, while the second extension 24022 contracts horizontally inward to form a positioning hole 210. During operation, the alignment of the chip mounting position can be observed through the transparent frame 2402. When placing the chip, the positioning hole 210 formed by the inward structure of the second extension 24022 guides the placement trajectory. Simultaneously, due to the transparent design, chip position deviations can be observed and corrected in real time. This configuration provides a visual window and guiding positioning installation channel through the transparent frame 2402 structure, eliminating alignment errors caused by the moving plate 240 component obstructing the view. The first extension 24021 allows the transparent frame 2402 to be snapped onto the upper surface of the moving plate body 2401, realizing a detachable design for the transparent frame 2402. By adjusting the area of ​​the positioning hole 210 formed by the second extension 24022, chips of different sizes can be mounted. In some embodiments, the transparent frame 2402 is made of glass, and the moving plate 240 is made of stainless steel.

[0032] In some embodiments, such as Figure 1 As shown, the positioning hole 210 is a rectangular through hole, and each side of the rectangular through hole is provided with a first groove 2101 recessed in the direction away from the center of the positioning hole 210. The positioning hole 210 is a rectangular through hole, and its outline precisely matches the shape of the rectangular chip. Each side of the rectangular through hole is provided with a first groove 2101 that is horizontally recessed in the direction away from the center of the hole. The first groove 2101 is formed in the edge area of ​​the positioning hole 210 on the moving plate 240. The groove depth is greater than the chip thickness, and the inner wall of the groove forms an operating gap with the side of the chip. During operation: when the chip is picked up with tweezers to fine-tune the chip position, the tip of the tweezers extends into the first groove 2101 to hold the edge of the chip side. The groove space isolates the tweezers from the adhesive layer area on the chip surface. When placing the chip, the tweezers move along the direction of the first groove 2101 until the chip is suspended and aligned with the mounting position. After releasing the tweezers, the chip falls vertically into the positioning hole 210. The inner wall of the groove limits the contact range of the tweezers to avoid touching the adhesive. This configuration provides an operating channel through the first groove 2101, ensuring that the tweezers only contact the area defined by the groove during the placement and removal of the rectangular chip. This isolates the tweezers from contact with the chip's upper surface and the adhesive layer, thus ensuring accurate chip positioning while avoiding the risk of adhesive contamination.

[0033] Furthermore, the shape of the positioning hole 210 matches the shape of the chip. That is, when the chip is rectangular, the positioning hole 210 is rectangular, and when the chip is hexagonal, the positioning hole 210 is hexagonal, with a gap fit between the two. During operation: when the chip is placed into the positioning hole 210, the chip edge makes multiple contacts with the hole wall, and automatically slides into the matching position during gravity-induced descent; if the chip is oriented incorrectly or the angle is off, the interference between the hole wall and the chip edge will prevent it from falling completely, and the placement posture needs to be readjusted. This setting, through a geometric matching physical constraint mechanism, corrects the chip's position and angle, eliminating positional deviations during manual placement.

[0034] As one possible implementation, such as Figure 2 As shown, at least two opposite edges of the base 100 are provided with second grooves 120 recessed towards the center of the base 100, and the second grooves 120 penetrate the two opposite surfaces of the base 100. The second grooves 120 are U-shaped or rectangular through slots, symmetrically formed in the edge region of the base 100, so that when the substrate is placed, a suspended portion is formed in the corresponding area of ​​the second groove 120. In specific implementation, when the substrate is placed on the surface of the base 100, the area of ​​the substrate edge covering the second groove 120 forms a suspended structure because there is no support below; when it is necessary to pick up, place or fine-tune the position of the substrate, it can be directly contacted from the second groove 120 to lift or move the substrate. This configuration provides a suspended area, providing unobstructed operating space for picking up, placing or fine-tuning the substrate, avoiding the difficulty of picking up and placing the substrate if it is completely attached to the base 100, and improving operating efficiency.

[0035] As one possible implementation, such as Figure 2 As shown, a second positioning post 130 is provided on the base 100. The second positioning post 130 is used to position and install the substrate. The second positioning post 130 is vertically fixed to the surface of the base 100 for positioning and installing the substrate. The second positioning posts 130 are distributed in the edge area of ​​the base 100, and their height is lower than the thickness of the substrate. The diameter of the post body is clearance-fitted with the hole on the lower surface of the substrate. During operation: after aligning the hole on the lower surface of the substrate with the top of the second positioning post 130 and pressing it down, the post body and the hole on the lower surface of the substrate form an insertion fit, so that the substrate is placed in the preset position along the post body. In this way, the mechanical limiting structure of post-hole insertion achieves rapid and accurate positioning of the substrate, eliminating the planar offset and angular deviation during manual placement.

[0036] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0037] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A chip-assisted stacking device, characterized in that, include: A base for placing a substrate; A limiting plate is detachably connected to the base. The limiting plate has a positioning hole, which is used to correspond to the chip mounting area of ​​the substrate and to accommodate and limit the chip.

2. The chip-assisted stacking device according to claim 1, characterized in that, The chip-assisted stacking device also includes multiple spacers, which are disposed between the base and the limiting plate to adjust the distance between the base and the limiting plate.

3. The chip-assisted stacking device according to claim 2, characterized in that, The base is provided with a first positioning post, and the gasket is provided with a first through hole. The gasket is connected to the first positioning post through the first through hole.

4. The chip-assisted stacking device according to claim 3, characterized in that, The limiting plate has a second through hole, and the limiting plate is connected to the first positioning post through the second through hole.

5. The chip-assisted stacking device according to claim 1, characterized in that, The limiting plate includes: A limiting frame has opposing inner and outer walls. The limiting frame is detachably connected to the base. The limiting frame is vertically movable above the base. The inner wall of the limiting frame is provided with an annular boss. Through holes are opened around the perimeter of the limiting frame, penetrating the inner and outer walls. The opening of the through holes is located above the annular boss. A movable plate is horizontally movably disposed on the annular boss. The movable plate has the positioning hole and the through hole for the adjustment component to extend into and push the movable plate to move horizontally on the annular boss.

6. The chip-assisted stacking device according to claim 5, characterized in that, The movable plate includes: A movable plate body is horizontally movably mounted on the annular protrusion, and the movable plate body has a third through hole; A transparent frame, which is a through prism structure, is embedded in the third through hole. The two opposite ends of the transparent frame are respectively provided with a first extension and a second extension. The first extension extends horizontally in a direction away from the axis of the transparent frame and covers the upper surface of the moving plate body. The second extension extends in a direction close to the axis of the transparent frame and surrounds the positioning hole.

7. The chip-assisted stacking device according to claim 1, characterized in that, The positioning hole is a rectangular through hole, and each side of the rectangular through hole is provided with a first groove that is recessed in a direction away from the center of the positioning hole.

8. The chip-assisted stacking device according to claim 1, characterized in that, The shape of the positioning hole matches the shape of the chip.

9. The chip-assisted stacking device according to claim 1, characterized in that, The base has at least two opposite edges with a second groove recessed toward the center of the base, the second groove extending through two opposite surfaces of the base.

10. The chip-assisted stacking device according to claim 1, characterized in that, The base is provided with a second positioning post, which is used to position and install the substrate.

Images